JP2008004618A - Method of manufacturing semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To ease assembling of a shaft to a roll sponge during scrubbing cleaning for manufacture or the like of a semiconductor device. <P>SOLUTION: A shaft 20 for assembling a roll sponge includes an inside main body 20a as a main body of the shaft and an outer periphery 20b, separately. The outer periphery 20b is divided into four sections or the like. The outer periphery 20b is inserted into the roll sponge beforehand, and the inside main body 20a is inserted into the inside of the inserted outer periphery 20b in a condition without friction resistance. The outer periphery 20b is pressed to the inner peripheral surface of the roll sponge to easily assemble the shaft 20. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a technology of a semiconductor device, and in particular, is a technology effective when applied to the assembly of a roll sponge in scrub cleaning.

  The technology described below has been studied by the present inventors in completing the present invention, and the outline thereof is as follows.

  In chemical mechanical polishing, scrub cleaning using a roll sponge is performed after chemical mechanical polishing is completed. By such scrub cleaning, polishing residue generated during chemical mechanical polishing is effectively removed, followed by drying.

  The roll sponge used in such scrub cleaning is formed into a hollow roll having irregularities on the peripheral surface, and is assembled by inserting a shaft inside. However, when assembling the shaft, it is necessary to assemble the shaft so that the shaft does not idle in the roll sponge. When inserting the shaft, the frictional resistance with the roll sponge is large, which is not easy.

With regard to such assembling work, for example, there is a technique disclosed in Patent Document 1 aiming at ease of assembling.
JP 2001-293439 A

  However, the present inventors have found that the following problems still remain in the shaft assembling technique.

  For example, in the technique disclosed in Patent Document 1, a roll sponge formed of polyvinyl alcohol or the like is once moistened to a wet state, and a jig is inserted and dried in that state to widen the hollow inner diameter. . Further, the jig is removed with the inner diameter expanded, the shaft is inserted, and then the wet state is restored, and the shaft is securely assembled in the roll sponge.

  In the disclosed technique, it is necessary to make a roll sponge with a reversible material that can cope with a wet state and a dry state, and a separate drying device or the like is required for drying with a jig inserted. Although such a configuration is certainly an excellent technique, it requires an additional drying process and equipment such as a drying apparatus, and is difficult to employ in scissors for scrub cleaning where more labor saving and efficiency are desired.

  Further, as an assembly technique currently being implemented, there is a technique in which a thin plate used as a guide is first inserted into a roll sponge, a shaft is inserted along the guide, and a guide is finally pulled out.

  However, in this technique, in the process of pulling out the guide at the end, there is a considerable frictional resistance with the roll sponge, and when the guide is pulled out, there are many problems that the roll brush is twisted or displaced. In order to eliminate such twists or misalignments, it was necessary to rework them.

  An object of the present invention is to provide a technique for facilitating the assembly of a roll sponge shaft used in manufacturing a semiconductor device or the like.

  The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

  Of the inventions disclosed in the present application, the outline of typical ones will be briefly described as follows.

  That is, the shaft to be inserted into the roll sponge is divided into an inner main body and an outer peripheral portion, and the inner main body corresponding to the shaft main body is inserted with the outer peripheral portion inserted into the roll sponge. Easy assembly of the shaft.

  Among the inventions disclosed in the present application, effects obtained by typical ones will be briefly described as follows.

  For the roll sponge, insert the outer periphery of the shaft, which has a separate outer periphery and inner body, and insert the inner body inside the inserted outer periphery to take into account the frictional resistance with the roll sponge. As a result, the shaft can be easily assembled.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that components having the same function are denoted by the same reference symbols throughout the drawings for describing the embodiment, and the repetitive description thereof may be omitted.

(Embodiment 1)
FIG. 1 is a conceptual diagram schematically showing a main part of a scrub cleaning apparatus as a semiconductor manufacturing apparatus used in the present invention. FIG. 2 is a perspective view of a roll sponge used in the scrub cleaning apparatus. FIG. 3 is a cross-sectional view showing a divided structure of the shaft assembled to the roll sponge. FIG. 4A is a perspective view showing the entire configuration of the shaft assembled to the roll sponge, and FIG. 4B is a cross-sectional view. FIG. 5 is an exploded perspective view showing a divided structure of the shaft.

