JP2017038012A - Tray transfer device and mounting device - Google Patents

Abstract

Provided are a tray transport device and a mounting device that do not require time and effort and can prevent a positional deviation of a tray with a simple configuration at a low cost.
A tray transport device that sequentially transports trays 200 from a plurality of stacked trays 200, and abutting the surface of the electronic component 9 with a receiving portion 201 and the surface of another tray 200 by stacking. A tray 200 having a back surface provided with a back contact portion 203 whose displacement is restricted is placed on a stage 110 on which the back surface is placed, and a tray 200 in which the electronic component 9 is housed in the housing portion 201 is placed on the stage 110. A moving mechanism for moving the stage 110 between the supply position α to be supplied, the unloading position β from which the electronic component 9 is unloaded from the tray 200, and the collection position γ from which the tray 200 is recovered from the stage 110, and the tray in the stage 110 200 is provided at a position that contacts the back contact portion 203 of 200, and has a restricting portion that restricts movement of the tray 200 relative to the stage 110.
[Selection] Figure 8

Description

  The present invention relates to a transport device that transports a tray and a mounting apparatus including the transport device.

  In the manufacturing process of flat panel displays such as liquid crystal displays and organic EL displays, it is necessary to mount electronic components on a mounting object such as a substrate. For example, the electronic component is mounted on the substrate by temporarily crimping the electronic component to the terminal portion provided on the peripheral upper surface of the substrate via a pressure-sensitive adhesive tape, followed by heat and pressure.

  A mounting apparatus that performs such mounting includes, for example, a transport device that transports an electronic component supplied to a mounting position on a tray. The tray transfer device moves the tray between a supply position for supplying a tray on which electronic components are placed, a carry-out position for carrying out electronic components from the tray, and a collection position for collecting the tray from which electronic components are carried out. Device.

JP 7-142890 A

  It is desirable that the tray transported by the transport apparatus as described above does not shift in the process of moving between the supply position, the unload position, and the collection position. For example, if the position and direction of the electronic component are constant at the unloading position, the electronic component can be unloaded and then mounted on the board accurately. For this reason, conventionally, the tray is positioned at a fixed position by a tray positioning mechanism.

  As the positioning mechanism, there are a clamp mechanism and a suction mechanism. The clamp mechanism is a mechanism that presses the tray against the reference wall side. The adsorption mechanism is a mechanism that adsorbs the tray to the intake hole by decompression. However, such a positioning mechanism needs to be provided with a special mechanism in the transport device, which is expensive. Also, each time a different size tray is used, the position adjustment is troublesome.

  Furthermore, in general, a portion of the tray that accommodates the electronic components is formed with relatively high accuracy, but the dimensional accuracy of the outer shape is rough, and there are variations of about several millimeters. For this reason, even if the trays have the same shape, it is difficult to position the individual trays at a fixed position with high accuracy when positioning with reference to the outer edge.

  The present invention has been proposed in order to solve the above-described problems of the prior art, and the purpose thereof is to prevent troubles in the operation and to prevent misalignment of the tray with a low-cost and simple configuration. An object of the present invention is to provide a tray transfer device and a mounting device that can be used.

  In order to achieve the above object, a tray transport device of the present invention is a tray transport device that sequentially transports a tray from a plurality of stacked trays, and a surface on which a workpiece storage unit is provided, and a stack A tray having a back surface provided with a back contact portion that is in contact with the surface of another tray and whose displacement is regulated is placed on a stage on which the back surface is placed, and the work is stored in the storage portion. A moving mechanism for moving the stage between a supply position at which the tray is supplied to the stage, an unloading position at which workpieces are unloaded from the tray, and a collection position at which the tray is recovered from the stage; And a restricting portion that is provided at a position in contact with a back contact portion of the tray in the stage and restricts movement of the tray with respect to the stage.

  The tray has a front abutting portion on the front surface that abuts against a back abutting portion of another tray and regulates displacement in a direction perpendicular to the stacking direction, and the regulating portion has the same shape as the tray. Yes, it may be a front contact portion in a dummy tray fixed to the stage. The dummy tray may be attached to the stage by a fixture.

  The back contact portion may have an inclined surface that is inclined with respect to the vertical direction, and the restricting portion may be provided at a position that contacts the inclined surface. The restricting portion may be provided in a region surrounding the tray accommodating portion placed on the stage.

  A supply unit that supplies the tray that stores the workpiece in the storage unit to the stage that has come to the supply position, an unloading unit that unloads the workpiece from the storage unit of the tray that has reached the unloading position, and the unloading unit And a recovery unit that recovers the tray that has been unloaded from the storage unit and has come to the recovery position.

  There may be a placement area for stacking trays supplied to the stage or trays collected from the stage, and a dummy tray having the same shape as the tray may be fixed to the placement area.

