JP2007009255A - Film deposition device and film deposition method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a film deposition device with which the temperature of a substrate can be easily controlled and a deposited film product having high performance and high quality can be obtained by holding the substrate in such a manner that the deformation of the substrate is suppressed to be small, and to provide a film deposition method. <P>SOLUTION: In the film deposition device which has a vacuum chamber, and a substrate holder for holding the substrate and a vaporization source in the chamber and which deposits a film on the surface of the substrate, the substrate holder has: a surface which opposes to the vaporization source and transmits the heat from a heat source to the substrate in order to heat the substrate to a prescribed temperature while being brought into contact with the rear surface of the substrate; and a tensile force-imparting holding means for imparting a tensile force to the substrate in the direction orthogonal to the thickness direction of the substrate. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

The present invention relates to a film deposition apparatus and a film deposition method for obtaining a film deposit by evaporating a raw material in a vacuum and depositing the evaporated raw material on a substrate.

  Conventionally, as a method for depositing a raw material film on a substrate, a film deposition method by a vapor deposition method such as a (vacuum) vapor deposition method, a sputtering method, and a CVD method is widely known. Here, there are various forms of the substrate holder for holding the substrate. Generally, the substrate only needs to be fixed at a predetermined position of the substrate holder during deposition of the raw material film.

  However, in reality, the base material and the base material holder are microscopically deformed due to their thermal expansion due to the heat of the base material, such as radiant heat from the evaporation source and sensible heat of the evaporated steam. Are not fixed and are moving with each other. Moreover, internal stress and distortion arise from the restraining force by fixing a base material and a base material holder, and it may lead to destruction, such as a base material generally cracking weaker than a base material holder depending on the case. is there.

  Also, when fixing the base material to the base material holder, if the area of the base material is large and the thickness is thin, if the peripheral part of the base material is held by the base material holder, the weight of the base material For example, the central portion may bend downward. If the raw material film is deposited on the base material in this state and then the base material is used in a flat plate shape, stress may be generated in the raw material film, which may cause a change in the characteristics of the raw material film or a crack.

  On the other hand, when heat such as radiant heat from an evaporation source or sensible heat of evaporation vapor is applied to the base material, the temperature of the base material rises, and the performance of the deposited raw material film may change.

  As an example in which such a raw material film is deposited, for example, there is production of a stimulable phosphor panel which is a recording medium used in a radiation image recording / reproducing system.

  The radiation image recording / reproducing system accumulates a part of this radiation energy when irradiated with radiation such as X-rays, and then stores stimulated luminescence according to the accumulated radiation energy when irradiated with excitation light such as visible light. Using a fluorescent phosphor (stimulable phosphor), a radiation image of a subject such as a human body is temporarily recorded as a latent image on the stimulable phosphor layer, and excitation light such as laser light is applied to the stimulable phosphor layer. It is known as a system comprising a radiation image recording device and a radiation image reading device that irradiates and generates stimulated emission light and photoelectrically detects the stimulated emission light to acquire an image signal indicating a radiation image of a subject. ing.

  While this stimulable phosphor panel has a demand to record and reproduce radiation images with high resolution, the stimulable phosphor layer filled with the stimulable phosphor can record and reproduce radiation images with high resolution. Are known.

  In general, a base material used for producing a stimulable phosphor panel has a large surface area (for example, the size of the base material is 300 mm × 300 mm or more), and the thickness of the base material is thin (for example, the base material). Therefore, when the stimulable phosphor panel is held in the vapor deposition apparatus via the peripheral portion of the base material, the central portion of the base material bends downward due to the weight of the base material. When the stimulable phosphor layer is deposited on the base material as it is, when the bent base material is returned to a predetermined flat plate shape, it is between the stimulable phosphor layer and the base material. The storage phosphor layer may be peeled off due to shear stress, or the storage phosphor layer may be cracked by internal stress generated in the storage phosphor layer. In particular, since the stimulable phosphor layer is deposited to have a thickness (for example, 500 μm) thicker than a normal thickness (for example, a thickness of several μm), a normal layer thickness is used when returning the bent shape to a flat plate shape. Larger shear stress and internal stress are generated as compared with the deposited layer deposited in (1).

