JP2003246019A - Release film and cover lay forming method - Google Patents
Release film and cover lay forming methodInfo
- Publication number
- JP2003246019A JP2003246019A JP2002083635A JP2002083635A JP2003246019A JP 2003246019 A JP2003246019 A JP 2003246019A JP 2002083635 A JP2002083635 A JP 2002083635A JP 2002083635 A JP2002083635 A JP 2002083635A JP 2003246019 A JP2003246019 A JP 2003246019A
- Authority
- JP
- Japan
- Prior art keywords
- release
- resin
- side layer
- layer
- release film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 18
- 229920001577 copolymer Polymers 0.000 claims abstract description 27
- 229920005989 resin Polymers 0.000 claims abstract description 23
- 239000011347 resin Substances 0.000 claims abstract description 23
- 229920000306 polymethylpentene Polymers 0.000 claims abstract description 21
- 239000011116 polymethylpentene Substances 0.000 claims abstract description 21
- 239000004711 α-olefin Substances 0.000 claims abstract description 16
- 238000002844 melting Methods 0.000 claims abstract description 11
- 230000008018 melting Effects 0.000 claims abstract description 11
- -1 ethylene, propylene, butene Chemical class 0.000 claims abstract description 8
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000005977 Ethylene Substances 0.000 claims abstract description 7
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims abstract description 5
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 claims abstract description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims abstract description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 4
- JMMZCWZIJXAGKW-UHFFFAOYSA-N 2-methylpent-2-ene Chemical compound CCC=C(C)C JMMZCWZIJXAGKW-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229920000089 Cyclic olefin copolymer Polymers 0.000 claims abstract description 4
- 239000004840 adhesive resin Substances 0.000 claims abstract description 4
- 229920006223 adhesive resin Polymers 0.000 claims abstract description 4
- 239000000155 melt Substances 0.000 claims abstract description 4
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 claims abstract description 4
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000003475 lamination Methods 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 4
- 125000005396 acrylic acid ester group Chemical group 0.000 claims description 2
- 125000005397 methacrylic acid ester group Chemical group 0.000 claims description 2
- 238000007747 plating Methods 0.000 abstract description 7
- 239000000463 material Substances 0.000 abstract description 6
- 239000005038 ethylene vinyl acetate Substances 0.000 abstract description 4
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 abstract description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 abstract 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 abstract 1
- 229920006226 ethylene-acrylic acid Polymers 0.000 abstract 1
- 150000002500 ions Chemical class 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 27
- 239000000853 adhesive Substances 0.000 description 10
- 230000001070 adhesive effect Effects 0.000 description 9
- 238000010030 laminating Methods 0.000 description 8
- 238000001125 extrusion Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 3
- 239000011800 void material Substances 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000002655 kraft paper Substances 0.000 description 2
- 239000000123 paper Substances 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- 229920000181 Ethylene propylene rubber Polymers 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 229920006225 ethylene-methyl acrylate Polymers 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920005629 polypropylene homopolymer Polymers 0.000 description 1
- 238000009824 pressure lamination Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、フレキシブルプリ
ント配線板の製造工程において用いられる離型フィルム
に関するものである。TECHNICAL FIELD The present invention relates to a release film used in a manufacturing process of a flexible printed wiring board.
