JPH0767774B2 - Cover tape for chip-type electronic component packaging - Google Patents
Cover tape for chip-type electronic component packagingInfo
- Publication number
- JPH0767774B2 JPH0767774B2 JP3098366A JP9836691A JPH0767774B2 JP H0767774 B2 JPH0767774 B2 JP H0767774B2 JP 3098366 A JP3098366 A JP 3098366A JP 9836691 A JP9836691 A JP 9836691A JP H0767774 B2 JPH0767774 B2 JP H0767774B2
- Authority
- JP
- Japan
- Prior art keywords
- cover tape
- adhesive layer
- chip
- packaging
- type electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004806 packaging method and process Methods 0.000 title claims description 17
- 239000012790 adhesive layer Substances 0.000 claims description 53
- 239000010410 layer Substances 0.000 claims description 43
- 238000007789 sealing Methods 0.000 claims description 23
- 239000000853 adhesive Substances 0.000 claims description 14
- 230000001070 adhesive effect Effects 0.000 claims description 14
- -1 polypropylene Polymers 0.000 claims description 10
- 229920005992 thermoplastic resin Polymers 0.000 claims description 10
- 239000011229 interlayer Substances 0.000 claims description 9
- 239000000843 powder Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 8
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims description 8
- 239000004743 Polypropylene Substances 0.000 claims description 7
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 7
- 229920000098 polyolefin Polymers 0.000 claims description 7
- 229920001155 polypropylene Polymers 0.000 claims description 7
- 239000004800 polyvinyl chloride Substances 0.000 claims description 7
- 229920003023 plastic Polymers 0.000 claims description 6
- 239000004033 plastic Substances 0.000 claims description 6
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 6
- 229920000728 polyester Polymers 0.000 claims description 5
- 238000002834 transmittance Methods 0.000 claims description 5
- 229920000178 Acrylic resin Polymers 0.000 claims description 4
- 239000004925 Acrylic resin Substances 0.000 claims description 4
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 claims description 4
- 229920001225 polyester resin Polymers 0.000 claims description 4
- 239000004645 polyester resin Substances 0.000 claims description 4
- 229920005749 polyurethane resin Polymers 0.000 claims description 4
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 4
- 229910001887 tin oxide Inorganic materials 0.000 claims description 4
- 239000011787 zinc oxide Substances 0.000 claims description 4
- 239000004677 Nylon Substances 0.000 claims description 3
- 239000004698 Polyethylene Substances 0.000 claims description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 3
- 229920001778 nylon Polymers 0.000 claims description 3
- 229920000573 polyethylene Polymers 0.000 claims description 3
- 238000009751 slip forming Methods 0.000 claims description 3
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 3
- 229920012753 Ethylene Ionomers Polymers 0.000 claims 1
- 230000000694 effects Effects 0.000 description 11
- 230000005611 electricity Effects 0.000 description 9
- 230000003068 static effect Effects 0.000 description 9
- 239000000463 material Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 230000009191 jumping Effects 0.000 description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 239000002216 antistatic agent Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 239000004922 lacquer Substances 0.000 description 3
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229920000554 ionomer Polymers 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 101100160821 Bacillus subtilis (strain 168) yxdJ gene Proteins 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 150000002466 imines Chemical class 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229920006284 nylon film Polymers 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229920006352 transparent thermoplastic Polymers 0.000 description 1
Landscapes
- Packages (AREA)
- Package Frames And Binding Bands (AREA)
- Laminated Bodies (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明はチップ型電子部品の保
管、輸送、装着に際し、チップ型電子部品を汚染から保
護し、電子回路基板に実装するために整列させ、取り出
せる機能を有する包装体のうち、収納ポケットを形成し
たプラスチック製キャリアテープに熱シールされ得るカ
バーテープに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a package having a function of protecting the chip-type electronic components from contamination during storage, transportation and mounting of the chip-type electronic components and aligning and removing them for mounting on an electronic circuit board. Of these, the present invention relates to a cover tape that can be heat-sealed to a plastic carrier tape having a storage pocket.
【０００２】[0002]
【従来の技術】近年、ＩＣを始めとして、トランジスタ
ー、ダイオード、コンデンサー、圧電素子レジスター、
などの表面実装用チップ型電子部品は、電子部品の形状
に合わせて、収納しうるエンボス成形されたポケットを
連続的に形成したプラスチック製キャリアテープとキャ
リアテープに熱シールし得るカバーテープとからなる包
装体に包装されて供給されている。内容物の電子部品は
該包装体のカバーテープを剥離した後、自動的に取り出
され電子回路基板に表面実装されている。2. Description of the Related Art In recent years, ICs, transistors, diodes, capacitors, piezoelectric element resistors,
Surface mount chip type electronic components such as are composed of a plastic carrier tape in which embossed pockets that can be stored are continuously formed according to the shape of the electronic component, and a cover tape that can be heat-sealed to the carrier tape. It is packaged and supplied in a package. After peeling off the cover tape of the package, the electronic components of the contents are automatically taken out and surface-mounted on the electronic circuit board.
【０００３】カバーテープがキャリアテープから剥離さ
れる際の強度をピールオフ強度と呼ぶが、この強度が低
すぎると包装体移送時に、カバーテープが外れ、内容物
である電子部品が脱落するという問題があった。逆に、
強すぎると、カバーテープを剥離する際キャリアテープ
が振動し、電子部品が装着される直前に収納ポケットか
ら飛び出す現象、即ちジャンピングトラブルを起こして
いた。The strength at which the cover tape is peeled off from the carrier tape is called peel-off strength. If this strength is too low, the cover tape will come off when the package is transferred, and the electronic components as the contents will fall off. there were. vice versa,
If it is too strong, the carrier tape vibrates when the cover tape is peeled off, causing a phenomenon of jumping out of the storage pocket immediately before the electronic component is mounted, that is, a jumping problem.
