JP2006128229A - Composite multilayer board - Google Patents

Abstract

In the case of a conventional composite multilayer substrate, a ceramic laminate 2 is provided with a conductor film such as a bottom conductor film 2C and a capacitance forming conductor film 2D and via conductors (not shown) as conductor patterns. Therefore, a difference occurs between the shrinkage amount of the conductor material for the conductor pattern and the shrinkage amount of the ceramic material when the substrate is baked, and a large undulation (height difference) occurs in the laminate 2. In the case of the laminate 2 having a cavity structure, a larger difference is caused in the shrinkage amount between a portion where the cavity 2B is present and a portion where the cavity 2B is not present, and the undulation is increased. The waviness due to the thinning becomes remarkable and the posture of the electronic component becomes unstable when mounting the electronic component, making it difficult to mount the electronic component.
A composite multilayer substrate of the present invention has a cavity having a laminated structure of a resin part and a ceramic part, and the cavity has a through hole formed in the ceramic part and a resin part. It is comprised from the recessed part 11B formed in this.
[Selection] Figure 1

Description

  The present invention relates to a composite multilayer substrate, and more particularly to a composite multilayer substrate that can securely mount an electronic component even if a reduction in height is promoted.

  As a conventional composite multilayer substrate of this type, for example, there is a multilayer ceramic substrate with a cavity described in Patent Document 1. For example, as shown in FIG. 13A, the multilayer ceramic substrate 1 is configured as a laminated body 2 in which a plurality of ceramic layers 2A are laminated, and a cavity is formed on one main surface (lower surface in the figure) of the laminated body 2. 2B is formed. An electronic component 3 such as a semiconductor chip is mounted in the cavity 2B. Thus, by forming the laminate 2 with ceramic, the cavity 2B can be formed with high accuracy, and further, by mounting the electronic component 3 in the cavity 2B, the reduction in the height of the multilayer ceramic substrate 1 can be promoted. it can. Note that a bottom conductor film 2C is formed in the cavity 2B, and a capacitance forming conductor film 2D facing the bottom conductor film 2C is formed in the laminate 2.

JP 2004-063664 A

  However, in the case of a conventional composite multilayer substrate, as described in Patent Document 1, a conductor film such as a bottom conductor film 2C or a capacitance forming conductor film 2D or a via conductor (not shown) is a conductor in the laminate 2. Since it is provided as a pattern, a difference occurs between the shrinkage amount of the conductor material forming the conductor pattern and the shrinkage amount of the ceramic material when the substrate is baked, and a large undulation (height difference) may occur in the laminate 2. there were. In the case of the laminated body 2 having a cavity structure, a difference in height between the part having the cavity 2B and the part not having the cavity 2B is more likely to occur, and the height difference is likely to occur. Due to the recent reduction in profile, the thickness of the laminate 2 is reduced, and the difference in height appears more prominently. If the difference in height exceeds, for example, 30 μm, the following problems are caused.

  For example, if there is a height difference in the cavity 2B, when the electronic component 3 such as a semiconductor chip is mounted in the cavity 2B, even if wire bonding is performed, for example, the posture of the electronic component 3 is not stable, There was a problem that it could not be implemented. When the electronic component 3 is a flip chip or the like, as shown in FIG. 13B, if there is a height difference on the bottom surface of the cavity 2B, a bump 3A that does not reach the connection terminal formed in the cavity 2B is generated, and the wire breaks. There was also a problem of causing defects. In addition, there is a problem that the electronic component 3 is inclined during mounting, and the corner contacts the cavity 2B to cause chipping.

  Further, the depth D of the cavity 2B is determined by the height of the electronic component 3, but it is necessary to reduce the thickness C of the portion other than the cavity 2B as much as possible in order to promote the reduction in the height of the substrate. If the thickness is made thinner, the substrate may be cracked when electronic components such as surface mount components are mounted on the main surface opposite to the cavity 2B (the upper surface in the figure), or the substrate may be cracked due to shrinkage during firing. . Further, in order to reduce the depth D of the cavity 2B, the depth D of the cavity 2B is set to the height of the electronic component 3 (in the case of an electronic component that requires wire bonding, the height of the wire is added to the height). However, in this case, it is necessary to consider the depth of the swell, so the swell becomes a factor that hinders the reduction in height.

  In addition, when heat dissipation in the cavity 2B is necessary, a thermal via 2E is provided through the bottom surface of the cavity 2B to the top surface of the laminate 2 as shown in FIG. Since there is a difference in firing shrinkage with the conductor material, it is necessary to limit the number of thermal vias 2E, and there is a problem that sufficient heat dissipation cannot be ensured.

  The present invention has been made to solve the above-described problems, and provides a composite multilayer substrate that can promote a reduction in height and can securely mount electronic components and realize multi-functionality. It is intended to provide.

  The composite multilayer substrate according to claim 1 of the present invention is a composite multilayer substrate having a laminated structure of a resin portion and a ceramic portion, wherein the composite multilayer substrate has a cavity, and the cavity is the ceramic It is comprised from the through-hole formed in the part, and the recessed part formed in the said resin part, It is characterized by the above-mentioned.

