1356551 九、發明說明： 曰所提出之曰本 月27日所提出 先權的利益，在 本專利申請案之 連接對象物之 之「等長直角連 具有一包含有層 具有複數個傳信 及該等接地通孔 有在其相對表面 該等相對表面上 接。該中間絕緣 具有在其外表面 緣板上之接地導 安裝於其中之信 本申請案根據並主張2 00 6年12月19 專利申請案第2006-341710號及2007年6 之日本專利申請案第2007- 1 69690號之優 此以參照的方式在本申請案中倂入該等日： 全部揭露。 【發明所屬之技術領域】 本發明係有關於一種用以彼此連接兩. 連接器（例如：直角連接器）。 【先前技術】 例如在日本專利（J P - B )第 2 6 2 3 4 3 5號 接器」中揭露此型態之連接器。該連接器 積在彼此上之三個絕緣板的基板。該基板 通孔及複數個接地通孔。使該等傳信通孔 經歷電鍍。 在該三個絕緣板間，該中間絕緣板具 上所形成之複數個信號圖案（導電圖案）。 之信號圖案經由該等傳信通孔彼此電性連 板之相對側上的其它絕緣板之每一絕緣板 上所形成之複數個接地導電圖案。其它絕 電圖案經由該等接地通孔彼此電性連接。 該等傳信通孔中之一些傳信通孔收容 號插腳觸點。該等接地通孔收容安裝於其中之接地插腳觸 點。 1356551 【發明內容】 在上述連接器中’在該中間絕緣板之相對表面上形成 該等信號導電圖案，而在該中間絕緣板之相對側上的其它 絕緣板之外表面上形成該等接地導電圖案。以此結構可允 許使在該基板上之佈線具有彼此相等之長度。然而，很難 達成在該基板上之佈線的高密度及一小型連接器。 因此’本發明之一示範目的係要提供一種能達成等長 佈線及一高密度基板之連接器。 本發明之另一示範目的係要提供一種具有絕佳高頻特 性之適用於一數位傳輸系統（例如：T M D S (最小化傳輸差分 信號））的小型連接器。 隨說明進行’本發明之其它目的將變成得清楚。 依據本發明之一示範態樣，提供一種用以連接兩個連 接對象物之連接器，該連接器包括：複數個接點，連接至 該等連接對象物中之一；一外罩，保持該等接點；以及一 連接構件，耦接至該外罩且包括連接至另一連接對象物之 複數個端子；該連接構件進一步包括：複數個第一導電圖 案’彼此平行配置；以及複數個第二導電圖案，與該等第 一導電圖案相交且彼此平行配置；該等第一及第二導電圖 案係在彼此不同之位置上所依序積層；該等第一導電圖案 具有連接至該等接點之一端及連接至該等第二導電圖案之 一端的另一端；該等第二導電圖案具有連接至該等端子之 另—端。 1356551 【實施方式】 首先參考第1A圖至第ό圖’將描述依據本發明之第一 實施例的一連接器。 該連接器包括複數個接點10、一保持該等接點10之 絕緣體（外罩）20及一覆蓋該等接點10及該絕緣體20之殼 30。該連接器結合或包含一具有複數個端子5〇及60之內 部基板40以做爲一連接構件。該內部基板4〇之端子50及 60連接至一安裝基板70。該殼30具有連接至該安裝基板 70之一對威iijfi子30a。該內部基板40同等於一·包括如JP 2623435B所述之兩個彼此黏附之基板的基板。 將該等接點10組裝至該絕緣體20，以在該殻3〇之一 安裝開口處在絕緣體20之兩側上配置成兩列。該等接點 1〇藉由該項技藝所已知之SMT(表面安裝技術）插入而連接 至該內部基板40。該等端子50及60藉由壓配於該內部基 板40之通孔中而固定至該內部基板40。或者，該等端子 50及60可以藉由焊接而電性連接至該內部基板40。 該等端子50及60被插入該安裝基板70之通孔且藉由 焊接而電性連接至該安裝基板70之一圖案（未顯示）。或 者，該等端子50及60藉由SMT電性連接至該安裝基板70 之圖案（未顯示）。 第6圖顯示一HDMI(高解析多媒體介面）之接腳分配。 例如：端子1、2及3分別分配有TMDS之"資料2 + "、"資 料2屏蔽”及"資料2 -π。在傳輸線中，最好在離該端子2 (資 料2屏蔽）有相同距離之位置上配置該等端子1(資料2 + ) Ι35ΰ551 及3(資料2-)。在第ΙΑ圖至第5圖中，分別以目 @、③)來表示該等端子1至3。 如圖3Α所示，該內部基板40具有一第一 層具有彼此不同長度且彼此平行延伸之導電圖 3Β圖所示，該內部基板40具有—第二層，該 彼此不同長度之複數個第二導電圖案42。該等 案42彼此平行且垂直於該等第—導電圖案41 導電圖案41之終端41b延伸。該等第一導電g 等第二導電圖案42之數目彼此相同。該等第 42之每一者具有一起端42a，該起端42a具有 之通孔45。同樣地，該等第一導電圖案41之 端4 1 b具有一經歷電鍍之相似通孔4 5。該等領 電性連接。‘ 如第3C及3D圖所示，該內部基板40具 四層，該第三及第四層具有相似於該等第一及 案41及42之複數個第三導電圖案43及複數個 案44。如第3A及3C圖所示，在垂直於一佈線 在彼此不同位置上配置該等第一及第三導電 43。如第3B及3D圖所示，以垂直於一佈線方 彼此不同位置上配置該等第二及第四導電圖案 如第4B圖所示，該第三導電圖案43之端 示）垂直地位於該第一導電圖案41中之彼此相 及3 (以①及③所示）間。如第4 C圖所示，該第四 之端子2 (以@所示）垂直地位於該第二導電圖案 0繞數字（①、 層’該第一 案4 1。如第 第二層具有 第二導電圖 從該等第一 S案41及該 二導電圖案 ~經歷電鍵 每一者的終 I孔45彼此 有第三及第 第二導電圖 第四導電圖 方向之方向 圖案 4 1及 向之方向在 4 2 及 4 4。 ί子2 (以@所 鄰的端子1 導電圖案44 :42中之彼 1356551 此相鄰的端子1及3 (以①及〇)所示）間。 且用以與該安裝基板70連接之端子50及60電性連接 且固定至該等第二導電圖案42之終端42b。在該內部基板 40之厚度方向將該等端子60之一些端子彎曲成曲柄形狀 (見第4B圖）以偏心而配置於第5A及5B圖中之中間列。因 此，有助於與該安裝基板70之佈線圖案的連接。 在該內部基板40之一下部分上，如第2C圖等所述形 成複數個半圓溝槽（定位部）49。每個溝槽作用成防止每個 端子60搖晃。藉由安裝該端子60之中間部至該溝槽49 中，相對於該內部基板40定位該端子60且有助於與該安 裝基板70之連接。 連接至該等端子50之傳輸線（信號）具有彼此相等之長 度。連接至該等端子60之傳輸線（屏蔽及其它）稍微比連接 至該等端子50之傳輸線長，因爲它們被彎曲成曲柄形狀。 如第4B及4C圖所述，在三角形之頂點上配置該兩個 信號接點1及3(以①及@所示）以及該接地接點2(以@所 示）。因此，獲得絕佳高頻特性。再者，藉由調整每一導電 圖案之寬度，以一預定位準設定特性阻抗。 參考第7A至8C圖，將描述依據本發明之第二示範性 實施例的一連接器。相同部分係以相同元件符號來表示， 因而將省略其敘述。 在該連接器中，具有依據該第一示範性實施例之連接 器的第二導電圖案42之第二層包括一如圖8A所示之接地 板8 0。接地端經由通孔8 1電性連接至該接地板8 0。惟， 1356551 沒有形成圖案化的佈線。 第7B圖所示之一表面層及第7C圖所示之一背面層分 別具有複數個墊（端子）84及85。當與用以連接該安裝基板 70之端子50及60連接時，該等墊84及85之阻抗匹配變 得容易。這些墊84及85經由通孔電鍍層82及83連接至 第8A及8B圖所述之內層。第7B及’7C圖所示之複數個墊 86經由該等通孔電鍍層82及83連接至第8A圖中之接地 板80。第8A圖中之避開部82'及8V作用以防止該接地板 80與該等通孔電鍍層82及83間之連接。 在上述連接器中，該接地板80係寬的。因此，減少該 項技藝中所已知之接地電感及獲得一充分返回通路（return path)，以便進一步改善該等高頻特性。此外，因爲該接地 沒有圖案化佈線，所以可藉由準備一具有該等通孔8 1之不 同位置的基板自由地選擇該項技藝中所已知之接地墊的位 置。於是，增加該安裝基板70之接腳分配的選擇之數目。 再者，藉由個別的組件之絕緣體保持用以與該安裝基 板70連接之端子50及60。因此，不需爲了保持該等端子 50及60使該內部基板（連接構件）40經歷一可能干擾電氣 性能之處理操作。於是，可減少該內部基板40之厚度》相 較於藉由壓配等在該內部基板40上保持用於連接之端子 5 0及6 0的情況，可改善共面性。 在該具有該等第二導電圖案42之層及該具有該等第 三導電圖案43之層中之至少一層上提供該覆蓋該內部基 板40之層中之一的大致全部面積的接地板80。