【０００２】[0002]
【従来の技術】フレキシブルプリント配線板（以下、Ｆ
ＰＣという）の製造工程においては、絶縁基材、例えば
ポリイミド樹脂フィルム表面に所定の回路を有するフレ
キシブル回路板上を、絶縁及び回路保護を目的として接
着剤付き耐熱樹脂フィルムであるカバーレイ（以下、Ｃ
Ｌという）で被覆し、紙、シリコーンゴム、テフロン
（Ｒ）等のクッション材と離型フィルムを用いてプレス
ラミネートすることが行われている。この製造工程にお
いては、ＦＰＣとの離型性、ＦＰＣの凹凸に十分追従す
ることによるＣＬ端面からの接着剤フロー抑制及び導体
部汚染防止、更にＦＰＣ全体を包み込むことによる圧力
の均一化、即ち離型性、対形状追従性、ＦＰＣ全体への
均一な圧力による脱ボイド性（以下、成形性という）の
他に、後工程での回路へのメッキ付き性等に優れた離型
フィルムが求められている。2. Description of the Related Art Flexible printed wiring boards (hereinafter referred to as F
In the manufacturing process of (PC), a coverlay (hereinafter, referred to as a heat-resistant resin film with an adhesive for the purpose of insulation and circuit protection) on an insulating substrate, for example, a flexible circuit board having a predetermined circuit on the surface of a polyimide resin film. C
(Hereinafter referred to as L), and press-lamination is performed by using a cushioning material such as paper, silicone rubber, Teflon (R) and a release film. In this manufacturing process, releasability from the FPC, suppression of adhesive flow from the CL end surface and prevention of conductor contamination by sufficiently following irregularities of the FPC, and uniform pressure distribution by enclosing the entire FPC, that is, separation In addition to moldability, conformability to shape, void removal by uniform pressure on the entire FPC (hereinafter referred to as moldability), a release film that is excellent in plating property on the circuit in the subsequent process is required. ing.
【０００３】[0003]
【発明が解決しようとする課題】本発明は、離型性、対
形状追従性、均一な成形性に優れた特性を維持しなが
ら、従来の離型フィルムでは不満足であったＦＰＣの後
工程におけるメッキ付き性を向上させた離型フィルム及
びそれを用いたカバーレイ成形方法を提供するものであ
る。DISCLOSURE OF THE INVENTION The present invention, in the post-process of FPC, which is unsatisfactory with the conventional release film, while maintaining the excellent properties of the releasability, the conformability to shape and the uniform moldability. Provided are a release film having improved plating properties and a coverlay molding method using the same.
【０００４】[0004]
【課題を解決するための手段】本発明は、［１］ 離型
側層と離型反対側層を有する離型フィルムにおいて、離
型側層の樹脂がポリメチルペンテン又はポリメチルペン
テンとαオレフィンとの共重合体、離型反対側層の樹脂
がエチレン、プロピレン、ブテン、ペンテン、ヘキセ
ン、メチルペンテンから選ばれたαオレフィン共重合体
又は多元共重合体、エチレンとアクリル酸エステル又は
メタクリル酸エステルの共重合体、エチレンと酢酸ビニ
ル、アクリル酸又はメタクリル酸との共重合体及びそれ
らの部分イオン架橋物から選ばれた共重合体又はそれら
の混合物で、かつ離型反対側層の樹脂が、メルトフロー
レート０．３〜１０．０ｇ／１０分、融点５０〜１５０
℃で、離型側層の樹脂が、ロックウェル硬度６５〜８
８、厚み１０〜１００μｍで、かつ離型側層と離型反対
側層の層間に接着樹脂層を含むことを特徴とする離型フ
ィルム、［２］ 離型反対側層の樹脂の厚みが、２０〜
２９０μｍである請求項１記載の離型フィルム、［３］
フレキシブルプリント配線板の製造工程において、第
［１］項又は［２］項記載の離型フィルムをカバーレイ
のプレスラミネートに用いることを特徴とするカバーレ
イ成形方法、である。The present invention relates to [1] a release film having a release side layer and a release opposite side layer, wherein the resin of the release side layer is polymethylpentene or polymethylpentene and α-olefin. Copolymer with, the resin of the layer on the opposite side of the mold release is α-olefin copolymer or multi-component copolymer selected from ethylene, propylene, butene, pentene, hexene, methylpentene, ethylene and acrylic acid ester or methacrylic acid ester A copolymer selected from the copolymers of ethylene and vinyl acetate, a copolymer of acrylic acid or methacrylic acid and a partial ionic crosslinked product thereof, or a mixture thereof, and the resin of the release opposite layer is Melt flow rate 0.3-10.0 g / 10 minutes, melting point 50-150
At ℃, the resin of the mold release side layer, Rockwell hardness 65-8
8. A release film having a thickness of 10 to 100 μm and including an adhesive resin layer between the release side layer and the release opposite side layer, [2] The thickness of the resin of the release opposite side layer is 20 ~
The release film according to claim 1, which has a thickness of 290 μm, [3]
A coverlay molding method, characterized in that the release film according to item [1] or [2] is used for press lamination of a coverlay in a process for manufacturing a flexible printed wiring board.
