JP2004042958A - Cover tape for packaging electronic component - Google Patents
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- JP2004042958A JP2004042958A JP2002203169A JP2002203169A JP2004042958A JP 2004042958 A JP2004042958 A JP 2004042958A JP 2002203169 A JP2002203169 A JP 2002203169A JP 2002203169 A JP2002203169 A JP 2002203169A JP 2004042958 A JP2004042958 A JP 2004042958A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 47
- 238000007789 sealing Methods 0.000 claims abstract description 10
- 239000012775 heat-sealing material Substances 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims abstract description 7
- 229920003023 plastic Polymers 0.000 claims abstract description 6
- 239000004033 plastic Substances 0.000 claims abstract description 6
- 239000004677 Nylon Substances 0.000 claims abstract description 5
- 229920001778 nylon Polymers 0.000 claims abstract description 5
- 229920000728 polyester Polymers 0.000 claims abstract description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 30
- 229920001577 copolymer Polymers 0.000 claims description 23
- 239000002216 antistatic agent Substances 0.000 claims description 21
- -1 polypropylene Polymers 0.000 claims description 20
- 229920001038 ethylene copolymer Polymers 0.000 claims description 18
- 238000007334 copolymerization reaction Methods 0.000 claims description 8
- 229920000642 polymer Polymers 0.000 claims description 8
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 7
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 7
- 238000002834 transmittance Methods 0.000 claims description 7
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 claims description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 6
- 125000005396 acrylic acid ester group Chemical group 0.000 claims description 6
- 125000000129 anionic group Chemical group 0.000 claims description 6
- 125000002091 cationic group Chemical group 0.000 claims description 6
- 125000005397 methacrylic acid ester group Chemical group 0.000 claims description 6
- 239000004094 surface-active agent Substances 0.000 claims description 6
- 239000004743 Polypropylene Substances 0.000 claims description 5
- 239000003945 anionic surfactant Substances 0.000 claims description 5
- 239000003093 cationic surfactant Substances 0.000 claims description 5
- 239000002736 nonionic surfactant Substances 0.000 claims description 5
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 4
- 229920000554 ionomer Polymers 0.000 claims description 4
- 229920001155 polypropylene Polymers 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 4
- 150000003242 quaternary ammonium salts Chemical group 0.000 claims description 4
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 claims description 3
- KWIUHFFTVRNATP-UHFFFAOYSA-N Betaine Natural products C[N+](C)(C)CC([O-])=O KWIUHFFTVRNATP-UHFFFAOYSA-N 0.000 claims description 3
- 239000005977 Ethylene Substances 0.000 claims description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 3
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims description 3
- 150000003973 alkyl amines Chemical class 0.000 claims description 3
- 229960003237 betaine Drugs 0.000 claims description 3
- 239000006229 carbon black Substances 0.000 claims description 3
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 3
- 229930195729 fatty acid Natural products 0.000 claims description 3
- 239000000194 fatty acid Substances 0.000 claims description 3