該接地板 -10- 1356551 80可以連接至在該第一至第四導電圖案4i至44中所包含 之接地圖案。 參考第9A至10C圖，將描述依據本發明之第三示範 性實施例的一連接器。相同部分係以相同元件符號來表 不*因而將省略其欽述。 在上述連接器中，藉由個別的組件之絕緣體90保持用 以與該安裝基板70(第1Β及1C圖）連接之端子50及60。 配置用於連接之端子50,以便夾住該內部基板40,以及藉 由該絕緣體90之保持部93及94保持該等端子50。使一 殼1〇〇沿著該絕緣體90之上下表面91及92延伸。該殼 1〇〇大致整個覆蓋該內部基板40。以相鄰該等用於連接之 端子50的相對端方式，配置殻安裝端子101至104。 在上述連接器中，在該內部基板40之厚度方向配置該 等用於連接之端子50的保持部93及94»因此，像串音 (Cr〇SS talk)特性之高頻特性變成是絕佳的。使該殼1〇〇沿 著該絕緣體90延伸。因此，藉由配置該等殼安裝端子1〇1 至104相鄰於該等用於連接之端子50a至50d，有鑑於高 頻使該等用於連接之端子50處於特別是高頻的相同狀況 中。（根據金屬端子是否呈現在兩個相鄰側上’該特性阻抗 是不同的。）再者，藉由以該殼100覆蓋該內部基板40之 大部分，可抑制不需要的輻射。 藉由上述各種連接器，可期望下面效果。 1.可提供一種具有絕佳高頻特性之適用於一數位傳輸 系統（例如：TMDS)之連接器。 1356551 2. 可改善EMI特性，因爲該殼覆蓋該外罩及具有連接 至該等連接對象物之另一連接對象物的殼端子。 3. 可達成該連接構件之高密度，因爲在該第一至第四 導電圖案之積層方向將連接至另一連接對象物之連接構件 的端子配置成三列。 4·該連接構件容易連接至另一連接對象物，因爲在該 連接構件之端子中，在垂直於該積層方向之間距方向藉由 該連接構件之定位部定位該中間列之端子 5 .該連接構件係小型的。 6_可獲得一種連接器’其中該等接點與該等端子間之 導電圖案具有彼此相等之長度。 7.進一步改善該高頻特性，因爲該接地層覆蓋該連接 構件之一層的整個面積。 此外，下面將列舉本發明之各種示範性實施例。 1. 一種連接器’用以連接兩個連接對象物，該連接器 包括： 複數個接點10，連接至該等連接對象物中之—； 一外罩20，保持該等接點；以及 一連接構件40’耦接至該外罩20且包括連接至另一 連接對象物70之複數個端子50及60; 該連接構件進一步包括： 複數個第一導電圖案41，彼此平行配置；以及 複數個第二導電圖案42,與該等第—導電圖案相交且 以彼此平行配置； -12- 1356551 該等第一及第二導電圖案41及42係在彼此不同之位 置上所依序積層； 該等第一導電圖案41具有連接至該等接點1〇之一端 41a及連接至該等第二導電圖案42之一端42a.的另一端 41b ： 該等第二導電圖案42具有連接至該等端子50及60之 另一端42b。 2. 依據第一示範性實施例之連接器，其中該連接構件 40進一步包括： 複數個第三導電圖案43,在相同於該等第一導電圖案 41之方向來配置且彼此平行配置；以及 複數個第四導電圖案44，與該等第三導電圖案43相 交，在相同於該等第二導電圖案42之方向來配置，以及彼 此平行配置； 該等第一至第四導電圖案41至44係在彼此不同之位 置上依序積層。 3. 依據第二示範性實施例之連接器，其中該等第三導 電圖案43具有連接至該等接點10之一端43a及連接至該 等第四導電圖案44之一端44a的另一端43b’該等第四導 電圖案44具有連接至該等端子50及60之另一端4〇。 4. 依據第三示範性實施例之連接器，其中該等端子50 及60係在該等第一至第四導電圖案41至44之積層方向配 置成三列，該連接構件40具有複數個定位部49’該等定 位部49在垂直於該積層方向之間距方向定位該等端子60 Ι35ύ551 於中間列中。 5. 依據第三示範性實施例之連接器，其中該等第一導 電圖案41及該等第三導電圖案43在第一佈線方向延伸及 在垂直於該第一佈線方向之方向配置在彼此不同之位置 上，該等第二導電圖案42及該等第四導電圖案44在第二 佈線方向延伸及在垂直於該第二佈線方向之方向配置在彼 此不同之位置上。 6. 依據第三示範性實施例之連接器，其中具有該等第 二導電圖案42之層及具有該等第三導電圖案43之層之至 少一層設有一覆蓋該連接構件40之一層的全部區域之接 地層80，該接地層80連接至在該等第一至第四導電圖案 41至44中之接地圖案。 7. 依據第一示範性實施例之連接器，其中該等接點10 與該等端子50及60間之導電圖案具有彼此相等之長度。 8. 依據第一示範性實施例之連接器’進一步包括覆蓋 該外罩20之設30，該殻30包括連接至另一連接對象物70 之殼端子30a。 9. 依據第八示範性實施例之連接器，其中該殼30具有 安裝開口，用以安裝至該等連接對象物中之一，該等接點 10係組裝至該外罩20，以在該安裝開口處在該外罩20的 兩側上配置成兩列。 10. 依據第九示範性實施例之連接器’其中該連接構件 係插入該等接點1 0之兩列間且連接至該等接點1 〇。 雖然已參考其示範性實施例來特別顯示及描述本發 -14- 1356551 明，但是本發明並非侷限於這些實施例。熟習該項技藝之 一般人士將了解到，可以在不脫離請求項所界定之本發明 的精神及範圍下實施各種形式及細節之變化。 【圖式簡單說明】 第1 A至1 D圖分別係依據本發明之第一示範性實施例 的一連接器之前視圖、側視圖、後視圖及平面圖； 第2A至2D圖分別係在第1A至1D圖所述之連接器中 所倂入之一內部基板的前視圖、側視圖、後視圖及平面圖； 第3A至3D圖分別係沿著第2B圖之線3a-3a、3b-3b、 3 c - 3 c及3 d - 3 d的剖面圖； 第4A至4C圖分別係沿著第2C圖之線4a-4a、4b-4b 及4c-4c的剖面圖，第4A及4B圖顯示端子被固定之狀態； 第5A圖係用以描述第1A至1D圖中之連接器的複數 個接點（接腳）相對於一安裝基板之配置的圖式。 第5B圖係用以描述該等接點相對於一絕緣體之配置 的圖式； 第6圖係用以描述一 HDMI (高解析多媒體介面）之接腳 分配的圖式： 第7 A至7 C圖分別係本發明之一第二示範性實施例的 一連接器之一內部基板的側視圖、正視圖及後視圖； 第8A至8C圖分別係沿著第7A及7B圖之線8a-8a、 8b-8b及8c-8c的剖面圖’爲了方便描述，第8A及8B圖 只有部分被劃影線； 第9A至9E圖分別係依據本發明之第三示範性實施例 135-6551 圖及底視圖， i 9E圖之線 的一連接器之側視圖、後視圖、前視圖、平面 第10A至10C圖分別係沿著第 9A ΐ 10a-10a、 10b-10b 及 10c-10c 的剖面圖。 【主要元件符號說明】1356551 IX. Description of the invention: The benefit of the stipulation proposed by 曰 on the 27th of this month, in the object of the connection of the patent application, the "equal length of the right angle connection has a layer containing a plurality of letters and the The grounding through holes are connected to the opposite surfaces of the opposite surfaces thereof. The intermediate insulating has a grounding guide on the outer surface of the outer surface of the letter. The application is based on and claims the patent application of December 19, 2006. In the present application, the present application is incorporated by reference to the same Japanese Patent Application No. 2007-341710, the entire