JP2003089784A - Heat-resistant adhesive film for built-up substrates - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an adhesive film for a build-up board which has excellent balance between heat resistance and molding workability at the time of bonding and has practical solder heat resistance and adhesive strength. SOLUTION: An epoxy equivalent of 250 or more with respect to 100 parts by weight of a polyimide resin (A) soluble in an organic solvent comprising a tetracarboxylic dianhydride component and a diamine component containing 5 to 20 mol% of a diaminosiloxane component is used. , Softening point 55 ~ 70
A heat-resistant adhesive film for a built-up board, which contains 5 to 45 parts by weight of a polyfunctional epoxy resin (B) at 0.1C and 0.1 to 20 parts by weight of a silane coupling agent (C) as main components.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat-resistant adhesive film for built-up substrates, and more particularly to a heat-resistant adhesive film containing a polyimide resin and an epoxy resin soluble in an organic solvent having a silicone unit.

[0002]

2. Description of the Related Art In recent years, several new mounting methods have been proposed for high-density mounting in response to the demand for high functionality and miniaturization of electrical equipment. One is a method of processing the base board and the insulating layer, which are the base of the multilayer board, for each board, and finally bonding them all together to form a multilayer structure, which is a development of the base board and insulating layer. There is a built-up method in which each layer is sequentially processed and laminated to form a multilayer. And
Conventionally, epoxy resin has been mainly used for these insulating layers. However, there are problems that the epoxy resin is inferior in reliability, inflexibility is insufficient, and inferior in dimensional stability. In addition, when used for rigid flex, the flowability was too high, which caused contamination of the flex part.

On the other hand, an adhesive film using a polyimide resin instead of an epoxy resin is also known. When a polyimide resin is used, flow characteristics and flexibility can be improved, but the pressing temperature is 200%. It has been pointed out that the processing conditions are severe, such as when the temperature exceeds ℃, which adversely affects the material to be adhered. In addition, as a material used for the multilayer board insulating layer, there is an adhesive film composed of a composition in which a silicone polyimide resin and an epoxy resin are mixed. When these are used for built-up applications, they are formed when the built-up layer is multilayered. The reliability of the connection part in a multilayer such as VBH (blind via hole) is insufficient. Japanese Patent Laid-Open No. 6-
200216 discloses a heat-resistant adhesive film for printed wiring boards made of a silicone polyimide resin and an epoxy resin. However, with the technology disclosed herein alone, when designing multilayer high-density wiring in a built-up wiring board, the thermal expansion coefficient of the insulating layer made of an adhesive film is large and the glass transition temperature is not sufficient, so that reliability is improved. When tested, it was difficult to satisfy the connection reliability between the terminals corresponding to the boards.

In addition, as a heat-resistant film adhesive, a combination of a polyimide resin having a glass transition temperature of 350 ° C. or less, an epoxy compound, a polyfunctional amino compound, and a silane coupling agent is disclosed in JP-A-10-1643. Has been done. However, the technique disclosed here is not so high in glass transition temperature as a film adhesive, and reliability for build-up wiring boards cannot be expected.

[0005]

SUMMARY OF THE INVENTION The object of the present invention is to solve the above-mentioned problems in the adhesive film, to process at a relatively low temperature of about 200 ° C. or lower regardless of the type of substrate, and to improve the connection reliability between terminals. It is an object of the present invention to provide a heat-resistant adhesive film suitable for built-up lamination that satisfies the requirements.

[0006]

Means for Solving the Problems As a result of diligent studies on the above problems, the present inventors have adjusted the content of diaminosiloxane constituting a polyimide resin and selected a specific epoxy resin. The inventors have found that the above problems can be solved by devising a structure, and have completed the present invention.

That is, the present invention relates to 100 parts by weight of a polyimide resin (A) soluble in an organic solvent, which comprises a tetracarboxylic dianhydride component and a diamine component containing 5 to 20 mol% of a diaminosiloxane component. A heat-resistant adhesive film for a built-up substrate, which contains 5 to 45 parts by weight of a polyfunctional solid epoxy resin (B) having a softening point of 55 to 70 ° C. and 0.1 to 20 parts by weight of a silane coupling agent (C) as main components. . The polyfunctional solid epoxy resin (B) used here preferably has an epoxy equivalent of 250 or more, and the adhesive film preferably has an elastic modulus after curing of 2.0 Gpa or more. Furthermore, the present invention is also a laminate in which the heat-resistant adhesive film for a built-up substrate is provided on a peelable support film.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described in detail below. In addition, in the following description, the heat-resistant adhesive film for build-up substrates of the present invention may be simply referred to as an adhesive film. The polyimide resin (A) used in the present invention comprises a tetracarboxylic dianhydride component and a diaminosiloxane component.
It is a polyimide resin which is soluble in an organic solvent and which comprises a diamine component contained in an amount of ˜20 mol%. Such a polyimide resin is a resin having repeating units represented by the following general formulas (1) and (2), and is soluble in an organic solvent.

