九、發明說明： 【發明所屬之技術領域】 技術領域 本發明係有關於一種可從供應部取出作為電子零件之 半導體晶片，並可使其上下翻轉地安裝於基板上之安裝裝 置及安裝方法。 【先前技術】 背景技術 在將作為電子零件之半導體晶片安裝於載帶或導線架 等之基板上之安裝方式中，有將形成於該半導體晶片之凸 塊面向下地安裝於前述基板上面的覆晶安裝。 用以進行覆晶安裝的安裝裝置設有作為半導體晶片之 供應部的晶圓載台。該晶圓載台上固持有貼附於黏接片之 半導體晶圓，且該半導體晶圓被切成小四方塊狀之多數半 導體晶片。 該裝置係利用設於翻轉拾取單元之翻轉拾取器 (pick-up t〇〇1)，將半導體晶片1個丨個地從前述晶圓載台藉由 吸附取出。翻轉拾取器在取出半導體晶片後可將其上下旋 轉180度，使已吸附固持之前述半導體晶片翻轉。即，將形 成有凸塊之面向下。 經翻轉而將形成有凸塊之面向下的半導體晶片係在形 成有凸塊之面向下的狀態傳遞至可朝χ、γΗ方向驅動之 安裝器’而承接㈣體晶片之安裝器會義至㈣送機構 搬送且較位之基板上方。然後，在χ、γ方向上定位後朝 下降方向驅動前述安裝器’再將固持於前端之半導體晶片 安裝於前述基板上。 在對基板安裝半導體晶片時，為了提高生產性，需要 縮短單件生產時間(Tact time)。目前已嘗試各種方法以縮短 單件生產時間’如使前述翻轉拾取器從供應部取出半導體 m片的速度或取出後之翻轉速度等尚速化，使前述安裝器 承接半導體晶片的速度或安裝速度高速化等。 但是，因前述翻轉拾取器或安裝器之動作速度的高速 化有極限，故有效率地對前述基板安裝半導體晶片以提高 生產性的方法也會有極限。 【發明内容】 發明揭示 本發明係可提供可使前述基板之電子零件的安裝效率 大幅提高的電子零件之安裝裝置及安裝方法。 即，本發明係一種電子零件之安裝裝置，係用以將電 子零件安裝於基板上者，包含有：丨個供應部個以供應 前述電子料者；第1嶋衫及第2轉U，係可在拾 取該供應部之前述電子零件後使其_者安裝單元， 係用以承接财述第1㈣單元_之前述電子料，並將 其安裝於前述基板上者；及第2安裝單元制財接經前 述第2翻料元_之前料子料，並料安裝於前 妬t去。 ，係用以將電子零 將前述基板往預定 本發明係-種電子零件之安裝方法 件安裝於基板上者，包含有以下步帮： 方向搬送並加以定位；藉由2個翻轉單元，從用以供應前述 電子零件之1個供應部交互拾取前述電子零件並使其翻 轉，及藉由安裝單元分別承接經各前述翻轉單元翻轉之前 述電子零件’並將其安裝於前述基板上。 圖式簡單說明 第1圖係顯示本發明之第丨實施形態之安裝裝置之概略 結構的平面圖。 第2圖係一對翻轉單元的正面圖。 第3圖係顯示控制電路的方塊圖。 第4A圖係顯示對基板安裝半導體晶片之最初步驟說明 圖。 第4B圖係顯示對基板安裝半導體晶片之下一步驟說明 圖。 > 第5圖係顯示本發明之第2實施形態之安裝裝置之概略 結構的平面圖。 第6圖係顯示本發明之第3實施形態之安裝裝置之配置 有—對安裝單元的部分平面圖。 第7圖係藉由一對安裝單元在搬送方向上將複數列半 導體晶片安裝在節距搬送之2片基板時的說明圖。 第8圖係顯示本發明之第4實施形態之以一對安裝單元 對長度較長之基板安裝半導體晶片時的說明圖。 【實施方式】 實施發明之最佳形態 以下參照圖式說明本發明之實施形態。 第1圖至第4B圖係顯示本發明之第！實施形態#圖係 顯不女裝裝置之概略結構的平面圖，且駐裝裝置設有基 台1。在該基台1之前後方向中 甲央部上沿寬度方向設有用以 構成基板歡搬送構件的搬料路2。讎送祕2之-端 設有用以供應基板W之裝巷邮。 ° ’而另一端則如後述’設有 用以存放安裝有作為電子零件 件之丰導體晶片4之基板W的 卸載部5。 如第1圖之箭頭X所示，由前述農載部3供應至前述搬送 通路2之基板靠藉由圖未示之搬送機構，以預定節距間歇 搬送至前述卸載部5。如第丨圖之箭頭所示，係以基板歡 搬送方向為X方向，且以獻方向垂直的方向為γ方向。X、 Y如第1圖所示。 在前述·基台1的寬度方向中央部，前述搬送通路2的前 方設有作為電子零件供應部之晶圓栽台7。如第2圖所示， 該晶圓載台7係在基台1上依序設有X台8、丫台9及❸台u，θ 台11上設有晶圓固持台12。 藉此，可朝X、γ及θ方向驅動前述晶圓固持台12。在 該晶圓固持台I2上，有半導體晶圓I3黏貼於樹脂製膜片（圖 未示）’且該半導體晶圓13被分割成多數前述半導體晶片4。 前述晶圓固持台12的下方設有上頂單元15。該上頂單 疋15係固持於和前述晶圓固持台12不同的安裝構件丨々上， 且該安裝構件14係安裝於圖未示之固定部。 藉此，只要朝X、Υ方向驅動前述晶圓固持台12，使其 相對於前述上頂單元15定位，即可如後述藉由前述上頂單 1328265 元15之圖未示之上頂銷，不使前述樹脂製膜片彈性變性地 將欲拾取之預定半導體晶片4往上頂。 前述晶圓載台7的側方設有前述晶圓固持台12之收容 部20。晶圓固持台12係藉由圖未示之搬送機構由前述收容 5部20供應至前述晶圓載台7。而且，當所有固持於晶圓固持 台12之半導體晶片4都被後述之翻轉單元17、18之翻轉拾取 器19取出時，該晶圓固持台12就會藉由前述搬送機構存放 至前述收容部20。 被前述上頂銷往上頂之半導體晶片4會由前述第丨翻轉 10單元17、第2轉單元18之翻轉拾取器19交互取出並上下翻 轉。 如第2圖所示，前述第1、第2翻轉單元17、18具有本體 21。形成於該本體21之一側之引導面21a上設有一對X引導 構件22，係沿前述與基板W之搬送方向相同的X方向以預定 15間隔平行設置者。該X引導構件22上設有可透過滑塊24朝X 方向移動之X可動體23。如第2圖所示，該X可動體23係藉 由設於前述本體21之寬度方向之一側之X驅動源25旋轉驅 動之螺軸25a，而可在X方向上作往復運動。 前述X可動體23設有旋轉驅動部26，該旋轉驅動部26 20 上沿X方向設有連接底端之臂部27。即，臂部27係藉由旋轉 驅動部26,以沿長邊方向之轴線為中心，在180度的範圍内 旋轉驅動。 前述臂部27的前端透過Z驅動部28設有前述翻轉拾取 器19。藉此，翻轉拾取器19可朝X方向、旋轉方向（Θ方向） 9 1328265 即z方向驅動。 當前述晶圓固持台12相對於X、γ及0方向定位時，會 * 驅動前述上頂單元15之上頂銷，將預定位置之半導體晶片4 往上頂。另外’第丨翻轉單元17或第2翻轉單元18中之任一 5翻轉拾取器19會朝X方向驅動，定位於被往上頂之半導體晶 片4上方。 接著’該翻轉拾取器19會藉由z驅動部28驅動至下降方 向’以吸附固持被前述上頂單元15之上頂銷往上頂之半導 • 體晶片4。 10 前述翻轉拾取器19在吸附半導體晶片4後，會在上升後 藉由旋轉驅動部26旋轉18〇度。藉此，可使半導體晶片4之 上下面翻轉’使形成有圖未示之凸塊之面向下。 又’第1翻轉單元17及第2翻轉單元18係由後述之控制 裝置39控制其驅動，以藉由第丨翻轉單元口及第2翻轉單元 15 18之翻轉拾取器19交互取出在晶圓載台7被往上頂之半導 體晶片4。 • /由前述第1翻轉單元Π之翻轉拾取器職前述晶圓 載台7取出之半導體晶片4係由第1圖所示之第1安裝單元31 之安裝器32承接。而藉由前述第2翻轉單元18之翻轉拾取器 2〇 19從剛述晶圓載台7取出之半導體晶片4則係由第2安裝單 元33之安裝器32承接。 前述第1、第2安裝單元31、33係隔著前述搬送通路2 刀別配置於與第1、第2翻轉單元17、18對應之位置。各安 裝單兀31、33具有頂部本體34，且該頂部本體34可藉由χ、 10 1328265 Y台37朝χ、γ方向驅動。 前述頂部本體34的側方設有Ζ台35。該Ζ台35底端固定 地設有臂部36，且該臂部36前端設有前述安裝器32。 當前述翻轉拾取器19從晶圓載台7取出半導體晶片4並 5使其翻轉時’會將前述安裝器32驅動至與X方向垂直之γ方 向之前述基台1的前方。而且，安裝器32的下端會定位於固 持於前述翻轉拾取器19且經翻轉之半導體晶片4上方。 接著’翻轉拾取器19朝上升方向驅動，安裝器32會吸 附固持於前述翻轉拾取器19之半導體晶片4向上之面。第2 10圖係顯示第2安裝單元33之安裝器32從第2翻轉單元18之翻 轉拾取器19承接半導體晶片4的情形。 冨女裝器32吸附半導體晶片4時’翻轉拾取器19就會解 除半導體晶片4的吸附。藉此，就可將半導體晶片4由前述 翻轉拾取器19傳遞至安裝器32。 15 承接半導體晶片4後之安裝器32會上升，且向γ方向後 方驅動，定位於搬送通路2之預定位置，即已搬送至安裝位 置之基板W上方。接著，前述安裝器32會下降，將吸附固 持於下端之前述半導體晶片4安裝於前述基板界預定之安 裝位置。 20 經第1翻轉單元17之翻轉拾取器19翻轉之半導體晶片4 係由第1安裝單元31之安裝器32承接，而經第2翻轉單元18 之翻轉拾取器19翻轉之半導體晶片4則係由第2安裝單元33 之安裝器32承接。 第1安裝單元31之安裝器32和第2安裝單元33之安裝器 11 1328265 32係從第1、第2翻轉單元17、18交互承接半導體晶片4。因 此，可防止第1、第2安裝單元31、33之安裝器32在晶圓載 台7上方碰撞等而互相干擾。 第3圖係顯示控制電路之方塊圖。前述晶圓載台7、第1 5 翻轉單元17、第2翻轉單元18、第1安裝單元31及第2安裝單 元33可藉由前述控制裝置39控制其驅動。 根據此種結構之安裝裝置，可藉由第i翻轉單元17及第 2翻轉單元18之翻轉拾取器19從晶圓載台7交互取出半導體 晶片4。 10 經第1翻轉單元17之翻轉拾取器19翻轉之半導體晶片4 會在藉由第1安裝單元31之安裝器32承接後安裝於基板w 上’而經第2翻轉單元18之翻轉拾取器19翻轉之半導體晶片 4則會在藉由第2安裝單元33之安裝器32承接後安裝於基板 W上。 15 在從晶圓載台7取出半導體晶片4時，該取出動作係藉 由前述第1翻轉單元17及第2翻轉單元18交互進行。由各翻 轉單元17、18取出之半導體晶片4係藉由第1安裝單元31、 第2安裝單7033交互安裝於基板W上。 也就是說，因藉由2個翻轉單元17、18和2個安裝單元 2〇 Μ、33將半導體晶片4交互安裝於基上故與分別以i 個翻轉單元和安裝單元安裝時相比，可以約加快2倍之單件 生產時間將半導體晶片4安裝於基板w上。 即，可將由第1翻轉單元17和第1安裝單元31安裝半導 體曰曰片4(該安裝為第1安裝）的時點，與由第2翻轉單元I8和 12 第2安裝單元33安裝半導體晶片4(該安裝為第2安裝）的時點 錯開進行。 因此雖然第1女裝與第2安裝的時點分別與習知安裝 的時點幾乎相同’但只要將第丨安裝與第2安裝之時點錯開 習知絲之科生斜_2分之丨崎，就可將安裝速度 提高至2倍。即，將第1安裝與第2钱時點錯開並行地進 行，可使全體的安裝速度提高至2倍。 參照第4A圖及第4B圖說明將半導體晶片4安裝於基板 W上時的順序。首先，從裝載部3搬出基板W，並搬送至搬 送通路2，當基板W的前端部到達藉由第丨安裝單元^安裝 半導體晶片4之第1安裝位置則時，可藉由第！安裝單元^ 將第4A目、第4B圖中以4_〇表示之半導體晶片安裝於基板| 上。 藉由第1安裝單元31安裝半導體晶片4之第1安裝位置 B卜與藉由第2安裝單元33安裝半導體晶片4之帛2安裝位置 B2係在X方向上相隔基板臂的搬送節距？之丨5倍的距離。 如第4A圖所示，當半導體晶片4-〇在第1安裝位置B1安 裝於基板w的刖端部時，就會以搬送節距p來搬送基板w， 然後將圖中以4-1表示之2個半導體晶片依序安裝於相隔 1.5P的距離之第1安裝單元31之第丨安裝位置則、和第2安裝 單元33之第2安裝位置B2上。此時，最初安裝之半導體晶片 4-0會位於比第2安裝位置32前面(p/2)節距的位置。 當以4-1表示之半導體晶片安裝於基板w上時，會以節 距P朝第4B圖中箭頭X所示之方向搬送基板w，然後將半導 1328265 體晶片依序安裝於第1安裝單元31之第1安裝位置B1、和第2 女裝單元33之第2安裝位置82上。