disclosure of which is hereby incorporated by reference. The invention relates to a connector (for example, a right-angle connector) for connecting to each other. [Prior Art] This type is disclosed, for example, in Japanese Patent (JP-B) No. 2 6 2 3 4 3 5 connector. State connector. The connector is a substrate of three insulating plates stacked on each other. The substrate via and the plurality of ground vias. The signaling vias are subjected to electroplating. Between the three insulating sheets, the intermediate insulating sheet has a plurality of signal patterns (conductive patterns) formed thereon. The signal pattern passes through the plurality of ground conductive patterns formed on each of the other insulating plates on the opposite sides of the opposite sides of the electrical vias. Other electrically insulating patterns are electrically connected to each other via the ground vias. Some of the signaling vias receive the pin contacts. The ground vias receive the ground pin contacts mounted therein. 1356551 SUMMARY OF THE INVENTION In the above connector, the signal conductive patterns are formed on opposite surfaces of the intermediate insulating plate, and the ground conductive is formed on the outer surfaces of other insulating plates on opposite sides of the intermediate insulating plate. pattern. This structure allows the wirings on the substrate to have equal lengths to each other. However, it is difficult to achieve a high density of wiring on the substrate and a small connector. Therefore, an exemplary object of the present invention is to provide a connector capable of achieving equal length wiring and a high density substrate. Another exemplary object of the present invention is to provide a miniature connector suitable for a digital transmission system (e.g., T M D S (minimized transmission differential signal)) having excellent high frequency characteristics. Other objects of the invention will become apparent as the description proceeds. According to an exemplary aspect of the present invention, a connector for connecting two connection objects is provided, the connector comprising: a plurality of contacts connected to one of the connection objects; a cover holding the same And a connecting member coupled to the outer cover and including a plurality of terminals connected to the other connecting object; the connecting member further comprising: a plurality of first conductive patterns ′ arranged in parallel with each other; and a plurality of second conductive a pattern intersecting the first conductive patterns and disposed in parallel with each other; the first and second conductive patterns are sequentially stacked at different positions from each other; the first conductive patterns having connections to the contacts One end and the other end connected to one end of the second conductive patterns; the second conductive patterns having the other end connected to the terminals. 1356551 [Embodiment] A connector according to a first embodiment of the present invention will be described first with reference to Figs. 1A to ’. The connector includes a plurality of contacts 10, an insulator (outer cover) 20 holding the contacts 10, and a case 30 covering the contacts 10 and the insulator 20. The connector incorporates or includes an inner substrate 40 having a plurality of terminals 5 and 60 as a connecting member. The terminals 50 and 60 of the internal substrate 4 are connected to a mounting substrate 70. The case 30 has one of the mounting substrates 70 connected to the iJifi sub 30a. The inner substrate 40 is