  Note that the above-mentioned problem is not limited to the case where the stimulable phosphor layer is deposited by vapor deposition on the base material, but must be generally considered.

  The following methods for dealing with these problems are disclosed.

(1) A method of electrostatic adsorption (for example, Patent Document 1).
The base material can be adsorbed to the base material holder by an electrostatic force, and deformation of the base material itself can be prevented.

(2) A method using magnetic attraction (for example, Patent Document 2).
The base material can be adsorbed to the base material holder by a magnetic attraction force, and deformation of the base material itself can be prevented.

(3) A method of applying pressure to the base material so as to follow the base (for example, Patent Document 3).
The base material is held at both ends of the base material by holding members, and presses the base material so that the holding members come close to each other, and bends to the opposite side of gravity. And the base material side surface of the base provided on the base material has a concave shape downward, and the base material is aligned with this concave shape.

(4) A method of reducing the amount of bending due to its own weight by applying tension to the substrate (for example, Patent Document 3). The base material is held at both ends of the base material by holding members, and by applying tension to the base material so that the holding members are separated from each other, the amount of bending of the convex shape due to the weight of the base material is reduced. Yes.
Japanese Patent Laid-Open No. 2003-344592 JP 2004-18938 A JP 2004-37234 A

  However, the method described in (1) has the following problems. First, in order to perform adsorption by electrostatic force, it is necessary that the base material is polarized by a dielectric. Therefore, there are limitations on the base material used. Further, in order to cause polarization, a high voltage of 3 to 10 kV is required. For example, it is necessary to provide a counter electrode in the substrate holder and apply the previous high voltage to the pair of electrodes.

  In general, when depositing a raw material film, the base material holder is rotated in the in-plane direction of the base material surface to be deposited for the purpose of making the film uniform. Therefore, a voltage transmission means such as a slip ring is required to rotate the substrate holder in a state where a high voltage is applied. Therefore, the suction mechanism becomes large and causes a great increase in cost in terms of equipment investment.

  In addition, when the material of the base material holder and the base material are different, a difference in deformation occurs due to the difference in thermal expansion coefficient between them, and the suction force changes or the base material holder and the base material are brought into close contact by suction. Therefore, it can be sufficiently predicted that the substrate will be damaged.

  In the method described in (2) above, a magnetic attractive force is used instead of the electrostatic force. Therefore, there are limitations on the base material used. When the base material is glass, for example, it is necessary to apply, for example, a magnetic material to the base material holder mounting surface side of the base material. Moreover, it is necessary to provide the base material holder with, for example, an electromagnet for generating a magnetic attractive force. Therefore, as in the case of using the electrostatic force described above, the mechanism for suction becomes large and causes a great increase in cost in terms of equipment investment and the like. Further, the occurrence of scratches is the same as in the case of the electrostatic force.

  Furthermore, the method described in (3) has the following problems. One is to hold the base material by holding mechanisms provided at both ends, and press the base material so as to be close to each other to push the base material to the opposite side of gravity and press it against a base having a concave shape below. The production of this concave shape is considered to be highly difficult in terms of accuracy, and is expected to be a factor in increasing the cost of the film deposition apparatus. Further, in the base material holding mechanism provided at both ends of the base material for pressing and pushing up both ends of the base material, only the rotation mechanism portion can freely move after the base material is set. Therefore, if there is a difference in the amount of thermal expansion between the base material and the base, the deviation of the concave shape between the base material and the base becomes large, and as a result, it becomes impossible to maintain a close contact state with the base material, or a partial stress Can be expected to be high. Therefore, it becomes difficult to uniformly control the temperature of the base material through the base over the entire surface of the base material, and deformation of the base material and damages associated therewith occur.