【０００５】[0005]
【発明の実施の形態】本発明の離型側層に用いる樹脂
は、ポリメチルペンテン又はポリメチルペンテンとαオ
レフィンとの共重合体である。ポリメチルペンテンと
は、以下の式（１）で示されるものである。
BEST MODE FOR CARRYING OUT THE INVENTION The resin used in the release side layer of the present invention is polymethylpentene or a copolymer of polymethylpentene and α-olefin. Polymethylpentene is represented by the following formula (1).
【０００６】ポリメチルペンテンとαオレフィンとの共
重合体の共重合の比率、αオレフィンの種類については
特に限定しない。ポリメチルペンテン又はポリメチルペ
ンテンとαオレフィンとの共重合体のロックウェル硬度
は、６５〜８８であり、好ましくは７５〜８５が望まし
い。６５未満だとＦＰＣとの対形状追従性、特にメッキ
付き性が劣り、８８を越えると離型性が悪くなり破れ
る。ロックウェル硬度を６５〜８８にするには、ポリメ
チルペンテン又はポリメチルペンテンとαオレフィンと
の共重合体は、単独でも２種類以上の混合物として用い
てもよい。本発明でのロックウェル硬度は、ＡＳＴＭ
Ｄ７８５のＲスケールに準じて測定するものである。The copolymerization ratio of the copolymer of polymethylpentene and α-olefin and the type of α-olefin are not particularly limited. The Rockwell hardness of polymethylpentene or a copolymer of polymethylpentene and α-olefin is from 65 to 88, preferably from 75 to 85. When it is less than 65, the conformability to shape with FPC, particularly the plating property, is poor, and when it exceeds 88, the releasability deteriorates and the film is broken. In order to adjust the Rockwell hardness to 65 to 88, polymethylpentene or a copolymer of polymethylpentene and α-olefin may be used alone or as a mixture of two or more kinds. The Rockwell hardness in the present invention is ASTM
It is measured according to the R scale of D785.
【０００７】ポリメチルペンテン又はポリメチルペンテ
ンとαオレフィンとの共重合体の厚みは、１０〜１００
μｍである。好ましくは１５〜５０μｍが望ましい。１
０μｍ未満だとプレスラミネート後にポリメチルペンテ
ン又はポリメチルペンテンとαオレフィンとの共重合体
が破れ、ＦＰＣと離型フィルムを分離する際に、ＦＰＣ
側にポリメチルペンテン又はポリメチルペンテンとαオ
レフィンとの共重合体が残ってしまう。１００μｍを越
えると対形状追従性が悪くなりＣＬに付着している接着
剤のフロー量が多くなる。The thickness of polymethylpentene or a copolymer of polymethylpentene and α-olefin is 10 to 100.
μm. It is preferably 15 to 50 μm. 1
If it is less than 0 μm, the polymethylpentene or the copolymer of polymethylpentene and α-olefin is ruptured after press lamination, and when separating the FPC and the release film, the FPC
Polymethylpentene or a copolymer of polymethylpentene and α-olefin remains on the side. When it exceeds 100 μm, the conformability to shape is deteriorated and the flow amount of the adhesive agent adhering to CL is increased.