  Moreover, the mounting apparatus of this invention has the said tray conveyance apparatus, and has a mounting part which mounts the workpiece | work carried out from the accommodating part of the said tray in the said carrying-out position to a mounting target object. Moreover, the mounting apparatus of this invention has the said tray conveyance apparatus, and has a mounting part which mounts components in the workpiece | work carried out from the accommodating part of the said tray in the said carrying-out position.

Schematic plan view showing an example of a mounting apparatus to which the embodiment is applied Schematic side view of the mounting apparatus of FIG. The perspective view which shows the tray which accommodates a single workpiece | work Sectional drawing which shows the lamination | stacking state of several trays The perspective view which shows the tray which accommodates a some workpiece | work. Sectional drawing which shows the tray conveying apparatus of embodiment Sectional drawing which shows the state which mounted the tray in FIG. Explanatory drawing which shows the movement of the tray in a tray conveying apparatus Explanatory drawing which shows the tray supply procedure by a supply part Explanatory drawing which shows the collection | recovery procedure of the tray by a collection part Side view showing another mode of supply unit and recovery unit Sectional view showing how the dummy tray is fixed to the stage Sectional drawing which shows the lamination | stacking aspect of the tray to a dummy tray Sectional drawing which shows the other aspect of a tray Sectional drawing which shows the other example of a control part

[Constitution]
The configuration of the present embodiment will be described with reference to the drawings.
[Mounting equipment]
A mounting apparatus S to which the tray transport apparatus 100 of this embodiment is applied will be described with reference to a plan view of FIG. 1 and a side view of FIG. The mounting device S is a device that attaches the electronic component 9 as a work to the side portion of the substrate W that is a mounting object via an adhesive tape (not shown). The electronic component 9 is, for example, a TCP (Tape Carrier Package), an FPC (Flexible Printed Circuit), or a bare chip. The adhesive tape is a thin strip-shaped anisotropic conductive member.

  The mounting apparatus S includes a base 1 having a substantially rectangular parallelepiped shape. On the upper surface of the base 1, as shown in FIG. 1, from one end side to the other end side in the longitudinal direction, the substrate supply unit 2, the adhering unit 3, the temporary crimping unit 4, the main crimping unit 5, and the discharge Part 6. Further, as shown in FIG. 2, a panel supply unit 12, a first delivery unit 19, a second delivery unit 33, and a panel carry-out unit 44 are provided above the base 1.

  In the following description, the longitudinal direction of the base 1 when viewed from the plane direction is the Y direction, and the direction orthogonal to the Y direction is the X direction. A direction perpendicular to the plane formed by the Y direction and the X direction is taken as a Z direction. In the following description, the Y direction and the X direction may be referred to as the horizontal direction, the Z direction as the vertical direction, and the movement in the Z direction may be referred to as elevation.

  The substrate supply unit 2 is a component that supplies the substrate W. The affixing unit 3 is a component that affixes an adhesive tape (not shown) to the side of the substrate W. The temporary press-bonding part 4 is a component that temporarily press-bonds a plurality of electronic components 9 to the upper surface of the side part to which the adhesive tape of the substrate W is attached. The main press-bonding part 5 is a component that performs main press-bonding on the electronic component 9 that is temporarily press-bonded to the upper surface of the side part by the temporary press-bonding part 4. The discharge unit 6 is a component that unloads the substrate W on which the electronic component 9 is finally bonded by the main pressing unit 5.

  The substrate supply unit 2 and the discharge unit 6 include mounting tables 10 and 46 that are stacked in a substrate W and driven in the Z direction. The sticking part 3, the provisional pressure bonding part 4, and the main pressure bonding part 5 have a sticking stage 15, a temporary pressure bonding stage 21, and a main pressure bonding stage 35 that are driven in the X direction, Y direction, Z direction, and θ direction. The θ direction is the rotation direction.

  The sticking unit 3 has a sticking mechanism 16. The sticking mechanism 16 is a mechanism for sticking an adhesive tape cut to a predetermined length on the side of the substrate W. The temporary pressure bonding portion 4 and the main pressure bonding portion 5 have pressure bonding devices 31 and 36. The crimping devices 31 and 36 are devices that crimp the electronic component 9 on the upper surface of the side portion of the substrate W to which the adhesive tape is attached.

  The panel supply unit 12 and the panel carry-out unit 44 are members that include suction pads that suck the substrate W and are driven in the Y direction. The first delivery unit 19 and the second delivery unit 33 are members that include suction pads that suck the substrate W and are fixed upward.

[Tray transport device]
In the mounting apparatus S, the electronic component 9 mounted on the substrate W is supplied from the tray transport apparatus 100. The tray conveying apparatus 100 will be described with reference to FIGS. 3 to 10 in addition to FIG.