  In the method described in (4) above, although the amount of bending of the substrate is reduced, there is no disclosure regarding a method of setting the temperature of the substrate to a predetermined temperature during film deposition.

  The present invention has been made in view of the above circumstances, and its purpose is to easily control the temperature of the base material, and to reduce the deformation of the base material to keep the base material small, thereby maintaining the performance of the deposited film. Another object of the present invention is to provide a film deposition apparatus and a film deposition method capable of obtaining a deposited film product with high quality.

  Said subject is solved by the following structures.

(Claim 1)
In a film deposition apparatus comprising a vacuum chamber, a substrate holder for holding the substrate in the vacuum chamber, and an evaporation source, and depositing a film on the surface of the substrate,
The base material holder is in contact with the back surface of the base material and a surface facing the evaporation source that transmits heat from a heat source that brings the base material to a predetermined temperature;
A film deposition apparatus comprising tension applying and holding means for applying tension to the substrate in a direction perpendicular to the thickness direction of the substrate.

(Claim 2)
The film deposition apparatus according to claim 1, wherein a surface facing the evaporation source has a convex shape.

(Claim 3)
A film deposition method comprising depositing a film of a substrate using the film deposition apparatus according to claim 1.

  According to the first aspect of the present invention, the substrate holder in the film deposition apparatus is in contact with the back surface of the substrate and faces the evaporation source that transmits heat from the heat source that brings the substrate to a predetermined temperature. Tension applying and holding means for applying tension in a direction perpendicular to the thickness direction of the base material to the base material.

  Accordingly, the film deposition surface of the base material is not limited to the material of the base material, and the deflection due to its own weight is reduced, and the surface becomes closer to a flat surface. Moreover, the generation of stress due to expansion and contraction caused by temperature change of the substrate is absorbed by the tension applying and holding means. Furthermore, since the base material is held by the base material holder by the tension applying and holding means, the force that restrains the base material and the base material holder from each other is weak, and therefore, the base material and the base material holder are rubbed with each other due to deformation for thermal expansion. There are few scratches and it fits in a good range. In addition, since the surface of the substrate holder facing the evaporation source is in contact with the back surface of the substrate, the temperature of the substrate can be effectively controlled.

  Accordingly, it is possible to provide a film deposition apparatus capable of obtaining a deposited film product having a high performance and quality of the deposited film by depositing a uniform film with few scratches on the substrate.

  According to the second aspect of the present invention, the substrate holder in the film deposition apparatus has a convex surface on the surface facing the evaporation source. Therefore, in addition to the above-described effects, the following effects are further obtained.

  The shape of the surface where the substrate holder comes into contact with the substrate is the same as the convex shape that is bent when both ends of the substrate are fixed and held. By doing this, the tension applied to the base material can be made to follow the convex shape of the base material holder with a weak force compared to the tension that is going to make the base material as flat as possible. it can. Therefore, the temperature of the substrate can be controlled more effectively.

  Moreover, although the base material and the base material holder are in contact as described above, the mutual restraining force between the base material and the base material holder is weak, and the tension applied to the base material is relatively weak as described above. Therefore, scars caused by rubbing the base material and the base material holder hardly occur.

  According to the invention described in claim 3, by using the film deposition apparatus described above, it is possible to provide a film deposition method with high performance and quality of the deposited film.

  FIG. 1 is a diagram showing a schematic configuration of a film deposition apparatus as an example of an embodiment according to the present invention. In FIG. 1, 1 is a vacuum chamber, 2 is a substrate, 3 is a substrate holder having a hollow part through which a heat medium described later can be passed, 4 is an evaporation source, 5 is a vacuum pump as exhaust means, and 6 is a heat A temperature adjustment mechanism that repeats the recovery of the heat medium returned from the base material holder 3 by sending the medium to the base material holder 3 at a set temperature, and 7 transmits the rotational force by isolating the atmospheric pressure from the vacuum. This is a rotation introducing mechanism.