此時所安裝之2個半導體 晶片係以4-2表示。藉此，可從基板w之搬送方向之前頭側 以(P/2)節距間隔安裝半導體晶片4_ 1、4_〇、‘2。 5 如此，只要在每次以節距P搬送基板W時，將半導體晶 片依序女裝於相隔1.5節距的距離之第2安裝位置Bi和第2 女裝位置B2上，就可以搬送節距p之2分之！的間隔將複數半 導體晶片4(4-1、4-0、4-2、…)安裝於基板w上。 此外’第1安裝位置B1和第2安裝位置B2的間隔並不限 10於1.5P ’只要為(Νρ+〇·5Ρ)即可。即，亦可為2.5P或3.5P、… 等。又，η為整數。 如此，只要將第1安裝位置Β1和第2安裝位置Β2的間隔 設為(Νρ+〇·5Ρ)’藉由在搬送通路2每丨節距地搬送基板w， 即可以與第i安裝位置則和第2安裝位置B2的間隔相應之 15搬送節距同時安裝2個半導體晶片4，故安裝所需之單件生 產時間可加快2倍。 只要藉由2個安裝裝置將半導體晶片4安裝於基板w 上，就可將單件生產時間加快2倍，但另一方面，也會使成 本提高。 2〇 但是’該實施形態之安裝裝置中包含用以搬送基板％ 之搬送通路2之搬送系統或用以將半導體晶片4往上頂之上 頂早元15等分別各有1個’只有翻轉單元17、18和安裝單元 31、33有2組。因此，與藉由2個裝置使單件生產時間加快2 倍的情形相比，可大幅地減低安裝裝置之成本。 14 1328265 2個翻轉單元17、18和2個安裝單元31、33係藉由控制 裝置39錯開時點驅動。藉此’不僅不會在2個翻轉單元π、 18之翻轉拾取器19同時位於晶圓載台7上方的時點使其驅 動，且亦不會在2個翻轉單元17、18之翻轉拾取器19同時承 5 接的時點使其驅動。 因此，不僅2個翻轉單元17、18之翻轉拾取器19不會在 晶圓載台7上方互相碰撞等而造成干擾，且2個安裝單元 31、33之安裝器32不會在晶圓載台7上方或基板W等上方互 相碰撞等而造成干擾。 10 安裝裝置設有2個翻轉單元17、18和2個安裝單元31、 33。因此，就算有2個翻轉單元17、18之其中一者或2個安 裝單元31、33之其中一者故障等，也可利用另一翻轉單元 或安裝單元繼續安裝半導體晶片4。 然後，說明第5圖所示之本發明之第2實施形態。第5 15 圖係安裝裝置的平面圖，且該安裝裝置之第1翻轉單元π之 X可動體23與第2翻轉單元18之X可動體23係藉由連接構件 41以預定間隔連接在一起。 藉此，一對X可動體23可機械性地維持由連接構件41 連接之間隔，而不會變成其以下之間隔或其以上之間隔。 20 即，一對X可動體23係藉由連接構件41而可阻止其分別獨立 地個別驅動》 只要將一對X可動體23的間隔維持一定，透過臂部27 設於第1 '第2翻轉單元17、18之一對翻轉拾取器19的間隔 也會維持一定。 15 1328265 因此’即使錯誤操作第丨、第2翻轉單元17、18、或動 作時點失常等，一對翻轉拾取器19也不會為了拾取半導體 晶片4而同時移動至晶圓載台7上，故可確實地防止該等一 對翻轉拾取器19碰撞或接觸等造成干擾受損。 5 接著’說明第6圖及第7圖所示之本發明之第3實施形 態。如第6圖所示，該實施形態係在將基板W從裝載部3供 應至搬送路徑2時，以預定間隔同時搬出為偶數片之2片基 板W。即，如第7圖所示，2片基板w之搬送方向前端部之 可安裝半導體晶片4的部位的間隔如該圖中之χι所示，係以 10與第1安裝單元31之安裝器32和第2安裝單元33之安裝器32 沿X方向之間隔相等的間隔搬出。 此外，雖圖未示，但亦可事先將2片基板w以預定間隔 載置於固持台，再將該固持台從裝載部3搬出。 第1安裝單元31和第2安裝單元33可藉由X、Y台37定位 15於X方向及Υ方向。因此，可藉由前述X、Υ台37使一對安 裝器32定位，以使一對安裝器32的間隔又1與2片基板|前端 部之可安裝半導體晶片4的部位的間隔一致。 如此，如第7圖所示，只要使一對安裝器32的間隔X1 與2片基板W前端部之可安裝半導體晶片4的部位的間隔一 2〇致，則在以節距？讯朝又方向節距搬送2片基板W，並將半導 體晶片4行列狀地安裝於其上時，即可藉由第i、第2安裝單 几31、33，在基板w之搬送方向上從基板w的前端部到後 端部之節距Pw的間隔相同地對節距搬送之2片基板w安裝 複數半導體晶片4。 16 1328265 即因可使第1安裝單元31和第2安裝單元33在相同條 件下運轉來安裝半導體“4 ’故可提高該等安裝單元31、 33的運轉率。 此時’試著假設-下對著節賴送之i片基板w，藉由 5第1安裝單元Μ和第2安裝單元33沿基板1之搬送方向以預 定節距Pw安裝半導體晶片4的情形。 當在基板W之搬送方向上以節距!^安裝偶數列半導體 晶片4時，因第丨安裝單元31和第2安裝單元幻係分別安裝相 同列數之半導體晶片4,故可使該等安裝器32以相同之運轉 10 率運轉。 但疋，當以節距Pw在基板W之搬送方向上安裝奇數列 半導體晶片4時，最後一列只有第1安裝單元3丨或第2安裝單 元33之其中一安裝器32進行安裝，另一安裝器32則呈停頓 狀態。因此，其中一安裝器32之運轉率就會降低。而且， 15若對2片一組之複數組基板W進行此種安裝，則運轉率之降 低就會依基板W的組數增大。 對此，如第3實施形態一般，只要以安裝器32分別對2 片基板W安裝半導體晶片4，則在基板W之搬送方向上安裝 奇數列半導體晶片4時，因可如前述使各安裝器32在相同運 2〇 轉率下運轉，故可提高安裝裝置的運轉率，而提高生產性。 此外，當設有安裝器32之臂部36的寬度尺寸大於基板 W的長度尺寸的2分之1時，會有無法將其中一安裝器32與 另一安裝器32分別定位在1片基板W之搬送方向之前端部 與中央部的情形。 17 1328265 即，若使其中一安裝器32定位在基板w前端部，則另 一安裝器32就會位於較基板W之長邊方向中央部後方(搬送 方向之上游側）。因此，與位於前端側之其中一安裝器32所 安裝之半導體晶片4沿搬送方向的列數相比，位於後方之另 5 一安裝器32所安裝之列數就會比較少，故另一安裝器32之 運轉率會降低。 但是，如第3實施形態一般，即使是在此種情形下只 要藉由安裝單元31、33之安裝器32分別對2片基板w安裝半 導體晶片4，即可使2個安裝器32在相同運轉率下運轉，故 10可提高運轉率。 此外，在該第3實施形態中，雖然係在搬送通路2以預 疋間隔搬送作為偶數片之2片基板W，以第丨安裝單元31和 第2安裝單兀33將半導體晶片4安裝在該等基板玫之前端 部，但，例如，亦可在搬送通路2以預定間隔搬送如4片或6 15片等2片以上之偶數片（η片）基板w。 此時，只要將第1安裝單元31定位於前頭之基板w前端 部，再將第2安裝單元33定位於從前頭之基板w算起第 [(N/2)+l]片之基板貿前端部，就可使第丨、第2安裝單元、 33不停頓地對n片基板撕安裝半導體晶片4 ^ 第8_顯示本發明之第4實施形態。該實施形態係基 板Wa為帶狀之長度較長時的情形，此時，第〗安裝單元μ 與第2安裝單7033的間隔X2為安裝於基板Wa之半導體晶片 4的節距Pw的整數倍^。 而且，若第1、第2安裝單元31、33在基板Wa上以節距 18[Technical Field] The present invention relates to a mounting device and a mounting method for attaching a semiconductor wafer as an electronic component from a supply portion and attaching it to the substrate upside down. [Prior Art] In a mounting method in which a semiconductor wafer as an electronic component is mounted on a substrate such as a carrier tape or a lead frame, there is a flip chip in which a bump formed on the semiconductor wafer is mounted face down on the substrate. installation. A mounting device for flip chip mounting is provided with a wafer stage as a supply portion of a semiconductor wafer. The wafer stage is fixedly attached to a semiconductor wafer attached to the bonding pad, and the semiconductor wafer is cut into a plurality of semiconductor wafers having a small square shape. This apparatus uses a flip-chip mounted on a flip-chip pickup unit to take out semiconductor wafers one by one from the wafer stage by adsorption. The flip-up pickup can rotate the semiconductor wafer up and down by 180 degrees after the semiconductor wafer is taken out to invert the previously held semiconductor wafer that has been adsorbed and held. That is, the face of the bump is formed to face downward. By flipping, the downward facing semiconductor wafer formed with the bumps is transferred to the mounter capable of driving in the direction of the Η, γΗ in the downwardly facing state in which the bumps are formed, and the mounter of the (four) body wafer is received (4) The substrate is transported and positioned above the substrate. Then, after positioning in the χ and γ directions, the mounter is driven in the descending direction, and the semiconductor wafer held at the front end is mounted on the substrate. When mounting a semiconductor wafer on a substrate, in order to improve productivity, it is necessary to shorten the one-piece production time (Tact time). At present, various methods have been tried to shorten the