- 229920001467 poly(styrenesulfonates) Polymers 0.000 claims description 3
- 229920000570 polyether Polymers 0.000 claims description 3
- 238000009751 slip forming Methods 0.000 claims description 3
- 229940006186 sodium polystyrene sulfonate Drugs 0.000 claims description 3
- 238000003860 storage Methods 0.000 claims description 3
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 3
- 229910001887 tin oxide Inorganic materials 0.000 claims description 3
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 3
- 239000011787 zinc oxide Substances 0.000 claims description 3
- 239000002888 zwitterionic surfactant Substances 0.000 claims description 3
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 2
- 125000005210 alkyl ammonium group Chemical group 0.000 claims description 2
- 125000005227 alkyl sulfonate group Chemical group 0.000 claims description 2
- 239000002280 amphoteric surfactant Substances 0.000 claims description 2
- 229920006318 anionic polymer Polymers 0.000 claims description 2
- 229920006317 cationic polymer Polymers 0.000 claims description 2
- MTNDZQHUAFNZQY-UHFFFAOYSA-N imidazoline Chemical compound C1CN=CN1 MTNDZQHUAFNZQY-UHFFFAOYSA-N 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 47
- 238000000034 method Methods 0.000 description 5
- 239000004793 Polystyrene Substances 0.000 description 4
- 230000005611 electricity Effects 0.000 description 4
- 229920002223 polystyrene Polymers 0.000 description 4
- 230000003068 static effect Effects 0.000 description 4
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000012793 heat-sealing layer Substances 0.000 description 2
- 229920005669 high impact polystyrene Polymers 0.000 description 2
- 239000004797 high-impact polystyrene Substances 0.000 description 2
- 229920001684 low density polyethylene Polymers 0.000 description 2
- 239000004702 low-density polyethylene Substances 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- JHPBZFOKBAGZBL-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylprop-2-enoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)=C JHPBZFOKBAGZBL-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229920007962 Styrene Methyl Methacrylate Polymers 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 150000008052 alkyl sulfonates Chemical class 0.000 description 1
- 229920006378 biaxially oriented polypropylene Polymers 0.000 description 1
- 239000011127 biaxially oriented polypropylene Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000005042 ethylene-ethyl acrylate Substances 0.000 description 1
- 229920005680 ethylene-methyl methacrylate copolymer Polymers 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000007765 extrusion coating Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000002563 ionic surfactant Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920003145 methacrylic acid copolymer Polymers 0.000 description 1
- ADFPJHOAARPYLP-UHFFFAOYSA-N methyl 2-methylprop-2-enoate;styrene Chemical compound COC(=O)C(C)=C.C=CC1=CC=CC=C1 ADFPJHOAARPYLP-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920006284 nylon film Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 125000001453 quaternary ammonium group Chemical group 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- Packaging Frangible Articles (AREA)
Abstract
Description
【０００１】
【発明が属する技術分野】
本発明は、電子部品の保管、輸送、装着に際し、電子部品を汚染から保護し、電子回路基板に実装するために整列させ、取り出せる機能を有する包装体のうち、収納ポケットを形成したプラスチック製キャリアテープにシールされ得るカバーテープに関するものである
【０００２】
【従来の技術】
