JP2003039294A - Curved surface processing device and curved surface processing method - Google Patents
Curved surface processing device and curved surface processing methodInfo
- Publication number
- JP2003039294A JP2003039294A JP2001230505A JP2001230505A JP2003039294A JP 2003039294 A JP2003039294 A JP 2003039294A JP 2001230505 A JP2001230505 A JP 2001230505A JP 2001230505 A JP2001230505 A JP 2001230505A JP 2003039294 A JP2003039294 A JP 2003039294A
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- Prior art keywords
- processing
- stage
- tool
- spindle
- rotation
- Prior art date
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- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
(57)【要約】
【課題】 非対称成分の大きな、又は複雑な形状の非軸
対称面を備えた光学素子等の被加工物を、良好な面粗度
で加工する。
【解決手段】 加工装置において、加工ツール27をP
TZステージ26a上に設置して、加工ツールが加工中
にPTZの体積変化を制御して微小変位できるようにす
る。前記PTZステージ26aは、非加工物を取り付け
た主軸の回転に同期して駆動制御され、前記加工ツール
27は回転する被加工物の回転位置に応じた変位量で前
記主軸と平行に変位しながら加工を行う。
PROBLEM TO BE SOLVED: To process a workpiece such as an optical element having a non-axisymmetric surface having a large or complex shape with a large asymmetric component with a good surface roughness. In a processing apparatus, a processing tool 27 is set to P
It is installed on the TZ stage 26a so that the processing tool can control the volume change of the PTZ during the processing and make a small displacement. The PTZ stage 26a is driven and controlled in synchronization with the rotation of the main spindle on which the non-workpiece is mounted, and the processing tool 27 is displaced in parallel with the main spindle by a displacement amount corresponding to the rotation position of the rotating workpiece. Perform processing.
Description
【0001】[0001]
【発明の属する技術分野】本発明は、曲面、例えば、光
学素子等の非対称加工面を有する非加工物を加工する曲
面加工装置及び同方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a curved surface processing apparatus and method for processing a non-processed object having a curved surface, for example, an asymmetrical processed surface such as an optical element.
【0002】[0002]
【従来の技術】例えば、CD、DVD等の記録・再生装
置等において、光学ピックアップでの記録系のレーザー
高効率利用、再生系のレーザーAS(非点)の補正など
のため非軸対称(アナモルフィック、トロイダルなど)
な光学素子が多用されている。また、カムコーダーなど
の撮像光学系においても高画角化に対応するために非軸
対称素子が必要となって来ていることから、非軸対称光
学素子の需要は近年特に高まっている。ところで、非軸
対称の光学素子を得るには、現在、例えば、(1)直接
材料を加工して所定形状を得るダイレクトカット方法、
(2)型を用いて成形(プラスティックの射出成形、ガ
ラスのリヒートプレス成形など)する方法がある。2. Description of the Related Art For example, in a recording / reproducing apparatus for a CD, a DVD, etc., a non-axial symmetry (analog) is used for high efficiency use of a recording system laser in an optical pickup and correction of a reproducing system laser AS (astigmatism). Morphic, toroidal, etc.)
Many optical elements are used. Further, even in an imaging optical system such as a camcorder, a non-axisymmetric optical element is required in order to cope with a high angle of view, so that the demand for a non-axisymmetric optical element has been particularly increased in recent years. By the way, in order to obtain a non-axisymmetric optical element, currently, for example, (1) a direct cutting method for directly processing a material to obtain a predetermined shape,
(2) There is a method of molding using a mold (plastic injection molding, glass reheat press molding, etc.).