  According to a second aspect of the present invention, there is provided the composite multilayer substrate according to the first aspect, wherein the first chip-type electronic component is provided inside the cavity, the inside of the resin portion, and The first chip-type electronic component has a second chip-type electronic component in a region different from the region projected onto the resin portion side.

  According to a third aspect of the present invention, there is provided the composite multilayer substrate according to the second aspect, wherein the first chip-type electronic component and the second chip-type electronic component are at least one in the vertical direction. It is characterized by overlapping.

  According to a fourth aspect of the present invention, there is provided the composite multilayer substrate according to any one of the first to third aspects, wherein the ceramic portion is a ceramic laminate in which a plurality of ceramic layers are laminated. And having a predetermined conductor pattern on the inside and on the surface of the ceramic laminate.

  Further, in the composite multilayer substrate according to claim 5 of the present invention, in the invention according to claim 4, the resin portion has a terminal electrode on a surface opposite to a bonding surface with the ceramic portion, The terminal electrode is connected to the conductor pattern formed in the ceramic laminate through a via conductor formed in the resin portion.

  According to a sixth aspect of the present invention, there is provided the composite multilayer substrate according to any one of the second to fifth aspects, wherein the first chip-type electronic component is sealed with a resin in the cavity. It is characterized by being stopped.

  Moreover, the composite multilayer substrate according to claim 7 of the present invention is the invention according to any one of claims 1 to 6, wherein the ceramic portion is formed by laminating a plurality of low-temperature sintered ceramic layers. It consists of a ceramic laminated body, The said conductor pattern is formed with the conductor material which has silver or copper as a main component, It is characterized by the above-mentioned.

  According to claim 8 of the present invention, in the composite multilayer substrate according to claim 6 or 7, the third chip-type electronic component is mounted on the surface of the ceramic portion. The third chip type electronic component is covered with a resin layer.

  The composite multilayer substrate according to claim 9 of the present invention is the resin laminate according to any one of claims 1 to 8, wherein the resin portion is a resin laminate in which a plurality of resin layers are laminated. It is characterized by comprising.

  The composite multilayer substrate according to claim 10 of the present invention is the composite multilayer substrate according to claims 1 to 9, wherein the through-hole formed in the ceramic portion has an opening diameter formed in the resin portion. It is characterized by being smaller than the opening diameter of the recess.

  According to the invention described in claims 1 to 10 of the present invention, a composite multilayer capable of promoting a reduction in height and mounting an electronic component reliably and realizing a multi-function. A substrate can be provided.

  Hereinafter, the present invention will be described based on the embodiment shown in FIGS. 1 is a sectional view showing an embodiment of the composite multilayer substrate of the present invention, FIG. 2 is a sectional view showing a comparison between the composite multilayer substrate shown in FIG. 1 and a conventional composite multilayer substrate, and FIGS. FIG. 6 is an explanatory diagram for explaining the manufacturing process of the composite multilayer substrate shown in FIG. 1, and FIGS. 6A and 6B show the main part of another manufacturing process of the composite multilayer substrate shown in FIG. 7 and 12 are sectional views showing other embodiments of the composite multilayer substrate of the present invention.

  For example, as shown in FIG. 1, the composite multilayer substrate 10 of the present embodiment has a laminated structure of a resin part 11 and a ceramic part 12 laminated on the resin part 11, and is printed via the resin part 11. It is designed to be mounted on a mounting board (not shown) such as a wiring board. Since a mounting board such as a printed wiring board is often formed of resin, as will be described later, the resin part 11 is between the thermal expansion coefficient of the ceramic part 12 and the thermal expansion coefficient of the mounting board, for example, between them. It is formed of a resin having a thermal expansion coefficient of By interposing such a resin portion 11 between the ceramic portion 12 and the mounting substrate, the difference in thermal expansion between the composite multilayer substrate 10 and the mounting substrate is alleviated, and as a result, the composite multilayer substrate 10 after mounting. However, it is difficult to detach from the mounting board even in a high temperature environment. As shown in the figure, the resin portion 11 is formed as a resin laminate in which a plurality of resin layers 11A are laminated, and the ceramic portion 12 is a ceramic laminate in which a plurality of ceramic layers 12A are laminated. It is formed as. Therefore, hereinafter, the ceramic portion 12 will be described as the ceramic laminate 12.

  Thus, as shown in FIG. 1, a recess 11B is formed at the center of the upper surface of the resin part 11, and a through hole 12B corresponding to the recess 11B of the resin part 11 is formed in the ceramic laminate 12. Yes. In the present embodiment, the opening diameter of the through-hole 12 </ b> B formed in the ceramic laminate 12 is larger than the opening diameter of the recess 11 </ b> B formed in the resin portion 11. The cavity 10A of the composite multilayer substrate 10 is formed by integrating the recess 11B of the resin portion 11 and the through hole 12B of the ceramic laminate 12 together. A first chip-type electronic component 13 is provided in the cavity 10A. The cavity 10 </ b> A bites into the resin portion 11 from the ceramic laminate 12, and effectively uses the recess 11 </ b> B of the resin portion 11 as a mounting space for the first chip-type electronic component 13. Further, second chip type electronic components 14A and 14B mounted on the lower surface of the ceramic laminate 12 are embedded in the resin portion 11, and the resin portion 11 is used as a mounting space for the second chip type electronic components 14A and 14B. Further, it can be used effectively and the functions can be expanded for multi-function.