【０００４】従来、キャリアテープに用いられる材質
は、シート成形が容易なポリ塩化ビニル（ＰＶＣ）もし
くはポリスチロール、ポリエステル（ＰＥＴ）、ポリカ
ーボネート、アクリル系シートが用いられているが、キ
ャリアテープに熱シールされるカバーテープには一般
に、二軸延伸ポリエステルフィルム、ＰＶＣまたはスチ
ロール系シートに熱シールを可能にするポリエチレン変
性もしくはエチレン酢酸ビニル共重合体（ＥＶＡ）変性
フィルムをラミネートした複合フィルムが用いられてい
た。しかし、これら従来のカバーテープは、ピールオフ
強度のシール温度、シール圧力等の条件依存性が大き
く、シール条件のバラツキにより、既述の適性ピールオ
フ強度範囲にコントロールすることが難しく、又、カバ
ーテープの保管あるいはシール後の保管環境によっても
温度・湿度の影響を受けて、経時的にピールオフ強度が
上昇あるいは低下して適性範囲から外れる場合があっ
た。Conventionally, as the material used for the carrier tape, polyvinyl chloride (PVC) or polystyrene, polyester (PET), polycarbonate, acrylic sheet, which is easy to form into a sheet, has been used, but the carrier tape is heat-sealed. The cover tape used is generally a biaxially stretched polyester film, a composite film obtained by laminating a polyethylene-modified or ethylene-vinyl acetate copolymer (EVA) -modified film on a PVC or styrene sheet to enable heat sealing. . However, these conventional cover tapes have a large dependency of the peel-off strength on conditions such as sealing temperature and sealing pressure, and it is difficult to control the peel-off strength to the above-mentioned suitable peel-off strength range due to variations in the sealing conditions. Depending on the storage environment after storage or sealing, the peel-off strength may increase or decrease over time due to the influence of temperature and humidity, and may fall outside the appropriate range.
【０００５】又、近年の表面実装技術の大幅な向上に伴
い、より高性能で小型化された電子部品のチップ化が進
む中で、包装体移送時に振動により電子部品が、キャリ
アテープエンボス内表面、或いはカバーテープの内側表
面と接触し、その際の摩擦により発生する静電気、及び
カバーテープをキャリアテープから剥離する際に発生す
る静電気のスパークにより電子部品が破壊・劣化を起こ
すといった静電気障害も発生しており、キャリアテー
プ、カバーテープといった包装体への静電対策が最重要
課題とされていた。In addition, as the surface mounting technology has been drastically improved in recent years, the electronic parts, which have higher performance and are smaller in size, are being made into chips, and during the transfer of the package, the electronic parts are oscillated by the carrier tape embossed inner surface. Alternatively, static electricity generated by contact with the inner surface of the cover tape, static electricity generated by friction at that time, and sparks of static electricity generated when the cover tape is peeled from the carrier tape may cause damage or deterioration of electronic components. Therefore, countermeasures against static electricity on packaging such as carrier tape and cover tape have been the most important issue.
【０００６】従来、カバーテープの静電処理について
は、用いられる材質へのカーボンブラックの練り込み、
或いはコーティングにより行われており、その効果も満
足されるものが得られていた。しかし、カバーテープの
静電処理について未だ充分な対策が取られておらず、現
状では、カバーテープの外層への帯電防止剤或いは導電
性材料のコーティング等が行われているに過ぎない。し
かし、その処理効果は封入される電子部品の保護として
はカバーテープ外側の処理のため充分でなく、特にカバ
ーテープの内側表面と電子部品の接触により発生する静
電気に対してはその効果はなかった。又、カバーテープ
内側表面つまり接着層ヘの静電処理については帯電防止
剤のコーティングあるいは接着層への練り込みにより行
うことが可能であるが、この場合接着層へ練り込まれる
帯電防止剤がカバーテープ内側表面へのブリードを越こ
し、シール性が不安定になりシール不良のトラブルが多
発し、又静電効果も経時的に低下し、或いは包装体の使
用される環境の温度・湿度、特に湿度に対する依存性が
強く、１０％ＲＨといった低湿度下では静電効果が著し
く低下するなど充分な効果が得らていなかった。一方、
導電性材料の接着層への練り込みについては従来、接着
層の形成方法がフィルムなどのラミネートであったため
技術的に困難であり、透明性が著しく低下するためカバ
ーテープとしての使用は難しかった。又、コーティング
についてはキャリアテープに安定して接着可能なバイン
ダーの選定が難しく、本来の接着層が覆い隠されるため
に行われていなかった。Conventionally, for electrostatic treatment of cover tape, kneading of carbon black into the material used,
Alternatively, coating has been performed, and a product having a satisfactory effect has been obtained. However, sufficient measures have not been taken yet for the electrostatic treatment of the cover tape, and at present, the outer layer of the cover tape is only coated with an antistatic agent or a conductive material. However, the treatment effect is not sufficient for protecting the enclosed electronic components because of the treatment on the outside of the cover tape, and it was not particularly effective against static electricity generated by the contact between the inner surface of the cover tape and the electronic components. . The inner surface of the cover tape, that is, the electrostatic treatment of the adhesive layer can be performed by coating an antistatic agent or kneading into the adhesive layer. In this case, the antistatic agent kneaded into the adhesive layer is covered. Over the bleed to the inner surface of the tape, the sealing property becomes unstable and troubles with poor sealing frequently occur, the electrostatic effect also decreases over time, or the temperature and humidity of the environment in which the package is used, especially It had a strong dependency on humidity, and under a low humidity of 10% RH, the electrostatic effect was remarkably reduced, and a sufficient effect was not obtained. on the other hand,
It has been technically difficult to knead a conductive material into an adhesive layer because the method for forming the adhesive layer has been a laminate such as a film, and it has been difficult to use it as a cover tape because the transparency is significantly lowered. Further, the coating has not been performed because it is difficult to select a binder that can be stably adhered to the carrier tape and the original adhesive layer is covered.