(tray)
First, the tray 200 conveyed by the tray conveying apparatus 100 will be described. The tray 200 is a member that accommodates the electronic component 9 and is transported to the tray transport device 100. In the following description, one surface of the tray 200 is the front surface and the other surface is the back surface. For example, when the tray 200 is placed horizontally with the housing portion of the electronic component 9 facing upward, the upper side is the front surface and the lower side is the back surface.

  As shown in FIGS. 3 and 4, the tray 200 includes a storage portion 201, a front contact portion 202, and a back contact portion 203. The accommodating portion 201 is a portion that accommodates the electronic component 9 provided on the surface of the tray 200. The front contact portion 202 and the back contact portion 203 are provided on the front surface and the back surface of the tray 200, respectively. The back contact portion 203 is in contact with the surface of the stacked trays 200 and displacement is restricted. The front abutting portion 202 abuts on the back abutting portion 203 of the stacked trays 200 and restricts displacement in a direction orthogonal to the stacking direction. That is, when the plurality of trays 200 are stacked, the front contact portion 200 and the back contact portion 203 are in contact with each other and restrict displacement in a direction perpendicular to the stacking direction.

  More specifically, the tray 200 is a rectangular thin box-shaped member. As shown in FIG. 3, the front abutting portion 202 is a bank-like portion that continuously rises over the entire circumference of the surface of the tray 200. The back contact portion 203 is a groove-like portion that is continuously depressed over the entire circumference of the back side of the tray 200. The front contact portion 202 is formed by bending the vicinity of the edge portion of the tray 200 into a convex shape, and the back side is a concave back contact portion 203. The accommodating part 201 is a rectangular recessed area surrounded by the front contact part 202 and the back contact part 203. Further, the outermost peripheral edge of the tray 200 is a surface parallel to the stage 110.

  As shown in FIG. 4, the front contact portion 202 and the back contact portion 203 have inclined surfaces 202a and 203a that are inclined with respect to the vertical direction, respectively. The inclined surface 202a is an outer surface of the front contact portion 202 and is inclined outward as it goes downward. The inclined surface 203a is an outer inner surface of the back contact portion 203, and is inclined outward as it goes downward. The back side of the inclined surface 202 a of the front contact portion 202 is an inclined surface 203 a of the back contact portion 203. When the trays 200 are stacked, as illustrated in FIG. 4, the inclined surface 202 a of the front contact portion 202 of the lower tray 200 contacts the inclined surface 203 a of the back contact portion 203 of the upper tray 200.

  Note that the tray 200 includes a single electronic component 9 and a plurality of electronic components 9. As shown in FIG. 3, the tray 200 having a single accommodation number has no partition in the accommodation unit 201, and one electronic component 9 is accommodated in the accommodation unit 201. As shown in FIG. 5, the tray 200 having a plurality of accommodation numbers is divided into a lattice shape inside the accommodation portion 201, and one electronic component 9 is accommodated in a frame formed by each lattice. 3 and 5, the electronic component 9 is shown as having a substantially L-shaped planar shape. In the following description, an example in which a single tray 200 is used will be described.

(Tray transfer device)
The tray transport device 100 is a device that transports the tray 200 on which the electronic component 9 is placed. As shown in FIGS. 1, 6, and 7, the tray transport apparatus 100 includes a stage 110, a moving mechanism 111, and a dummy tray 210.

  The stage 110 is a member on which the tray 200 is placed with its back surface facing. The stage 110 is, for example, a plate having a flat surface on which the tray 200 is placed. The moving mechanism 111 is a mechanism that moves the stage 110 between the supply position α, the carry-out position β, and the collection position γ.

  The supply position α is a position where the tray 200 in which the electronic component 9 is accommodated in the accommodating portion 201 is supplied to the stage 110. The unloading position β is a position where the electronic component 9 is unloaded from the tray 200. The collection position γ is a position where the tray 200 is collected from the stage 110. The supply position α is one moving end side of the stage 110. The collection position γ is on the other moving end side of the stage 110. The unloading position β is between the supply position α and the collection position γ on the moving path of the stage 110.

  The moving mechanism 111 includes, for example, a support part 111a and a drive part 111b as shown in FIGS. The support portion 111 a is a pair of legs that are fixed to the lower surface of the stage 110 and support the stage 110.

  The drive unit 111b is a mechanism that moves the stage 110 in the horizontal direction by moving the support unit 111a. The drive part 111b is a linear guide attached to the support part 111a, for example. The linear guide has a rail 111c and a movable block 111d. The rail 111c is a pair of linear members laid in the horizontal Y direction. The movable block 111d is a member that slides along the rail 111c. The movable block 111d is fixed to the lower end of the support portion 111a, and supports the stage 110 together with the support portion 111a.

  In addition, the drive unit 111b includes a ball screw and a drive source (not shown). The ball screw is a member that moves the movable block 111d by turning. The drive source is a member that rotates the ball screw. As a result, the movable block 111d moves along the rail 111c as the ball screw rotates. Since the support portion 111a attached to the movable block 111d moves in the horizontal direction together with the movable block 111d, the stage 110 supported by the support portion 111a also moves in the horizontal direction (Y direction).