equivalent to a substrate including two substrates adhered to each other as described in JP 2623435B. The contacts 10 are assembled to the insulator 20 to be arranged in two rows on both sides of the insulator 20 at one of the mounting openings of the casing 3. The contacts 1 are connected to the internal substrate 40 by SMT (Surface Mount Technology) insertion known in the art. The terminals 50 and 60 are fixed to the inner substrate 40 by being press-fitted into the through holes of the inner substrate 40. Alternatively, the terminals 50 and 60 can be electrically connected to the inner substrate 40 by soldering. The terminals 50 and 60 are inserted into the through holes of the mounting substrate 70 and electrically connected to one of the mounting substrates 70 (not shown) by soldering. Alternatively, the terminals 50 and 60 are electrically connected to the pattern of the mounting substrate 70 (not shown) by SMT. Figure 6 shows the pin assignment of an HDMI (High Resolution Multimedia Interface). For example, terminals 1, 2, and 3 are assigned TMDS's "data 2 + ", "data 2 masking" and "data 2 -π. In the transmission line, it is best to shield from terminal 2 (data 2) The terminals 1 (data 2 + ) Ι 35 ΰ 551 and 3 (data 2) are arranged at the same distance. In the second to fifth figures, the terminals 1 to 3 are respectively indicated by the heads @, 3) 3. As shown in FIG. 3A, the inner substrate 40 has a first layer having different lengths from each other and extending parallel to each other, as shown in FIG. 3A, the inner substrate 40 has a second layer, which is a plurality of different lengths. a second conductive pattern 42. The cases 42 extend parallel to each other and perpendicular to the terminal 41b of the conductive pattern 41 of the first conductive pattern 41. The number of the second conductive patterns 42 such as the first conductive g and the like are identical to each other. Each of the 42 has a terminal end 42a having a through hole 45. Similarly, the end 4 1 b of the first conductive pattern 41 has a similar through hole 45 that undergoes electroplating. Sexual connection. ' As shown in Figures 3C and 3D, the internal substrate 40 has four layers, the third and the third The layer has a plurality of third conductive patterns 43 and a plurality of individual cases 44 similar to the first and fourth cases 41 and 42. As shown in FIGS. 3A and 3C, the first portions are disposed at different positions from each other perpendicular to a wiring. And a third conductive 43. As shown in FIGS. 3B and 3D, the second and fourth conductive patterns are disposed at different positions perpendicular to each other on a wiring side, as shown in FIG. 4B, the end of the third conductive pattern 43 Vertically located between the first conductive patterns 41 and 3 (shown as 1 and 3). As shown in FIG. 4C, the fourth terminal 2 (shown as @) is vertically positioned. The second conductive pattern 0 is wound around a number (1, layer 'the first case 41. If the second layer has a second conductive pattern from the first S case 41 and the two conductive patterns~ undergoing a key each The final I holes 45 have the direction pattern 4 1 of the direction of the fourth conductive pattern of the third and second conductive patterns, and the direction of the direction 4 4 and 4 4 . ί子 2 (terminal 1 conductive pattern 44 adjacent to @: Between the adjacent terminals 1 and 3 (shown as 1 and 〇), and the terminal for connecting to the mounting substrate 70 50 and 60 are electrically connected and fixed to the terminal 42b of the second conductive