【０００７】[0007]
【発明が解決しようとする課題】本発明は前述の様な問
題を解決すべく、接着層の静電気対策が施され、且つピ
ールオフ強度のシール条件依存性、経時変化の小さくシ
ール性の安定したカバーテープを得んとして鋭意研究し
た結果、外層として二軸延伸フィルムを使用し、接着層
として導電性微粉末を分散したヒートシールラッカータ
イプの熱可塑性接着剤をコーティングし、または、外層
と接着層の間の中間層としてポリオレフィン層を設けた
複合フイルムが透明であり、良好な特性を持つカバーテ
ープとなり得るとの知見を得て、本発明を完成するに至
ったものである。SUMMARY OF THE INVENTION In order to solve the above problems, the present invention provides a cover in which the adhesive layer is provided with measures against static electricity, the peel-off strength is dependent on the sealing conditions, and the change with time is small and the sealing property is stable. As a result of diligent research to obtain a tape, a biaxially stretched film was used as the outer layer, and a heat-seal lacquer type thermoplastic adhesive in which conductive fine powder was dispersed was coated as the adhesive layer, or the outer layer and the adhesive layer were combined. The present invention has been completed based on the finding that a composite film provided with a polyolefin layer as an intermediate layer between them is transparent and can be a cover tape having good characteristics.
【０００８】[0008]
【課題を解決するための手段】本発明は、チップ型電子
部品を収納する収納ポケットを連続的に形成したプラス
チック製キャリアテープに、熱シールし得るカバーテー
プであって、該カバーテープは、外層はポリエステル、
ポリプロピレン、ナイロンのいずれかである二軸延伸フ
ィルムであり、接着層はポリウレタン系樹脂、アクリル
系樹脂、ポリ塩化ビニル系樹脂、エチレンビニルアセテ
ート系樹脂、ポリエステル系樹脂のいずれか又はこれら
の組合せから成る熱可塑性樹脂に酸化錫、酸化亜鉛、酸
化チタンのいずれかの導電性微粉末を分散させて成るこ
とを特徴とするチップ型電子部品包装用カバーテープ、
又は該カバーテープの外層と接着層との間に中間層とし
てポリエチレン、エチレンビニルアセテート共重合体、
アイオノマー、ポリプロピレンあるいはそれらの変性物
のいずれかのポリオレフィン層を含むチップ型電子部品
包装用カバーテープである。本発明の好ましい態様は導
電性微粉末の添加量が接着層の熱可塑性樹脂１００重量
部に対して１０〜３００重量部であり、該カバーテープ
の接着層と該キャリアテープのシール面の接着強度が該
カバーテープの外層又は中間層と接着層との層間密着強
度よりも大きく、該カバーテープの外層又は中間層と接
着層との層間密着強度がシール幅１mm当り１０〜１２０
ｇｒであり、該カバーテープの可視光線透過率が１０％
以上であることを特徴とするチップ型電子部品包装用カ
バーテープである。SUMMARY OF THE INVENTION The present invention is a cover tape that can be heat-sealed to a plastic carrier tape in which storage pockets for storing chip-type electronic components are continuously formed, the cover tape being an outer layer. Is polyester,
It is a biaxially stretched film that is either polypropylene or nylon, and the adhesive layer is made of polyurethane resin, acrylic resin, polyvinyl chloride resin, ethylene vinyl acetate resin, polyester resin, or a combination thereof. thermoplastic resin tin oxide, zinc oxide, titanium oxide emissions either conductive fine powder was a dispersed, characterized by comprising a chip-type electronic component packaging cover tape,
Or polyethylene, et Ji Ren vinyl acetate copolymer as an intermediate layer between the outer layer and the adhesive layer of the cover tape,
A cover tape for packaging a chip-type electronic component, which comprises a polyolefin layer of any of an ionomer, polypropylene or a modified product thereof. A preferred embodiment of the present invention is from 10 to 3 00 parts by weight amount of the conductive fine powder on 100 parts by weight of the thermoplastic resin of the adhesive layer, the adhesive of the adhesive layer and the sealing surface of the carrier tape of the cover tape The strength is greater than the interlayer adhesion strength between the outer layer or intermediate layer of the cover tape and the adhesive layer, and the interlayer adhesion strength between the outer layer or middle layer of the cover tape and the adhesive layer is 10 to 120 per 1 mm of the seal width.
and the visible light transmittance of the cover tape is 10%.
The cover tape for packaging a chip-type electronic component is characterized by the above.