  As shown in FIG. 6, the dummy tray 210 is a member having the same shape as the tray 200 described above. That is, the dummy tray 210 has the same front contact portion 202 and back contact portion 203 as the tray 200. One of the dummy trays 210 used as the tray 200 can be used as it is.

  The dummy tray 210 is fixed to the stage 110 by a fixing tool 110a. For example, a bolt is used as the fixture 110a. The bolt is inserted into a hole formed at an edge parallel to the stage 110 of the dummy tray 210. Then, the dummy tray 210 is fixed to the stage 110 by screwing into the screw holes formed in the stage 110.

  The stage 110 is provided with a positioning part 112. The positioning unit 112 is a member that positions the dummy tray 210 at a fixed position when the outer edge of the dummy tray 210 abuts. The positioning part 112 is, for example, a protruding part that protrudes from the stage 110. At least two sides of the outer edge of the dummy tray 210 are in contact with the protruding portion. That is, although not shown, the protrusion has a straight portion in a direction perpendicular to the protrusion.

  Furthermore, the tray conveyance apparatus 100 of this embodiment has the supply part 120, the carrying-out part 130, and the collection | recovery part 140, as shown in FIG.1 and FIG.8. The supply unit 120 is a component that supplies the tray 200 in which the electronic component 9 is stored in the storage unit 201 to the stage 110 that has come to the supply position α. Since the dummy tray 210 is fixed to the stage 110 as described above, the supply unit 120 supplies the tray 200 onto the dummy tray 210.

  As shown in FIG. 8, the supply unit 120 includes a cover 121, a holding unit 122, and an elevating unit 123. The cover 121 is a rectangular tube-shaped component that stores and stacks the trays 200 on which the electronic components 9 are placed. The holding unit 122 is provided at the lower end of the cover 121, and between a holding position for holding the rear edge of the lowermost tray 200 and a release position for releasing the edge of the tray 200 by a driving mechanism (not shown). Moving.

  The elevating unit 123 is a mechanism for elevating the tray 200 supplied to the dummy tray 210. The elevating unit 123 includes, for example, a pin 123a and a cylinder 123b. The pin 123a is a member that passes through a hole (not shown) formed in the stage 110 and the dummy tray 210, supports the back of the tray 200 in contact with the tip, and moves up and down in the Z direction to move up and down the tray 200. . The cylinder 123b is a mechanism for moving the pin 123a forward and backward.

  The unloading unit 130 is a component that unloads the electronic component 9 from the storage unit 201 of the tray 200 that has reached the unloading position β. The electronic component 9 carried out by the carry-out unit 130 is conveyed to a position where the temporary crimping unit 4 is attached to the substrate W. The carry-out unit 130 includes a transfer arm 131 and a suction head 132. The transport arm 131 is a component that is driven in the X direction, the Y direction, and the Z direction by a driving mechanism (not shown). The suction head 132 is a member that sucks the electronic component 9 through a suction hole connected to a decompression device (not shown).

  The collection unit 140 is a component that collects the tray 200 that has been unloaded from the storage unit 201 by the carry-out unit 130 and has come to the collection position γ. Since the tray 200 is mounted on the dummy tray 210 and reaches the collection position γ as described above, the collection unit 140 collects the tray 200 from the dummy tray 210.

  The collection unit 140 includes a cover 141, a holding unit 142, and an elevating unit 143. The cover 141 is a rectangular tube-shaped component part that stacks and accommodates the trays 200 from which the electronic components 9 have been unloaded. The holding part 142 is provided at the lower end of the cover 141, and is held between a holding position for holding the rear edge of the lowermost tray 200 and a release position for releasing the edge of the tray 200 by a driving mechanism (not shown). Moving.

  The elevating unit 143 is a mechanism for elevating the tray 200 collected from the dummy tray 210. The elevating unit 143 includes, for example, a pin 143a and a cylinder 143b. The pin 143a is a member that passes through a hole (not shown) formed in the stage 110 and the dummy tray 210, supports the back of the tray 200 in contact with the tip, and moves up and down in the Z direction to move up and down. . The cylinder 143b is a mechanism for moving the pin 143a back and forth.

  The mounting apparatus S including the tray transport apparatus 100 is controlled by a control apparatus (not shown). The control device controls activation, stop, speed, operation timing, and the like of each unit of the tray transport device 100 and the mounting device S. These controls are performed by arithmetic processing based on input signals from various sensors and timers (not shown).

  The control device can be realized by, for example, a dedicated electronic circuit or a computer that operates with a predetermined program. An input device for an operator to input instructions and information necessary for control and an output device for confirming the state of the device are connected to the control device.