【０００８】本発明の離型反対側層に用いる樹脂は、エ
チレン、プロピレン、ブテン、ペンテン、ヘキセン、メ
チルペンテンから選ばれたαオレフィン共重合体又は多
元共重合体、エチレンとアクリル酸エステル又はメタク
リル酸エステルの共重合体、エチレンと酢酸ビニル、ア
クリル酸又はメタクリル酸との共重合体及びそれらの部
分イオン架橋物から選ばれた共重合体又はそれらの混合
物である。この離型反対側層の樹脂のメルトフローレー
トは、０．３〜１０．０ｇ／１０分である。０．３ｇ／
１０分未満だと対形状追従性等の成形性が悪く、１０．
０ｇ／１０分を越えると離型多層フィルムの端面から樹
脂の染み出しが多くなり作業性が悪くなる。本発明での
メルトフローレートは、ＡＳＴＭ Ｄ１２３８に準じて
測定するものである。The resin used for the layer on the opposite side of the mold release of the present invention is an α-olefin copolymer or multi-component copolymer selected from ethylene, propylene, butene, pentene, hexene and methylpentene, ethylene and acrylic ester or methacrylic acid. It is a copolymer selected from an acid ester copolymer, a copolymer of ethylene and vinyl acetate, an acrylic acid or methacrylic acid, and a partially ionic crosslinked product thereof, or a mixture thereof. The melt flow rate of the resin in the layer opposite to the mold release is 0.3 to 10.0 g / 10 minutes. 0.3 g /
If it is less than 10 minutes, the moldability such as the shape followability is poor.
When it exceeds 0 g / 10 minutes, the resin exudes much from the end face of the release multilayer film, resulting in poor workability. The melt flow rate in the present invention is measured according to ASTM D1238.
【０００９】離型反対側層の樹脂の融点は、５０〜１５
０℃である。５０℃未満だとバラシ作業時の作業性が劣
り、１５０℃を越えるとＣＬ接着剤フロー量が多くな
る。離型反対側層の樹脂厚みは、２０〜２９０μｍが好
ましく、２０μｍ未満だと成形性が悪く、２９０μｍを
越えると離型フィルムの端面からの染み出しが多くな
り、作業性が悪くなり好ましくない。本発明での融点
は、示差走査型熱量計で測定（昇温速度１０℃／分）す
るものである。The melting point of the resin on the layer opposite to the mold release is 50 to 15
It is 0 ° C. If it is less than 50 ° C, the workability during the disassembling work is poor, and if it exceeds 150 ° C, the CL adhesive flow amount increases. The resin thickness of the layer opposite to the release layer is preferably from 20 to 290 μm, and when it is less than 20 μm, the moldability is poor, and when it exceeds 290 μm, the exudation from the end face of the release film is increased and the workability is deteriorated, which is not preferable. The melting point in the present invention is measured with a differential scanning calorimeter (heating rate 10 ° C./min).
【００１０】本発明の離型フィルムは、離型側層と離型
反対側層を有し、離型側層と離型反対側層の層間に接着
樹脂層を含むことが必須である。離型フィルムの総厚み
としては、５０〜３００μｍが好ましく、５０μｍ未満
だと成形性が悪く、３００μｍを越えると離型フィルム
端面での染み出しが多くなり作業性が悪くなるので好ま
しくない。接着剤の種類としては無水マレイン酸変性ポ
リオレフィン，ニトリルゴム，スチレン−ブタジエンゴ
ム，エチレン−プロピレンゴム，天然ゴム，ブチルゴム
等挙げられる．本発明での離型フィルムの離型側層と
は、ＦＰＣ面に接する層のことを指す。It is essential that the release film of the present invention has a release side layer and a release opposite side layer, and an adhesive resin layer is included between the release side layer and the release opposite side layer. The total thickness of the release film is preferably from 50 to 300 μm, and when it is less than 50 μm, the moldability is poor, and when it exceeds 300 μm, the exudation on the end face of the release film is increased and the workability is deteriorated, which is not preferable. Examples of the type of adhesive include maleic anhydride modified polyolefin, nitrile rubber, styrene-butadiene rubber, ethylene-propylene rubber, natural rubber and butyl rubber. The release side layer of the release film in the present invention refers to a layer in contact with the FPC surface.