  Further, a space formed around the first chip-type electronic component 13 in the cavity 10A is filled with resin, and the first chip-type electronic component 13 is sealed with this resin, and this resin portion (hereinafter, referred to as “resin portion”). The upper surface of 15 is coincident with the upper surface of the ceramic laminate 12, and one flat surface is formed. Since the opening diameter of the through hole 12B of the ceramic laminate 12 is formed larger than the opening diameter of the recess 11B of the resin portion 11, the resin can be easily injected into the cavity 10A when filling the resin. The first chip-type electronic component 13 is sealed from the resin to protect the first chip-type electronic component 13 from external impacts, moisture, and the like. In addition, the opening diameter of the through-hole 12B of the ceramic laminated body 10 and the opening diameter of the recessed part 11B of the resin part 11 may be substantially the same.

  Next, each component of the composite multilayer substrate 10 will be described in detail. First, the resin part 11 will be described. As shown in FIG. 1, external terminal electrodes 11C are formed in a predetermined pattern on the lower surface of the resin part 11, and are connected to the mounting substrate via these external terminal electrodes 11C. . External terminal electrodes 11D are also formed in a predetermined pattern on the bottom surface of the recess 11B of the resin part 11, and the first chip-type electronic component 13 is connected via these external terminal electrodes 11D. The resin part 11 is provided with a via conductor 11E, and this via conductor 11E serves to connect the conductor pattern of the ceramic laminate 12 and the conductor pattern of the mounting board. In addition, the external terminal electrode interposed in the joint surface of the resin part 11 and the ceramic laminated body 12 is not formed in the resin part 11 side but the ceramic laminated body 12 side for the reason mentioned later.

  The resin layer 11A is preferably formed of a mixed resin composition of a thermosetting resin and an inorganic filler. As the thermosetting resin, for example, an epoxy resin, a phenol resin, a cyanate resin or the like excellent in heat resistance and moisture resistance can be used, and as the inorganic filler, for example, alumina, silica, titania or the like can be used. Thus, by adding an inorganic filler, the thermal expansion coefficient of the resin part 11 can be adjusted as described above, and the heat dissipation can be improved. Can be appropriately controlled. When high frequency electronic components are mounted as the first and second chip type electronic components 13, 14A, 14B, the resin portion 11 preferably has a low dielectric constant.

  The external terminal electrodes 11C and 11D of the resin part 11 can be formed of a metal foil such as a copper foil. The via conductor 11 </ b> E can be formed by filling the via conductor hole formed in the resin portion 11 with a conductive resin. The conductive resin is a conductive resin composition containing, for example, metal particles and a thermosetting resin. As the metal particles, metals such as gold, silver, copper, and nickel can be used, and as the thermosetting resins, resins such as epoxy resins, phenol resins, and cyanate resins can be used. Further, the via conductor 11E can be formed of, for example, electroless plated copper and electrolytic plated copper as necessary.

  Next, the ceramic laminate 12 will be described. As shown in FIG. 1, external terminal electrodes 12C are formed in a predetermined pattern on the lower surface of the ceramic laminate 12, and the resin portion 11 is formed via these external terminal electrodes 12C. The via conductor 11E is connected. External terminal electrodes 12D are also formed in a predetermined pattern on the upper surface of the ceramic laminate 12, and a third chip type electronic component (not shown) is mounted through these external terminal electrodes 12D. Furthermore, an in-plane conductor 12E is formed in a predetermined pattern on each ceramic layer 12A of the ceramic laminate 12, and the upper and lower in-plane conductors 12E are connected by via conductors 12F formed in a predetermined pattern. The conductor pattern of the ceramic laminate 12 is formed by these in-plane conductors 12E, via conductors 12F, and the like.

The ceramic layer 12A is formed of a ceramic material. Although it does not restrict | limit especially as a ceramic material, For example, a low temperature sintered ceramic (LTCC: Low Temperature Co-fired Ceramic) material is used preferably. The low-temperature sintered ceramic material refers to a ceramic material that can be fired at a temperature of 1000 ° C. or lower. Low-temperature sintered ceramic materials include, for example, glass composite LTCC materials in which borosilicate glass is mixed with ceramic powder such as alumina, forsterite, and cordierite, and crystallization of ZnO-MgO-Al ₂ O ₃ -SiO ₂ Non-glass system using crystallized glass LTCC material using glass, BaO—Al ₂ O ₃ —SiO ₂ ceramic powder, Al ₂ O ₃ —CaO—SiO ₂ —MgO—B ₂ O ₃ ceramic powder, etc. Examples include LTCC materials.

  By using a low-temperature sintered ceramic material as the ceramic laminate 12, a low melting point with a low resistance such as silver (Ag), copper (Cu), gold (Au), etc. as a conductor material such as the external terminal electrodes 12 </ b> C and 12 </ b> D. Can be used and can be integrated with the ceramic layer 12A by co-sintering at a low temperature. Therefore, conductor patterns such as the external terminal electrodes 12C and 12D are formed as sintered metal. Further, by using a low-temperature sintered ceramic, a passive element such as a capacitor or an inductor having a ceramic sintered body as a base body can be incorporated in the ceramic laminate 12.