[Action]
The operation of the present embodiment as described above will be described.
[Outline of mounting operation]
First, an outline of the mounting operation of the electronic component 9 on the substrate W by the mounting apparatus S will be described with reference to FIGS. 1 and 2. The substrate W stacked on the mounting table 10 of the substrate supply unit 2 is transported to the bonding unit 3 by the panel supply unit 12 and mounted on the bonding stage 15.

  In the sticking unit 3, the sticking mechanism 16 sticks a sticking tape to the substrate W. The first delivery unit 19 receives the substrate W from the sticking stage 15 that has moved, and delivers the substrate W to the temporary crimping stage 21 of the temporary crimping unit 4. In the temporary crimping section 4, the electronic component 9 is temporarily crimped to the substrate W by the crimping device 31.

  The second delivery unit 33 receives the substrate W from the moved temporary crimping stage 21 and delivers it to the final crimping stage 35 in the final crimping unit 5. In the final crimping section 5, the electronic component 9 is finally crimped to the substrate W by the crimping device 36.

  The panel carry-out unit 44 moves to the main press-bonding stage 35 to receive the substrate W and places it on the mounting table 46 of the discharge unit 6. The substrate W placed on the placement table 46 is transferred to the next process by a robot or the like (not shown).

[Tray transport]
Next, a tray transport operation by the tray transport apparatus 100 will be described with reference to FIGS.
(Tray supply)
First, as shown in FIG. 8A, the stage 110 moves to the supply position α. Then, the dummy tray 210 comes below the supply unit 120. The procedure for supplying the tray 200 from the supply unit 120 is shown in FIG.

  As shown in FIG. 9A, a plurality of trays 200 on which electronic components 9 are placed are stacked and accommodated in the cover 121 of the supply unit 120, and the edge of the lowermost tray 200 is a holding unit. 122.

  As shown in FIG. 9B, the pin 123a of the elevating unit 123 is raised to push up the back surface of the lowermost tray 200. As a result, the stacked trays 200 rise and leave the holding unit 122. The holding unit 122 moves outward from the tray 200.

  As shown in FIG. 9C, the pin 123a moves down and moves to a position where only the lowermost tray 200 is exposed from the cover 121.

  As shown in FIG. 9D, the holding unit 122 moves in a direction to hold the edge of the tray 200 immediately above the lowermost layer. As a result, the tray 200 above the lowermost layer is held in the cover 121.

  As shown in FIG. 9E, the pin 123 a is further lowered, and the lowermost tray 200 is placed on the dummy tray 210.

  When the tray 200 is placed on the dummy tray 210 in this way, as shown in FIG. 7, the inclined surface 202 a in the front contact portion 202 of the dummy tray 210 is changed to the inclined surface in the back contact portion 203 of the tray 200. Abuts against 203a. Thereby, the movement of the tray 200 with respect to the stage 110 is regulated. That is, even if the stage 110 moves, the position of the tray 200 relative to the stage 110 is prevented. In particular, a shift in the moving direction of the tray 200 that is likely to occur due to the movement of the stage 110 is suppressed.

(Unloading electronic parts)
Next, as shown in FIGS. 1 and 8B, the stage 110 moves to the unloading position β. The transport arm 131 of the carry-out unit 130 moves the suction head 132 to the electronic component 9 on the tray 200 placed on the dummy tray 210. The transport arm 131 transports the suction head 132 that sucks and holds the electronic component 9 to the crimping device 31 of the temporary crimping unit 4.

  As described above, even when the electronic component 9 is carried out by the suction head 132, the front contact portion 202 provided on the entire circumference of the dummy tray 210 is in contact with the back contact portion 203 of the tray 200. Misalignment is prevented.

(Tray collection)
Next, as shown in FIG. 8C, the stage 110 moves to the collection position γ. Then, the dummy tray 210 comes below the collection unit 140. The procedure for collecting the tray 200 into the collection unit 140 is shown in FIG.

  As shown in FIG. 10A, a plurality of collected trays 200 are stacked and accommodated in the cover 141 of the collection unit 140. The edge of the lowermost tray 200 is held by the holding unit 142.

  As shown in FIG. 10B, the pin 143 a of the elevating unit 143 is raised to push up the back surface of the tray 200 on the dummy tray 210. The tray 200 pushed up by the pins 143 a pushes up the lowermost tray 200 in the cover 141, so that the stacked trays 200 rise and leave the holding unit 142. The holding unit 142 moves in a direction to retract from the tray 200.

  As shown in FIG. 10C, the pins 143a further rise, and the tray 200 pushed up by the pins 143a moves to a position where it is accommodated in the cover 141.

  As shown in FIG. 10D, the holding part 142 moves in a direction to support the edge part of the tray 200 pushed up by the pins 143a. As a result, all the pushed-up trays 200 are held in the cover 141.