【0003】図5は、従来の加工装置を概略的に示す斜
視図である。加工装置10は、概略的には第一の基台1
4上に摺動自在に設けたZ方向ステージ13、Z方向ス
テージ13上の主軸11、及び加工ツール側部分20の
第二の基台22、該基台22上のX方向ステージ21、
X方向ステージ21に載置された加工ツール27から成
っている。基台14上面にはZ方向ステージ13を案内
するための突条15が設けられており、一方Z方向ステ
ージ13下面には前記突条15に対応した溝16が形成
されている。Z方向ステージ13は、伝動機構19aを
介してモータ19により回転駆動される回転軸19bの
回転により、基台14上で前記突条15に案内されて往
復変位し、同時に主軸11及び被加工物取付用主軸面板
17も同様に変位する。Z方向ステージ13上には、主
軸11及び主軸11を回転させるためのモータ18が配
置されており、かつ、主軸11後部には主軸の回転角を
検出するための角度センサー(C軸)12が内蔵されて
いる。FIG. 5 is a perspective view schematically showing a conventional processing apparatus. The processing apparatus 10 is roughly a first base 1
4, a Z-direction stage 13 slidably provided on the spindle 4, a spindle 11 on the Z-direction stage 13, a second base 22 of the processing tool side portion 20, an X-direction stage 21 on the base 22,
The processing tool 27 is mounted on the X-direction stage 21. A ridge 15 for guiding the Z-direction stage 13 is provided on the upper surface of the base 14, while a groove 16 corresponding to the ridge 15 is formed on the lower surface of the Z-direction stage 13. The Z-direction stage 13 is reciprocally displaced by being guided by the protrusion 15 on the base 14 by the rotation of the rotary shaft 19b which is rotationally driven by the motor 19 via the transmission mechanism 19a, and at the same time, the main shaft 11 and the workpiece. The mounting spindle plate 17 is similarly displaced. A main shaft 11 and a motor 18 for rotating the main shaft 11 are arranged on the Z-direction stage 13, and an angle sensor (C axis) 12 for detecting a rotation angle of the main shaft 11 is provided at a rear portion of the main shaft 11. It is built in.
【0004】加工装置の加工ツール側部分20の基台2
2上面にはX方向ステージ21を案内するための突条2
3が設けられ、一方、X方向ステージ21下面には前記
突条23に対応した溝24が設けられている。X方向ス
テージ21は、伝動機構28aを介してモータ28によ
り回転駆動される回転軸28bの回転により、第二の基
台22上で前記突条23に案内されて往復変位すること
ができる。基台22上面には、加工ツール27を加工面
法線方向に常に姿勢制御するためのB軸25があり、そ
の上面にツールステージ26が設置されている。Base 2 of the processing tool side portion 20 of the processing apparatus
2 A ridge 2 for guiding the X-direction stage 21 on the upper surface
3 is provided, while a groove 24 corresponding to the protrusion 23 is provided on the lower surface of the X-direction stage 21. The X-direction stage 21 can be reciprocally displaced by being guided by the protrusion 23 on the second base 22 by the rotation of the rotating shaft 28b that is rotationally driven by the motor 28 via the transmission mechanism 28a. On the upper surface of the base 22, there is a B axis 25 for constantly controlling the attitude of the processing tool 27 in the normal direction to the processing surface, and a tool stage 26 is installed on the upper surface thereof.
【0005】加工ツール27は、前記ツールステージ2
6とともにX方向ステージ21上に設置されている。こ
こでX方向ステージ21はZ方向ステージ13と直交状
に配置されており、加工対象のワークに対する加工ツー
ル27の位置の径方向位置決めを行う。The processing tool 27 is the tool stage 2 described above.
6 and 6 on the X-direction stage 21. Here, the X-direction stage 21 is arranged orthogonally to the Z-direction stage 13 and performs radial positioning of the position of the processing tool 27 with respect to the workpiece to be processed.