single-piece production time, such as the speed at which the flip-chip pick-up device takes out the semiconductor m-piece from the supply portion, or the speed at which the flip-flop is taken out, and the like, so that the mounter can take the speed or the mounting speed of the semiconductor wafer. High speed and so on. However, there is a limit to the speed of operation of the flip-flop or the mounter, and there is a limit to the method of efficiently mounting the semiconductor wafer on the substrate to improve productivity. Disclosure of the Invention The present invention provides an electronic component mounting apparatus and a mounting method capable of greatly improving the mounting efficiency of electronic components of the substrate. That is, the present invention is an electronic component mounting apparatus for mounting an electronic component on a substrate, comprising: one supply unit for supplying the electronic material; the first shirt and the second turn U, After the electronic component of the supply unit is picked up, the electronic component can be used to receive the electronic material of the first (four) unit of the financial statement and mounted on the substrate; and the second installation unit can be used for making money. After receiving the aforementioned second turning element _ before the material, and installed in the front 妒 t. The method for mounting the substrate to the substrate by mounting the electronic substrate to the predetermined method of the present invention includes the following steps: direction transfer and positioning; by using two flip units, The electronic component is alternately picked up and inverted by a supply unit that supplies the electronic component, and the electronic component 'over which is inverted by each of the inverting units is respectively received by the mounting unit and mounted on the substrate. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view showing a schematic configuration of a mounting apparatus according to a third embodiment of the present invention. Figure 2 is a front elevational view of a pair of flip units. Figure 3 is a block diagram showing the control circuit. Fig. 4A is a view showing an initial step of mounting a semiconductor wafer on a substrate. Fig. 4B is a view showing a step of mounting a semiconductor wafer on a substrate. > Fig. 5 is a plan view showing a schematic configuration of a mounting device according to a second embodiment of the present invention. Fig. 6 is a partial plan view showing the arrangement of the mounting device according to the third embodiment of the present invention. Fig. 7 is an explanatory view showing a case where a plurality of semiconductor wafers are mounted on a two-ply substrate by pitch in a transport direction by a pair of mounting units. Fig. 8 is an explanatory view showing a state in which a semiconductor wafer is mounted on a substrate having a long length by a pair of mounting units in the fourth embodiment of the present invention. BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described with reference to the drawings. Figures 1 to 4B show the first aspect of the present invention! Embodiment # Figure is a plan view showing a schematic structure of a women's wear device, and the station device is provided with a base 1. In the front and rear direction of the base 1, a moving path 2 for constituting the substrate transfer member is provided in the width direction in the central portion. The end of the secret 2 is provided with a loading and unloading mail for supplying the substrate W. The other end is provided with an unloading portion 5 for storing the substrate W on which the conductor wafer 4 as the electronic component is mounted, as will be described later. As indicated by an arrow X in Fig. 1, the substrate supplied to the transport path 2 by the agricultural load unit 3 is intermittently transported to the unloading unit 5 at a predetermined pitch by a transport mechanism (not shown). As indicated by the arrow in the figure, the direction in which the substrate is conveyed is the X direction, and the direction in which the direction is perpendicular is the γ direction. X and Y are as shown in Figure 1. In the center portion in the width direction of the base 1 described above, a wafer stage 7 as an electronic component supply unit is provided in front of the conveyance path 2. As shown in FIG. 2, the wafer stage 7 is provided with an X stage 8, a stage 9 and a stage u on the base 1, and a wafer holding stage 12 is provided on the θ stage 11. Thereby, the wafer holding stage 12 can be driven in the X, γ, and θ directions. On the wafer holding table I2, a semiconductor wafer I3 is adhered to a resin film (not shown), and the semiconductor wafer 13 is divided into a plurality of the semiconductor wafers 4. An upper unit 15 is provided below the wafer holding table 12. The upper top unit 15 is held on a mounting member different from the wafer holding table 12, and the