【００１１】本発明の離型フィルムの製法は、共押出ラ
ミネート工法、押出ラミネート工法、ドライラミネート
工法等のいずれの工法でもよい。接着剤の塗工法は，共
押出しラミネート工法の場合はダイス内で樹脂同士が積
層・接着され，押出しラミネート工法の場合は接着剤を
基材フィルム側にロール（版）で塗布して，基材フィル
ムと押出しされた樹脂をラミネートし，同様にドライラ
ミネート工法は接着剤を基材フィルム側にロール（版）
で塗布してフィルム同士をラミネートする．本発明の離
型フィルムをＦＰＣの製造工程において、ＣＬのプレス
ラミネートに用い、加圧積層する成形方法としては、例
えば当板の間に、紙、シリコーンゴム、テフロン（Ｒ）
等のクッション材、離型フィルム、ＦＰＣ、離型フィル
ム、前記クッション材の順に重ねた構成からなる被プレ
ス物を１０〜３０枚程度載置し、所定の条件で加熱加圧
後、後硬化をすればよい。The release film of the present invention may be produced by any of a coextrusion laminating method, an extrusion laminating method, a dry laminating method and the like. In the case of the co-extrusion laminating method, the resin is laminated and adhered in the die in the case of the co-extrusion laminating method, and in the case of the extrusion laminating method, the adhesive is applied to the base film side with a roll (plate) to form the base material. The film and the extruded resin are laminated, and in the same way, the dry laminating method rolls the adhesive on the base film side.
Apply to laminate the films together. The mold release film of the present invention is used for press lamination of CL in the manufacturing process of FPC, and the molding method of pressure lamination is, for example, paper, silicone rubber, Teflon (R) between the plates.
About 10 to 30 objects to be pressed having a structure in which a cushioning material such as a release film, an FPC, a release film, and the cushioning material are stacked in this order are heated and pressed under predetermined conditions, and post-cured. do it.
【００１２】[0012]
【実施例】以下に本発明を実施例によって、更に詳細に
説明するが、本発明はこれらの実施例に限定されるもの
ではない。以下に示す実施例及び比較例において使用し
た原材料の特性は、以下の通りである。
ポリメチルペンテンとαオレフィンとの共重合体（ＴＰ
Ｘ）：品番ＭＸ００２［ロックウェル硬度６２］、品番
ＭＸ００４［ロックウェル硬度８０］、品番ＲＴ１８
［ロックウェル硬度８９］（三井化学（株）製）
エチレン−酢酸ビニル共重合体（ＥＶＡ）：試作品［酢
酸ビニル含量（ＶＡＣ）１０重量％、融点９３℃、メル
トフローレート（ＭＦＲ）＝０．１ｇ／１０分］、品番
エバフレックスＶ−５７１６ＲＣ［酢酸ビニル含量（Ｖ
ＡＣ）１０重量％、融点９３℃、メルトフローレート
（ＭＦＲ）＝２．５ｇ／１０分］、試作品［酢酸ビニル
含量（ＶＡＣ）１０重量％、融点９３℃、メルトフロー
レート（ＭＦＲ）＝１５ｇ／１０分］（三井・デュポン
ポリケミカル（株）製）
ポリエチレン（ＰＥ）：品番スミカセンＬ２１１［メル
トフローレート（ＭＦＲ）＝２．０ｇ／１０分、融点１
１２℃］（住友化学工業（株）製）
エチレン−メチルアクリレート共重合体（ＥＭＭＡ）：
品番アクリフトＷＤ２０３−１［メルトフローレート
（ＭＦＲ）＝２．０ｇ／１０分、融点９０℃］（住友化
学工業（株）製）
ポリプロピレン（ＰＰ）：品番ＦＳ２０１１ＤＧ［ホモ
ポリプロピレン、融点１６０℃］（住友化学工業（株）
製）