  As shown in FIG. 10E, the pin 143a further descends and enters the lower portion of the dummy tray 210.

[effect]
In the present embodiment, the tray 200 having the front surface provided with the housing portion 201 of the electronic component 9 and the back surface provided with the back contact portion 203 that is in contact with the surface by lamination and whose displacement is restricted is provided on the back surface thereof. , A supply position α at which the tray 200 in which the electronic component 9 is accommodated in the accommodating portion 201 is supplied to the stage 110, and an unloading position β at which the electronic component 9 is unloaded from the tray 200. The tray 200 includes a moving mechanism 111 that moves the stage 110 between the collection position γ where the tray 200 is collected from the stage 110.

  Furthermore, the present embodiment has a restricting portion that is provided at a position where it abuts against the back contact portion 203 of the tray 200 and restricts the movement of the tray 200 with respect to the stage 110. In this embodiment, the restricting portion includes a front abutting portion 202 that restricts displacement of the tray 200 on the surface in contact with a back abutting portion 203 of another tray 200 in a direction perpendicular to the stacking direction. The regulating portion is the front abutting portion 202 in the dummy tray 210 having the same shape as the tray 200.

  According to the present embodiment as described above, the positioning is not performed based on the outer edge of the tray 200 but is provided at a position where the tray 200 comes into contact with the back contact portion 203 of the tray 200 when the tray 200 is stacked on the dummy tray 210. It is positioned at a fixed position by the regulated portion. For this reason, it is possible to prevent the positional deviation of the tray 200 with a simple configuration, and a special mechanism is not required and the cost can be reduced. Since the tray 200 can be positioned simply by overlapping the restricting portion, it does not require time for positioning work.

  Further, if the tray 200 used for transporting the electronic component 9 is used as the dummy tray 210, the tray 200 is simply placed on the dummy tray 210, and the dummy tray 210 is placed on the back contact portion 203 of the tray 200. The front abutting portion 202 abuts and is automatically positioned. For this reason, the labor of positioning according to the tray 200 to be used can be largely omitted.

  Although a method of positioning based on the outer edge of the tray 200 is common, there is no idea of making positioning easy by bringing a regulating portion into contact with the back side of the tray 200 as in the present invention. Moreover, by simply attaching the dummy tray 210 to the stage 110, position regulation from the back side of the tray 200 can be realized easily and at low cost.

  Further, the dummy tray 210 is fixed to the stage 110 by a fixing tool 110a. That is, since it is only necessary to fix the dummy tray 210 with the fixture 110a, preparation becomes very simple.

  The back contact portion 203 has an inclined surface 203a inclined with respect to the vertical direction, and the restricting portion is provided at a position where the restricting portion contacts the inclined surface 203a. That is, the front contact portion 202 of the dummy tray 210 contacts the inclined surface 203 a of the back contact portion 203. By this inclined surface 203a, the horizontal range in which the restricting portion can come into contact with the back contact portion 203 is widened. For this reason, when the tray 200 is placed on the stage 110, the restricting portion can be reliably brought into contact with the back contact portion 203 even if there is a slight displacement. In particular, when the dummy tray 210 is used, the inclined surface 202a of the front abutting portion 202 is in contact with the inclined surface 203a of the back abutting portion 203. Is positioned.

  The restricting portion is provided in an area surrounding the accommodating portion 201 of the tray 200 placed on the stage 110. For example, the front contact portion 202 of the dummy tray 210 is provided on the entire circumference of the tray 200. For this reason, displacement in all directions parallel to the stage 110 is prevented.

  Positioning is possible only by placing the tray 200 on the stage 110, and subsequent displacement can be prevented, so that the configuration of the supply unit 120, the carry-out unit 130, and the collection unit 140 can be simplified. Further, since the positional deviation of the tray 200 is prevented, the position of the electronic component 9 is stabilized and accurate mounting is possible, so that the product yield is improved.

[Other Embodiments]
The present invention is not limited to the above embodiment.
(1) The workpiece to be used is not limited to the electronic component 9. For example, the workpiece can be the substrate W. Therefore, the tray transport device 100 can be applied as the substrate supply unit 2. As the mounting part of the mounting device S, the configuration of the substrate supply part 2, the sticking part 3, the provisional pressure bonding part 4, the main pressure bonding part 5, the discharge part 6, etc. is exemplified, but the structure of the mounting part is not limited to this, Any configuration may be used as long as the workpiece is mounted on the mounting target.

(2) The means for supplying and collecting the tray 200 is not limited to the above-described aspect.
For example, as shown in FIG. 11A, a placement region 300 in which the trays 200 supplied to the stage 110 are stacked in advance is provided adjacent to the supply position α. As shown in FIG. 11B, a dummy tray 210 having the same shape as the tray 200 is fixed in the placement area 300, and the tray 200 in which the electronic components 9 are accommodated is placed in the dummy tray 210. Stack up. And the conveyance mechanism 310 which takes out the tray 200 stacked | stacked on the mounting area | region 300 from the uppermost stage, and conveys it to the stage 110 which came to supply position (alpha) is provided.