  The base material holder 3 includes a base material holder base portion 3a, a base material guide base portion 3b, and a tension applying / holding portion 3c that is a pair of tension applying / holding means that holds the base material 2 and applies tension to the base material 2. ing. Here, the base material 2 held by the tension applying / holding portion 3c comes into contact with the evaporation source side surface of the base material guide base portion 3b.

  Here, the base material holder 3 can rotate the base material 2 via the rotation introduction mechanism 7 by a power source not shown. In general, the film deposition apparatus preferably has a mechanism for rotating the substrate 2 in order to make the deposited film uniform.

  The substrate holder 3 is connected to the temperature adjustment mechanism 6. The temperature adjustment mechanism 6 of the example of the present embodiment is for circulating a heat medium whose temperature is controlled so as to reach a predetermined temperature through the hollow portion inside the substrate holder 3. Therefore, the temperature of the base material 2 is determined by using the hollow portion inside the base material holder 3 through which the heat medium controlled so as to have a predetermined temperature passes as a heat source. By being transmitted to the base material 2 through the base material holder base portion 3a and the base material guide base portion 3b), the temperature becomes a predetermined temperature without being affected by the radiant heat from the evaporation source 4 or the sensible heat of the evaporated vapor. To be controlled.

  The temperature adjustment mechanism 6 is based on the circulation of the heat medium in the example of the present embodiment, but is not particularly limited to this, and a method of embedding a heater or the like in the substrate holder 3 may be used. Further, a thermocouple may be provided in the base material holder 3, and thereby the temperature value of the base material 2 may be fed back to the temperature control mechanism 6, so that temperature control with higher accuracy may be performed. In addition, the predetermined temperature is, for example, an appropriate temperature of the base material set according to the film raw material and the film state at the time of film formation when it is desired to produce a deposited film having a high film density on the base material. For example, it may be determined in advance by experiments or the like. Further, after the film deposition is completed, the substrate is easily taken out, for example, at a temperature of about 40 ° C.

  Here, FIG. 2 shows a schematic diagram of an example of the substrate holder 3 included in the film deposition apparatus according to the first embodiment of the present invention. The base material holder 3 includes a pair of tension applying and holding portions 3c that apply tension to the base material 2 in a direction orthogonal to the thickness direction of the base material 2 (the direction of the arrow Y in the drawing). A tension is applied to the base material 2 by 3c, and the base material 2 is held in a state where the base material 2 is in contact with the surface 38 on the evaporation source 4 side of the base material guide stand portion 3b of the base material holder 3.

  The substrate 2 is, for example, a substrate for a stimulable phosphor panel on which the stimulable phosphor is deposited as columnar crystals. The substrate 2 has a size of approximately 300 mm × 300 mm and a thickness of approximately 2 mm.

  The base material holder 3 further includes a base material holder base portion 3a that is fixed in the film deposition apparatus via the rotation introducing mechanism 7, and a base material guide base portion that is provided on the lower surface of the base material holder base portion 3a. 3b and a pair of tension applying and holding portions 3c provided opposite to each other on both outer sides of the substrate guide base portion 3b.

  The tension applying / holding portion 3c is arranged to fix an elastic member, such as a spring 34, for applying a tension to the base material 2 and one end of the spring 34 to the base material holder base portion 3a. A support 35 and a holding portion 30 that fixes the other end of the spring to the base material 2 and clamps the peripheral edge portions 2 a at both ends of the base material 2 are provided.

  The positions of the support 35 and the holding unit 30 for fixing the spring 34 are parallel to the tangent line of the surface on which the film is deposited on the peripheral edge 2a of the substrate 2 while holding the substrate 2. It is preferable to be on an extension line of a line passing through the center of thickness.