接着剤：品番アドマーＱＢ５５０（三井化学（株）製）EXAMPLES The present invention will be described in more detail with reference to examples below, but the present invention is not limited to these examples. The characteristics of the raw materials used in the examples and comparative examples shown below are as follows. Copolymer of polymethylpentene and α-olefin (TP
X): Part number MX002 [Rockwell hardness 62], Part number MX004 [Rockwell hardness 80], Part number RT18
[Rockwell hardness 89] (manufactured by Mitsui Chemicals, Inc.) Ethylene-vinyl acetate copolymer (EVA): prototype [vinyl acetate content (VAC) 10% by weight, melting point 93 ° C, melt flow rate (MFR) = 0 .1 g / 10 minutes], product number Evaflex V-5716RC [vinyl acetate content (V
AC) 10% by weight, melting point 93 ° C., melt flow rate (MFR) = 2.5 g / 10 minutes], prototype [vinyl acetate content (VAC) 10% by weight, melting point 93 ° C., melt flow rate (MFR) = 15 g / 10 min] (Mitsui DuPont Polychemical Co., Ltd.) Polyethylene (PE): Part number Sumikasen L211 [melt flow rate (MFR) = 2.0 g / 10 min, melting point 1]
12 ° C] (Sumitomo Chemical Co., Ltd.) Ethylene-methyl acrylate copolymer (EMMA):
Product number Acryft WD203-1 [melt flow rate (MFR) = 2.0 g / 10 minutes, melting point 90 ° C.] (Sumitomo Chemical Co., Ltd.) Polypropylene (PP): Product number FS2011DG [Homopolypropylene, melting point 160 ° C.] (Sumitomo Chemical Industry Co., Ltd.
Adhesive: Product number Admer QB550 (manufactured by Mitsui Chemicals, Inc.)
【００１３】実施例１
離型フィルムは、３台の押出機にそれぞれ離型層側とし
てＴＰＸ、接着剤層としてアドマーＱＢ５５０を、離型
反対側層としてＥＶＡを三層ダイスに供給することによ
り押出し、積層一体化して作成した。実施例２〜６、比
較例１〜７については、表１、表２に示す特性の樹脂を
用いて同様に作成した。多段型プレス機を用い、クラフ
ト紙（厚さ０．３ｍｍ）、離型フィルム、ＦＰＣ、離型
フィルム、クラフト紙、の順に重ね、１５０℃、３０ｋ
ｇ／ｃｍ2で６０分加圧後、５０℃になるまで加圧冷却
した後、以下の評価項目で評価した。評価結果を表１、
表２に示す。Example 1 A release film was extruded by supplying TPX as a release layer side, Admer QB550 as an adhesive layer, and EVA as a layer opposite to the release side to a three-layer die into three extruders. It was made by laminating and integrating. In Examples 2 to 6 and Comparative Examples 1 to 7, the resins having the characteristics shown in Tables 1 and 2 were used in the same manner. Using a multi-stage press, kraft paper (thickness 0.3 mm), release film, FPC, release film, kraft paper are stacked in this order at 150 ° C, 30k.
After pressurizing at g / cm 2 for 60 minutes, pressurizing and cooling to 50 ° C., the following evaluation items were evaluated. Table 1 shows the evaluation results.
It shows in Table 2.