【0006】以上で説明した加工装置10を用いて非軸
対称加工を行う場合、加工対象物は前記主軸11の主軸
面板17上に取り付けられてモータ18により回転し、
Z方向ステージ13は、主軸11の回転に同期して非軸
対称の加工面形状に合わせてモータ19の駆動により微
小変位し、非加工物の径方向に位置決めされたツール2
7に対して加工対象物の切り込み(切削)を行う。図6
は、加工時における主軸11の回転角度とZ方向ステー
ジ13のZ方向(加工対象でいうサグ)での変位(サグ
の偏差)との関係を示している。アナモルフィック、ト
ロイダルなどの非軸対称面を加工する場合には、Z方向
ステージ13は、図示のように主軸11が1回転(360
゜)する間にZ方向に変位する。主軸11の回りで、被
加工物のある径のところを考えると、そのZ方向変位は
回転角度に対しsin波状となり、外周に行くほど1回
転中のZ方向ステージの変位は大きく、中心近傍では逆
に小さくなり、中心は0となる。図中、例えばφ=4.
0とφ=2.0、φ=1.0での回転角度とサグの偏差
との関係から明らかなように、φが小さくなるに従って
サグの偏差が小さくなっているのが分かる。When performing non-axisymmetric processing using the processing apparatus 10 described above, the object to be processed is mounted on the spindle face plate 17 of the spindle 11 and rotated by the motor 18,
The Z-direction stage 13 is slightly displaced by driving a motor 19 in synchronization with the rotation of the main shaft 11 in accordance with a non-axisymmetric machining surface shape, and the tool 2 positioned in the radial direction of the non-machining object.
The object to be processed is cut (cut) with respect to 7. Figure 6
Shows the relationship between the rotation angle of the spindle 11 during processing and the displacement (sag deviation) of the Z-direction stage 13 in the Z direction (sag referred to as the processing target). When machining a non-axisymmetric surface such as an anamorphic or toroidal surface, the Z-direction stage 13 rotates the main shaft 11 one revolution (360
It moves in the Z direction during the rotation. Considering a certain diameter of the workpiece around the spindle 11, the Z-direction displacement is sin wave-like with respect to the rotation angle, and the displacement of the Z-direction stage during one rotation is large toward the outer periphery, and near the center. Conversely, it becomes smaller and the center becomes 0. In the figure, for example, φ = 4.
As is clear from the relationship between the rotation angle and the sag deviation at 0, φ = 2.0, and φ = 1.0, it can be seen that the sag deviation decreases as φ decreases.
【0007】このように、従来の加工装置では非軸対称
な光学素子を加工するために、主軸11を1回転する間
にZ方向ステージ13をZ方向にsin波状に往復変位
させている。しかしながら、Z方向ステージ13上には
モータ18等を含めた主軸11と加工対象物の重量が加
わるため大重量となり、その慣性による応答性の低下は
避けられず、主軸11の回転速度を上げるに従って変位
遅延の問題は大きくなる。つまり、主軸11を高速回転
した状態でZ方向ステージ13を追従させるのは困難と
なり、特に切削加工ではその面粗度において不利とな
る。As described above, in the conventional processing apparatus, in order to process an axisymmetric optical element, the Z-direction stage 13 is reciprocally displaced in the Z direction in a sin wave shape while the main shaft 11 is rotated once. However, since the spindle 11 including the motor 18 and the like and the weight of the object to be machined are added on the Z-direction stage 13, the weight becomes large, and the deterioration of the responsiveness due to the inertia is unavoidable, and as the rotation speed of the spindle 11 is increased. The problem of displacement delay is exacerbated. In other words, it becomes difficult to follow the Z-direction stage 13 while the main shaft 11 is rotating at a high speed, and the surface roughness is disadvantageous particularly in the cutting process.