【０００９】[0009]
【作用】本発明のカバーテープ１の構成要素を図１で説
明すると、外層２は二軸延伸ポリエステルフィルム、二
軸延伸ポリプロピレンフィルム、二軸延伸ナイロンフィ
ルムのいずれかの二軸延伸フィルムであり、厚みが６〜
１００μの透明で剛性の高いフィルムである。６μ以下
では剛性がなくなり、１００μを越えると硬すぎてシー
ルが不安定となる。外層２の接着剤層３に接する側は、
必要に応じてコロナ処理、プラズマ処理、サンドブラス
ト処理等の表面処理を施して接着剤層３への密着力を向
上させることが出来る。接着層５は透明性を有する熱可
塑性樹脂（例えばポリウレタン系樹脂、アクリル系樹
脂、エチレンビニルアセテート系樹脂、ポリ塩化ビニル
系樹脂、ポリエステル系樹脂など）のヒートシールラッ
カータイプのものであって、各単体又はその組合せによ
って、相手材のプラスチック製キャリアテープ６に熱シ
ールし得る特性を有するものが選定される。The components of the cover tape 1 of the present invention will be described with reference to FIG. 1. The outer layer 2 is a biaxially stretched film selected from a biaxially stretched polyester film, a biaxially stretched polypropylene film and a biaxially stretched nylon film. Thickness is 6 ~
It is a 100μ transparent and highly rigid film. If it is less than 6μ, the rigidity is lost, and if it exceeds 100μ, it is too hard and the seal becomes unstable. The side of the outer layer 2 in contact with the adhesive layer 3 is
If necessary, surface treatment such as corona treatment, plasma treatment, and sandblast treatment can be applied to improve the adhesion to the adhesive layer 3. The adhesive layer 5 is a heat-seal lacquer type of a transparent thermoplastic resin (for example, polyurethane resin, acrylic resin, ethylene vinyl acetate resin, polyvinyl chloride resin, polyester resin, etc.) A single material or a combination thereof is selected so as to have a property capable of being heat-sealed to the plastic carrier tape 6 as the mating material.
【００１０】且つ、接着層中に酸化錫、酸化亜鉛、酸化
チタンのいずれかの導電性微粉末が均一に分散されてお
り、その際、製膜後の接着層の表面抵抗値は１０13Ω／
□以下が必要であり、更に好ましくは１０6Ω／□〜１
０9Ω／□の範囲が良い。１０13Ω／□より大きくなる
と、静電効果が極端に悪くなり目的とする性能が得られ
ない。又、その添加量は上記表面抵抗特性により接着層
の熱可塑性樹脂１００重量部に対して１０〜３００重量
部であり更に好ましくは１００〜２５０重量部が良い。
１０重量部より少ないと静電効果は発現せず、３００重
量部より多いと接着層の熱可塑性樹脂への分散性が著し
く悪くなり、かつ外層との密着性が悪くなり、透明性も
低下しコストも高くなるため生産に適さない。又、静電
処理材料自身が導電性を有するため半永久的に静電効果
があり、ブリード等を起こさないためシール性にも影響
は及ぼさず、接着層の表面抵抗値が１０13Ω／□以下に
調整されているため、該キャリアテープ６に電子部品を
該カバーテープ１で封入したものは運搬途上で電子部品
が該カバーテープ１と接触しても、あるいは該カバーテ
ープ１を剥離して電子部品をピックアップする際におい
ても静電気は発生せず電子部品を静電気障害から保護す
ることができる。[0010] and tin oxide in the adhesive layer, a zinc oxide, or a conductive oxide fine powder <br/> titanium emission are uniformly distributed, whereby the surface resistance of the adhesion layer after film The value is 10 13 Ω /
□ or less is necessary, and more preferably 10 6 Ω / □ to 1
The range of 0 9 Ω / □ is good. When it is higher than 10 13 Ω / □, the electrostatic effect is extremely deteriorated and the desired performance cannot be obtained. Further, the addition amount thereof is 10-3 00 parts by weight and more preferably from 10 0 to 25 0 parts by weight to 100 parts by weight of the thermoplastic resin of the adhesive layer by the surface resistivity characteristics.
Electrostatic effects and less than 10 parts by weight do not express, 3 00 parts by weight high dispersibility is remarkably deteriorated in the thermoplastic resin of the adhesive layer from, and worsens the adhesiveness between the outer layer, also transparent
It is not suitable for production because it will decrease and the cost will increase . In addition, since the electrostatically treated material itself has conductivity, it has a semi-permanent electrostatic effect, and it does not cause bleeding or the like, so it does not affect the sealing property, and the surface resistance value of the adhesive layer is 10 13 Ω / □ or less. Since the electronic component is enclosed in the carrier tape 6 by the cover tape 1, even if the electronic component comes into contact with the cover tape 1 during transportation, or the cover tape 1 is peeled off, Even when picking up a component, static electricity is not generated and it is possible to protect the electronic component from electrostatic damage.
【００１１】なお、静電効果を更に上げるために外層側
つまり二軸延伸フィルムの表裏面に帯電防止処理層ある
いは導電層を設けてもよい。又、ヒートシール型接着剤
の形成方法については溶融製膜法と溶液製膜法のどちら
でも良いが好ましくは溶液製膜が導電性微粉末の分散性
の点から望ましい。又、接着層の膜厚は５μ以下が好ま
しく、更に好ましくは２μ以下がよい。膜厚が５μ以上
では溶液製膜法ではその製法上作成が難しい。In order to further enhance the electrostatic effect, an antistatic treatment layer or a conductive layer may be provided on the outer layer side, that is, the front and back surfaces of the biaxially stretched film. The heat-sealable adhesive may be formed by either a melt film forming method or a solution film forming method, but solution film forming is preferable from the viewpoint of dispersibility of the conductive fine powder. The thickness of the adhesive layer is preferably 5 μm or less, more preferably 2 μm or less. If the film thickness is 5 μm or more, it is difficult to make it by the solution film forming method.