  Each of the holding portions 30 is inserted with an upper clamp plate 32 fixed to the support 35 via a spring 34, a push screw 33 screwed into the female screw portion H1 of the upper clamp plate 32, and a push screw 33. The lower clamp plate 31 having the hole H2 is disposed between the upper clamp plate 32 and the lower clamp plate 31, and the lower clamp plate 31 is moved away from the upper clamp plate 32. And a coil spring 36 to be urged. The push screw 33 is screwed into the female screw portion H1 of the upper clamp plate 32 through the hole H2 of the lower clamp plate 31 and the central hollow portion of the cylindrical coil spring 36, and the lower clamp plate 31 is rotated by the rotation of the push screw 33. While receiving the urging force of the coil spring 36, the coil spring 36 is moved toward and away from the upper clamp plate 32.

  Attachment of the base material 2 to the base material holder 3 is performed as follows. In a state where the base material 2 is temporarily held by hand or the like at the set position of the base material guide stand portion 3b, the interval between the upper clamp plate 32 and the lower clamp plate 31 is increased by the rotation of the push screw 33 of the holding portion 30; The spring 34, which has one end fixed to the holding portion 30, is brought close to the base material 2 while being extended, and the peripheral edge 2 a of the base material 2 is inserted between the upper clamp 32 plate and the lower clamp plate 31. And the space | interval of the upper clamp board 32 and the lower clamp board 31 is narrowed by rotation of the push screw 33, and the peripheral part 2a of the base material 2 is clamped between the upper clamp board 32 and the lower clamp board 31 board. This is performed at both peripheral edges 2a of the substrate 2. In addition, what is necessary is just to perform in the reverse order of said, when removing the base material 2.

  When the base material 2 is held by the base material holder 3 as described above, the base material 2 is a surface of the base material holder 3 provided in the film deposition apparatus that faces the vapor deposition source side of the base material guide table 3b. The substrate 2 is in a state of being tensioned by the springs 34 that are held in contact with the plate 38 and are fixed to the holding portions 30 of both peripheral edge portions 2a of the substrate 2.

  Therefore, the base material 2 is held in a state of a shape close to a flat plate by reducing the amount of bending toward the evaporation source 4 due to its own weight. In view of this, the surface 38 on the vapor deposition source 4 side of the substrate guide base 3b of the substrate holder 3 is preferably a flat surface because it is a surface in contact with the substrate 2. Here, the tension of the spring 34 may be appropriately determined depending on the material, thickness, size, and the like of the base material 2 so that the base material 2 is in the above-described state, and the second embodiment according to the present invention described below will be described. The same applies to the form.

  By doing in this way, the temperature of the base material 2 can be efficiently set to a desired temperature via the base material holder 3 by operating the temperature adjusting mechanism 6.

  After holding the substrate 2 on the substrate holder 3 as described above, the air in the vacuum chamber 1 is exhausted by the vacuum pump 5. In parallel with this, the temperature control mechanism 6 is operated to bring the temperature of the base material 2 to a desired temperature. Thereafter, the degree of vacuum in the vacuum chamber 1 is reached to a desired value, and after the temperature of the substrate 2 reaches the desired temperature, the film material is evaporated from the evaporation source 4 to deposit a film on the substrate 2. To do.

  Next, FIG. 3 shows a schematic diagram of an example of the substrate holder 3 included in the film deposition apparatus according to the second embodiment of the present invention. The difference between the film deposition apparatus of the first embodiment described above and the film deposition apparatus of the second embodiment is that the surface 38 in FIG. 2 shows the substrate holder 3 of the first embodiment. 3 is preferable to be flat, whereas the surface 39 in FIG. 3 showing the substrate holder 3 of the second embodiment is more preferably convex toward the evaporation source 4 side. Only. This will be described below.

When the base material 2 is simply held at the peripheral edges at both ends, the base material 2 is bent downward due to its own weight, and the amount of the bending is defined as W ₀ . FIG. 4 is a diagram for explaining the concept of the deflection amount W ₀ . As shown in FIG. 4, the deflection amount W ₀ is the distance from the line connecting the holding positions 40 at both peripheral edges of the base material 2 to the position farthest away from this line as the base material 2 is bent. To do.