  Since the ceramic laminate 12 is made of a low-temperature sintered ceramic material and has a surface roughness Rmax (several μm) comparable to that of a copper foil, the bonding force with the resin portion 11 is weak. Therefore, in the present embodiment, the external terminal electrode 12C that connects the ceramic laminate 12 and the resin portion 11 is formed of sintered metal as described above. Since the sintered metal forming the external terminal electrode 12C has a surface roughness Rmax of several tens of μm and an order of magnitude higher than the surface roughness of the copper foil of several μm, it is bonded to the resin part 11 by the anchor effect of the sintered metal. Strength can be increased. The difference in surface roughness is that the copper foil is formed by plating or rolling a copper plate, whereas the sintered metal is obtained by baking a conductive paste containing a resin component in a volume ratio of 10 to 40%. Because of the formation of the resin component, the resin component is burned away, leaving voids inside and on the surface to increase the surface roughness.

  The first chip-type electronic component 13 is connected to the external terminal electrode 11D formed on the bottom surface of the concave portion 11B of the resin portion 11 via the solder ball 16, for example. As the first chip-type electronic component 13, for example, an active chip component such as a semiconductor chip or a passive chip component such as a multilayer capacitor or a multilayer inductor can be provided. As shown in FIG. 2, the first chip-type electronic component 13 is mounted on the recess 11B of the resin portion 11 as compared with the case where the first chip-type electronic component 13 is mounted on the resin portion 11 ′ having no recess. The ceramic laminate 12 can be reduced in height by the depth L. That is, since the first chip-type electronic component 13 bites into the recess 11 </ b> B of the resin portion 11, the thickness of the ceramic laminate 12 is the same as that of the first chip-type electronic component 13 (high). It is possible to reduce the height without being limited by the above.

  Further, the second chip-type electronic components 14A and 14B in the resin portion 11 are both arranged so as to surround the first chip-type electronic component 13 provided in the cavity 10A, that is, the recess 11B of the resin portion 11. Yes. In other words, the second chip-type electronic components 14A and 14B are arranged in a different region from the projection region of the first chip-type electronic component 13, that is, the region immediately below. Further, since the second chip-type electronic components 14A and 14B are arranged so as to be biased outward from the first chip-type electronic component 13, the second chip-type electronic components 14A and 14B are partially separated from the first chip-type electronic component 13 in the height direction. Can be arranged overlapping each other. Since the second chip-type electronic components 14A and 14B are embedded in the resin portion 11 that does not need to be fired, not only passive chip components but also active chip components can be provided in the resin portion 11 and are multifunctional. Can be promoted. In the present embodiment, passive chip components such as multilayer capacitors and multilayer inductors are provided as the second chip type electronic component 14A, and active chip components such as semiconductor chips are provided as the second chip type electronic component 14B. ing.

  In addition, the resin forming the sealing resin portion 15 is preferably formed of a mixed resin composition of a thermosetting resin and an inorganic filler, like the resin layer 11A of the resin portion 11.

  Next, a method for manufacturing the chip composite multilayer substrate 10 shown in FIG. 1 will be described with reference to FIGS. First, a method for producing the ceramic laminate 11 will be described. First, on a resin film such as PET, for example, a slurry containing a low-temperature sintered ceramic material is coated and dried to produce a predetermined number of ceramic green sheets having a thickness of about 10 to 200 μm.

  Next, a plurality of via conductor holes having a predetermined pattern, for example, about 100 μm are formed in the ceramic green sheet using a mold or laser light. Then, for example, a conductive paste prepared by kneading metal powder, resin, and organic solvent mainly composed of Ag or Cu is filled in the via conductor hole of the ceramic green sheet and dried to form a via conductor portion. To do. Further, the same type of conductive paste is printed in a predetermined pattern on the ceramic green sheet using a screen printing method, and dried to form a surface conductor and an in-plane conductor as a surface conductor portion. In the same manner, a via conductor portion and a surface conductor portion are also formed on other ceramic green sheets. A through hole for the cavity 12B is made in these ceramic green sheets using a mold, laser light, or the like.

  Next, a predetermined number of ceramic green sheets manufactured as described above are stacked and thermocompression bonded at a predetermined pressure, for example, 0.1 to 1.5 MPa, at a temperature of 40 to 100 ° C., and have a through hole for the cavity 12B. A raw ceramic laminate is made. This raw ceramic laminate is fired to obtain a ceramic laminate 12 shown in FIG. When using an Ag-based conductive paste, the raw ceramic laminate is fired at about 850 ° C. in air, and when using a Cu-based conductive paste, the raw ceramic laminate is heated at about 950 ° C. in nitrogen gas. Bake. After obtaining the ceramic laminate 12, if necessary, Ni / Sn or Ni / Au or the like is formed on the surfaces of the external terminal electrodes 12C and 12D exposed on the upper and lower surfaces of the ceramic laminate 12 by wet plating or the like. The ceramic laminate 12 shown in FIG. 3A is obtained through these series of steps.