【0008】次に、前記従来の加工装置を用いて研削加
工を行う場合について説明する。研削加工では加工ツー
ルである砥石を回転させることができるため、相対回転
速度が上がり、面粗度の面からみれば主軸11を高速回
転しなくてもよいという有利な点がある。しかし、それ
でも変位を大きくとる非軸対称面であると、切削の場合
と同様にZ方向ステージの応答性の問題が生じやはり同
様の問題が生じる。光学素子ではその素子の最終面粗度
を光学鏡面にまで上げるため、加工対象の材料と加工ツ
ールの材料によって異なるものの、加工対象物と加工ツ
ールの相対速度を上げることが特に必要である。ところ
が、以上で述べたZステージの変位応答性の問題から、
実際には研削加工においても、非軸対称加工においては
主軸回転速度をアップできない。Next, description will be made on a case where grinding is performed by using the conventional processing apparatus. Since the grindstone, which is a processing tool, can be rotated in the grinding process, there is an advantage that the relative rotation speed is increased and the spindle 11 does not have to be rotated at a high speed in terms of surface roughness. However, even if it is a non-axisymmetric surface that takes a large amount of displacement, the Z-direction stage has a problem of responsiveness as in the case of cutting, and the same problem still occurs. In the optical element, since the final surface roughness of the element is increased to the optical mirror surface, it is particularly necessary to increase the relative speed between the object to be processed and the processing tool, although it depends on the material to be processed and the material of the processing tool. However, from the problem of displacement response of the Z stage described above,
In reality, the spindle rotation speed cannot be increased even in the non-axisymmetric grinding process.
【0009】以上、従来の加工装置における問題点を整
理すれば、以下のとおりである。加工対象の光学面に
は鏡面性が必要なため、加工対象と加工ツールの相対速
度を上げる必要がある、しかしながら、非軸対称加工
では、主軸1回転毎にZ方向変位が発生するため変位さ
せる対象の重量は変位応答性に影響を与える。の相
対速度を変化できる研削加工においても、Z方向ステー
ジの変位ストロークが大きくなれば重量の大きなもので
は不利となる。The problems in the conventional processing apparatus are summarized as follows. Since the optical surface of the processing object needs to have a mirror surface, it is necessary to increase the relative speed between the processing object and the processing tool. However, in non-axisymmetric processing, displacement occurs because the Z direction displacement occurs for each rotation of the spindle. The weight of the object affects the displacement response. Even in the grinding process in which the relative speed of the Z stage can be changed, if the displacement stroke of the Z-direction stage becomes large, it becomes disadvantageous if the weight is large.
【0010】[0010]
【発明が解決しようとする課題】そこで、本発明は従来
の加工装置の持つ欠点を解消することを目的とするもの
であって、従来は、加工時において主軸及び非加工物を
載せた状態でZステージに微小変位を与えたことによ
り、主軸の回転速度によりその応答性が問題となったこ
とに鑑み、主軸の代わりに軽量な加工ツールを微小変位
させる構成を採ることで、Zステージの応答性の問題を
解決し、主軸11の回転速度を上げることで、加工効率
と加工面の面粗度を向上させ、同時に非軸対称成分の大
きな面や複雑な面の加工にも十分対応できるようにする
ことを目的とするものである。Therefore, an object of the present invention is to eliminate the drawbacks of the conventional machining apparatus. Conventionally, the main spindle and the non-machined object are mounted during machining. In view of the fact that the responsiveness of the Z-stage has been affected by the rotational speed of the spindle due to the slight displacement, the structure of slightly displacing the lightweight machining tool instead of the spindle allows the Z-stage to respond. By solving the problem of reliability and increasing the rotation speed of the spindle 11, the machining efficiency and the surface roughness of the machined surface are improved, and at the same time, it is possible to sufficiently cope with the processing of a large non-axisymmetric component surface or a complicated surface. The purpose is to
【0011】[0011]
【課題を解決するための手段】請求項1の発明は、被加
工物を回転させる回転手段と、前記被加工物の加工ツー
ルを変位駆動する加工ツール駆動手段と、前記回転手段
の回転に同期して前記加工ツール駆動手段を駆動制御す
る手段とを有し、回転する被加工物の回転位置に応じた
変位量で前記加工ツールを変位駆動することを特徴とす
る曲面加工装置である。According to a first aspect of the present invention, a rotating means for rotating a workpiece, a machining tool driving means for displacing a machining tool of the workpiece, and a rotation of the rotating means are synchronized. And a means for driving and controlling the processing tool driving means, and the displacement tool drives the processing tool by a displacement amount according to the rotational position of the rotating workpiece.