  In the present invention, a scrub cleaning apparatus 10a as the semiconductor manufacturing apparatus 10 is used. The scrub cleaning apparatus 10a is used for cleaning a silicon wafer after completion of chemical mechanical polishing in a multilayer wiring process such as a damascene process.

  For example, scrub cleaning means that the roll sponge is brought into contact with the wafer surface at an appropriate pressure while rotating the wafer, and the roll sponge is rotated and moved while flowing pure water or the like. The thing is removed.

  In this scrub cleaning apparatus 10a, for example, as schematically shown in FIG. 1, roll sponges 12 are provided on the front side and the back side of the wafer W while the wafer W is rotatably held by the spin chuck 11. The contact is made at a predetermined pressure.

  That is, the wafer W is rotated by a plane by the spin chuck 11 and is sandwiched by the roll sponge 12 from the front side and the back side while being rotated in a plane. Further, in this state, the roll sponge 12 is rotated so that unnecessary substances such as dust attached to the wafer W can be effectively removed.

  As shown in FIG. 2, the roll sponge 12 used for scrub cleaning is formed in a hollow cylindrical shape having a large number of convex portions 13 around it. A shaft 20 shown in FIG. 3 is inserted into the hollow portion 14 so as to be assembled.

  As shown in the cross-sectional view of FIG. 3, the shaft 20 includes an inner body 20a that is a shaft body and an outer peripheral portion 20b. The inner main body 20a and the outer peripheral portion 20b are configured separately from each other, and can be handled separately when the shaft 20 is assembled.

  In the shaft 20 having such a configuration, as shown in the perspective view of FIG. 4A, a protrusion 21 is provided around the inner body 20a. As shown in FIGS. 4A and 4B, an outer peripheral portion 20 b is assembled between the protrusions 21.

  In the case shown in FIG. 4A, four protrusions 21 are provided at equal intervals around the inner body 20a. The protrusion 21 is provided along the longitudinal direction of the inner main body 20a. The outer peripheral portion 20b is divided and formed in accordance with the protrusion 21. The outer peripheral part 20b is formed in the shape which peeled off the outer peripheral side between the protrusions 21 of the inner main body 20a with a predetermined layer thickness.

  Therefore, in a state where each of the divided outer peripheral portions 20b is assembled on the inner main body 20a side, the inner main body 20a is wrapped from the outer peripheral side. That is, the outer peripheral side of the inner main body 20a can be covered with a predetermined layer thickness. Such a state is shown in FIG.

  FIG. 5 is an exploded perspective view showing that the outer peripheral portion 20b is divided into four equal parts. As is clear from the cross-sectional view shown in FIG. 4B, the side of the outer peripheral portion 20b that contacts the inner body 20a is not formed in an arc shape, but is formed in a concave shape having a corner, and the inner body. The outer surface side of 20a and the inner surface side of the outer peripheral portion 20b are configured to be fitted together.

  The side that contacts the inner body 20a of the outer peripheral portion 20b may be formed in an arc shape, but in such a case, the circumference ratios of the outer surface side of the inner main body 20a and the inner surface side of the outer peripheral portion 20b are matched. In order to increase the production cost, high-precision machining is required, so a shape that is easy to process with a square shape was adopted.

  Further, as shown in FIGS. 4A and 5, the protrusion 21 provided on the inner body 20 a side is provided with a chemical discharge port 22, and scrub cleaning is performed with the shaft 20 assembled in the roll sponge 12. At this time, a required chemical solution is supplied from the chemical solution discharge port 22 of the shaft 20 so that the roll sponge 12 can be in a wet state.

  Furthermore, a groove 23 is provided on the outer surface side of the outer peripheral portion 20b along the longitudinal direction of the outer peripheral portion 20b. When the groove 23 is in contact with the inner surface side of the roll sponge 12, the inner surface side of the roll sponge 12 is slightly inside the groove 23. The roll sponge 12 is configured so that the roll sponge 12 and the outer peripheral portion 20b are engaged with each other.

  As shown in FIGS. 4A and 5, the inner side 20 a side of the shaft 20 is further provided with a flange 24 that functions as a stopper when inserted into the roll sponge 12 for a predetermined length on one end side. Yes. The other end is provided with a threaded portion 25 having a threaded surface.