  After that, after aligning the external terminal electrode 12C on the lower surface of the ceramic laminate 12 and the second chip-type electronic components 14A and 14B, as shown in FIG. The components 14A and 14B are mounted on the ceramic laminate 12 via a bonding material such as solder.

  Next, the resin part 11 is produced. First, the concave portion 11B of the resin portion 11, that is, the external terminal electrode 11D at the portion that becomes the bottom surface of the cavity 10A and the external terminal electrode 11C at the lower surface of the resin portion 11 are prepared. For this purpose, as shown in FIG. 4 (a), a metal foil having a thickness of about 10 to 40 μm, for example, a copper foil, is pasted on a support body 100 made of PET or the like, and then a photoresist is applied to form a copper-coated resist layer. After forming on foil and exposing with a predetermined pattern, it develops and an unnecessary resist layer is removed. Next, after etching, unnecessary copper foil portions are removed, the resist film is peeled off, and external terminal electrodes 11D are formed in a predetermined pattern on the support 100 as shown in FIG. Similarly, as shown in FIG. 5B, the external terminal electrodes 11C of the recesses 11B of the resin part 11 are formed in a predetermined pattern on a support 100A made of PET or the like.

  Next, as shown in FIG. 4C, a predetermined number of resin sheets 111A in a prepreg state in which a thermosetting resin such as an epoxy resin and an inorganic filler such as alumina are mixed are prepared. Via conductor holes are formed in a predetermined pattern using a laser beam or the like in the resin sheet 111A, and the via conductor 11E is formed by filling these via conductor holes with a conductive resin. Further, as shown in the figure, a through hole 111B for the cavity 10A is made in the predetermined resin sheet 111A by using a mold, laser light or the like, and an external terminal electrode formed on the support body 100 in the predetermined resin sheet 111A. Transfer 11D. Then, as shown in FIG. 4 (c), these resin sheets 111A are laminated on the support 100A in a predetermined order while being positioned, and then pressure-bonded with a predetermined pressure. The resin part 11 which has the recessed part 11B shown in FIG.

  Thereafter, as shown in FIG. 5A, the ceramic laminate 12 is positioned and thermocompression bonded above the resin portion 11 on the support 100A, and the second chip-type electronic components 14A and 14B are resinated. Embedded in the part 11. The resin portion 11 is completely cured by this thermocompression bonding. When thermocompression bonding is performed, as shown in FIG. 5B, a vacuum laminator or the like that can be pressed isotropically according to the form of the laminate of the resin portion 11 and the ceramic laminate 12 is used. preferable. When performing isotropic pressure pressing, the composite multilayer substrate main body of the resin portion 11 and the ceramic laminate 12 having good flatness is supported by supporting the laminate with a flat member such as a metal plate as shown in FIG. 10X can be obtained.

  A first chip-type electronic component 13 such as a semiconductor chip is mounted in a cavity 10A formed in the composite multilayer substrate body 10X. At this time, since the mounting surface of the first chip-type electronic component 13 is formed by the resin layer 11A of the resin portion 11, there is no undulation like the ceramic layer, that is, there is no height difference, and the first chip is formed in the cavity 10A. The posture of the mold electronic component 13 is stabilized, and the first chip-type electronic component 13 can be mounted accurately and accurately without causing a connection failure or the like. Further, when flip-chip connection is performed, chipping is not performed, and self-alignment can be performed with high accuracy during reflow.

  After the first chip-type electronic component 13 is mounted, the gap formed in the cavity 10A is filled with resin, and the first chip-type electronic component 13 is sealed as shown in FIG. To form the sealing resin portion 15.

  As described above, according to the present embodiment, the cavity 10 </ b> A of the composite multilayer substrate 10 is composed of the through-hole 12 </ b> B formed in the ceramic laminate 12 and the recess 11 </ b> B formed in the resin portion 11. The following effects can be obtained.

  That is, since the cavity 10A is formed up to the inside of the resin portion 11, a part of the resin portion 11 can be used as a mounting space for the first chip-type electronic component 13. Can be promoted. Further, since the concave portion 11B of the resin portion 11 forming the bottom surface of the cavity 10A is not baked, the bottom surface (mounting surface) of the concave portion 11B serving as the mounting surface of the first chip-type electronic component 13 is formed flat without causing waviness. Therefore, the posture of the first chip-type electronic component 13 on the mounting surface is stabilized, and electrical connection by wire bonding or the like can be reliably performed. Even when the first chip-type electronic component 13 is flip-chip connected, each of the plurality of connection terminals of the first electronic component 13 can reliably reach the external terminal electrode 11D in the recess 11B and can be reliably connected. Sometimes there is no risk of poor connection such as chipping or flip chip. Moreover, since the ceramic laminate 12 has the through holes 12B and no thin portions, it is not necessary to consider the waviness of the mounting surface, the depth of the cavity 10A can be ensured as designed, and the low profile of the substrate can be secured. Can be promoted. In addition, since the mounting surface of the first chip-type electronic component 13 is the resin layer 12A, there is no crack due to firing shrinkage as in the ceramic layer, and it is not brittle and has a proof strength against a load during mounting. Such defects are eliminated and reliability is improved.