mounting member 14 is attached to a fixing portion (not shown). Therefore, as long as the wafer holding table 12 is driven in the X and Υ directions to be positioned relative to the upper top unit 15, the top pin can be unillustrated by the above-mentioned top id 1328265. The predetermined semiconductor wafer 4 to be picked up is topped without elastically denaturation of the resin film. The accommodating portion 20 of the wafer holding table 12 is provided on the side of the wafer stage 7. The wafer holding table 12 is supplied from the storage unit 5 to the wafer stage 7 by a transport mechanism (not shown). Moreover, when all of the semiconductor wafers 4 held by the wafer holding table 12 are taken out by the inverting pickups 19 of the inverting units 17, 18 which will be described later, the wafer holding table 12 is stored in the housing portion by the aforementioned conveying mechanism. 20. The semiconductor wafer 4 which is topped up by the upper top pin is alternately taken out by the first turn flipping unit 10 and the second picking unit 19 of the second turning unit 18 and turned upside down. As shown in Fig. 2, the first and second reversing units 17, 18 have a main body 21. A pair of X guide members 22 are provided on the guide surface 21a formed on one side of the main body 21, and are disposed in parallel at predetermined intervals of 15 in the X direction which is the same as the transport direction of the substrate W. The X guiding member 22 is provided with an X movable body 23 that is movable in the X direction through the slider 24. As shown in Fig. 2, the X movable body 23 is reciprocable in the X direction by a screw shaft 25a that is rotationally driven by an X drive source 25 provided on one side in the width direction of the main body 21. The X movable body 23 is provided with a rotation driving portion 26, and the rotation driving portion 2620 is provided with an arm portion 27 that connects the bottom end in the X direction. In other words, the arm portion 27 is rotationally driven in the range of 180 degrees around the axis in the longitudinal direction by the rotation driving portion 26. The front end of the arm portion 27 is provided with the above-described reverse pickup 19 through the Z driving portion 28. Thereby, the inverting pickup 19 can be driven in the X direction and the rotation direction (Θ direction) 9 1328265, that is, the z direction. When the wafer holding table 12 is positioned with respect to the X, γ, and 0 directions, the top pin of the upper top unit 15 is driven to push the semiconductor wafer 4 at a predetermined position upward. Further, any of the fifth flipping unit 17 or the second inverting unit 18 is driven in the X direction to be positioned above the semiconductor wafer 4 which is topped up. Then, the inverting pickup 19 is driven to the descending direction by the z driving portion 28 to adsorb and hold the semiconductor wafer 4 which is topped up by the top pin of the upper top unit 15. After the semiconductor wafer 4 is adsorbed, the reverse flip-chip 19 is rotated by 18 degrees by the rotary driving portion 26 after rising. Thereby, the upper and lower faces of the semiconductor wafer 4 can be flipped 'to face the lower side of the bumps not shown. Further, the first inverting unit 17 and the second inverting unit 18 are controlled to be driven by a control device 39, which will be described later, to mutually take out the wafer stage by the flipping unit 19 of the second inverting unit port and the second inverting unit 15 18 7 is a semiconductor wafer 4 that is topped up. • The semiconductor wafer 4 taken out of the wafer stage 7 by the flipping device of the first reversing unit 承 is received by the mounter 32 of the first mounting unit 31 shown in Fig. 1 . On the other hand, the semiconductor wafer 4 taken out from the wafer stage 7 by the inverting pickup 2〇19 of the second inverting unit 18 is received by the mounter 32 of the second mounting unit 33. The first and second attachment units 31 and 33 are disposed at positions corresponding to the first and second reversing units 17 and 18 via the transport path 2 . Each mounting unit 31, 33 has a top body 34, and the top body 34 can be driven in the γ, γ direction by χ, 10 1328265 Y stage 37. A side wall 35 is provided on the side of the top body 34. An arm portion 36 is fixedly disposed at a bottom end of the platform 35, and the front end of the arm portion 36 is provided with the aforementioned mounter 32. When the flip-chip pickup 19 takes out the semiconductor wafer 4 from the wafer stage 7 and inverts it, the mounter 32 is driven to the front side of the base 1 in the γ-direction perpendicular to the X direction. Moreover, the lower end of the mounter 32 is positioned above the flipped semiconductor wafer 4 held by the flipper 19. Then, the flip-up pickup 19 is driven in the upward direction, and the mounter 32 sucks up the upward direction of the semiconductor wafer 4 held by the flip-flop 19. Fig. 