  The shaft 20 having such a configuration is assembled in the roll sponge 12 as follows. First, as shown in FIG. 6B, the outer peripheral portion 20b of the shaft 20 is inserted into the hollow portion 14 in the roll sponge 12 schematically shown in a sectional view in FIG. When inserting, it inserts in the state which combined the outer peripheral part 20b divided | segmented so that the hole for inner side main body 20a insertion might be formed inside.

  In a state where the outer peripheral portion 20b is inserted in combination in this way, as shown in FIG. 6C, even if the divided outer peripheral portions 20b are combined, the whole does not become a perfect circle, and accordingly, the hollow portion 14 The inner diameter is smaller than the inner diameter. The inner side surrounded by the outer peripheral portion 20b is still hollow.

  After the outer peripheral portion 20 b is inserted into the hollow portion 14 in this way, the inner main body 20 a that is a shaft main body is further inserted into the hollow portion 14. When inserting the inner main body 20a, the inner main body 20a is inserted so as to be inserted into the hollow portion 14 inside the outer peripheral portion 20b previously inserted. Such a state is shown in FIG.

  As the inner main body 20a is inserted inside the outer peripheral portion 20b, the outer peripheral portion 20b is expanded so as to be pressed against the inner peripheral surface side of the roll sponge 12. As the outer peripheral surface side of the outer peripheral portion 20b is pushed and spread, friction with the inner peripheral surface side of the roll sponge 12 is generated and cannot be removed. On the other hand, since the inner body 20a is inserted inside the outer peripheral portion 20b, the frictional resistance generated at the time of insertion is not so much and can be easily inserted although it is tight.

  In this way, as shown in FIG. 7A, the shaft 20 is inserted into the roll sponge 12 until the flange portion 24 of the inner body 20a stops, and then fixed with the screw portion 25 so that the shaft 20 does not come off. .

  When the inner body 20a is inserted into the outer peripheral portion 20b, as shown in FIG. 7 (a), the front end of the screw portion 25 on the insertion end side of the shaft 20 is first inserted to facilitate insertion. What is necessary is just to attach the taper tool 30 for insertion provided with the taper so that attachment or detachment is possible. The insertion taper 30 may be removed when the shaft 20 is assembled into the roll sponge 12.

  As described above, in the present invention, when the shaft 20 is assembled into the roll sponge 12, the shaft 20 in which the outer peripheral portion 20b and the inner body 20a are configured separately is inserted, and the outer peripheral portion 20b is first inserted into the roll sponge 12. Keep it. Thereafter, the inner body 20a is inserted so as to spread the outer peripheral portion 20b, whereby the shaft 20 can be easily assembled into the roll sponge 12.

  In such a configuration, the shaft 20 is configured separately to the outer peripheral portion 20b and the inner main body 20a, and the outer peripheral portion 20b is first inserted into the roll sponge 12, and then the inner main body is placed inside the outer peripheral portion 20b. The structure which inserts 20a is employ | adopted. When the outer peripheral portion 20b is inserted into the roll sponge 12, as described above, it can be inserted with a diameter smaller than the inner diameter of the roll sponge 12, so that an insertion failure due to frictional resistance with the roll sponge 12 does not occur.

  Further, when the inner body 20a is inserted inside the outer peripheral portion 20b, the inner main body 20a and the outer peripheral portion 20b can be tightly inserted when the inner body 20a and the outer peripheral portion 20b are made of, for example, a similar metal or plastic having a low frictional resistance. However, there is no frictional obstacle with respect to the roll sponge 12 made of polyvinyl alcohol (PVA) or the like.

  Therefore, in the configuration in which the outer peripheral portion 20b and the inner main body 20a are inserted into the roll sponge 12 and integrally assembled, the outer peripheral portion 20b is not easily twisted or displaced with respect to the inner main body 20a and quickly and easily assembled. It can be performed.

  The conventional technology was based on the premise that the completed shaft was inserted into the roll sponge, so the inner diameter of the roll sponge was once expanded, or the guide was pulled out after inserting the shaft with a guide. It was necessary to do.

  However, the shaft is divided into an inner body and an outer peripheral portion, and the outer peripheral portion side that contacts the inner peripheral surface of the roll sponge is inserted into the roll sponge first, and then the outer peripheral portion is guided inside the outer peripheral portion side. As a result, it was very easy to assemble the roll sponge.