In the film deposition apparatus according to the first embodiment, the bending amount W ₀ is reduced by applying a tension to the base material 2 so as to have a shape closer to a flat plate. However, as the applied tension is increased, the amount of bending of the base material 2 is reduced, while the flexibility of the base material 2 is lowered. In other words, when the substrate 2 touches the substrate 2 having a higher hardness than the substrate 2, there is a concern that the substrate 2 may be damaged. For example, it is considered that the surface of the base material guide base part 3b and the base material 2 are in contact with each other in order to adjust the temperature of the base material 2 as one of the causes of scratches.

  Therefore, in order to prevent the occurrence of this scratch, it is only necessary to reduce the tension. However, when the tension is reduced, the amount of bending due to the weight of the base material 2 increases, and the surface of the base material guide base 3b shown in FIG. Thus, the central portion of the substrate 2 is separated from 38. Therefore, in the temperature distribution of the base material 2 at the time of film deposition, the central portion and the periphery of the base material 2 are different.

  As a countermeasure against this, if the surface of the base material guide base part 3b has a convex shape downward like the surface 39 in FIG. 3, it becomes close to the bent shape due to the weight of the base material 2 described above. If the shape and the tension applied to the base material 2 are appropriate, the base material 2 can be aligned with the convex shape of the surface 39 by applying a relatively weak tension to the base material 2.

Accordingly, by providing the surface 39 with a convex shape corresponding to an appropriate amount of deflection smaller than the amount of deflection W ₀ when the substrate 2 is bent by its own weight, and applying a tension along the convex shape to the substrate 2. The amount of bending of the base material 2 when depositing the film can be made into a state where no problem occurs when used in a flat plate shape, and the temperature of the base material 2 can be adjusted effectively, The occurrence of scratches on the surface in contact with the surface 39 of the substrate 2 can be prevented.

  The film deposition method is a vacuum deposition method in this embodiment, but is not limited to this, and a sputtering method, a CDV method, or the like may be used.

  The film deposition apparatus was the same as that shown and described in FIG. 1 of the embodiment. The substrate 2 was a 2 mm thick aluminum plate having a size of 300 mm × 300 mm. Cesium bromide was used as the film material. As the evaporation source 4, a rectangular parallelepiped container made of molybdenum was used, and heating was performed by a resistance heating method. The evaporation source 4 was filled with 800 g of film raw material.

  The base material holder 3 holding the base material 2 will be described in Comparative Examples 1 and 2 and Examples 1 and 2 below.

  The vacuum chamber 1 was evacuated using a vacuum pump 5 and adjusted so that the degree of vacuum reached was 0.1 Pa. Thereafter, energization of the evaporation source 4 was started, and deposition on the base material 2 was performed while controlling the amount of energization so that the inside of the container of the evaporation source 4 was 800 ° C. When the film thickness of the substrate 2 reached 300 μm, the evaporation of the film material was terminated. During vapor deposition, a heat medium having a temperature of 200 ° C. was circulated to the substrate holder 3 by the temperature adjustment mechanism 5.

  In Comparative Examples 1 and 2 and Examples 1 and 2 shown below, films were deposited under the same conditions except for the base material holder 3 holding the base material 2.

(Comparative Example 1)
As shown in FIG. 5, the substrate holder 3 has a flat surface 50 in contact with the substrate 2, and the substrate 2 is connected to both peripheral portions by a substrate holding member 51 and a screw 51 a that fixes the substrate 50 to the substrate holder. Held at 2a. The base material holding member 51 is fixed by sandwiching the base material 2 with the base material holder 3. The base material holding member 51 has a part for pressing the base material 2 and a part for inserting the screw 51 b to fix the base material holding member 51 to the base material holder 3. It is as follows.
Using these materials, the substrate 2 was held and the film was deposited to obtain a substrate A with a deposited film.