【００１４】成形性
○：ボイド発生率 ２．０％未満
×：ボイド発生率 ２．０％以上
ＣＬ接着剤のフロー量（ＣＬ端面からの接着剤染み出し
長さ）
○：フロー量 １５０μｍ未満
×：フロー量 １５０μｍ以上
フィルム端面の染み出し量
○：染み出し量 ５ｍｍ未満
×：染み出し量 ５ｍｍ以上
ＴＰＸ（離型側層）の破れ
○：破れ発生率 ２．０％未満
×：破れ発生率 ２．０％以上
メッキ付き性（必要メッキ面積の９０％以上にメッキが
付いているものを良品）
○：良品が９８％以上
×：良品が９８％未満Moldability ○: Void generation rate less than 2.0% ×: Void generation rate 2.0% or more CL adhesive flow amount (length of adhesive seeping from CL end face) ○: Flow amount less than 150 μm × : Flow amount 150 μm or more Bleed amount on film end surface ○: Bleed amount less than 5 mm ×: Bleed amount 5 mm or more TPX (release side layer) breakage ○: Breakage occurrence rate less than 2.0% ×: Breakage occurrence rate 2 Plating property of 0.0% or more (a product with 90% or more of the required plating area being plated is a good product) ○: 98% or more of a good product ×: Less than 98% of a good product
【００１５】[0015]
【表１】 [Table 1]
【００１６】[0016]
【表２】 [Table 2]
【００１７】[0017]
【発明の効果】本発明は、離型性、対形状追従性、均一
な成形性に優れた特性を維持しながら、従来の離型フィ
ルムでは達成できなかったＦＰＣの後工程におけるメッ
キ付き性を向上させた離型フィルムである。INDUSTRIAL APPLICABILITY The present invention maintains the excellent characteristics of mold releasability, conformability to shape, and uniform moldability, while providing the plating property in the post-process of FPC which cannot be achieved by the conventional mold release film. It is an improved release film.
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 4F100 AK03A AK04B AK07B AK08A AK08B AK09B AK22B AK25B AL01A AL01B BA02 BA07 BA15 GB43 JA04B JA06B JK12A JL01 JL14 YY00A YY00B 5E314 AA24 BB01 CC15 FF06 GG24 ─────────────────────────────────────────────────── ─── Continued front page F term (reference) 4F100 AK03A AK04B AK07B AK08A AK08B AK09B AK22B AK25B AL01A AL01B BA02 BA07 BA15 GB43 JA04B JA06B JK12A JL01 JL14 YY00A YY00B 5E314 AA24 BB01 CC15 FF06 GG24
Claims (3)
ィルムにおいて、離型側層の樹脂がポリメチルペンテン
又はポリメチルペンテンとαオレフィンとの共重合体、
離型反対側層の樹脂がエチレン、プロピレン、ブテン、
ペンテン、ヘキセン、メチルペンテンから選ばれたαオ
レフィン共重合体又は多元共重合体、エチレンとアクリ
ル酸エステル又はメタクリル酸エステルの共重合体、エ
チレンと酢酸ビニル、アクリル酸又はメタクリル酸との
共重合体及びそれらの部分イオン架橋物から選ばれた共
重合体又はそれらの混合物で、かつ離型反対側層の樹脂
が、メルトフローレート０．３〜１０．０ｇ／１０分、
融点５０〜１５０℃で、離型側層の樹脂が、ロックウェ
ル硬度６５〜８８、厚み１０〜１００μｍで、かつ離型
側層と離型反対側層の層間に接着樹脂層を含むことを特
徴とする離型フィルム。1. A mold release film having a mold release side layer and a mold release opposite side layer, wherein the resin of the mold release side layer is polymethylpentene or a copolymer of polymethylpentene and α-olefin,
The resin on the layer opposite to the mold release is ethylene, propylene, butene,
Α-olefin copolymers or multi-component copolymers selected from pentene, hexene and methylpentene, copolymers of ethylene and acrylic acid ester or methacrylic acid ester, copolymers of ethylene and vinyl acetate, acrylic acid or methacrylic acid And a copolymer selected from these partially ionically crosslinked products or a mixture thereof, and the resin of the layer on the opposite side of the mold release has a melt flow rate of 0.3 to 10.0 g / 10 min,
The melting point of 50 to 150 ° C., the resin of the release side layer has a Rockwell hardness of 65 to 88, a thickness of 10 to 100 μm, and includes an adhesive resin layer between the release side layer and the release opposite layer. And release film.