  In addition, according to the present embodiment, the first chip-type electronic component 13 is provided inside the cavity 10 </ b> A, and the first chip-type electronic component 13 is projected onto the resin portion 11 inside the resin portion 11. Since the second chip-type electronic components 14A and 14B are provided in a region different from the region, the resin part 11 is effectively used as a mounting space for the second chip-type electronic components 14A and 14B. Therefore, the multifunctional function of the composite multilayer substrate 10 can be promoted. In addition, since the first chip-type electronic component 13 and the second chip-type electronic components 14A and 14B are arranged so as to partially overlap at least in the vertical direction, the height of the composite multilayer substrate 10 can be reduced while performing high-density mounting. It can be realized at the same time.

  The ceramic laminate 12 is configured by laminating a plurality of ceramic layers 12A, and has a conductor pattern including external terminal electrodes 12C and 12D, in-plane conductors 12E, and via conductors 12F on the inside and on the surface thereof, so that the first chip The periphery of the mold electronic component 13 can be effectively used as a wiring region, and a reduction in the height of the composite multilayer substrate 10 can be promoted. In addition, the resin portion 11 has an external terminal electrode 11C on the surface opposite to the bonding surface with the ceramic laminate 12, and the external terminal electrode 11C is interposed via via conductors 11E formed in the resin portion 11. Since it is connected to the external terminal electrode 12C, which is a conductor pattern formed on the ceramic laminate 12, the conductor pattern of the ceramic laminate 12 and the conductor pattern of the mounting substrate are securely connected via the via conductor 11E of the resin portion 11. As a result, the first and second chip-type electronic components 13, 14 </ b> A, 14 </ b> B and the mounting substrate can be securely connected to realize the multi-function of the composite multilayer substrate 10.

  In addition, since the first chip-type electronic component 13 is sealed with the sealing resin portion 15 in the cavity 10A, the first chip-type electronic component 13 is removed from the external impact or humidity by the sealing resin portion 15. It can be surely protected. The ceramic laminate 12 is configured by laminating a plurality of low-temperature sintered ceramic layers 12A, and the conductor pattern is made of a conductor material mainly composed of silver or copper. The pattern can be co-fired at a low temperature of 1000 ° C. or lower, and the conductor pattern can be reliably formed even at a low temperature.

  In the above embodiment, as shown in FIG. 4, the resin portion 11A is prepared by previously laminating the resin sheet 111A having the through hole 111B for the cavity 10A. However, as shown in FIG. 6A, there is no through hole. The recess 11B can be formed even from the resin portion 11 ′ in which a predetermined number of resin sheets are stacked. That is, a resin sheet 11A having no through holes is laminated to produce a resin portion 11 ′, and after positioning the ceramic laminate 12 above the resin portion 11 ′, a hot press having a protrusion 200A corresponding to the recess 11B. 200, the resin of the resin sheet flows when the ceramic laminate 12 is pressure-bonded to the resin portion 11 ′ when heated and pressed by the heating press 200 from above the positioned ceramic laminate 12 at a predetermined temperature. Then, as shown in FIG. 5B, the resin portion 11 is formed in a state in which the recess 11B is formed and the second chip-type electronic components 14A and 14B on the ceramic laminate 12 side are embedded in the resin portion 11 ′. A composite multilayer substrate body 10 'is obtained by being integrated with'. Thereafter, the composite multilayer substrate 10 can be manufactured in the same manner as in the above embodiment.

  Next, still another embodiment of the composite multilayer substrate of the present invention will be described with reference to FIGS. In the following description, the number is incremented by 10 for each embodiment, and the description will focus on the features of each embodiment.

  Similar to the composite multilayer substrate 10 shown in FIG. 1, the composite multilayer substrate 20 shown in FIG. 7 includes a resin portion 21, a ceramic portion 22, and first and second chip-type electronic components 23, 24A, and 24B. Furthermore, the composite multilayer substrate 20 of the present embodiment seals the third chip type electronic components 27A and 27B mounted on the upper surface of the ceramic portion 22 and the third chip type electronic components 27A and 27B. The configuration is the same as that of the composite multilayer substrate 10 shown in FIG. As the third chip-type electronic components 27A and 27B, for example, active chip components such as semiconductor chips and passive chip components such as multilayer capacitors and multilayer inductors can be mounted.

  The third chip-type electronic components 27A and 27B are mounted on the external terminal electrode 22D on the upper surface of the ceramic portion 22. Although the ceramic portion 22 is formed by firing, since the through-hole 22B is formed in the ceramic portion 22, the surface of the ceramic portion 22 is compared with a ceramic laminate (not shown) having a cavity for the reason described above. The waviness (height difference) is small, the third chip-type electronic components 27A and 27B can be mounted with high accuracy, and poor connection and the like can be remarkably suppressed.