  Further, as shown in FIG. 11C, a placement area 400 for stacking the trays 200 collected from the stage 110 is provided adjacent to the collection position γ. A dummy tray 210 having the same shape as the tray 200 is fixed to the placement area 400. And the conveying apparatus 320 which receives the tray 200 which came to the collection | recovery position (gamma), and is piled up in the mounting area | region 400 is provided.

  The transport mechanisms 310 and 320 include transport arms 310a and 320a and suction heads 310b and 320b. The transfer arms 310a and 320a are components that are driven in the X, Y, and Z directions by a drive mechanism (not shown). The suction heads 310b and 320b are members that hold the tray 200 by suction through suction holes connected to a decompression device (not shown).

  In such an embodiment, as shown in FIG. 11A, the worker stacks the tray 200 on the dummy tray 210 in advance. Then, as shown in FIG. 11B, among the stacked trays 200, the uppermost tray 200 is sucked and held by the suction head 310b of the transport arm 310a, and the transport arm 310a is positioned at the supply position α. Transport to stage 110. Then, the suction head 310 b releases the tray 200 on the dummy tray 210. As a result, the tray 200 is supplied onto the dummy tray 210.

  Further, as shown in FIG. 11C, the tray 200 on which the electronic component 9 has been unloaded on the stage 110 positioned at the collection position γ is sucked and held by the suction head 320b of the transfer arm 320a, and the transfer arm 320a. Is conveyed to the placement area 400. Then, the suction head 320 b releases the tray 200 on the collected tray 200 stacked on the dummy tray 210. Thereby, the tray 200 is collected.

  In such an aspect, since the dummy trays 210 are also provided in the placement areas 300 and 400, the positions of the trays 200 stacked on the placement areas 300 and 400 are always constant. For this reason, the positional deviation of the tray 200 supplied and recovered by the transport mechanisms 310 and 320 is prevented.

  Furthermore, as a means for supplying the stacked trays 200, there are a type that is taken out from below and a type that is taken out from above as described above. Further, as described above, there are two types of means for stacking and collecting the trays 200: a type of stacking from below, and a type of stacking from above. These may be used in any combination. For example, the supply side can be taken out from the bottom, the collection side can be taken out from the top, the supply side can be taken out from the top, and the collection side can be taken out from the bottom.

(3) The fixture 110a that fixes the dummy tray 210 to the stage 110 is not limited to the above embodiment. For example, as shown in FIG. 12, a groove 110 b having a substantially T-shaped cross section that is continuous in the horizontal direction is formed on the stage 110. A head of a vertical bolt 110c is inserted into the groove 110b. The threaded portion of the bolt 110c is inserted into a hole formed in an edge portion parallel to the stage 110 of the dummy tray 210, and the protruding portion is fastened and fixed with a nut 110d. Thereby, since it can fix in any position of the groove | channel 110b, according to the dummy tray 210, a desired position can be selected. Furthermore, it is also possible to use a hook-and-loop fastener, an adhesive tape, etc. as a fixture.

(4) The manner in which the tray 200 and the dummy tray 210 overlap is not limited to the above embodiment. For example, in the above aspect, the outer inclined surface 202a of the front contact portion 202 and the outer inclined surface 203a of the back contact portion 203 are in contact, but as shown in FIG. The inner inclined surface 202a of the front contact portion 202 and the inner inclined surface 203a of the back contact portion 203 may contact each other. Moreover, as shown to FIG. 13 (B), you may regulate in the aspect in which the front contact part 202 and the back contact part 203 mutually fit.

  Further, the tray 200 is not limited to one formed by molding a thin plate member formed of resin or the like. For example, as shown in FIG. 14, the tray 200 has a frame-like thick portion on the outer peripheral portion, and the inside of the thick portion is a container portion 201 that is thinner than the thick portion, and the upper surface of the thick portion. Is the front contact portion 202, and the lower surface of the thick portion is the back contact portion 203. The front abutting portion 202 is provided with cylindrical protrusions 202c at a predetermined arrangement interval, and the rear abutting portion 203 is circular in a plan view in which the protruding portion 202c is fitted in the same arrangement as the protruding portion 202c. The recess 203c is provided. In this case, the projection 202c of the front contact portion 202 of the other toilet 202 is fitted into the recess 203c of the back contact portion 203, whereby the horizontal position of the stacked trays 200 is restricted. That is, the protrusion 202c and the recess 203c perform the same function as the inclined surfaces 202a and 203a of the tray 200 described in the above embodiment. The shape of the protrusion 202c is not limited to a cylindrical shape, and may be other shapes such as a polygonal column shape, a conical shape, a polygonal pyramid shape, and the horizontal direction of the tray 200 by fitting into a correspondingly formed recess portion. Any shape can be used as long as the position can be regulated.