  The scrub cleaning apparatus 10a having such a configuration is used, for example, in conjunction with the chemical mechanical polishing apparatus 40 to perform wafer cleaning after completion of chemical mechanical polishing.

  Incidentally, the chemical mechanical polishing apparatus 40 is configured as follows. As shown in FIG. 8, a chemical mechanical polishing apparatus (CMP apparatus: Chemical Mechanical Polish apparatus) 40 includes a casing 41 having an upper opening, and a motor is connected to the casing 41 via a rotating shaft 42. A polishing disc 44 rotated by 43 is provided. A polishing pad 45 is attached to the surface of the polishing board 44.

  On the other hand, the wafer W is held in the recess 46a of the wafer carrier 46 with the surface to be polished facing downward, as shown in FIG. The wafer carrier 46 is integrated with the drive shaft 47 and is rotated relative to the polishing board 44 by a motor (not shown), and moves up and down so that the surface to be polished of the wafer W can be pressed against the polishing pad 45 with a predetermined pressure. It is configured to be possible.

  Slurry S is supplied by the slurry supply pipe 48 between the polishing pad 45 and the surface to be polished of the wafer W, and the surface to be polished of the wafer W that is rotationally pressed against the polishing pad 45 is chemically and mechanically polished. It is supposed to be polished.

  In addition, the chemical mechanical polishing apparatus 40 is provided with a dresser 49 that is rotated by a drive shaft 49a driven by a motor, and can be appropriately pressed onto the polishing pad 45 to shape the surface of the polishing pad 45. It is like that.

  The chemical mechanical polishing apparatus 40 having such a configuration and the scrub cleaning apparatus 10a are combined, for example, as shown in FIGS. 9A and 9B so as to perform a series of chemical mechanical polishing processes. ing. Of course, the scrub cleaning apparatus 10a may be used only for scrub cleaning independently without being incorporated into the series of chemical mechanical polishing steps.

  For example, in the configuration shown in FIG. 9A, the transfer robot 50 is placed in the center, and the wafer loaded from the load unit 60 a is transferred to the chemical mechanical polishing apparatus 40 by the transfer robot 50. After a predetermined chemical mechanical polishing is performed, the wafer is again sent to the anticorrosion processing unit 70 by the transfer robot 50.

  After the corrosion prevention process is completed, the wafer is again sent to the scrub cleaning processing unit 80 by the transfer robot 50 and scrub cleaned. In the scrub cleaning, as described above, the roll sponge 12 provided with the shaft 20 in which the inner main body 20a and the outer peripheral portion 20b are configured separately is used. After the scrub cleaning, the scrub is sent to a drying processing unit 90 and dried. The dried wafer is transferred from the unload unit 60b to the next process by the transfer robot 50.

  The configuration shown in FIG. 9B is the same as that shown in FIG. 9A, and the wafer loaded from the load unit 60a is transferred to the chemical mechanical polishing apparatus 40 by the transfer robot 50, and the chemical mechanical polishing is performed. Processing is performed. After that, the anticorrosion processing unit 70 performs the anticorrosion processing, and after the anticorrosion processing is completed, the scrub cleaning processing unit 80 performs the scrub cleaning, and finally the drying processing unit 90 performs the drying processing, and moves from the unload unit 60b to the next process. It is.

  As a semiconductor device manufactured through a series of chemical mechanical polishing steps including scrub cleaning as described above, a semiconductor device in which multilayer wiring is formed using a damascene process can be cited. Hereinafter, a method for manufacturing a semiconductor device of the present invention will be described with an example of such a damascene process.

  FIG. 10 shows a cross-sectional view of the semiconductor device 100. In the case shown in FIG. 10, a state immediately before chemical mechanical polishing is shown. An n-type well 102 and a field oxide film 103 are provided on the main surface of a wafer 101 made of p-type single crystal silicon. A p-channel type MISFET (Qp) is provided in the active region of the n-type well 102 surrounded by the field oxide film 103.

  The p-channel type MISFET mainly includes a gate oxide film 104 formed on the surface of the n-type well 102, a gate electrode 105 formed on the gate oxide film 104, and a source and drain formed on both sides of the gate electrode 105. As a pair of p-type semiconductor regions 106.

  Although not shown, a p-type well in which an n-channel MISFET is formed is provided in another region of the wafer 101.