【００１２】又、外層２と接着層５との間に中間層とし
てポリエチレン、ポリエチレンビニルアセテート共重合
体、アイオノマー、ポリプロピレンあるいはそれらの変
性物のいずれかのポリオレフィン層を構成すると、中間
層がヒートシール時の熱及び圧力が均一にかかるようク
ッション層の機能を担い且つ、該カバーテープの耐引き
裂き性を向上させるためシール性が更に改良される。こ
の場合、ポリオレフィンの厚みは１０μ以上好ましくは
２０〜６０μのフィルムが良い。１０μより薄いとクッ
ション効果がなく、６０μよりも厚いと逆に、ヒートシ
ール性を悪くする。なお外層と中間層とのラミネート強
度を向上させる目的でイソシアネート系、イミン系等の
乾燥固化硬化させて用いるラッカー型の接着剤層を介し
て両者をラミネートしてもよい。When a polyolefin layer of polyethylene, polyethylene vinyl acetate copolymer, ionomer, polypropylene or a modified product thereof is formed as an intermediate layer between the outer layer 2 and the adhesive layer 5, the intermediate layer is heat-sealed. Since the cushion layer has a function to uniformly apply heat and pressure at the time, and the tear resistance of the cover tape is improved, the sealing property is further improved. In this case, the polyolefin has a thickness of 10 μm or more, preferably 20 to 60 μm. If it is thinner than 10 μ, there is no cushioning effect, and if it is thicker than 60 μ, conversely, the heat sealability is deteriorated. For the purpose of improving the laminating strength between the outer layer and the intermediate layer, they may be laminated together via a lacquer type adhesive layer which is used by being dried and solidified and cured, such as isocyanate type or imine type.
【００１３】又、カバーテープのシールーピール過程に
おいて、まず、該カバーテープ１は該キャリアテープ６
の両サイドに片方で１ｍｍ前後の幅でレール状に連続的
にシールされる（図２）。次にピール時に該カバーテー
プ１を該キャリアテープ６から引き剥す際、該カバーテ
ープ１の接着層５と該キャリアテープ６のシール面の接
着強度が該カバーテープ１の外層２と接着層５の層間密
着強度よりも小さいと、ピールオフ強度は該カバーテー
プ１の接着層５と該キャリアテープ６のシール面の接着
強度と対応し、現在最も一般的な剥離機構である界面剥
離によりピールが行われる。この場合、カバーテープを
キャリアテープに強くシールするとピールが難しくな
り、逆に弱くシールすると剥がれてしまうというよう
に、本来カバーテープに要求されるキャリアテープに対
する強力シール性と剥離時の容易なピール性という相反
する特性を同時に満足する充分な性能が得られなかっ
た。一方、本発明の様に該カバーテープ１の接着層５と
該キャリアテープ６のシール面の接着強度が該カバーテ
ープ１の外層２と接着層５の層間密着強度よりも大きい
と、製膜された接着層５のうちシールされた部分のみが
キャリアテープに残り（図３）、引き剥された後のカバ
ーテープ（図４）は接着層５のヒートシールされた部分
のみが脱落した形となるいはゆる転写剥離によりピール
が行われる。即ち、ピールオフ強度は接着層５と外層２
との層間密着強度と対応するものとなっており、シール
／ピール面は完全に分離でき、カバーテープ１のシール
はキャリアテープ６に強固に行えると同時にカバーテー
プ１のピールはできるだけ容易に行えるよう設計でき
る。つまり、剥離面はカバーテープ１内に設計されてお
り、その層間密着強度をキャリアテープ６の材質に依ら
ず任意に設定できる。又カバーテープのシール面は、該
キャリアテープ６に強固にシール可能な接着剤の選定が
でき安定したシール・ピール機構が得られる。In the seal peeling process of the cover tape, first, the cover tape 1 is the carrier tape 6
Each side is continuously sealed in a rail shape with a width of about 1 mm on one side (Fig. 2). Next, when peeling off the cover tape 1 from the carrier tape 6 at the time of peeling, the adhesive strength between the adhesive layer 5 of the cover tape 1 and the sealing surface of the carrier tape 6 is the same as that of the outer layer 2 and the adhesive layer 5 of the cover tape 1. When it is smaller than the interlayer adhesion strength, the peel-off strength corresponds to the adhesion strength between the adhesive layer 5 of the cover tape 1 and the sealing surface of the carrier tape 6, and peeling is performed by interfacial peeling, which is the most common peeling mechanism at present. . In this case, if the cover tape is strongly sealed to the carrier tape, peeling becomes difficult, and conversely, if the cover tape is weakly peeled off, it peels off. It was not possible to obtain sufficient performance that simultaneously satisfies the contradictory characteristics. On the other hand, when the adhesive strength between the adhesive layer 5 of the cover tape 1 and the sealing surface of the carrier tape 6 is larger than the interlayer adhesive strength between the outer layer 2 of the cover tape 1 and the adhesive layer 5 as in the present invention, a film is formed. Only the sealed portion of the adhesive layer 5 remains on the carrier tape (FIG. 3), and the cover tape (FIG. 4) after being peeled off has only the heat-sealed portion of the adhesive layer 5 dropped off. Or peeling is performed by loose transfer peeling. That is, the peel-off strength is the adhesive layer 5 and the outer layer 2
The seal / peel surface can be completely separated, and the cover tape 1 can be firmly sealed to the carrier tape 6 and the cover tape 1 can be peeled as easily as possible. Can be designed. That is, the peeling surface is designed in the cover tape 1, and the interlayer adhesion strength thereof can be set arbitrarily regardless of the material of the carrier tape 6. For the sealing surface of the cover tape, an adhesive that can firmly seal the carrier tape 6 can be selected, and a stable sealing and peeling mechanism can be obtained.
【００１４】この場合、該カバーテープ１の外層２と接
着層５と層間密着強度はシール幅１ｍｍ当り１０〜１２
０ｇｒ更に好ましくは１０〜７０ｇｒとなるよう接着剤
が選定される。ピール強度が１０ｇｒより低いと包装体
移送時に、カバーテープが外れ、内容物である電子部品
が脱落するという問題がある。逆に、１２０ｇｒよりも
高いと、カバーテープを剥離する際キャリアテープが振
動し、電子部品が装着される直前に収納ポケットから飛
び出す現象、即ちジャンピングトラブルを起こす。本発
明の転写剥離機構によれば、従来の界面剥離に比較して
よりシール条件に対する依存性が低く、且つ、保管環境
によるピールオフ強度の経時変化が少ないという目的と
する性能を得ることができる。In this case, the adhesive strength between the outer layer 2 and the adhesive layer 5 of the cover tape 1 is 10 to 12 per 1 mm of the seal width.