patterns 42. Some terminals of the terminals 60 are bent into a crank shape (see Fig. 4B) in the thickness direction of the inner substrate 40 to be eccentrically arranged. In the middle column of the 5A and 5B drawings, the connection to the wiring pattern of the mounting substrate 70 is facilitated. On a lower portion of the internal substrate 40, a plurality of semicircular trenches are formed as described in FIG. 2C and the like. (Positioning portion) 49. Each groove acts to prevent each terminal 60 from shaking. By mounting the intermediate portion of the terminal 60 into the trench 49, the terminal 60 is positioned relative to the inner substrate 40 and facilitates connection to the mounting substrate 70. Transmission lines (signals) connected to the terminals 50 have lengths equal to each other. The transmission lines (shield and others) connected to the terminals 60 are slightly longer than the transmission lines connected to the terminals 50 because they are bent into a crank shape. As shown in Figures 4B and 4C, the two signal contacts 1 and 3 (shown as 1 and @) and the ground contact 2 (shown as @) are placed at the apex of the triangle. Therefore, excellent high frequency characteristics are obtained. Furthermore, the characteristic impedance is set at a predetermined level by adjusting the width of each of the conductive patterns. Referring to Figures 7A through 8C, a connector in accordance with a second exemplary embodiment of the present invention will be described. The same portions are denoted by the same reference numerals, and the description thereof will be omitted. In the connector, the second layer of the second conductive pattern 42 having the connector according to the first exemplary embodiment includes a ground plate 80 as shown in Fig. 8A. The ground end is electrically connected to the ground plate 80 via the through hole 8 1 . However, 1356551 does not form patterned wiring. One of the surface layers shown in Fig. 7B and one of the back layers shown in Fig. 7C have a plurality of pads (terminals) 84 and 85, respectively. When the terminals 50 and 60 for connecting the mounting substrate 70 are connected, the impedance matching of the pads 84 and 85 becomes easy. These pads 84 and 85 are connected to the inner layers described in Figs. 8A and 8B via via plating layers 82 and 83. The plurality of pads 86 shown in Figs. 7B and '7C are connected to the ground plate 80 in Fig. 8A via the via plating layers 82 and 83. The avoidance portions 82' and 8V in Fig. 8A act to prevent the connection between the ground plate 80 and the via plating layers 82 and 83. In the above connector, the ground plate 80 is wide. Therefore, the grounding inductance known in the art is reduced and a sufficient return path is obtained to further improve the high frequency characteristics. Moreover, since the ground has no patterned wiring, the position of the ground pad known in the art can be freely selected by preparing a substrate having different positions of the vias 81. Thus, the number of options for pin assignment of the mounting substrate 70 is increased. Furthermore, the terminals 50 and 60 for connection to the mounting substrate 70 are held by insulators of individual components. Therefore, it is not necessary to cause the internal substrate (connection member) 40 to undergo a processing operation which may interfere with electrical performance in order to maintain the terminals 50 and 60. Therefore, the thickness of the inner substrate 40 can be reduced, and the coplanarity can be improved as compared with the