  A silicon oxide film 107 is provided on the p-channel MISFET, and wirings 109, 110, and 111 are formed on the silicon oxide film 107 through the contact holes 108 provided in the silicon oxide film 107 as the first layer. Wiring is provided. The wirings 109, 110, and 111 are connected to the p-type semiconductor region 106 through, for example, the contact holes 108, and are formed by depositing tungsten (W) by sputtering or the like.

  A silicon oxide film 112 is provided on the wirings 109, 110, and 111, and through holes 113 and 114 are provided in the silicon oxide film 112. Plugs 115 are embedded in the through holes 113 and 114. The plug 115 is formed by etching back tungsten deposited by CVD.

  A silicon oxide film 116 is further provided on the silicon oxide film 112, and concave grooves 117 and 118 are formed in the silicon oxide film 116 on the through holes 113 and 114. A copper (Cu) film 119 is provided on the silicon oxide film 116 including the inside of the concave grooves 117 and 118 by a sputtering method or the like.

  The copper film 119 having such a structure is chemically mechanically polished by the chemical mechanical polishing apparatus 40 described above, and is flatly polished as shown in FIG. Thus, copper wirings 120 and 121 as second wiring layers are formed in the concave grooves 117 and 118.

  Since the copper wirings 120 and 121 are formed by grinding the copper film 119 by chemical mechanical polishing, a slurry residue containing particles such as abrasive grains or metal such as copper oxide is formed on the wafer surface. It is attached. Scrub cleaning is used to remove such deposits.

  For such scrub cleaning, a roll sponge 12 into which a shaft 20 in which an inner main body 20a and an outer peripheral portion 20b are separately formed is inserted is used. The assembly of the shaft 20 to the roll sponge 12 is different from the conventional methods, and the outer peripheral portion 20b of the shaft 20 is first inserted into the roll sponge 12, and then the outer peripheral portion 20b is used as a guide as the shaft body. Since the inner body 20a is inserted, the shaft assembly of the roll sponge 12 is very simple and can be performed without any trouble.

(Embodiment 2)
In the present embodiment, as shown in FIG. 12A, the cross-sectional shape of the contact surface of the outer peripheral portion 20b described in the first embodiment with the inner body 20a is changed. That is, the angle of the hooked portion on the inner peripheral surface is kept constant so that the machining time can be shortened.

  Further, as shown in FIG. 12B, the processing time can be further shortened by changing the cross-sectional shape of the outer surface of the outer peripheral portion 20b that contacts the inner peripheral surface of the roll sponge 12 described in the first embodiment. It was. That is, the arc shape is changed to a square shape whose outer edge is formed by a straight line.

  With such a square shape, the outer peripheral portion 20b is easily caught on the roll sponge 12 without providing the groove 23 shown in the first embodiment on the outer surface, and the shaft 20 is easily fixed in the roll sponge 12. There is also.

  As mentioned above, the invention made by the present inventor has been specifically described based on the embodiment. However, the present invention is not limited to the embodiment, and various modifications can be made without departing from the scope of the invention. Needless to say.

  In the said embodiment, although the case where an outer peripheral part was comprised in 4 division was shown, if it is 2 divisions or more, it can be used fundamentally. However, it is more preferable that the structure is divided into three or more parts to allow easy insertion when the outer peripheral portion is placed in the roll sponge.

  In the above embodiment, the case where the present invention is grasped as a method for manufacturing a semiconductor device has been described. However, from the description of the above embodiment, the present invention is used as a semiconductor manufacturing apparatus such as a scrub cleaning apparatus or a scrub cleaning apparatus. It can also be grasped as a roll sponge to be used, or as a shaft attachment method of a roll sponge used in a scrub cleaning device.

  In the above embodiment, scrub cleaning is described by taking a silicon wafer as an example. However, the object to be scrub cleaned is not limited to a silicon wafer, and when scrub cleaning is performed using a roll sponge with electronic components. Can also be widely applied.

  The present invention can be used in the field of manufacturing semiconductor devices that perform scrub cleaning using a roll sponge.