The adhesive is selected to be 0 gr, more preferably 10 to 70 gr. If the peel strength is lower than 10 gr, the cover tape may come off when the package is transferred, and the electronic component as the content may fall off. On the other hand, if it is higher than 120 gr, the carrier tape vibrates when the cover tape is peeled off, causing a phenomenon of jumping out of the storage pocket immediately before the electronic component is mounted, that is, a jumping trouble. According to the transfer peeling mechanism of the present invention, it is possible to obtain the target performance that the dependency on the sealing condition is lower than that of the conventional interfacial peeling and that the peel-off strength changes little with time due to the storage environment.
【００１５】又、カバーテープの可視光線透過率が１０
％以上好ましくは５０％以上になる様に構成されている
ために、キャリアテープに封入された内部の電子部品が
目視あるいは機械によって確認できる。１０％より低い
と内部の電子部品の確認が難しい。Further, the visible light transmittance of the cover tape is 10
% Or more, preferably 50% or more, so that the electronic components inside the carrier tape can be visually or mechanically confirmed. If it is lower than 10%, it is difficult to confirm the internal electronic components.
【００１６】[0016]
【実施例】本発明の実施例及び比較例を以下に示すがこ
れらの実施例によって本発明は何ら限定されるものでは
ない。 《実施例１，２，３、比較例１、２、３、４》 二軸延伸フィルムあるいは二軸延伸フィルムとポリオレ
フィンフィルムのラミネート品のポリオレフィンフィル
ム側に、酢酸エチル溶剤に接着剤を希釈溶解させた接着
層をグラビアコーターにより膜厚２μに溶液製膜し、表
１に示した層構成のカバーテープを得た。得られたカバ
ーテープを5.5mm幅にスリットした後、８mm幅のＰＶＣ
製キャリアテープとヒートシールを行い、ピール強度を
測定した。又、接着層側の表面抵抗値及びカバーテープ
試作品の可視光線透過率の測定を行いその特性評価結果
を表２に示した。EXAMPLES Examples and comparative examples of the present invention are shown below, but the present invention is not limited to these examples. << Examples 1 , 2 , 3 and Comparative Examples 1 , 2 , 3 , 4 >> An adhesive was diluted and dissolved in an ethyl acetate solvent on the polyolefin film side of a biaxially stretched film or a laminate of a biaxially stretched film and a polyolefin film. The adhesive layer was solution-cast with a gravure coater to a film thickness of 2 μm to obtain a cover tape having the layer structure shown in Table 1. After slitting the obtained cover tape into 5.5mm width, PVC of 8mm width
Peel strength was measured by carrying out heat sealing with a carrier tape made by the manufacturer. Further, the surface resistance value on the adhesive layer side and the visible light transmittance of the cover tape prototype were measured, and the evaluation results of the characteristics are shown in Table 2.
【００１７】[0017]
【表１】 [Table 1]
【００１８】[0018]
【表２】 [Table 2]
【００１９】[0019]
【発明の効果】本発明に従うと、接着層が静電処理され
ており、電子部品とカバーテープとの接触あるいは、カ
バーテープの剥離時に発生する静電気が抑えられ、且
つ、その静電効果が使用環境や経時変化にも安定であり
シール性にも影響を及ぼさない点、接着層と外層また
は、中間層と接着層の組合せにより、ピールオフ強度を
１ｍｍ当り１０〜１２０ｇｒの範囲で任意に設定しうる
点、又、ピールオフ強度がカバーテープ内の層間の密着
強度により決定されるため、キャリアテープとのシール
条件に影響を受けない点、という３点により、従来の問
題点であるピールオフ強度のシール条件に対する依存性
が大きいという問題、及び保管環境により経時的に変化
する問題又、電子部品とカバーテープとの接触あるい
は、カバーテープの剥離時に発生する静電気の問題を解
決することができ、安定したピールオフ強度を得ること
ができる。According to the present invention, the adhesive layer is subjected to electrostatic treatment, so that static electricity generated when the electronic component and the cover tape are in contact with each other or when the cover tape is peeled off is suppressed, and the electrostatic effect is used. The peel-off strength can be arbitrarily set in the range of 10 to 120 gr per 1 mm by the combination of the adhesive layer and the outer layer or the intermediate layer and the adhesive layer, which is stable to the environment and aging and does not affect the sealing property. In addition, since the peel-off strength is determined by the adhesion strength between the layers in the cover tape, the peel-off strength is not affected by the sealing condition with the carrier tape. Dependence on the cover tape and the change over time depending on the storage environment, contact between electronic components and the cover tape, or peeling of the cover tape Can solve the static electricity problem occurring, it is possible to obtain a stable peel-off strength.
【図１】本発明のカバーテープの層構成を示す断面図。FIG. 1 is a cross-sectional view showing a layer structure of a cover tape of the present invention.
【図２】本発明のカバーテープをキャリアテープに接着
し、その使用状態を示す断面図。FIG. 2 is a cross-sectional view showing a use state in which the cover tape of the present invention is bonded to a carrier tape.
【図３】本発明のカバーテープをキャリアテープに接着
し、その使用状態を示す断面図。FIG. 3 is a cross-sectional view showing a use state in which the cover tape of the present invention is adhered to a carrier tape.