近年、ＩＣを始めとして、トランジスター、ダイオード、コンデンサー、圧電素子レジスター、などの表面実装用電子部品は、電子部品の形状に合わせて、収納しうるエンボス成形されたポケットを連続的に形成したプラスチック製キャリアテープとキャリアテープにシールし得るカバーテープとからなる包装体に包装されて供給されている。しかし、プラスチックの多くは電気絶縁性が高いため、発生した静電気が容易に蓄積して内容物である電子部品の搬送や組み立て作業において電子部品の機能が低下するあるいは破壊される等の静電気問題を起こしてしまう場合がある。また、電子部品は包装体のカバーテープを剥離した後、自動的に取り出され電子回路基板に表面実装されている。その際、剥離強度の最大値と最小値の差が大きいとキャリアテープが波打ち電子部品が飛び出したり、剥離強度が強すぎるとカバーテープが切れたりする場合がある。また、剥離強度が弱すぎると実装工程に至る迄にカバーテープが剥がれてしまい電子部品が脱落する。また、カバーテープで電子部品を包装した後に内容物が正しく挿入されているか検査する工程において、カバーテープの曇度が高いと内容物の確認が困難になる。
【０００３】
【発明が解決しようとする課題】
本発明は、前述のトラブルを考慮してなされたもので、優れた帯電防止性能を有し、剥離強度が適切かつ剥離強度の最大値と最小値の差が小さい、透明性に優れたカバーテープを提供する。
【０００４】
【課題を解決するための手段】
本発明は
（１） 電子部品を収納する収納ポケットを連続的に形成したプラスチック製キャリアテープに、熱シールしうるカバーテープであって、該カバーテープはキャリアテープに熱シールされる側から熱シール材層（以下、層Ｂと略す）、基材層（以下、層Ａと略す）の少なくとも２層からなり、層Ｂ表面の表面抵抗値が１×１０１２Ω／□以下であることを特徴とする電子部品包装用カバーテープ、
（２） 層Ａと層Ｂとの間に、ポリエステル層、ナイロン層及びポリプロピレン層からなる群より選ばれた１種以上の層が積層されてなる（１）項記載の電子部品包装用カバーテープ、
（３） 層Ｂが、エチレン共重合体及びスチレン又はスチレン共重合体を含有してなる（１）または（２）項記載の電子部品包装用カバーテープ、
（４） エチレン共重合体の共重合成分が、酢酸ビニル、アクリル酸、アクリル酸エステル、メタクリル酸、メタクリル酸エステル及びアイオノマーからなる群より選ばれた１種である（３）項記載の電子部品包装用カバーテープ、
（５） スチレン共重合体の共重合成分が、ブタジエン、水素添加ブタジエン、エチレン、ブチレン、プロピレン、イソプレン、アクリル酸、アクリル酸エステル、メタクリル酸及びメタクリル酸エステルからなる群より選ばれた１種或いはそれらの組み合わせである（３）又は（４）項記載の電子部品包装用カバーテープ、
（６） エチレン共重合体の共重合比率がエチレン１００重量部に対し、１７〜９０重量部である（３）（４）又は（５）項記載の電子部品包装用カバーテープ、
（７） 層Ｂの厚みが０．５〜５０μｍである（１）〜（６）項のいずれか１項に記載の電子部品包装用カバーテープ、
（８） 該カバーテープをキャリアテープと熱シールした後、カバーテープをキャリアテープから剥離する時、熱シール材層が凝集破壊剥離することを特徴とする（１）〜（７）項のいずれか１項に記載の電子部品包装用カバーテープ、
（９） 層Ｂに酸化錫、酸化亜鉛、酸化チタン、カーボンブラックのいずれか又はこれらの組合せから成る導電性微粉末及び／または界面活性剤或いは高分子型帯電防止剤を分散させ、シール層表面の抵抗値が１×１０１３Ω／□以下である（１）〜（８）項のいずれか１項に記載の電子部品包装用カバーテープ、
（１０） 界面活性剤がノニオン系、カチオン系、アニオン系或いは両イオン系界面活性剤である（９）項記載の電子部品包装用カバーテープ、
（１１） ノニオン系界面活性剤がＮ，Ｎ−ビス（２−ヒドロキシエチル）アルキルアミン或いは脂肪酸エステルである（１０）項記載の電子部品包装用カバーテープ、
（１２） アニオン系界面活性剤がアルキルスルホン酸塩である（１０）項記載の電子部品包装用カバーテープ、
（１３） カチオン系界面活性剤がアルキルアンモニウム塩である（１０）項記載の電子部品包装用カバーテープ、
（１４） 両イオン系界面活性剤がアルキルベタイン、イミダゾリン型両性である（１０）項記載の電子部品包装用カバーテープ、
（１５） 高分子型帯電防止剤がノニオン系、カチオン系、或いはアニオン系高分子型帯電防止剤である（９）項記載の電子部品包装用カバーテープ、
（１６） ノニオン系高分子型帯電防止剤がポリエーテルである（１５）項記載の電子部品包装用カバーテープ、
（１７） アニオン系高分子型帯電防止剤がポリスチレンスルホン酸ソーダである（１５）項記載の電子部品包装用カバーテープ、
（１８） カチオン系高分子型帯電防止剤が第四級アンモニウム塩系高分子型帯電防止剤である（１５）項記載の電子部品包装用カバーテープ、
（１９） 該カバーテープをキャリアテープと熱シールした後、カバーテープをキャリアテープから剥離される時の強度が１ｍｍ巾当たり０．１〜１．３Ｎである（１）〜（１８）項いずれか１項に記載の電子部品包装用カバーテープ、
（２０） 全光線透過率が７５％以上で曇度が７０％以下である（１）〜（１９）項いずれか１項に記載の電子部品包装用カバーテープ、
（２１） 該カバーテープをキャリアテープと熱シールした後、カバーテープをキャリアテープから剥離される時の剥離強度の最大値と最小値の差が１ｍｍ巾当たり０．０１〜０．４Ｎである（１）〜（２０）項いずれか１項に記載の電子部品包装用カバーテープ
である。
【０００５】
【発明の実施の形態】
本発明のカバーテープ１の構成要素の一例を図１で説明すると、層Ａが二軸延伸ポリエステルフィルム、二軸延伸ポリプロピレンフィルム、二軸延伸ナイロンフィルムいずれかの二軸延伸フィルムであり、厚みが６〜１００μｍの透明で剛性の高いフィルムである。
カバーテープの機械強度を上げる為に二層以上、該延伸フィルムを積層してもよい。層Ｂを製膜する手法に共押出法を選択した場合、同目的で層Ａと層Ｂの間に無延伸のポリエステル層、ナイロン層、ポリプロピレン層を積層してもよい。
【０００６】
本発明の層Ｂは、エチレン共重合体及びスチレン又はスチレン共重合体を含有することが好ましく、その比率はエチレン共重合体１００重量部に対しスチレン又はスチレン共重合体を１０〜１００重量部であることが好ましい。
該エチレン共重合体に含まれる共重合成分は酢酸ビニル、アクリル酸、アクリル酸エステル、メタクリル酸、メタクリル酸エステル、アイオノマーの何れかより選択される。また、該スチレン共重合体に含まれる共重合成分は、アクリル酸、アクリル酸エステル、メタクリル酸、メタクリル酸エステルの何れかより選択される
該スチレン共重合体の添加部数が１０重量部以下であるとキャリアテープとカバーテープを熱シールした後、カバーテープを剥がす際、剥離強度の最大値と最小値の差が０．４Ｎ以上になり滑らかに剥がす事が困難になる。
１００重量部以上であると曇度が７０％以上になり且つ、フィルムが脆くなり基材層との密着が弱くなり層間剥離を起こす。
基材との密着強度を上げる為に層Ａと層Ｂの間にポリエチレン、ポリエチレン系共重合体、ポリウレタン系接着剤或いはエポキシ系接着剤を設けてもよい。
【０００７】
該スチレン共重合体のスチレン成分は、ゴム成分を含み耐衝撃性を上げたハイインパクトポリスチレン（ＨＩＰＳ）系等、種々選択できるが透明性、熱安定性の面から一般用ポリスチレン（ＧＰＰＳ）系が望ましい。本発明に用いるスチレン共重合体は、これらのスチレン成分と、アクリル酸、アクリル酸エステル、メタクリル酸及びメタクリル酸エステルからなる群より選ばれた１種の共重合成分とを共重合させることにより得られる。
本発明に用いるスチレン共重合体は透明性が優れており、このスチレン共重合体を用いることによって透明性に優れたカバーテープを得ることができる。