case where the terminals 50 and 60 for connection are held on the inner substrate 40 by press fitting or the like. A ground plate 80 covering substantially the entire area of one of the layers of the inner substrate 40 is provided on at least one of the layer having the second conductive patterns 42 and the layer having the third conductive patterns 43. The ground plate -10- 1356551 80 may be connected to the ground pattern included in the first to fourth conductive patterns 4i to 44. Referring to Figures 9A through 10C, a connector in accordance with a third exemplary embodiment of the present invention will be described. The same parts are denoted by the same component symbols and thus their description will be omitted. In the above connector, the terminals 90 and 60 connected to the mounting substrate 70 (Fig. 1 and Fig. 1C) are held by the insulator 90 of the individual components. The terminal 50 for connection is disposed so as to sandwich the inner substrate 40, and the terminals 50 are held by the holding portions 93 and 94 of the insulator 90. A case 1 is extended along the upper surfaces 91 and 92 above the insulator 90. The case 1 〇〇 substantially covers the inner substrate 40. The case mounting terminals 101 to 104 are disposed in such a manner as to be adjacent to the opposite ends of the terminals 50 for connection. In the above connector, the holding portions 93 and 94 of the terminal 50 for connection are disposed in the thickness direction of the internal substrate 40. Therefore, the high frequency characteristic like the characteristics of the crosstalk becomes excellent. of. The casing 1 is extended along the insulator 90. Therefore, by arranging the case mounting terminals 1〇1 to 104 adjacent to the terminals 50a to 50d for connection, the terminals 50 for connection are in the same condition, particularly high frequency, in view of high frequency. in. The characteristic impedance is different depending on whether or not the metal terminals are present on two adjacent sides. Further, by covering the majority of the internal substrate 40 with the case 100, unnecessary radiation can be suppressed. With the above various connectors, the following effects can be expected. 1. A connector suitable for a digital transmission system (for example, TMDS) having excellent high frequency characteristics can be provided. 1356551 2. The EMI characteristic can be improved because the case covers the cover and the case terminal having another connection object connected to the connection object. 3. The high density of the connecting member can be achieved because the terminals of the connecting members connected to the other connecting object are arranged in three rows in the laminating direction of the first to fourth conductive patterns. 4. The connecting member is easily connected to another connecting object, because in the terminal of the connecting member, the terminal 5 of the intermediate column is positioned by the positioning portion of the connecting member in a direction perpendicular to the direction of the laminated direction. The components are small. 6_ A connector can be obtained in which the conductive patterns between the contacts and the terminals have lengths equal to each other. 7. The high frequency characteristic is further improved because the ground layer covers the entire area of one of the layers of the connecting member. Further, various exemplary embodiments of the invention are enumerated below. 