(Comparative Example 2)
As shown in FIG. 6, the base material holder 3 has a surface 60 in contact with the base material 2 that is convex downward in the direction of gravity. The base material 2 was fixed to the base material holder 3 by holding the base material 2 at both peripheral edges 2a with the same base material holding member 51 as in Comparative Example 1 and screws 51a for fixing the same to the base material holder.
Using these materials, the substrate 2 was held and the film was deposited to obtain a substrate B with a deposited film.

Example 1
The substrate holder 3 shown in FIG. 2 described in the first embodiment was used. The surface 38 in contact with the base material 2 of the base material holder 3 was a flat surface.
Using these materials, the substrate 2 was held and film formation was performed to obtain a substrate C with a deposited film.

(Example 2)
The substrate holder 3 shown in FIG. 3 described in the second embodiment was used. The surface 39 in contact with the base material 2 of the base material holder 3 was convex.
Using these, the substrate 2 was held and the film was deposited to obtain a substrate D with a deposited film.

(Evaluation)
The deposited film-coated substrates A, B, C and D thus produced were evaluated from the following viewpoints.

(Inner film density of deposited film)
In the deposited film on the substrate, the film density at the central part and the edge part was measured, and a value obtained by applying each measured value to the following equation (1) was defined as an evaluation value ES. This evaluation value ES was compared with a reference value (0.05), and marked as ◯ (good) when the evaluation value ES was less than the reference value, and x (defect) when the evaluation value ES was equal to or greater than the reference value.
ES = ABS (MC-ME) / MC (1)
However,
MC: film density value at the center ME: film density value at the edge (presence or absence of scratches or deformation due to observation of the back surface of the substrate)
The surface of the base material 2 on which the film is not deposited (the back surface) is checked for scratches, and the base material 2 with the back surface down is placed on a flat reference table (JIS B7513 standard second-order flatness 30 μm) to visually check the deformation state of the base material. And observed. The observed state of the substrate 2 was classified into the following four types, and indicated by symbols 、, ○, Δ, and X corresponding to each of them.
Scratched, no deformation: ◎
Scratched, no deformation: ○
No scratch, deformation: △
Scratched, deformed: ×
The results of the above evaluation are summarized in Table 1.

  As can be seen from Table 1, the deposited film product manufactured by using the film deposition apparatus according to the present invention has a good film uniformity, and a deposited film product that does not easily cause scratches on the base material 2 and is not deformed can be obtained. Was confirmed.

It is a figure which shows an example of schematic structure of the film deposition apparatus used for the Example concerning this invention. It is a figure which shows the outline of an example of the base-material holder 3 which the film deposition apparatus of 1st Embodiment concerning this invention has. It is a figure which shows the outline of an example of the base-material holder 3 which the film deposition apparatus of 2nd Embodiment concerning this invention has. It is a diagram illustrating a deflection amount W ₀ of deflection generated downward by self-weight of the substrate 2. It is a figure explaining the method to hold | maintain the base material 2 in the comparative example 1. FIG. It is a figure explaining the method to hold | maintain the base material 2 in the comparative example 2. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Vacuum chamber 2 Base material 3 Base material holder 3a Base material holder base part 3b Base material guide stand 3c Tension provision holding part 30 Holding part 4 Evaporation source 5 Vacuum pump 6 Temperature adjustment mechanism 7 Rotation introduction mechanism

Claims (3)

In a film deposition apparatus comprising a vacuum chamber, a substrate holder for holding the substrate in the vacuum chamber, and an evaporation source, and depositing a film on the surface of the substrate,
The base material holder is in contact with the back surface of the base material and a surface facing the evaporation source that transmits heat from a heat source that brings the base material to a predetermined temperature;
A film deposition apparatus comprising tension applying and holding means for applying tension to the substrate in a direction perpendicular to the thickness direction of the substrate. The film deposition apparatus according to claim 1, wherein a surface facing the evaporation source has a convex shape. A film deposition method comprising depositing a film on the surface of a substrate using the film deposition apparatus according to claim 1.

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