  According to the present embodiment, since the third chip-type electronic components 27A and 27B are mounted on the surface (upper surface) of the ceramic laminate 22, the composite multilayer that is more multifunctional than in the above-described embodiment. The substrate 20 can be obtained. In addition, since the third chip type electronic components 27A and 27B are covered with the second sealing resin portion 28, the third chip type electronic components 27A and 27B can be reliably protected from external humidity and the like. .

  A composite multilayer substrate 30 shown in FIG. 8 includes a resin portion 31, a ceramic portion 32, and first and second chip-type electronic components 33, 34A, and 34B, as in the composite multilayer substrate 10 shown in FIG. Furthermore, the composite multilayer substrate 30 of this embodiment includes a resin laminate including a resin portion 31 and a second resin portion 38 formed on the lower surface of the resin portion 31, and is provided in the second resin portion 38. Except for the provision of the third chip-type electronic components 37A and 37B, the configuration is the same as that of the composite multilayer substrate 10 shown in FIG. The resin part 31 and the second resin part 38 have different resin components, for example. In the second resin portion 38, as in the resin portion 31, active chip components such as semiconductor chips and passive chip components such as multilayer capacitors and multilayer inductors may be incorporated as third chip electronic components 37A and 37B. And further multi-functionalization can be promoted. In the present embodiment, the third chip-type electronic component 37A is connected to the external terminal electrode 31C formed on the lower surface of the resin portion 31, and the third chip-type electronic component 37B is connected to the upper surface of the second resin portion 38. It is connected to the formed external terminal electrode 38D. In the drawing, reference numeral 38E denotes a via conductor formed in the second resin portion 38. The via conductor 38E connects the via conductor 31E of the resin portion 31 and the mounting substrate. Also in this embodiment, the same effect as the composite multilayer substrate 20 shown in FIG. 7 can be expected.

  Similar to the composite multilayer substrate 10 shown in FIG. 1, the composite multilayer substrate 40 shown in FIG. 9 includes a resin portion 41, a ceramic portion 42, and first and second chip-type electronic components 43, 44A, and 44B. In the present embodiment, the second chip-type electronic components 44A and 44B are connected to the external terminal electrode 41C formed on the lower surface of the resin portion 41, and are the same as those of the composite multilayer substrate 10 shown in FIG. It is configured.

  10 includes a resin portion 51, a ceramic portion 52, and a first chip-type electronic component 53. The first chip-type electronic component 53 is connected to the ceramic portion 52 via a bonding wire 53A. Except for being connected to the external terminal electrode 52D, it is configured according to the composite multilayer substrate 10 shown in FIG. That is, in this embodiment, it is shown that the first chip-type electronic component 53 can be mounted in the cavity 50A by wire bonding as in the above embodiments. Also in this embodiment, since the bottom surface of the cavity 50A is formed by the resin portion 51 and is flat, the posture of the first chip-type electronic component 53 is stabilized in the cavity 50A, and the first chip-type electronic component 53 is It can be reliably connected to the external terminal electrode 52D of the ceramic portion 52. Also in this embodiment, the same effect as each said embodiment can be expected.

  11 includes a resin portion 61, a ceramic portion 62, and a first chip-type electronic component 63, and the opening diameter of the resin portion 61 is larger than the opening diameter of the ceramic portion 62. Except for this, it is configured according to the composite multilayer substrate 10 shown in FIG. By making the opening diameter of the resin part 61 larger than the opening diameter of the ceramic part 62 as shown by circles in FIG. That is, when a bare chip is mounted as the first chip-type electronic component 63, wetting of the bonding material can be prevented, and when a flip chip is mounted, an underfill material under the flip chip is used. It is possible to prevent the underfill material from getting wet on the wall surface of the cavity 60A before the underfill material is sufficiently filled under the flip chip when filled.

  In each of the above-described embodiments, the composite multilayer substrate having the cavity formed on the upper surface has been described. However, the composite multilayer substrate of the present invention has a so-called down cavity in which the cavity is formed downward as shown in FIG. There may be. The composite multilayer substrate 70 of the present embodiment has a laminated structure of a resin part 71 and a ceramic part 72 formed as a lower layer of the resin part 71 as shown in FIG. A recess 71B is formed at the center of the lower surface of the resin part 71, and a through hole 72B corresponding to the recess 71B of the resin part 71 is formed in the ceramic part 72. The recess 71B and the through hole 72B are integrated to form a down cavity 70A. The down cavity 70A bites into the resin portion 71 from the ceramic portion 72 as in the above embodiments, and has substantially the same function as the cavities in the above embodiments. That is, the first chip-type electronic component 73 is accommodated in the down cavity 70A, and this chip-type electronic component 73 is connected to the external terminal electrode 71D formed in the recess 71B of the resin portion 71. The first chip-type electronic component 73 in the down cavity 70 </ b> A is sealed with a sealing resin portion 75. Second chip electronic components 74A and 74B are connected to the external terminal electrodes 72C on the upper surface of the ceramic portion 72, respectively, and these second chip electronic components 74A and 74B are sealed by the resin portion 71. In the composite multilayer substrate 70, the lower surface of the ceramic portion 72 is a mounting surface with the mounting substrate. A mixed resin layer made of a mixed resin composition may be interposed between the mounting surface of the composite multilayer substrate 70 and the mounting surface of the mounting substrate. Since the other structure of the composite multilayer substrate 70 of this embodiment is comprised according to said each embodiment, only a code | symbol is attached | subjected in FIG. 12, and the description is abbreviate | omitted. Also in this embodiment, the same effect as each said embodiment can be expected.