(5) It is not always necessary to use the front contact portion 202 of the dummy tray 210 as the restricting portion. For example, as shown in FIG. 15, the jig 204 may be fixed at a position where the stage 110 contacts the back contact portion 203 of the tray 200. The jig 204 includes an inclined surface that contacts the inclined surface 203a of the back contact portion 203, and restricts the movement of the tray 200 by contacting the inclined surface with the inclined surface 203a of the back contact portion 203. be able to. The shape of the jig 204 may be the same as that of the front contact portion 202, or may be provided partially rather than the entire circumference.

(6) In the above embodiment, the tray 200 is transported by one stage 110, but a plurality of stages 110 may be provided. In this case, when the electronic component 9 is unloaded from the tray 200 of any one of the stages 110, the tray 200 can be supplied to the other stage 110, or the tray 200 can be recovered from the other stage 110. . Thereby, the electronic component 9 can be efficiently supplied to the mounting apparatus S.

DESCRIPTION OF SYMBOLS 1 Base 2 Board | substrate supply part 3 Adhering part 4 Temporary crimping part 5 Final crimping part 6 Discharge part 9 Electronic component 10 Mounting stand 12 Panel supply part 15 Adhering stage 16 Adhering mechanism 19 1st delivery part 21 Temporary crimping stage 31 Crimping device 33 Second delivery portion 35 Crimping stage 36 Crimping device 44 Panel unloading portion 46 Mounting table 100 Tray transport device 110 Stage 110a Fixing tool 110b Groove 110c Bolt 110d Nut 111 Moving mechanism 111a Supporting portion 111b Driving portion 111c Rail 111d Block 112 Positioning unit 120 Supply unit 121 Cover 122 Holding unit 123 Lifting unit 123a Pin 123b Cylinder 130 Unloading unit 131 Transfer arm 132 Suction head 140 Collection unit 141 Cover 142 Holding unit 143 Lifting unit 143a Pin 143b Cylinder 200 Tray 210 D -Tray 201 Storage portion 202 Front abutting portion 202a Inclined surface 202c Protruding portion 203 Back abutting portion 203a Inclined surface 203c Depressed portion 204 Jig 300 Placement area 310 Conveying mechanism 310a Conveying arm 310b Adsorption head 320 Conveying mechanism 320a Conveying arm 320b Adsorption Head 400 Mounting area S Mounting apparatus W Substrate

Claims (9)

A tray transfer device that sequentially transfers a tray from a plurality of stacked trays,
A tray having a front surface on which a work accommodating portion is provided and a back surface on which a back contact portion whose displacement is restricted by contact with the surface of another tray by stacking is placed with the back surface facing. And stage
Between a supply position where the tray in which the work is accommodated in the accommodating portion is supplied to the stage, a carry-out position where the work is carried out from the tray, and a collection position where the tray is collected from the stage, A moving mechanism for moving the stage;
A restricting portion that is provided at a position in contact with a back contact portion of the tray in the stage and restricts movement of the tray with respect to the stage;
A tray transfer device comprising: The tray has, on the surface, a front abutting portion that abuts against a back abutting portion of another tray and regulates displacement in a direction perpendicular to the stacking direction,
The tray conveying device according to claim 1, wherein the restricting portion is a front abutting portion of a dummy tray which is the same shape as the tray and is fixed to the stage.   The tray transfer device according to claim 2, wherein the dummy tray is attached to the stage by a fixture. The back contact part has an inclined surface inclined with respect to the vertical direction,
The tray conveying device according to claim 1, wherein the restricting portion is provided at a position where the restricting portion comes into contact with the inclined surface.   5. The tray transport device according to claim 1, wherein the restricting portion is provided in a region surrounding a storage portion of the tray placed on the stage. A supply unit for supplying a tray containing workpieces in the storage unit to the stage which has come to the supply position;
An unloading unit for unloading the workpiece from the tray storage unit that has come to the unloading position;
A recovery unit that recovers the tray that has been unloaded from the storage unit by the unloading unit and has come to the recovery position;
6. The tray conveyance device according to claim 1, wherein the tray conveyance device is provided. A stacking area for stacking trays supplied to the stage or trays collected from the stage;
The tray conveyance device according to claim 1, wherein a dummy tray having the same shape as the tray is fixed to the placement area. It has a tray conveyance device given in any 1 paragraph of Claims 1-7,
A mounting apparatus, comprising: a mounting portion that mounts the work unloaded from the tray accommodating portion on a mounting object at the unloading position. It has a tray conveyance device given in any 1 paragraph of Claims 1-7,
A mounting apparatus comprising a mounting portion for mounting a component on the work unloaded from the tray accommodating portion at the unloading position.

Images