【0012】請求項2の発明は、請求項1に記載された
曲面加工装置において、前記加工ツールは被加工物の回
転軸の方向に変位駆動されることを特徴とする曲面加工
装置である。A second aspect of the present invention is the curved surface machining apparatus according to the first aspect, wherein the machining tool is driven to be displaced in the direction of the rotation axis of the workpiece.
【0013】請求項3の発明は、請求項1又は2に記載
された曲面加工装置において、前記加工ツール駆動手段
は圧電体を備えたことを特徴とする曲面加工装置であ
る。A third aspect of the present invention is the curved surface machining apparatus according to the first or second aspect, wherein the machining tool driving means includes a piezoelectric body.
【0014】請求項4の発明は、被加工物を回転させる
工程、前記被加工物の回転に同期し、該非加工物の回転
位置に応じた変位量で前記加工ツールを変位駆動する工
程、を有することを特徴とする曲面加工方法である。According to a fourth aspect of the present invention, there are provided a step of rotating the work piece, and a step of displacing and driving the working tool in synchronization with the rotation of the work piece by a displacement amount corresponding to the rotational position of the non-work piece. It is a curved surface processing method characterized by having.
【0015】[0015]
【発明の実施の形態】本発明の実施形態を図面を参照し
つつ説明する。図1は本発明の加工装置10の加工ツー
ル側部分20を概略的に示す斜視図であり、加工装置1
0の他の構成は従来のものと同様である。図示の構成に
おいて従来と同様の部分には同様の番号を付してある。
即ち、X方向ステージ22上にはB軸25が設置されて
おり、B軸25上にはツールステージ26及び加工ツー
ル27が置かれている。この構成は既に説明した従来の
加工装置と同様であるが、本実施形態においては、B軸
25とツールステージ26との間に圧電体、例えばPZ
T(チタン酸ジルコン酸鉛)から成るステージ(PTZ
ステージ)26aが配置されている点で相違している。
PZTステージ26aはPZTが電位差に応じて歪が生
じるのを利用して、印加電圧によりPZTを制御し、ツ
ールステージ26、従って加工ツール27がZ方向に所
望量だけ微小変位するようにしている。つまり、加工時
において従来の加工装置においてはZ方向ステージ13
をZ方向に微小変位させていたのに代えて、本実施形態
では加工ツールをZ方法に微小変位させて切削又は研削
を行うようにしている。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view schematically showing a processing tool side portion 20 of a processing apparatus 10 of the present invention.
Other configurations of 0 are the same as the conventional one. In the configuration shown in the figure, the same parts as the conventional ones are given the same numbers.
That is, the B axis 25 is installed on the X-direction stage 22, and the tool stage 26 and the processing tool 27 are placed on the B axis 25. Although this configuration is similar to that of the conventional processing apparatus described above, in the present embodiment, a piezoelectric material such as PZ is provided between the B axis 25 and the tool stage 26.
Stage made of T (lead zirconate titanate) (PTZ
Stage 26a is arranged.
The PZT stage 26a utilizes the fact that the PZT is distorted in accordance with the potential difference, and controls the PZT by the applied voltage so that the tool stage 26, and hence the machining tool 27, is slightly displaced in the Z direction by a desired amount. That is, during processing, the Z-direction stage 13 is used in the conventional processing apparatus.
Instead of performing the small displacement in the Z direction, in the present embodiment, the processing tool is slightly displaced in the Z method to perform cutting or grinding.
【0016】本実施形態では、PZTステージ26aを
採用して加工ツール側を変位させることで変位応答性を
高め、加工ツールをワーク切り込み方向と同じ方向に応
答性よく変位できるようにしたため、面粗度の向上と共
に非軸対称の変位が大きい面や複雑な面の加工が可能で
ある。In the present embodiment, the PZT stage 26a is adopted to displace the machining tool side to enhance the displacement response, and the machining tool can be displaced in the same direction as the workpiece cutting direction with good responsiveness. With the improvement of the degree, it is possible to machine a surface with a large amount of non-axisymmetric displacement or a complicated surface.