更にキャリアテープからカバーテープを剥がす際、層Ｂが凝集破壊する事が望ましい。エチレン共重合体とスチレン共重合体の組み合わせによってはキャリアテープとカバーテープの界面で剥がれる界面剥離でも滑らかに剥がれる場合もあるが層Ｂが凝集破壊するとカバーテープとキャリアテープとの接着面と剥離面が異なる為、剥離強度がカバーテープ製造時に制御され安定しやすい。
【０００８】
本発明の層Ｂに含まれるエチレン共重合体の共重合比率がエチレン１００重量部に対し、１７〜９０重量部であることが好ましい。
１７重量部以下であるとキャリアテープに熱シールは可能であるがシールした後、時間が経過するに連れ剥離強度が低下する傾向があり、最終的には剥がれる場合がある。
９０重量部以上であると同様にキャリアテープに熱シールは可能であるがシールした後、時間が経過するに連れ剥離強度が上昇する傾向があり、最終的には剥がれなくなる場合がある。また、９０重量部以上のエチレン共重合体は市販されている商品が少なく特殊品になりコストアップの原因にもつながる。
本発明の層Ｂの厚みは０．５〜５０μｍである事が望ましい。
０．５μｍ以下であると基材との密着が弱くなり層間剥離を起こす。
５０μｍ以上になると透明性が著しく悪くなり曇度が７０％を超え内容物の視認性が低下する。
積層方法としては共押出、押出コーティング、グラビュアコーターによる。
【０００９】
本発明のカバーテープは、包装される電子部品が静電気により破壊されたり、電子部品の大きさが小さい為に実装工程でカバーテープが剥がされる時に静電気でカバーテープに付着するなどのトラブルを防止する為に層Ｂに帯電防止剤を分散させる事が好ましい。
帯電防止剤の添加量は、エチレン共重合体１００重量部、スチレン又はスチレン共重合体を１０〜１００重量部に対し、０．１〜５０重量部であることが好ましい。
該帯電防止剤としては大きく低分子型と高分子型帯電防止剤、導電性微粉末とに分類できる。低分子型帯電防止剤は言い換えると界面活性剤である。界面活性剤は更にイオン性で分類するとノニオン系、アニオン系、カチオン系、両イオン系と挙げられる。化学構造からノニオン系では（Ｎ，Ｎ−ビス（２−ヒドロキシエチル）アルキルアミン、脂肪酸エステル）、アニオン系では（アルキルスルホン酸塩）、カチオン系では（アルキルアンモニウム塩）、両イオン系では（アルキルベタイン、イミダゾリン型両性）がある。しかし、樹脂中に分散させ成型を行う際には耐熱性の点を考慮するとノニオン系のものがより好ましい。
【００１０】
高分子型帯電防止剤は上記低分子型帯電防止剤の導電性付与官能基を高分子ユニットに組み込み導電性能を持たせたものである。同様にノ二オン系のポリエーテル（ポリエチレンオキサイド・ポリエチレンオキサイド架橋体・ポリエチレンオキサイド共重合体・ポリエチレングリコール・ポリエチレングリコール共重合体）、カチオン系の第四級アンモニウム塩系（第四級アンモニウム塩基含有メタクリレート共重合体・第四級アンモニウム塩基含有マレイミド共重合体・第四級アンモニウム塩基含有メタクリル共重合体）、アニオン系のスルホン酸系（ポリスチレンスルホン酸ソーダ）等種々選択できるが、ベースポリマーとなる上記エチレン共重合体に練りこんだ際に導電性を付与し、帯電防止性能を発揮するポリマーであればよい。
【００１１】
導電性微粉末としては酸化錫、酸化亜鉛、酸化チタン、カーボンブラックがあげられる。これらを単体で使用しても効果は得られるがこれら２種以上を組み合わせて使用しても差し支えない。但しこれらを分散させる際は材料によっても異なるが製膜した際の表面の抵抗値が１×１０１３Ω／□以下になる様、調製しなければならない。１×１０１３Ω／□を越えると前述した静電気トラブルが発生する場合がある。
【００１２】
該カバーテープは全光線透過率は７５％以上、曇度は７０％以下になる様、積層しなければならない。全光線透過率が７５％未満、曇度が７０％以上になると検査員にもよるがカバーテープで電子部品を包装した後に内容物が正しく挿入されているかどうか検査する際、困難になる。
【００１３】
【実施例】
本発明の実施例を以下に示すがこれらの実施例によって本発明は何ら限定されるものではない。
《実施例１〜６及び比較例１》
表１にあげた二軸延伸フィルム（第１層＝本発明の層Ａに相当する）と、表１にあげた第２層〜第７層及び熱シール層（本発明の層Ｂに相当する）を共押出法により製膜したフィルムとをドライラミネートし、図２に示した層構成のカバーテープを得た。
得られたカバーテープを５．５ｍｍ巾にスリット後、８ｍｍ巾のポリスチレン製キャリアテープとシール温度１６０℃でシールを行い、剥離強度を測定した。表面抵抗値はＳＩＭＣＯ製ワークサーフェイステスターにより、全光線透過率、曇度はＪＩＳ Ｋ７１０５に従って測定した。
【００１４】
実施例及び比較例について表１に示した。
各層の右数字は各層の厚み（単位：μｍ）を、熱シール層枠内のエチレン共重合体及びポリスチレン共重合体欄は、エチレン共重合体及びスチレン共重合体の共重合成分を示す。ポリスチレン共重合体欄の数字はエチレン共重合体１００重量部に対する添加材（スチレン共重合体）の添加重量部を意味する。括弧内数字はエチレン共重合体の共重合比率を意味する。光線透過率以下の右枠内の記号はそれぞれの単位を意味する。
【００１５】
【表１】
＜比較例４＞
実施例６と同組成でＰＳ−ＭＭＡの添加部数を１０重量部ずつ増やし同様の評価を実施したところ９０重量部迄問題なかったが１００重量部の時点で製膜時、膜切れが発生し製膜できなかった。
【００１７】
表１中の記号は以下の通りである。
ＰＥＴ ：ポリエチレンテレフタレート
ＰＰ ：ポリプロピレン
ＰＳ−ＭＭＡ ：スチレン−メチルメタクリレート共重合体
Ｎｙ ：ナイロン
Ｏ− ：二軸延伸の意味。
ＬＤＰＥ ：低密度ポリエチレン
ＥＶＡ ：エチレンー酢酸ビニル共重合体
ＥＥＡ ：エチレンーエチルアクリレート共重合体
ＥＭＭＡ ：エチレンーメチルメタクリレート共重合体
ＩＯＮ ：アイオノマー
ＡＤ ：接着性樹脂（ポリエチレン酸変性物）
ＤＬ ：ドライラミネート接着剤層
【００１８】
【発明の効果】
本発明に従うと、全光線透過率が７５％以上、曇度が７０％以下になる様、積層されている為透明性に優れ、これまでより電子部品包装後の内容物の確認が容易になる。
また、剥離強度が強すぎず弱すぎず、また、剥離強度の最大値と最小値の差が小さくなる様、制御できる為、実装工程における剥離強度によるトラブルを防止できる。
シール面の表面抵抗値が１×１０１３Ω／□以下である為、該工程における静電気によるトラブルを防止できる。
【図面の簡単な説明】
【図１】本発明のカバーテープの層構成を示す断面図である。
【図２】本発明の実施例にあげたカバーテープの層構成を示す断面図である。
【図３】本発明のカバーテープをキャリアテープに接着し、その使用状態を示す断面図である。
【符号の説明】
１：カバーテープ
２：二軸延伸フィルム（層Ａ）
３：熱シール層（層Ｂ）
４：層Ｂを除く共押出層
５：ポリウレタン系接着剤層
６：シールされる部分
７：キャリアテープ[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a plastic carrier in which a storage pocket is formed in a package having a function of protecting electronic components from contamination, aligning and mounting the electronic components on an electronic circuit board when storing, transporting, and mounting the electronic components. The present invention relates to a cover tape that can be sealed to a tape.
[Prior art]