2 shows a case where the mounter 32 of the second mounting unit 33 receives the semiconductor wafer 4 from the flip picker 19 of the second reversing unit 18. When the wafer holder 4 adsorbs the semiconductor wafer 4, the flipping of the semiconductor wafer 4 is released by the flipping of the pickup. Thereby, the semiconductor wafer 4 can be transferred from the above-described flip pickup 19 to the mounter 32. After the semiconductor wafer 4 is received, the mounter 32 is lifted and driven in the γ direction, and is positioned at a predetermined position of the transport path 2, i.e., above the substrate W that has been transported to the mounting position. Then, the mounter 32 is lowered, and the semiconductor wafer 4 adsorbed and held at the lower end is attached to a predetermined mounting position of the substrate boundary. The semiconductor wafer 4 inverted by the flip-up pickup 19 of the first reversing unit 17 is received by the mounter 32 of the first mounting unit 31, and the semiconductor wafer 4 inverted by the flip-up pickup 19 of the second reversing unit 18 is The mounter 32 of the second mounting unit 33 is received. The mounter 32 of the first mounting unit 31 and the mounter 11 1328265 of the second mounting unit 33 alternately receive the semiconductor wafer 4 from the first and second reversing units 17, 18. Therefore, it is possible to prevent the mounters 32 of the first and second mounting units 31 and 33 from colliding with each other above the wafer stage 7 and the like. Figure 3 is a block diagram showing the control circuit. The wafer stage 7, the first inverting unit 17, the second inverting unit 18, the first mounting unit 31, and the second mounting unit 33 can be controlled to be driven by the control unit 39. According to the mounting device of such a configuration, the semiconductor wafer 4 can be alternately taken out from the wafer stage 7 by the flipping device 19 of the i-th flipping unit 17 and the second inverting unit 18. The semiconductor wafer 4 which has been inverted by the flip-up pickup 19 of the first reversing unit 17 is mounted on the substrate w after being received by the mounter 32 of the first mounting unit 31, and is turned over by the second flip unit 18; The inverted semiconductor wafer 4 is mounted on the substrate W after being received by the mounter 32 of the second mounting unit 33. When the semiconductor wafer 4 is taken out from the wafer stage 7, the take-out operation is performed by the first inverting unit 17 and the second inverting unit 18 in an interactive manner. The semiconductor wafer 4 taken out by each of the turning units 17 and 18 is alternately mounted on the substrate W by the first mounting unit 31 and the second mounting sheet 7033. That is to say, since the semiconductor wafers 4 are alternately mounted on the base by the two flipping units 17, 18 and the two mounting units 2, 33, it is possible to be mounted with i flip units and mounting units, respectively. The semiconductor wafer 4 is mounted on the substrate w at a speed of about two times the single piece production time. That is, the semiconductor wafer 4 can be mounted by the first reversing unit 17 and the first mounting unit 31 (the first mounting is mounted), and the semiconductor wafer 4 can be mounted by the second reversing unit I8 and the second mounting unit 33. (The installation is the second installation) is staggered. Therefore, although the time of the first women's wear and the second installation are almost the same as those of the conventional installation, the misplaced point of the second installation is the same as the second installation. The installation speed can be increased by 2 times. In other words, when the first installation and the second money are shifted in parallel, the overall installation speed can be doubled. The procedure when the semiconductor wafer 4 is mounted on the substrate W will be described with reference to Figs. 4A and 4B. First, the substrate W is carried out from the loading unit 3 and transported to the transport path 2, and when the front end portion of the substrate W reaches the first mounting position where the semiconductor wafer 4 is mounted by the second mounting unit ^, it can be replaced by the first! Mounting unit ^ The semiconductor wafer indicated by 4_〇 in Figs. 4A and 4B is mounted on the substrate|. The first mounting position B of the semiconductor wafer 4 mounted by the first mounting unit 31 and the mounting position B2 of the semiconductor wafer 4 mounted by the second mounting unit 33 are the transport pitches of the substrate arms in the X direction. After 5 times the distance. As shown in FIG. 4A, when the semiconductor wafer 4-turn is attached to the end portion of the substrate w at the first mounting position B1, the substrate w is transported by the transport pitch p, and then the figure is indicated by 4-1. The two semiconductor wafers are sequentially mounted on the second mounting position of the first