９０μｍである請求項１記載の離型フィルム。2. The thickness of the resin on the layer opposite to the mold release is 20 to 2
The release film according to claim 1, which has a thickness of 90 μm.
において、請求項１又は２記載の離型フィルムをカバー
レイのプレスラミネートに用いることを特徴とするカバ
ーレイ成形方法。3. A coverlay molding method, characterized in that the release film according to claim 1 or 2 is used for press lamination of a coverlay in a process of manufacturing a flexible printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002083635A JP2003246019A (en) | 2001-12-20 | 2002-03-25 | Release film and cover lay forming method |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001-388037 | 2001-12-20 | ||
| JP2001388037 | 2001-12-20 | ||
| JP2002083635A JP2003246019A (en) | 2001-12-20 | 2002-03-25 | Release film and cover lay forming method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003246019A true JP2003246019A (en) | 2003-09-02 |
Family
ID=28676942
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002083635A Pending JP2003246019A (en) | 2001-12-20 | 2002-03-25 | Release film and cover lay forming method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003246019A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007090644A (en) * | 2005-09-28 | 2007-04-12 | Sekisui Chem Co Ltd | Multilayer mold-releasing film |
| JP2007098861A (en) * | 2005-10-06 | 2007-04-19 | Sekisui Chem Co Ltd | Multilayer release film and method for producing multilayer release film |
| US7851271B2 (en) | 2003-04-18 | 2010-12-14 | Asahi Kasei Chemicals Corporation | Release film for printed wiring board production |
| US7932315B2 (en) | 2005-01-07 | 2011-04-26 | Asahi Kasei Chemicals Corporation | Inner part of hard disk drive |
| KR20150087645A (en) | 2014-01-22 | 2015-07-30 | (주)경성화인켐 | Polyolefin sheet for hot-press forming and release buffer film containing the same |
| KR20230112758A (en) | 2022-01-20 | 2023-07-28 | 박현배 | A hot lamination type cushion pad and manufacturing method of flexible printed circuit board |
| KR20230112759A (en) | 2022-01-20 | 2023-07-28 | 박현배 | Manufacturing method of hot lamination type cushion pad and manufacturing method of flexible printed circuit board using thereof |
| KR20230137518A (en) | 2022-03-21 | 2023-10-05 | 박현배 | Monitoring system using silicone cushion pad for multi-use thermocompression bonding |
-
2002
- 2002-03-25 JP JP2002083635A patent/JP2003246019A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7851271B2 (en) | 2003-04-18 | 2010-12-14 | Asahi Kasei Chemicals Corporation | Release film for printed wiring board production |
| US8124694B2 (en) | 2003-04-18 | 2012-02-28 | Asahi Kasei Chemicals Corporation | Mold releasing film for printed circuit board production |
| US7932315B2 (en) | 2005-01-07 | 2011-04-26 | Asahi Kasei Chemicals Corporation | Inner part of hard disk drive |
| JP2007090644A (en) * | 2005-09-28 | 2007-04-12 | Sekisui Chem Co Ltd | Multilayer mold-releasing film |
| JP2007098861A (en) * | 2005-10-06 | 2007-04-19 | Sekisui Chem Co Ltd | Multilayer release film and method for producing multilayer release film |
| KR20150087645A (en) | 2014-01-22 | 2015-07-30 | (주)경성화인켐 | Polyolefin sheet for hot-press forming and release buffer film containing the same |
| KR20230112758A (en) | 2022-01-20 | 2023-07-28 | 박현배 | A hot lamination type cushion pad and manufacturing method of flexible printed circuit board |
| KR20230112759A (en) | 2022-01-20 | 2023-07-28 | 박현배 | Manufacturing method of hot lamination type cushion pad and manufacturing method of flexible printed circuit board using thereof |
| KR20230137518A (en) | 2022-03-21 | 2023-10-05 | 박현배 | Monitoring system using silicone cushion pad for multi-use thermocompression bonding |
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