In recent years, electronic components for surface mounting, such as ICs, transistors, diodes, capacitors, piezoelectric element registers, etc., are made of plastic in which embossed pockets that can be accommodated are continuously formed according to the shape of the electronic components. It is supplied by being packaged in a package consisting of a carrier tape and a cover tape that can be sealed to the carrier tape. However, since many plastics have high electrical insulation properties, the generated static electricity easily accumulates and causes problems such as deterioration or destruction of the function of the electronic components in the transport or assembly work of the electronic components. May cause it. The electronic components are automatically taken out after the cover tape of the package is peeled off, and are surface-mounted on an electronic circuit board. At this time, if the difference between the maximum value and the minimum value of the peel strength is large, the carrier tape may undulate and the electronic component may jump out. If the peel strength is too strong, the cover tape may be cut. On the other hand, if the peeling strength is too low, the cover tape will be peeled off before the mounting step, and the electronic component will fall off. In addition, in the step of checking whether the contents are correctly inserted after packaging the electronic component with the cover tape, if the cover tape has a high haze, it is difficult to check the contents.
[0003]
[Problems to be solved by the invention]
The present invention has been made in consideration of the above-described problems, has excellent antistatic performance, has an appropriate peel strength and a small difference between the maximum value and the minimum value of the peel strength, and has excellent transparency. I will provide a.
[0004]
[Means for Solving the Problems]
The present invention provides (1) a cover tape that can be heat-sealed to a plastic carrier tape in which storage pockets for storing electronic components are continuously formed, wherein the cover tape is heat-sealed from the side that is heat-sealed to the carrier tape. It comprises at least two layers of a material layer (hereinafter abbreviated as layer B) and a base material layer (hereinafter abbreviated as layer A), and has a surface resistance of 1 × 10 12 Ω / □ or less on the surface of layer B. Cover tape for packaging electronic components,
(2) At least one layer selected from the group consisting of a polyester layer, a nylon layer, and a polypropylene layer is laminated between the layer A and the layer B, and the cover tape for electronic component packaging according to (1). ,
(3) The cover tape for packaging electronic components according to (1) or (2), wherein the layer B contains an ethylene copolymer and styrene or a styrene copolymer.
(4) The electronic component according to (3), wherein the copolymerization component of the ethylene copolymer is one selected from the group consisting of vinyl acetate, acrylic acid, acrylic acid ester, methacrylic acid, methacrylic acid ester, and ionomer. Cover tape for packaging,
(5) The copolymerization component of the styrene copolymer is one selected from the group consisting of butadiene, hydrogenated butadiene, ethylene, butylene, propylene, isoprene, acrylic acid, acrylic acid ester, methacrylic acid, and methacrylic acid ester. (3) or a cover tape for packaging electronic parts according to (4), which is a combination thereof.