mounting unit 31 at a distance of 1.5 P and the second mounting position B2 of the second mounting unit 33. At this time, the initially mounted semiconductor wafer 4-0 is positioned at a pitch (p/2) in front of the second mounting position 32. When the semiconductor wafer indicated by 4-1 is mounted on the substrate w, the substrate w is transported in the direction indicated by the arrow X in FIG. 4B at the pitch P, and then the semiconductor wafer of the 1132265 is sequentially mounted on the first mounting. The first mounting position B1 of the unit 31 and the second mounting position 82 of the second women's unit 33 are provided. The two semiconductor wafers mounted at this time are indicated by 4-2. Thereby, the semiconductor wafers 4_1, 4_〇, and '2 can be mounted at a pitch of (P/2) from the head side before the transfer direction of the substrate w. 5 In this way, as long as the substrate W is transported at the pitch P each time, the semiconductor wafer can be sequentially transferred to the second mounting position Bi and the second women's position B2 at a distance of 1.5 pitches, so that the pitch can be transported. 2 points of p! The plurality of semiconductor wafers 4 (4-1, 4-0, 4-2, ...) are mounted on the substrate w. Further, the interval between the first mounting position B1 and the second mounting position B2 is not limited to be equal to or greater than 1.5 P ’ as long as (Νρ+〇·5Ρ). That is, it may be 2.5P or 3.5P, ... or the like. Further, η is an integer. In this manner, the interval between the first mounting position Β1 and the second mounting position Β2 is (Νρ+〇·5Ρ)', and the substrate w can be transported at a pitch of the transport path 2, that is, the ith mounting position can be used. Two semiconductor wafers 4 are mounted at the same time as the interval of the second mounting position B2, so that the production time of one piece required for installation can be doubled. As long as the semiconductor wafer 4 is mounted on the substrate w by two mounting devices, the production time of a single piece can be doubled, but on the other hand, the cost is also increased. 2. However, the mounting device of the embodiment includes a transfer system for transporting the substrate 2, or a transfer unit for transferring the semiconductor wafer 4 to the top of the top, 15 There are two groups of 17, 18 and mounting units 31, 33. Therefore, the cost of the mounting device can be greatly reduced as compared with the case where the two pieces of production time are doubled by two devices. 14 1328265 The two reversing units 17, 18 and the two mounting units 31, 33 are driven at a point when the control device 39 is staggered. Therefore, it is not only not driven when the flipping device 19 of the two flipping units π, 18 is simultaneously positioned above the wafer stage 7, and also does not flip the pickup 19 at the same time by the two flipping units 17, 18. Drive it at the point of 5 connection. Therefore, not only the inverting pickups 19 of the two inverting units 17, 18 do not collide with each other over the wafer stage 7, but also the mounters 32 of the two mounting units 31, 33 are not above the wafer stage 7. Or the substrate W or the like collides with each other to cause interference. 10 The mounting device is provided with two turnover units 17, 18 and two mounting units 31, 33. Therefore, even if one of the two inverting units 17, 18 or one of the two mounting units 31, 33 fails, the semiconductor wafer 4 can be continuously mounted by using another inverting unit or mounting unit. Next, a second embodiment of the present invention shown in Fig. 5 will be described. The fifth embodiment is a plan view of the mounting device, and the X movable body 23 of the first reversing unit π of the mounting device and the X movable body 23 of the second reversing unit 18 are connected together at a predetermined interval by the connecting member 41. Thereby, the pair of X movable bodies 23 can mechanically maintain the interval at which the connecting members 41 are connected without becoming equal to or less than the interval therebetween. In other words, the pair of X movable bodies 23 can be prevented from being individually driven independently by the connecting member 41. The interval between the pair of X movable bodies 23 is maintained constant, and the transmitting arm portion 27 is provided at the first 'second flipping'. The spacing of one of the units 17, 18 to the flipper 19 will also remain constant. 15 1328265 Therefore, even if the erroneous operation of the second, the second reversing units 17, 18, or the operation point is abnormal, the pair of flip-up pickups 19 are not simultaneously moved to the wafer stage 7 for picking up the semiconductor wafer 4, so It is surely prevented that the pair of flip-up pickers 19 collide or contact, etc., causing interference damage. 