【0017】図2は本実施形態における主軸11の回転
数と面粗度との関係を表した図(グラフ)である。ここ
で、図2Aは、切削加工における面粗度Raと主軸回転
数との関係、及び図2Bは、研削加工において、主軸回
転数を100rpmで一定にしたときの面粗度Raと砥
石軸回転数との関係を示している。切削加工時において
は主軸回転数を500rpm程度にすると面粗度Raを
0.01μm程度にできることが、また、研削加工にお
いては、例えば主軸の回転を100rpmとしたとき砥
石軸回転数が4000rpmに達した段階で面粗度Ra
を0.01μm程度の良好な状態にできることが分か
る。加工制御は、主軸11の回転を主軸角度センサ(C
軸)12で読み取り、その回転と同期を取ってPZTス
テージ26aを変位させ、所望の非軸対称光学素子の研
削又は切削ができるように行う。この変位量制御はX、
Z、C軸をNCユニットがトータルで制御することで行
うが、その制御自体は従来周知である。FIG. 2 is a diagram (graph) showing the relationship between the rotational speed of the spindle 11 and the surface roughness in this embodiment. Here, FIG. 2A shows the relationship between the surface roughness Ra and the spindle rotation speed in the cutting process, and FIG. 2B shows the surface roughness Ra and the grindstone shaft rotation when the spindle speed is constant at 100 rpm in the grinding process. It shows the relationship with the number. The surface roughness Ra can be set to about 0.01 μm when the spindle speed is set to about 500 rpm during cutting, and the grinding wheel spindle speed reaches 4000 rpm when the spindle rotation is set to 100 rpm during grinding. Surface roughness Ra at the stage
It can be seen that can be made in a good state of about 0.01 μm. The machining control is based on the rotation of the spindle 11 by the spindle angle sensor (C
(Axis) 12 and the PZT stage 26a is displaced in synchronism with the rotation so that the desired non-axisymmetric optical element can be ground or cut. This displacement control is X,
The NC unit controls the Z and C axes in total, and the control itself is well known in the art.
【0018】次に本発明の実施例について説明する。有
限CD用対物レンズにおいて光源であるLDの非点隔差
を補正するための、ディスク側の光学面(S2)を非軸
対称とする場合について説明する。非軸対称S2の非球
面式の各係数は、例えば
X方向
R=−4.20219
K=−6.97
A4=0.00070
A6=−0.0002
A8=2.15E−5
A10=−1.2Eー6
Y方向
R=−4.19595
K=−6.97
A4=0.00070
A6=−0.0002
A8=2.15E−5
A10=−1.2Eー6Next, examples of the present invention will be described. A case will be described in which the optical surface (S2) on the disk side for correcting the astigmatic difference of the LD, which is the light source, in the finite CD objective lens is axisymmetric. Each coefficient of the aspherical expression of the non-axisymmetric S2 is, for example, R = −4.202019 K = −6.97 A4 = 0.00070 A6 = −0.0002 A8 = 2.15E-5 A10 = −1 in the X direction. .2E-6 Y direction R = -4.19595 K = -6.97 A4 = 0.00070 A6 = -0.0002 A8 = 2.15E-5 A10 = -1.2E-6
【0019】図3は、この実施例における加工時におけ
る主軸の回転角度とサグの偏差との関係を示した図であ
る。図示のように、この実施例においても主軸の1回転
中にサグの偏差がsin波状に振れており、かつ中心か
ら外周に向かうに従ってその振れが大きいことが確認で
きる。また、LD側光学面S1についてはR=2.57
6を持つ軸対称の非球面である。加工対称物は無電解ニ
ッケルメッキを施したSUS材料で、メッキ層の切削加
工を行った。加工条件としては主軸回転数500rpmに
て加工した。また使用したPZTはドイツPI社のフレ
クシャタイプ、加工装置は東芝機械製ULG−100C
H3(商品名)を用いてファナック社製NC装置にてP
ZTをコントロールした。FIG. 3 is a diagram showing the relationship between the rotation angle of the spindle and the sag deviation during machining in this embodiment. As shown in the drawing, also in this embodiment, it can be confirmed that the sag deviation fluctuates like a sin wave during one rotation of the main shaft, and that the deviation fluctuates from the center toward the outer circumference. Further, R = 2.57 for the LD side optical surface S1.