(6) The cover tape for packaging electronic parts according to (3), (4) or (5), wherein the copolymerization ratio of the ethylene copolymer is 17 to 90 parts by weight with respect to 100 parts by weight of ethylene.
(7) The cover tape for packaging electronic parts according to any one of (1) to (6), wherein the thickness of the layer B is 0.5 to 50 μm.
(8) The heat sealing material layer is cohesively fractured and peeled off when the cover tape is peeled off from the carrier tape after the cover tape is heat-sealed with the carrier tape. The cover tape for packaging electronic components according to claim 1,
(9) A conductive fine powder of any one of tin oxide, zinc oxide, titanium oxide and carbon black or a combination thereof and / or a surfactant or a polymer type antistatic agent is dispersed in the layer B, and the surface of the seal layer is dispersed. The electronic component packaging cover tape according to any one of (1) to (8), wherein a resistance value of the electronic component packaging is 1 × 10 13 Ω / □ or less.
(10) The cover tape for packaging electronic parts according to (9), wherein the surfactant is a nonionic, cationic, anionic or zwitterionic surfactant.
(11) The cover tape for packaging electronic parts according to (10), wherein the nonionic surfactant is N, N-bis (2-hydroxyethyl) alkylamine or a fatty acid ester.
(12) The cover tape for packaging electronic parts according to (10), wherein the anionic surfactant is an alkyl sulfonate.
(13) The cover tape for packaging electronic parts according to (10), wherein the cationic surfactant is an alkyl ammonium salt.
(14) The cover tape for packaging electronic parts according to (10), wherein the amphoteric surfactant is an alkyl betaine or imidazoline type amphoteric.
(15) The cover tape for packaging electronic parts according to (9), wherein the high molecular weight antistatic agent is a nonionic, cationic or anionic high molecular weight antistatic agent.
(16) The cover tape for packaging electronic parts according to (15), wherein the nonionic polymer type antistatic agent is a polyether.
(17) The cover tape for packaging electronic parts according to (15), wherein the anionic polymer type antistatic agent is sodium polystyrene sulfonate.
(18) The cover tape for packaging electronic parts according to (15), wherein the cationic polymer type antistatic agent is a quaternary ammonium salt type polymer antistatic agent.
(19) Any one of (1) to (18), wherein the strength when peeling off the cover tape from the carrier tape after heat sealing the cover tape with the carrier tape is 0.1 to 1.3 N per 1 mm width. The cover tape for packaging electronic components according to claim 1,
(20) The cover tape for packaging electronic parts according to any one of (1) to (19), wherein the total light transmittance is 75% or more and the haze is 70% or less.
(21) After the cover tape is heat-sealed with the carrier tape, the difference between the maximum value and the minimum value of the peel strength when the cover tape is peeled off from the carrier tape is 0.01 to 0.4 N per 1 mm width ( The cover tape for packaging electronic components according to any one of 1) to (20).
[0005]
BEST MODE FOR CARRYING OUT THE INVENTION
One example of the components of the cover tape 1 of the present invention will be described with reference to FIG. 1. The layer A is a biaxially oriented polyester film, a biaxially oriented polypropylene film, or a biaxially oriented nylon film. It is a transparent and highly rigid film of 6 to 100 μm.
In order to increase the mechanical strength of the cover tape, two or more layers of the stretched film may be laminated. When the co-extrusion method is selected as a method for forming the layer B, a non-stretched polyester layer, nylon layer, or polypropylene layer may be laminated between the layer A and the layer B for the same purpose.
[0006]
Layer B of the present invention preferably contains an ethylene copolymer and styrene or a styrene copolymer, and the ratio is 10 to 100 parts by weight of styrene or styrene copolymer with respect to 100 parts by weight of ethylene copolymer. Preferably, there is.
The copolymer component contained in the ethylene copolymer is selected from any of vinyl acetate, acrylic acid, acrylic ester, methacrylic acid, methacrylic ester, and ionomer. Further, the copolymerization component contained in the styrene copolymer has an addition number of 10 parts by weight or less of the styrene copolymer selected from acrylic acid, acrylic acid ester, methacrylic acid, and methacrylic acid ester. When the cover tape is peeled off after the heat sealing of the carrier tape and the cover tape, the difference between the maximum value and the minimum value of the peel strength becomes 0.4 N or more, making it difficult to remove smoothly.
If it is 100 parts by weight or more, the haze becomes 70% or more, the film becomes brittle, the adhesion to the base material layer becomes weak, and delamination occurs.
A polyethylene, a polyethylene-based copolymer, a polyurethane-based adhesive or an epoxy-based adhesive may be provided between the layer A and the layer B in order to increase the adhesion strength to the substrate.