5 Next, the third embodiment of the present invention shown in Figs. 6 and 7 will be described. As shown in Fig. 6, in the embodiment, when the substrate W is supplied from the loading unit 3 to the transport path 2, the two substrates W which are even pieces are simultaneously unloaded at predetermined intervals. That is, as shown in Fig. 7, the interval at which the semiconductor wafer 4 can be mounted on the tip end portion of the two substrates w in the transport direction is shown as 10 in the figure, and is mounted on the mounter 32 of the first mounting unit 31. The mounters 32 of the second mounting unit 33 are carried out at equal intervals in the X direction. Further, although not shown, two substrates w may be placed on the holding table at predetermined intervals in advance, and the holding table may be carried out from the loading unit 3. The first mounting unit 31 and the second mounting unit 33 can be positioned 15 in the X direction and the Υ direction by the X and Y stages 37. Therefore, the pair of mounters 32 can be positioned by the X and the cymbal 37 so that the interval between the pair of mounters 32 is equal to the interval between the portions of the two substrates/front ends where the semiconductor wafer 4 can be mounted. As described in Fig. 7, when the interval X1 between the pair of mounters 32 and the interval at which the semiconductor wafer 4 can be mounted on the tip end portion of the two substrates W are made one by one, is the pitch? When the two substrates W are transported in the direction of the pitch and the semiconductor wafers 4 are mounted in a row, the i-th and second mounting sheets 31 and 33 can be transported in the transport direction of the substrate w. The plurality of semiconductor wafers 4 are mounted on the two substrates w transported by the pitch at the same pitch of the pitch Pw from the front end portion to the rear end portion of the substrate w. 16 1328265 Even if the semiconductor mounting device "4" can be mounted by operating the first mounting unit 31 and the second mounting unit 33 under the same conditions, the operating rate of the mounting units 31, 33 can be improved. The semiconductor wafer 4 is mounted at a predetermined pitch Pw by the fifth first mounting unit Μ and the second mounting unit 33 in the transport direction of the substrate 1 against the i-substrate w to be fed. When the even-numbered semiconductor wafers 4 are mounted by the pitches, the same number of semiconductor wafers 4 are mounted by the second mounting unit 31 and the second mounting unit, so that the mountings 32 can be operated in the same manner. However, when the odd-numbered semiconductor wafer 4 is mounted in the transport direction of the substrate W by the pitch Pw, only one of the first mounting unit 3 or the second mounting unit 33 is mounted in the last column. The other installer 32 is in a pause state. Therefore, the operation rate of one of the mounters 32 is lowered. Moreover, if such a mounting is performed on the two-piece multi-array substrate W, the operation rate is lowered. The number of groups according to the substrate W is increased. In the third embodiment, when the semiconductor wafer 4 is mounted on the two substrates W by the mounter 32, when the odd-numbered semiconductor wafers 4 are mounted in the transport direction of the substrate W, the mounters 32 can be operated in the same manner as described above. 2. The operation is performed at a rotation rate, so that the operation rate of the mounting device can be improved, and the productivity can be improved. Further, when the width of the arm portion 36 provided with the mounter 32 is larger than one-half of the length of the substrate W, There is a case where one of the mounters 32 and the other mounter 32 cannot be positioned at the end portion and the center portion of the transfer direction of the one substrate W. 17 1328265 That is, if one of the mounters 32 is positioned at the front end portion of the substrate w Then, the other mounter 32 is located behind the center portion in the longitudinal direction of the substrate W (on the upstream side in the transport direction). Therefore, the semiconductor wafer 4 mounted on one of the mounters 32 on the front end side is in the transport direction. Compared with the number of columns, the number of columns installed in the other five mounting devices 32 at the rear side is relatively small, so that the operating rate of the other mounting device 32 is lowered. However, as in the third embodiment, even in this case In the case only By mounting the semiconductor wafer 4 on the two substrates w by the mounters 32 of the mounting units 31 and 33, the two mounters 32 can be operated at the same operation rate, so that the operation rate can be improved by 10. In the third embodiment, the two substrates W which are the even pieces are conveyed at the pre-intervals in the transport path 2, and the semiconductor wafer 4 is mounted on the front end of the substrates by the second mounting unit 31 and the second mounting unit 33. In the transport path 2, for example, two or