It is an axisymmetric aspherical surface having 6. The symmetrical product is a SUS material plated with electroless nickel, and the plating layer was cut. As the processing conditions, processing was performed at a spindle speed of 500 rpm. Also, the PZT used was a flexure type from German PI, and the processing equipment was ULG-100C manufactured by Toshiba Machine.
P using the FANUC NC device using H3 (trade name)
The ZT was controlled.
【0020】図4A、Bは、その結果得られた被軸対称
面の測定結果を示した図である。図示のように、X、Y
方向の中間Rにてフィッティングすると形状が非軸対称
に加工できているのが分かる。また、各方向でフィッテ
ィングした時の面精度は0.1μm程度で良好である。
また面粗度もRa=0.01μmと良好であった。なお、
以上非軸対称な光学素子を加工する場合について説明し
たが、本発明はこれに限定されず、例えば、前記光学素
子を成形するための型の加工等、非軸対称な加工面を有
する被加工物に広く適用することができる。4A and 4B are views showing the measurement results of the axisymmetric surface obtained as a result. X, Y as shown
It can be seen that the shape can be processed to be non-axisymmetric when the fitting is performed at the middle R of the direction. The surface accuracy when fitting in each direction is about 0.1 μm, which is good.
The surface roughness was Ra = 0.01 μm, which was good. In addition,
The case of processing a non-axisymmetric optical element has been described above, but the present invention is not limited to this, and for example, processing of a mold for molding the optical element, such as processing of a non-axisymmetric processing surface, is performed. It can be widely applied to objects.
【0021】[0021]
【発明の効果】本発明によれば、軽量な工具を変位させ
て加工を行うため、主軸を高速回転させても従来のZ方
向ステージを変位させる場合のような応答遅延が発生せ
ず、切削、研削のいずれの加工においても、非加工物に
ついて良好な面粗度のものを得ることが出来る。また、
非軸対称成分の大きな面も容易に形成可能であり、か
つ、例えば4回転対称、6回転対称などの複雑な面の加
工にも十分対応可能である。As described above, according to the present invention, a lightweight tool is displaced for machining. Therefore, even if the spindle is rotated at a high speed, the delay in response as in the case of displacing the conventional Z-direction stage does not occur, and the cutting is performed. In any of the grinding and grinding processes, it is possible to obtain a non-processed product having a good surface roughness. Also,
It is possible to easily form a surface having a large non-axisymmetric component, and it is possible to sufficiently process a complicated surface such as 4-rotation symmetry and 6-rotation symmetry.
【図1】 本発明の加工装置の加工ツール側部分を概略
的に示す斜視図である。FIG. 1 is a perspective view schematically showing a processing tool side portion of a processing apparatus of the present invention.
【図2】 加工装置による、主軸の回転数と面粗度との
関係を説明するための図である。FIG. 2 is a diagram for explaining the relationship between the rotational speed of the spindle and the surface roughness by the processing device.
【図3】 本発明の実施例における主軸の回転角度とサ
グの偏差との関係を示す図である。FIG. 3 is a diagram showing a relationship between a rotation angle of a main shaft and a sag deviation in the embodiment of the present invention.
【図4】 本発明を実施して得られた被軸対称面の測定
結果を示す図である。FIG. 4 is a diagram showing measurement results of an axisymmetric surface obtained by carrying out the present invention.
