[go: up one dir, main page]

JP2008032620A - プローブピン - Google Patents

プローブピン Download PDF

Info

Publication number
JP2008032620A
JP2008032620A JP2006208123A JP2006208123A JP2008032620A JP 2008032620 A JP2008032620 A JP 2008032620A JP 2006208123 A JP2006208123 A JP 2006208123A JP 2006208123 A JP2006208123 A JP 2006208123A JP 2008032620 A JP2008032620 A JP 2008032620A
Authority
JP
Japan
Prior art keywords
probe pin
contacts
probe
contact
tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006208123A
Other languages
English (en)
Japanese (ja)
Inventor
Kiyoshi Takekoshi
清 竹腰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2006208123A priority Critical patent/JP2008032620A/ja
Priority to PCT/JP2007/063475 priority patent/WO2008015868A1/ja
Priority to TW96124509A priority patent/TW200819752A/zh
Publication of JP2008032620A publication Critical patent/JP2008032620A/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
JP2006208123A 2006-07-31 2006-07-31 プローブピン Pending JP2008032620A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2006208123A JP2008032620A (ja) 2006-07-31 2006-07-31 プローブピン
PCT/JP2007/063475 WO2008015868A1 (fr) 2006-07-31 2007-07-05 Broche de contrôle
TW96124509A TW200819752A (en) 2006-07-31 2007-07-05 Probe pin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006208123A JP2008032620A (ja) 2006-07-31 2006-07-31 プローブピン

Publications (1)

Publication Number Publication Date
JP2008032620A true JP2008032620A (ja) 2008-02-14

Family

ID=38997050

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006208123A Pending JP2008032620A (ja) 2006-07-31 2006-07-31 プローブピン

Country Status (3)

Country Link
JP (1) JP2008032620A (zh)
TW (1) TW200819752A (zh)
WO (1) WO2008015868A1 (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012042448A (ja) * 2010-08-23 2012-03-01 Star Technologies Inc 半導体素子のプローブカード及びその垂直型プローブ
JP2013181824A (ja) * 2012-03-01 2013-09-12 Mitsubishi Electric Corp 電気特性測定方法、コンタクトプローブ
JP2013205191A (ja) * 2012-03-28 2013-10-07 Nidai Seiko:Kk スプリングプローブおよびスプリングプローブの製造方法
WO2015194385A1 (ja) * 2014-06-16 2015-12-23 オムロン株式会社 プローブピン

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6737002B2 (ja) * 2016-06-17 2020-08-05 オムロン株式会社 プローブピン
JP7620385B2 (ja) * 2019-04-25 2025-01-23 オムロン株式会社 プローブピン、検査治具および検査ユニット
DE102022119935A1 (de) * 2022-08-08 2024-02-08 Ingun Prüfmittelbau Gmbh Prüfstiftvorrichtung

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000121673A (ja) * 1998-08-12 2000-04-28 Tokyo Electron Ltd コンタクタ
JP2001052827A (ja) * 1999-08-06 2001-02-23 Mitsubishi Electric Corp テスト用ソケット、その製造方法、テスト用ソケットを用いたテスト方法、及び被テスト部材

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000121673A (ja) * 1998-08-12 2000-04-28 Tokyo Electron Ltd コンタクタ
JP2001052827A (ja) * 1999-08-06 2001-02-23 Mitsubishi Electric Corp テスト用ソケット、その製造方法、テスト用ソケットを用いたテスト方法、及び被テスト部材

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012042448A (ja) * 2010-08-23 2012-03-01 Star Technologies Inc 半導体素子のプローブカード及びその垂直型プローブ
JP2013181824A (ja) * 2012-03-01 2013-09-12 Mitsubishi Electric Corp 電気特性測定方法、コンタクトプローブ
JP2013205191A (ja) * 2012-03-28 2013-10-07 Nidai Seiko:Kk スプリングプローブおよびスプリングプローブの製造方法
WO2015194385A1 (ja) * 2014-06-16 2015-12-23 オムロン株式会社 プローブピン
US10145862B2 (en) 2014-06-16 2018-12-04 Omron Corporation Probe pin
KR101948401B1 (ko) * 2014-06-16 2019-02-14 오므론 가부시키가이샤 프로브 핀

Also Published As

Publication number Publication date
WO2008015868A1 (fr) 2008-02-07
TWI341389B (zh) 2011-05-01
TW200819752A (en) 2008-05-01

Similar Documents

Publication Publication Date Title
JP5868239B2 (ja) プローブ及びプローブカード
CN104062476B (zh) 探针卡用导板
CN101454946B (zh) 电连接器
WO2007129686A1 (ja) プローブ
JPWO2017179320A1 (ja) プローブピン及びこれを用いた電子デバイス
WO2008015868A1 (fr) Broche de contrôle
JP4859820B2 (ja) プローブ
JP2018179934A (ja) 電気的接続装置
JPWO2005011069A1 (ja) ソケット、及び試験装置
JP2007017234A (ja) 検査装置用ソケット
JP2006132982A (ja) プローブ
JP5673366B2 (ja) 半導体素子用ソケット
JP5147227B2 (ja) 電気的接続装置の使用方法
TWI708949B (zh) 探針及測試裝置
US9435854B2 (en) Electrical contactor and contact method for the same
CN112526178B (zh) 探针及测试装置
JP2005292019A (ja) プローブ
JP2007127488A (ja) プローブカード
CN220961635U (zh) 一种用于ic测试使用的接触式探针
JP4056983B2 (ja) プローブカード
JP4044270B2 (ja) ソケット
JP3908230B2 (ja) プローブ
JP2006337080A (ja) 通電試験用プローブ
JP2007205861A (ja) プローブピン及びプローブカード
JP2005345171A (ja) 半導体素子の検査装置

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20090219

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110621

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20111101