[0007]
The styrene component of the styrene copolymer can be selected from various types such as a high impact polystyrene (HIPS) system containing a rubber component and having an improved impact resistance, but a general purpose polystyrene (GPPS) system is used from the viewpoint of transparency and thermal stability. desirable. The styrene copolymer used in the present invention is obtained by copolymerizing these styrene components with one copolymer component selected from the group consisting of acrylic acid, acrylic acid ester, methacrylic acid and methacrylic acid ester. Can be
The styrene copolymer used in the present invention has excellent transparency, and a cover tape excellent in transparency can be obtained by using this styrene copolymer.
Further, when the cover tape is peeled off from the carrier tape, it is desirable that the layer B be cohesively broken. Depending on the combination of the ethylene copolymer and the styrene copolymer, even if the interface peels off at the interface between the carrier tape and the cover tape, it may peel off smoothly, but if the layer B cohesively breaks, the adhesive surface and the peeling surface between the cover tape and the carrier tape , The peel strength is controlled during the production of the cover tape, and is easily stabilized.
[0008]
The copolymerization ratio of the ethylene copolymer contained in the layer B of the present invention is preferably 17 to 90 parts by weight based on 100 parts by weight of ethylene.
If the amount is less than 17 parts by weight, the carrier tape can be heat-sealed, but after sealing, the peel strength tends to decrease over time, and the carrier tape may eventually peel off.
When the amount is 90 parts by weight or more, the carrier tape can be heat-sealed in the same manner, but after sealing, the peel strength tends to increase as time elapses, and ultimately the peeling may not be possible. Further, the ethylene copolymer in an amount of 90 parts by weight or more has few commercial products and becomes a special product, which leads to an increase in cost.
The thickness of the layer B of the present invention is desirably 0.5 to 50 μm.
When the thickness is 0.5 μm or less, the adhesion to the substrate becomes weak, and delamination occurs.
If it is 50 μm or more, the transparency is remarkably deteriorated, the haze exceeds 70%, and the visibility of the contents is reduced.
Lamination methods are coextrusion, extrusion coating, and gravure coater.
[0009]
The cover tape of the present invention prevents troubles such as the electronic components to be packaged being destroyed by static electricity and the electronic components being small in size and being attached to the cover tape by static electricity when the cover tape is peeled off during the mounting process. For this reason, it is preferable to disperse an antistatic agent in the layer B.
The addition amount of the antistatic agent is preferably 0.1 to 50 parts by weight based on 100 parts by weight of the ethylene copolymer and 10 to 100 parts by weight of the styrene or the styrene copolymer.
The antistatic agents can be broadly classified into low-molecular type, high-molecular type antistatic agents and conductive fine powder. In other words, the low-molecular type antistatic agent is a surfactant. Surfactants can be further classified into ionic, nonionic, anionic, cationic and zwitterionic surfactants. From the chemical structure, the nonionic system (N, N-bis (2-hydroxyethyl) alkylamine, fatty acid ester), the anionic system (alkylsulfonate), the cationic system (alkylammonium salt), and the zwitterionic system (alkyl Betaine, imidazoline-type amphoteric). However, when the resin is dispersed in a resin and molded, a nonionic resin is more preferable in consideration of heat resistance.
[0010]
The polymer-type antistatic agent is obtained by incorporating the conductivity-imparting functional group of the low-molecular-weight antistatic agent into a polymer unit so as to have a conductive property. Similarly, nonionic polyethers (polyethylene oxide / polyethylene oxide crosslinked product / polyethylene oxide copolymer / polyethylene glycol / polyethylene glycol copolymer) and cationic quaternary ammonium salts (containing a quaternary ammonium base) A variety of methacrylate copolymers / maleimide copolymers containing a quaternary ammonium salt group / methacrylic acid copolymers containing a quaternary ammonium salt group, and anionic sulfonic acids (sodium polystyrene sulfonate) can be selected. Any polymer that imparts conductivity when kneaded into the above ethylene copolymer and exhibits antistatic performance may be used.
[0011]
Examples of the conductive fine powder include tin oxide, zinc oxide, titanium oxide, and carbon black. The effect can be obtained by using these alone, but they can be used in combination of two or more. However, when these are dispersed, they must be prepared so that the resistance value of the surface when the film is formed is 1 × 10 13 Ω / □ or less, though it depends on the material. If it exceeds 1 × 10 13 Ω / □, the above-mentioned electrostatic trouble may occur.
[0012]
The cover tape must be laminated so that the total light transmittance is 75% or more and the haze is 70% or less. If the total light transmittance is less than 75% and the haze is 70% or more, it becomes difficult to inspect whether the contents are correctly inserted after packaging the electronic component with a cover tape, depending on the inspector.
[0013]
【Example】
Examples of the present invention are shown below, but the present invention is not limited by these examples.
<< Examples 1 to 6 and Comparative Example 1 >>
The biaxially stretched film shown in Table 1 (first layer = corresponding to layer A of the present invention), the second to seventh layers and the heat sealing layer shown in Table 1 (corresponding to layer B of the present invention) ) Was dry-laminated with a film formed by a co-extrusion method to obtain a cover tape having a layer configuration shown in FIG.