【図5】 従来の加工装置を概略的に示す斜視図であ
る。FIG. 5 is a perspective view schematically showing a conventional processing apparatus.
【図6】 従来の加工装置における主軸の回転角度とサ
グの偏差との関係を示す図である。FIG. 6 is a diagram showing a relationship between a rotation angle of a spindle and a sag deviation in a conventional processing device.
10…加工装置、11…主軸、12…角度センサー(C
軸)、13…Z方向ステージ、14…基台、15…突
条、16…溝、17…主軸面板、19…モータ、19a
…減速機構、22…基台、23…突条、24…溝、25
…B軸、26…ツールステージ、26a…PTZステー
ジ、27…加工ツール、モタ28、減速機構28a、回
転軸28b、10 ... Processing device, 11 ... Spindle, 12 ... Angle sensor (C
Axis), 13 ... Z-direction stage, 14 ... base, 15 ... ridge, 16 ... groove, 17 ... spindle face plate, 19 ... motor, 19a
... Reduction mechanism, 22 ... Base, 23 ... Projection, 24 ... Groove, 25
... B axis, 26 ... Tool stage, 26a ... PTZ stage, 27 ... Machining tool, motor 28, reduction mechanism 28a, rotary shaft 28b,
Claims (4)
動手段と、 前記回転手段の回転に同期して前記加工ツール駆動手段
を駆動制御する手段とを有し、 回転する被加工物の回転位置に応じた変位量で前記加工
ツールを変位駆動することを特徴とする曲面加工装置。1. Rotating means for rotating a workpiece, machining tool driving means for displacing and driving a machining tool for the workpiece, and driving control of the machining tool driving means in synchronization with rotation of the rotating means. And a means for displacing and driving the machining tool by a displacement amount according to a rotational position of a rotating workpiece.
いて、 前記加工ツールは被加工物の加工面法線の方向に変位駆
動されることを特徴とする曲面加工装置。2. The curved surface processing apparatus according to claim 1, wherein the processing tool is displaced and driven in a direction of a normal to a processing surface of a workpiece.
置において、 前記加工ツール駆動手段は圧電体を備えたことを特徴と
する曲面加工装置。3. The curved surface processing apparatus according to claim 1, wherein the processing tool driving means includes a piezoelectric body.
応じた変位量で前記加工ツールを変位駆動する工程、を
有することを特徴とする曲面加工方法。4. A step of rotating a work piece, and a step of displacing and driving the working tool in synchronization with rotation of the work piece by a displacement amount according to a rotational position of the non-work piece. Curved surface processing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001230505A JP2003039294A (en) | 2001-07-30 | 2001-07-30 | Curved surface processing device and curved surface processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001230505A JP2003039294A (en) | 2001-07-30 | 2001-07-30 | Curved surface processing device and curved surface processing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003039294A true JP2003039294A (en) | 2003-02-12 |
Family
ID=19062705
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001230505A Pending JP2003039294A (en) | 2001-07-30 | 2001-07-30 | Curved surface processing device and curved surface processing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003039294A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7293337B2 (en) | 2003-08-12 | 2007-11-13 | Konica Minolta Opto, Inc. | Machining apparatus |
| CN114589582A (en) * | 2022-03-18 | 2022-06-07 | 重庆臻宝实业有限公司 | Machining method for grinding curved surface of symmetrical circular curved surface electrode |
-
2001
- 2001-07-30 JP JP2001230505A patent/JP2003039294A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7293337B2 (en) | 2003-08-12 | 2007-11-13 | Konica Minolta Opto, Inc. | Machining apparatus |
| CN114589582A (en) * | 2022-03-18 | 2022-06-07 | 重庆臻宝实业有限公司 | Machining method for grinding curved surface of symmetrical circular curved surface electrode |
| CN114589582B (en) * | 2022-03-18 | 2022-12-16 | 重庆臻宝实业有限公司 | Machining method for grinding curved surface of symmetrical circular curved surface electrode |
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