【図４】本発明のカバーテープをキャリアテープに接着
し、その使用状態を示す断面図。FIG. 4 is a cross-sectional view showing a use state in which the cover tape of the present invention is bonded to a carrier tape.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｂ６５Ｄ 73/02 Ｍ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Internal reference number FI technical display location B65D 73/02 M
Claims (12)
トを連続的に形成したプラスチック製キャリアテープ
に、熱シールし得るカバーテープであって、外層がポリ
エステル、ポリプロピレン、ナイロンのいずれかである
二軸延伸フィルムであり、接着層が熱可塑性樹脂に酸化
錫、酸化亜鉛、酸化チタンのいずれか又はこれらの組合
せから成る導電性微粉末を分散させて成ることを特徴と
するチップ型電子部品包装用カバーテープ1. A cover tape capable of being heat-sealed to a plastic carrier tape in which a storage pocket for storing a chip-type electronic component is continuously formed, and a biaxial outer layer of which is polyester, polypropylene or nylon. stretching a film, tin oxide adhesive layer is a thermoplastic resin, zinc oxide, a chip-type electronic component packaging, characterized by comprising a conductive fine powder made of any or a combination of titanium oxide emissions are dispersed Cover tape
樹脂、アクリル系樹脂、ポリ塩化ビニル系樹脂、エチレ
ンビニルアセテート系樹脂、ポリエステル系樹脂のいず
れか又はこれらの組合せて成る請求項１記載のチップ型
電子部品包装用カバーテープ。2. The chip according to claim 1, wherein the thermoplastic resin of the adhesive layer is any one of a polyurethane resin, an acrylic resin, a polyvinyl chloride resin, an ethylene vinyl acetate resin, a polyester resin, or a combination thereof. Type cover tape for packaging electronic components.
性樹脂１００重量部に対して１０〜３００重量部であ
り、接着層の表面抵抗値が１０13Ω／□以下である請求
項１又は２記載のチップ型電子部品包装用カバーテー
プ。Wherein the addition amount of the conductive fine powder is 10-3 00 parts by weight per 100 parts by weight of the thermoplastic resin of the adhesive layer, wherein the surface resistivity of the adhesive layer is 10 13 Ω / □ or less Item 1. A cover tape for packaging a chip-type electronic component according to item 1 or 2.
のシール面の接着強度がカバーテープの外層と接着層の
層間密着強度よりも大きいことを特徴とする請求項１、
２又は３記載のチップ型電子部品包装用カバーテープ。4. The adhesive strength between the adhesive layer of the cover tape and the sealing surface of the carrier tape is greater than the interlayer adhesive strength between the outer layer of the cover tape and the adhesive layer.
The cover tape for packaging a chip-type electronic component according to 2 or 3.
強度がシール幅１ｍｍ当り１０〜１２０ｇｒであるとこ
ろの請求項４記載のチップ型電子部品包装用カバーテー
プ。5. The cover tape for packaging chip-type electronic parts according to claim 4, wherein the interlayer adhesion strength between the outer layer of the cover tape and the adhesive layer is 10 to 120 gr per 1 mm of the seal width.
以上である請求項１、２、３、４又は５項記載のチップ
型電子部品包装用カバーテープ。6. The visible light transmittance of the cover tape is 10%.
The cover tape for packaging a chip-type electronic component according to claim 1, 2, 3, 4 or 5 as described above.
トを連続的に形成したプラスチック製キャリアテープ
に、熱シールし得るカバーテープであって、外層がポリ
エステル、ポリプロピレン、ナイロンのいずれかである
二軸延伸フィルムであり、中間層がポリエチレン、エチ
レンビニルアセテート共重合体、アイオノマー、ポリプ
ロピレンあるいはそれらの変性物のいずれかのポリオレ
フィンであり、接着層が熱可塑性樹脂に酸化錫、酸化亜
鉛、酸化チタンのいずれか又はこれらの組合せから成る
導電性微粉末を分散させて成ることを特徴とするチップ
型電子部品包装用カバーテープ。7. A cover tape which can be heat-sealed to a plastic carrier tape having a continuous storage pocket for storing a chip-type electronic component, the outer layer of which is either polyester, polypropylene or nylon. a stretched film, the polyethylene intermediate layer, ethylene-vinyl acetate copolymer, ionomer, and any polyolefin polypropylene or a modified product thereof, tin oxide adhesive layer is a thermoplastic resin, zinc oxide, the titanium oxide emissions A cover tape for packaging a chip-type electronic component, characterized in that a conductive fine powder comprising any one or a combination thereof is dispersed.
樹脂、アクリル系樹脂、ポリ塩化ビニル系樹脂、エチレ
ンビニルアセテート系樹脂、ポリエステル系樹脂のいず
れか又はこれらの組合せから成る請求項７記載のチップ
型電子部品包装用カバーテープ。8. The chip according to claim 7, wherein the thermoplastic resin of the adhesive layer is any one of a polyurethane resin, an acrylic resin, a polyvinyl chloride resin, an ethylene vinyl acetate resin, a polyester resin, or a combination thereof. Type cover tape for packaging electronic components.
性樹脂１００重量部に対して１０〜３００重量部であ
り、接着層の表面抵抗値が１０13Ω／□以下である請求
項７又は８記載のチップ型電子部品包装用カバーテー
プ。9. amount of conductive fine powder is 10-3 00 parts by weight per 100 parts by weight of the thermoplastic resin of the adhesive layer, wherein the surface resistivity of the adhesive layer is 10 13 Ω / □ or less Item 9. A cover tape for packaging a chip-type electronic component according to item 7 or 8.