1. A connector 'for connecting two connection objects, the connector comprising: a plurality of contacts 10 connected to the connection objects; a cover 20 holding the contacts; and a connection The member 40' is coupled to the outer cover 20 and includes a plurality of terminals 50 and 60 connected to another connection object 70; the connection member further includes: a plurality of first conductive patterns 41 disposed in parallel with each other; and a plurality of second a conductive pattern 42 intersecting the first conductive patterns and arranged in parallel with each other; -12- 1356551 the first and second conductive patterns 41 and 42 are sequentially stacked at different positions from each other; The conductive pattern 41 has one end 41a connected to the contacts 1 and the other end 41b connected to one end 42a of the second conductive patterns 42: the second conductive patterns 42 have connections to the terminals 50 and 60 The other end 42b. 2. The connector according to the first exemplary embodiment, wherein the connecting member 40 further comprises: a plurality of third conductive patterns 43 disposed in the same direction as the first conductive patterns 41 and arranged in parallel with each other; The fourth conductive patterns 44 intersect with the third conductive patterns 43 and are disposed in the same direction as the second conductive patterns 42 and are arranged in parallel with each other; the first to fourth conductive patterns 41 to 44 are Layers are placed in different positions from each other. 3. The connector according to the second exemplary embodiment, wherein the third conductive patterns 43 have one end 43a connected to the contacts 10 and the other end 43b' connected to one end 44a of the fourth conductive patterns 44. The fourth conductive patterns 44 have the other ends 4 连接 connected to the terminals 50 and 60. 4. The connector according to the third exemplary embodiment, wherein the terminals 50 and 60 are arranged in three rows in the lamination direction of the first to fourth conductive patterns 41 to 44, and the connecting member 40 has a plurality of positioning The portion 49' of the positioning portions 49 positions the terminals 60 Ι 35 ύ 551 in the middle row in a direction perpendicular to the stacking direction. 5. The connector according to the third exemplary embodiment, wherein the first conductive patterns 41 and the third conductive patterns 43 are extended in the first wiring direction and are arranged different from each other in a direction perpendicular to the first wiring direction. In the position, the second conductive patterns 42 and the fourth conductive patterns 44 extend in the second wiring direction and are disposed at positions different from each other in a direction perpendicular to the second wiring direction. 6. The connector according to the third exemplary embodiment, wherein at least one of the layer having the second conductive patterns 42 and the layer having the third conductive patterns 43 is provided with an entire area covering one of the layers of the connecting member 40. The ground layer 80 is connected to the ground pattern in the first to fourth conductive patterns 41 to 44. 7. The connector according to the first exemplary embodiment, wherein the conductive patterns between the contacts 10 and the terminals 50 and 60 have equal lengths from each other. 8. The connector ' in accordance with the first exemplary embodiment' further includes a cover 30 covering the outer cover 20, the case 30 including a case terminal 30a connected to another connection object 70. 