After slitting the obtained cover tape to 5.5 mm width, it was sealed with a 8 mm wide polystyrene carrier tape at a sealing temperature of 160 ° C., and the peel strength was measured. The surface resistance was measured by a work surface tester manufactured by SIMCO, and the total light transmittance and the haze were measured in accordance with JIS K7105.
[0014]
Table 1 shows Examples and Comparative Examples.
The numbers on the right of each layer indicate the thickness (unit: μm) of each layer, and the columns of ethylene copolymer and polystyrene copolymer in the heat seal layer frame indicate copolymer components of the ethylene copolymer and the styrene copolymer. The numbers in the column of the polystyrene copolymer mean the addition parts by weight of the additive (styrene copolymer) with respect to 100 parts by weight of the ethylene copolymer. The number in parentheses means the copolymerization ratio of the ethylene copolymer. The symbols in the right frame below the light transmittance mean the respective units.
[0015]
[Table 1]
<Comparative Example 4>
When the same evaluation was carried out with the same composition as in Example 6 and the amount of PS-MMA added was increased by 10 parts by weight, no problem was observed up to 90 parts by weight. The film could not be formed.
[0017]
The symbols in Table 1 are as follows.
PET: Polyethylene terephthalate PP: Polypropylene PS-MMA: Styrene-methyl methacrylate copolymer Ny: Nylon O-: Meaning of biaxial stretching.
LDPE: low-density polyethylene EVA: ethylene-vinyl acetate copolymer EEA: ethylene-ethyl acrylate copolymer EMMA: ethylene-methyl methacrylate copolymer ION: ionomer AD: adhesive resin (modified polyethylene acid)
DL: dry laminate adhesive layer
【The invention's effect】
According to the present invention, since the laminate is laminated so that the total light transmittance becomes 75% or more and the haze becomes 70% or less, transparency is excellent, and it becomes easier to confirm the contents after packaging electronic parts than before. .
In addition, since the peel strength can be controlled so as not to be too strong or too weak, and the difference between the maximum value and the minimum value of the peel strength can be reduced, trouble due to the peel strength in the mounting process can be prevented.
Since the surface resistance of the sealing surface is 1 × 10 13 Ω / □ or less, troubles due to static electricity in the process can be prevented.
[Brief description of the drawings]
FIG. 1 is a sectional view showing a layer structure of a cover tape of the present invention.
FIG. 2 is a sectional view showing a layer structure of a cover tape according to an embodiment of the present invention.
FIG. 3 is a cross-sectional view showing a state in which the cover tape of the present invention is adhered to a carrier tape and used.
[Explanation of symbols]
1: cover tape 2: biaxially stretched film (layer A)
3: heat sealing layer (layer B)
4: Co-extruded layer excluding layer B 5: Polyurethane adhesive layer 6: Sealed portion 7: Carrier tape
Claims (21)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002203169A JP2004042958A (en) | 2002-07-11 | 2002-07-11 | Cover tape for packaging electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002203169A JP2004042958A (en) | 2002-07-11 | 2002-07-11 | Cover tape for packaging electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2004042958A true JP2004042958A (en) | 2004-02-12 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002203169A Pending JP2004042958A (en) | 2002-07-11 | 2002-07-11 | Cover tape for packaging electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2004042958A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006205433A (en) * | 2005-01-26 | 2006-08-10 | Denki Kagaku Kogyo Kk | Composite sheet |
| JP2012187884A (en) * | 2011-03-14 | 2012-10-04 | Shikoku Kako Kk | Packaging bag for hydrogen sulfide gas corrosive product |
| WO2012137630A1 (en) * | 2011-04-01 | 2012-10-11 | 電気化学工業株式会社 | Cover film |
| JP2018127256A (en) * | 2017-02-09 | 2018-08-16 | 住友ベークライト株式会社 | Cover tape and electronic component packaging |
| CN114502482A (en) * | 2019-10-11 | 2022-05-13 | 大日本印刷株式会社 | Cover tape for packaging electronic component, package, and package set |
-
2002
- 2002-07-11 JP JP2002203169A patent/JP2004042958A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006205433A (en) * | 2005-01-26 | 2006-08-10 | Denki Kagaku Kogyo Kk | Composite sheet |
| JP2012187884A (en) * | 2011-03-14 | 2012-10-04 | Shikoku Kako Kk | Packaging bag for hydrogen sulfide gas corrosive product |
| WO2012137630A1 (en) * | 2011-04-01 | 2012-10-11 | 電気化学工業株式会社 | Cover film |
| CN103459146A (en) * | 2011-04-01 | 2013-12-18 | 电气化学工业株式会社 | cover film |
| JP5894578B2 (en) * | 2011-04-01 | 2016-03-30 | デンカ株式会社 | Cover film |
| JP2018127256A (en) * | 2017-02-09 | 2018-08-16 | 住友ベークライト株式会社 | Cover tape and electronic component packaging |
| CN114502482A (en) * | 2019-10-11 | 2022-05-13 | 大日本印刷株式会社 | Cover tape for packaging electronic component, package, and package set |
| CN114502482B (en) * | 2019-10-11 | 2023-10-24 | 大日本印刷株式会社 | Cover tapes, packaging bodies and sets for packaging bodies for packaging electronic components |
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