more even-numbered (n-piece) substrates w such as four or sixteen or sixteen may be transported at predetermined intervals. In this case, the first mounting unit 31 is positioned at the front. The front end portion of the substrate w, and the second mounting unit 33 is positioned at the front end of the substrate of the [(N/2)+l] sheet from the front substrate w, so that the second and second mounting units can be 33. The semiconductor wafer 4 is torn to the n-piece substrate without stopping. ^ 8 shows a fourth embodiment of the present invention. In this embodiment, when the length of the strip Wa is long, the interval X2 between the mounting unit μ and the second mounting sheet 7033 is an integral multiple of the pitch Pw of the semiconductor wafer 4 mounted on the substrate Wa. ^. Further, if the first and second mounting units 31, 33 are at a pitch 18 on the substrate Wa
Pw安襞m列半導體晶片4，則只要以該圖PM所示之[Pwxm]2 倍的距離搬送基板Wa，即可使第1、第2安裝單元31、％不 停頓地對長度較長之基板Wa連續安裝半導體晶片4。 在前述實施形態中，雖然係驅動晶圓載台，將欲拾取 之半導體晶片相對於上頂單元定位再往上頂，然後使翻轉 f元移動至該位置以取出半導體晶片，但亦可不移動翻轉 早兀’而使晶圓載台和和上頂單元移動，使欲往上頂之半 導體晶片的位置固^ ’再藉由翻轉單it於該位置取出半導 體晶片。 產業上利用之可能性 根據本發明，因储由2個翻轉單元從1個供應部分別 取出電子零件’相2個安裝單元分別承接各翻轉單元取出 電子零件$後女裝於基板上故可使電子零件之安裝 能率提高幾乎二倍。 【圖式簡單說明】 第1圖係顯示本發明之第1實施形態之安裝裳置之概略 結構的平面圖。 第2圖係-對翻轉單元的正面圖。 第3圖係顯示控制電路的方塊圖。 第4Α圖係顯示對基板安裝半導體晶片之最初步驟說明 圖。 第4Β圖係顯示對基板安裝半導體晶片之下 圖。 第5圖係顯示本發明之第2實施形態之安裝裝置之概略 1328265 結構的平面圖。 第6圖係顯示本發明之第3實施形態之安裝裝置之配置 有一對安裝單元的部分平面圖。 第7圖係藉由一對安裝單元在搬送方向上將複數列半 5 導體晶片安裝在fp距搬运之2片基板時的說明圖。 第8圖係顯示本發明之第4實施形態之以一對安裝單元 對長度較長之基板安裝半導體晶片時的說明圖。When the Pw is mounted on the semiconductor wafer 4, the substrate Wa can be transported at a distance of 2 times [Pwxm] shown in the figure PM, so that the first and second mounting units 31 and % can be made long without stopping. The substrate Wa is continuously mounted with the semiconductor wafer 4. In the foregoing embodiment, although the wafer stage is driven, the semiconductor wafer to be picked up is positioned with respect to the upper top unit, and then the flipping f element is moved to the position to take out the semiconductor wafer, but the flipping may not be performed early. The wafer stage and the top unit are moved to position the semiconductor wafer to be topped up and then the semiconductor wafer is taken out by flipping the unit. Industrial Applicability According to the present invention, the electronic components are respectively taken out from one supply unit by the two reversing units. The two mounting units respectively receive the reversing units and take out the electronic components. The installation energy efficiency of electronic parts is almost doubled. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view showing a schematic configuration of a mounting skirt according to a first embodiment of the present invention. Figure 2 is a front view of the flip unit. Figure 3 is a block diagram showing the control circuit. Figure 4 is a diagram showing the initial steps of mounting a semiconductor wafer on a substrate. The fourth drawing shows the lower view of the semiconductor wafer mounted on the substrate. Fig. 5 is a plan view showing the outline of a mounting apparatus according to a second embodiment of the present invention. Fig. 6 is a partial plan view showing the arrangement of a pair of mounting units in the mounting device according to the third embodiment of the present invention. Fig. 7 is an explanatory view showing a case where a plurality of half-conductor wafers are mounted on the two substrates to be transported at a distance of fp by a pair of mounting units in the transport direction. Fig. 8 is an explanatory view showing a state in which a semiconductor wafer is mounted on a substrate having a long length by a pair of mounting units in the fourth embodiment of the present invention.
10 15 20 20 1328265 【主要元件符號說明】 1...基台 25...XIS 動源 2…搬送通路 25a…螺軸 3…裝賴 26…旋轉驅動部 4...半導體晶片 27...臂部 5…卸纖 28". Z驅動部 7...晶圓載台 31…第1安裝單元 8"_X 台 32...安裝器 9…Y台 33...第2安裝單元 11...Θ台 34...頂部本體 12...晶圓固持台 35…Z台 13...晶圓 36…臂部 14…安裝構件 37...X、Y台 15…上頂單元 41…連接構件 17...第1翻轉單元 B1"·第1安裝位置 18...第2翻轉單元 B2...第2安裝位置 19…翻轉拾取器 PjPw...節距 20…收容部 PM…距離 21…本體 W，Wa…魏 21a...引導面 X…搬送方向 22...X引導構件 χιρ...間隔 23...X可動體 Y...垂直方向 24…滑塊 2110 15 20 20 1328265 [Description of main component symbols] 1...Abutment 25...XIS Moving source 2...Transporting path 25a...Pringing axis 3...Release 26...Rotary drive unit 4...Semiconductor wafer 27.. Arm 5: Unloading 28" Z drive unit 7... Wafer stage 31... First mounting unit 8"_X stage 32... Mounter 9...Y stage 33...Second mounting unit 11. .. 34: top body 12... wafer holding table 35...Z stage 13...wafer 36...arm 14...mounting member 37...X,Y stage 15...top unit 41 ...connecting member 17...first reversing unit B1"·first mounting position 18...second reversing unit B2...second mounting position 19...reversing picker PjPw...pitch 20...accommodating part PM ...distance 21...body W,Wa...wei 21a...guide surface X...transport direction 22...X guide member χιρ...interval 23...X moveable body Y...vertical direction 24...slider 21