9. The connector according to the eighth exemplary embodiment, wherein the case 30 has a mounting opening for mounting to one of the connecting objects, the contacts 10 being assembled to the housing 20 for mounting The openings are arranged in two rows on both sides of the outer cover 20. 10. The connector of the ninth exemplary embodiment wherein the connecting member is inserted between the two columns of the contacts 10 and connected to the contacts 1 〇. Although the present invention has been particularly shown and described with reference to the exemplary embodiments thereof, the invention is not limited to the embodiments. It will be appreciated by those skilled in the art that various changes in form and detail may be made without departing from the spirit and scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS FIGS. 1A to 1D are respectively a front view, a side view, a rear view and a plan view of a connector according to a first exemplary embodiment of the present invention; FIGS. 2A to 2D are respectively at the 1A A front view, a side view, a rear view and a plan view of one of the internal substrates inserted into the connector of FIG. 1A; FIGS. 3A to 3D are respectively taken along line 3a-3a, 3b-3b of FIG. 2B, Sections 3 c - 3 c and 3 d - 3 d; Figures 4A to 4C are sections along lines 4a-4a, 4b-4b and 4c-4c of Figure 2C, respectively, Figures 4A and 4B show The state in which the terminals are fixed; FIG. 5A is a diagram for describing the configuration of the plurality of contacts (pins) of the connector in FIGS. 1A to 1D with respect to a mounting substrate. Figure 5B is a diagram for describing the arrangement of the contacts with respect to an insulator; Figure 6 is a diagram for describing the pin assignment of an HDMI (High Resolution Multimedia Interface): 7A to 7 C The drawings are respectively a side view, a front view and a rear view of an internal substrate of a connector of a second exemplary embodiment of the present invention; FIGS. 8A to 8C are respectively taken along lines 8a-8a of FIGS. 7A and 7B; Sections 8b-8b and 8c-8c' For the convenience of description, FIGS. 8A and 8B are only partially hatched; FIGS. 9A to 9E are diagrams according to the third exemplary embodiment 135-6551 of the present invention, respectively. The bottom view, the side view, the rear view, the front view, and the plan 10A to 10C of a connector of the line of the i 9E are respectively sectional views along the 9A ΐ 10a-10a, 10b-10b, and 10c-10c. [Main component symbol description]
10 接 點 20 絕 緣 體 (外罩） 30 殼 3 0a 殻 端 子 40 內 部 基 板 4 1 第 — 導 電 圖 案 4 1b 終 端 42 第 二 導 電 圖 案 42a 起 端 42b 終 端 43 第 三 導 電 圖 案 44 第 四 導 電 圖 案 45 通 孔 49 半 導 體 溝 槽 (定 50 端 子 5 0a 端 子 5 0b 端 子 50c 端 子 50d 端 子 60 端 子 -16- 135655110 Contact 20 Insulator (cover) 30 Shell 3 0a Shell terminal 40 Internal substrate 4 1 - Conductive pattern 4 1b Terminal 42 Second conductive pattern 42a Starting end 42b Terminal 43 Third conductive pattern 44 Fourth conductive pattern 45 Through hole 49 Semiconductor trench (fix 50 terminal 5 0a terminal 5 0b terminal 50c terminal 50d terminal 60 terminal-16- 1356551
70 安裝基板 80 接地板 8 1 通孔 82 通孔電鍍層 82' 避開部 83 通孔電鍍層 8 3 ' 避開部 84 墊 85 墊 86 墊 90 絕緣體 9 1 上表面 92 下表面 93 握持部 94 握持部 1 00 殼 10 1 殼安裝端子 1 02 殼安裝端子 1 03 殼安裝端子 104 殼安裝端子70 Mounting substrate 80 Grounding plate 8 1 Through hole 82 Through hole plating layer 82' Avoiding portion 83 Through hole plating layer 8 3 'Without portion 84 Pad 85 Pad 86 Pad 90 Insulator 9 1 Upper surface 92 Lower surface 93 Grip 94 Grip 1 00 Shell 10 1 Housing Mounting Terminal 1 02 Housing Mounting Terminal 01 Housing Mounting Terminal 104 Housing Mounting Terminal