  The present invention is not limited to the above-described embodiments, and a composite multilayer substrate with a cavity is a composite multilayer substrate having a laminated structure of a resin portion and a ceramic portion, and the composite multilayer substrate has a cavity. And if the said cavity is comprised from the through-hole formed in the said ceramic part, and the recessed part formed in the said resin part, it is included by this invention.

  The present invention can be suitably used for, for example, a composite multilayer substrate on which chip-type electronic components used in various electronic devices are mounted.

It is sectional drawing which shows one Embodiment of the composite multilayer substrate of this invention. It is sectional drawing which compares and shows the composite multilayer substrate shown in FIG. 1, and the conventional composite multilayer substrate. (A), (b) is explanatory drawing for demonstrating the process of mounting a chip-type electronic component in the ceramic part of the composite multilayer substrate shown in FIG. 1, respectively. (A)-(d) is explanatory drawing for demonstrating the process of manufacturing the resin part of the composite multilayer substrate shown in FIG. 1, respectively. (A), (b) is explanatory drawing for demonstrating the process of crimping | bonding the ceramic part and resin part of a composite multilayer substrate which are respectively shown in FIG. (A), (b) is explanatory drawing which shows the principal part of the other manufacturing process of the composite multilayer substrate shown in FIG. 1, respectively. It is sectional drawing which shows other embodiment of the composite multilayer substrate of this invention. It is sectional drawing which shows other embodiment of the composite multilayer substrate of this invention. It is sectional drawing which shows other embodiment of the composite multilayer substrate of this invention. It is sectional drawing which shows other embodiment of the composite multilayer substrate of this invention. It is sectional drawing which shows other embodiment of the composite multilayer substrate of this invention. It is sectional drawing which shows other embodiment of the composite multilayer substrate of this invention. It is a figure which shows an example of the conventional composite multilayer substrate, (a) is the sectional drawing, (b) is sectional drawing which expands and shows a part. It is sectional drawing at the time of providing a thermal via in the composite multilayer substrate shown in FIG.

Explanation of symbols

10, 10B, 20, 30, 40, 50, 60, 70 Composite multilayer substrate 10A, 20A, 30A, 40A, 50A, 60A, 70A Cavity 11, 21, 31, 41, 51, 61, 71 Resin part 11A Resin layer 11B Recess 11C, 11D External terminal electrode (conductor pattern, terminal electrode)
12, 22, 32, 42, 52, 62, 72 Ceramic part 12A Ceramic layer 12B Through hole 12C, 12D External terminal electrode (conductor pattern)
13, 23, 33, 43, 53, 63, 73 First chip type electronic component 14A, 24A, 34A, 44A, 74A Second chip type electronic component 14B, 24B, 34B, 44B, 74B Second chip type Electronic component 15 Sealing resin portion 27A, 37A Third chip type electronic component 27B, 37B Third chip type electronic component 28 Second sealing resin portion (resin layer)

Claims (10)

  A composite multilayer substrate having a laminated structure of a resin portion and a ceramic portion, wherein the composite multilayer substrate has a cavity, and the cavity is formed in a through hole formed in the ceramic portion and in the resin portion. A composite multilayer substrate comprising: a recessed portion formed on the substrate.   A first chip-type electronic component is provided inside the cavity, and the second chip is disposed in a region different from the projection region of the first chip-type electronic component on the resin portion side inside the resin portion. The composite multilayer substrate according to claim 1, comprising: a chip-type electronic component.   3. The composite multilayer substrate according to claim 2, wherein the first chip-type electronic component and the second chip-type electronic component partially overlap at least in the vertical direction.   The ceramic part is made of a ceramic laminate in which a plurality of ceramic layers are laminated, and has a predetermined conductor pattern inside and on the surface of the ceramic laminate. The composite multilayer substrate according to Item.   The resin part has a terminal electrode on a surface opposite to a joint surface with the ceramic part, and the terminal electrode is formed on the ceramic laminate via via conductors formed on the resin part. The composite multilayer substrate according to claim 4, wherein the composite multilayer substrate is connected to the conductor pattern. 6. The composite multilayer substrate according to claim 2, wherein the first chip-type electronic component is sealed with a resin in the cavity.   The ceramic part is formed of a ceramic laminate in which a plurality of low-temperature sintered ceramic layers are laminated, and the conductor pattern is formed of a conductor material mainly composed of silver or copper. The composite multilayer substrate according to claim 6.   8. The third chip type electronic component is mounted on the surface of the ceramic portion, and the third chip type electronic component is covered with a resin layer. Composite multilayer board.   The composite multilayer substrate according to any one of claims 1 to 8, wherein the resin portion includes a resin laminate in which a plurality of resin layers are laminated.   10. The composite multilayer substrate according to claim 1, wherein an opening diameter of the through hole formed in the ceramic portion is smaller than an opening diameter of the concave portion formed in the resin portion.

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