プのシール面の接着強度がカバーテープの中間層と接着
層の層間密着強度よりも大きいことを特徴とする請求項
７、８又は９記載のチップ型電子部品包装用カバーテー
プ。10. The chip according to claim 7, wherein the adhesive strength between the adhesive layer of the cover tape and the sealing surface of the carrier tape is higher than the interlayer adhesive strength between the intermediate layer of the cover tape and the adhesive layer. Type cover tape for packaging electronic components.
密着強度がシール幅１ｍｍ当り１０〜１２０ｇｒである
ところの請求項１０記載のチップ型電子部品包装用カバ
ーテープ。11. The cover tape for packaging chip-type electronic parts according to claim 10, wherein the interlayer adhesion strength between the intermediate layer and the adhesive layer of the cover tape is 10 to 120 gr per 1 mm of the seal width.
％以上である請求項７、８、９、１０又は１１項記載の
チップ型電子部品包装用カバーテープ。12. The visible light transmittance of the cover tape is 10.
% Or more, the cover tape for packaging chip-type electronic components according to claim 7, 8, 9, 10 or 11.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3098366A JPH0767774B2 (en) | 1990-02-06 | 1991-02-01 | Cover tape for chip-type electronic component packaging |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2-10225 | 1990-02-06 | ||
| JP1022590 | 1990-02-06 | ||
| JP3098366A JPH0767774B2 (en) | 1990-02-06 | 1991-02-01 | Cover tape for chip-type electronic component packaging |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH058339A JPH058339A (en) | 1993-01-19 |
| JPH0767774B2 true JPH0767774B2 (en) | 1995-07-26 |
Family
ID=26345461
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3098366A Expired - Lifetime JPH0767774B2 (en) | 1990-02-06 | 1991-02-01 | Cover tape for chip-type electronic component packaging |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0767774B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100443382C (en) * | 2001-11-01 | 2008-12-17 | 出光统一科技株式会社 | Atmosphere-improving tape for package, package with atmosphere-improving tape and manufacturing method thereof, packaging container with atmosphere-improving tape, occlusal tool, and package with occlusal tool |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3582859B2 (en) * | 1993-08-04 | 2004-10-27 | 大日本印刷株式会社 | Lid material |
| JP3654976B2 (en) * | 1995-10-13 | 2005-06-02 | 大日本印刷株式会社 | Cover material for carrier tape |
| JP4826018B2 (en) * | 2000-04-03 | 2011-11-30 | 大日本印刷株式会社 | Carrier tape lid |
| JP4334858B2 (en) * | 2001-12-19 | 2009-09-30 | 大日本印刷株式会社 | Cover tape for taping packaging of electronic parts |
| JP4199485B2 (en) | 2002-06-07 | 2008-12-17 | 久光製薬株式会社 | Patch |
| JP4919727B2 (en) | 2006-08-04 | 2012-04-18 | 日東電工株式会社 | Printed circuit board |
| JPWO2015005330A1 (en) * | 2013-07-09 | 2017-03-02 | 住友ベークライト株式会社 | Cover tape for packaging electronic parts |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62179743U (en) * | 1986-05-06 | 1987-11-14 | ||
| JPS62184549U (en) * | 1986-05-13 | 1987-11-24 | ||
| JP2626890B2 (en) * | 1987-08-24 | 1997-07-02 | 富士写真フイルム株式会社 | Packaging materials for photosensitive materials |
-
1991
- 1991-02-01 JP JP3098366A patent/JPH0767774B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100443382C (en) * | 2001-11-01 | 2008-12-17 | 出光统一科技株式会社 | Atmosphere-improving tape for package, package with atmosphere-improving tape and manufacturing method thereof, packaging container with atmosphere-improving tape, occlusal tool, and package with occlusal tool |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH058339A (en) | 1993-01-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR940011833B1 (en) | Cover Tape for Chip Electronic Component Packaging | |
| KR950006382B1 (en) | Covering tape for electronic component chip | |
| EP1270210B1 (en) | Cover tape for packaging electronic components | |
| US20030017328A1 (en) | Transparent, electrically conductive and heat-sealable material and lidded container for carrier tape using the same | |
| JPH08295001A (en) | Lid and carrier tape and taping using these | |
| JP2609779B2 (en) | Cover tape for packaging chip-type electronic components | |
| JPH0767774B2 (en) | Cover tape for chip-type electronic component packaging | |
| JP3503754B2 (en) | Cover tape for packaging chip-type electronic components | |
| JP3241220B2 (en) | Cover tape for packaging chip-type electronic components | |
| JP2002193377A (en) | Electronic part packaging cover tape | |
| JP2901857B2 (en) | Cover tape for packaging chip-type electronic components | |
| JP2695536B2 (en) | Cover tape for packaging chip-type electronic components | |
| JP4202685B2 (en) | Cover tape for paper carrier tape | |
| JP2511761Y2 (en) | Cover tape for chip type electronic parts packaging | |
| JP2809979B2 (en) | Cover tape for packaging chip-type electronic components | |
| JP4826018B2 (en) | Carrier tape lid | |
| JPH11198299A (en) | Lid material | |
| JP4213375B2 (en) | Cover tape for packaging electronic parts | |
| JPH09156684A (en) | Cover tape for packaging electronic parts | |
| JPH083036Y2 (en) | Cover tape for chip-type electronic component packaging | |
| JP4569043B2 (en) | Cover tape for packaging electronic parts | |
| JP2001106256A (en) | Cover tape for packaging electronic parts | |
| JP3995922B2 (en) | Cover tape for packaging electronic parts | |
| JPH0912083A (en) | Electronic part package | |
| JP4222041B2 (en) | Cover tape for packaging electronic parts |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090726 Year of fee payment: 14 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090726 Year of fee payment: 14 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100726 Year of fee payment: 15 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110726 Year of fee payment: 16 |
|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110726 Year of fee payment: 16 |