It is the fragmentary explanatory view showing typically the principal part of one example of the scrub cleaning device used in the present invention. It is a perspective view of the roll sponge used by this invention. It is sectional drawing which shows typically the division | segmentation structure of the shaft attached to the roll sponge used by this invention. (A) is a perspective view which shows the whole structure of the shaft attached to the roll sponge used by this invention, (b) is sectional drawing. It is a disassembled perspective view which shows the division | segmentation structure of the shaft attached to the roll sponge used by this invention. (A), (b), (c) is explanatory drawing which shows typically the attachment procedure of the shaft to a roll sponge. (A), (b) is explanatory drawing which shows typically the attachment procedure of the shaft to a roll sponge. It is explanatory drawing which shows the structure of a chemical mechanical polishing apparatus typically. (A), (b) is explanatory drawing which shows the apparatus structure in the case of performing a series of chemical mechanical polishing processes including scrub cleaning. It is sectional explanatory drawing which shows an example of the semiconductor device to which this invention is applied. It is sectional explanatory drawing which shows an example of the semiconductor device to which this invention is applied. (A), (b) is sectional explanatory drawing which shows the modification of an outer peripheral part typically.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Semiconductor manufacturing apparatus 10a Scrub cleaning apparatus 11 Spin chuck 12 Roll sponge 13 Convex part 14 Hollow part 20 Shaft 20a Inner main body 20b Outer part 21 Protrusion 22 Chemical solution discharge port 23 Groove 24 Grow part 25 Screw part 30 Insertion taper tool 40 Chemical Mechanical polishing device 41 Housing 42 Rotating shaft 43 Motor 44 Polishing board 45 Polishing pad 46 Wafer carrier 46a Recess 47 Drive shaft 48 Slurry supply pipe 49 Dresser 49a Drive shaft 50 Transport robot 60a Loading section 60b Unloading section 70 Corrosion protection processing section 80 Scrub Cleaning unit 90 Drying processing unit 100 Semiconductor device 101 Wafer 102 N-type well 103 Field oxide film 104 Gate oxide film 105 Gate electrode 106 P-type semiconductor region 107 Silicon oxide film 108 Contact hole 109 Wiring 110 Wiring 111 Wiring 112 Silicon oxide film 113 Through hole 114 Through hole 115 Plug 116 Silicon oxide film 117 Concave groove 118 Concave groove 119 Copper film 120 Copper wiring 121 Copper wiring Qp p channel type MISFET
S slurry

Claims (5)

A method of manufacturing a semiconductor device including a step of scrub cleaning,
In the scrub cleaning, a method of manufacturing a semiconductor device is characterized in that a roll sponge in which a shaft in which an outer peripheral portion and an inner main body are separately formed is inserted is used. A method of manufacturing a semiconductor device including a step of scrub cleaning,
In the scrub cleaning, the hollow roll sponge used for cleaning includes an outer peripheral portion in which the outer peripheral portion of the shaft that contacts the hollow inner surface of the roll sponge is divided, and an inner portion configured separately from the outer peripheral portion. A method of manufacturing a semiconductor device, wherein the shaft having a main body is inserted. A method of manufacturing a semiconductor device including a step of scrub cleaning,
In the scrub cleaning, the outer peripheral portion of the shaft, in which the outer peripheral portion and the inner main body are configured separately, is first inserted into the hollow portion of the roll sponge, and then the inner main body is inserted, and the outer peripheral portion and the outer main portion are inserted. A method for manufacturing a semiconductor device, comprising: using the roll sponge in which an inner body is assembled in the hollow portion and the shaft is integrally formed. A method of manufacturing a semiconductor device including a step of scrub cleaning,
The roll sponge used in the scrub cleaning is provided with a shaft in which the inner main body and the outer peripheral portion are configured separately,
The outer peripheral portion is formed so as to surround the periphery of the inner main body of the shaft, and is divided along the axial direction of the shaft,
In assembling the roll sponge, the outer peripheral portion is inserted into the roll sponge, and the inner main body is inserted inside the outer peripheral portion. A method of manufacturing a semiconductor device including a step of scrub cleaning,
The roll sponge used in the scrub cleaning is inserted with a shaft in which the inner main body and the outer peripheral portion are configured separately,
The outer peripheral portion is formed so as to surround the inner main body of the shaft, and is divided along the axial direction of the shaft,
When assembling the roll sponge, the outer peripheral portion is first inserted into the roll sponge, the inner main body is inserted inside the inserted outer peripheral portion, and the protrusion is provided between the protrusions provided around the inner main body. A method of manufacturing a semiconductor device, wherein the semiconductor device is assembled so that an outer peripheral portion is accommodated.

Images