[0009]

[Chemical 1] (However, Ar ₁ represents a tetravalent aromatic group, R ₁ and R ₂ represent a divalent hydrocarbon group, R _{3 to} R ₆ represent a hydrocarbon group having 1 to ₆ carbon atoms, and n represents Indicates an integer of 1 to 20)

[Chemical 2] (However, Ar ₁ represents a tetravalent aromatic group and Ar ₂ represents a divalent aromatic group.) The polyimide resin having the repeating unit represented by the general formula (1) and the general formula (2) is It is obtained by reacting a tetracarboxylic dianhydride component with an aromatic diamine and a diamine component consisting of diaminosiloxane.

Specific examples of the tetracarboxylic acid dianhydride are preferably 3,3 ', 4,4'-diphenyl ether tetracarboxylic acid dianhydride and 3,3', 4,4'-diphenylsulfone tetracarboxylic acid dianhydride. An anhydride, 3,3 ', 4,4'-benzophenone tetracarboxylic acid dianhydride, 2,2', 3,3'-benzophenone tetracarboxylic acid dianhydride and the like can be mentioned. In addition, as a part of tetracarboxylic dianhydride 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride, 2,3', 3,4'-biphenyltetracarboxylic dianhydride, 1, It is also possible to use 4,5,8, -naphthalenetetracarboxylic dianhydride, 1,2,5,6-naphthalenetetracarboxylic dianhydride and the like in combination.

As specific examples of the aromatic diamine,
1) Biphenyl type diamine compound, diphenyl ether type diamine compound, benzophenone type diamine compound,
Diphenyl sulfone-based diamine compound, diphenylmethane-based diamine compound, diphenylalkane-based diamino compound such as 2,2-bis (phenyl) propane, 2) di (phenoxy) benzene-based diamine compound, di (phenyl)
Benzene-based diamine compound, 3) Di (phenoxyphenyl) hexafluoropropane-based diamine-based compound, bis (phenoxyphenyl) sulfone-based diamine compound or the like having two or more aromatic rings (benzene ring, etc.), especially 2 to 5 An aromatic diamine mainly containing an aromatic diamine compound can be mentioned, and these can be used individually or in mixture.

As the above-mentioned aromatic diamine, especially 2,2-
Bis (3-aminophenoxyphenyl) propane, 2,2-bis (4-aminophenoxyphenyl) propane, 3,3-bis (3-aminophenoxyphenyl) sulfone, 4,4-bis (3-aminophenoxyphenyl) Sulfone, 3,3-bis (4-aminophenoxyphenyl) sulfone, 3,3-bis (4-aminophenoxyphenyl) sulfone, 3,3-bis (4-aminophenoxyphenyl) sulfone, 4,4-bis ( 4-aminophenoxyphenyl) sulfone, 4,4-bis (4-aminophenoxyphenyl) sulfone, 2,2-bis (3-aminophenoxyphenyl) hexafluoropropane, 2-2-bis (4-aminophenoxyphenyl) Hexafluoropropane, 1,4-bis (4-aminophenoxy) benzene, 1,3-bis (4-aminophenoxy) benzene, 4,
It is desirable to use a diamine having three or more aromatic rings such as 4- (p-phenylenediisopropylidene) bisaniline and 4,4- (m-phenylenediisopropylidene) bisaniline.

Further, it is preferable to blend a part of the aromatic diamine with a diamine having a functional group reactive with an epoxy resin. That is, 1 of Ar _{2 in} the general formula (2)
It is preferable that the part is a group represented by the following general formula (3).

[Chemical 3] (However, Ar ₃ represents a trivalent or tetravalent aromatic group, X represents a hydroxyl group, an amino group or a carboxyl group, and m is 1 or 2
Indicates. )

Aromatic diamines having a functional group reactive with such an epoxy resin include 2,5-diaminophenol, 3,5-diaminophenol and 4,4 '-(3,3'-dihydroxy). Diaminobiphenyl, 4,4 '-(2,2'-dihydroxy) diaminobiphenyl, 2,2'-bis (3 amino-4-hydroxyphenyl) hexafluoropropane, 3,3', 4,
4'-biphenyltetraamine, 3,3 ', 4,4'-tetraaminodiphenyl ether, 4,4'-(3,3'-dicarboxy) diphenylamine, 3,3'-dicarboxy-4,4'- Examples thereof include diaminodiphenyl ether, and particularly preferably 4,4 ′
-(3,3'-dihydroxy) diphenylamine. When these aromatic diamines are used, they react with the epoxy resin during thermocompression bonding to form a crosslinking mechanism, so that the adhesive strength and chemical resistance of the adhesive film of the present invention can be further improved. The aromatic diamine having a functional group reactive with the epoxy resin is preferably used in an amount of at least 1 mol% of the total aromatic diamine, and particularly preferably in the range of 1 to 10 mol%.

Examples of the diaminosiloxane include those represented by the following general formula (4).

[Chemical 4] (However, R ₁ and R ₂ represent a divalent hydrocarbon group, and R ₃ to
R ₆ represents a hydrocarbon group having 1 to ₆ carbon atoms, and n represents an integer of 1 to 20) In the above formula, the average n number of diaminosiloxane is preferably in the range of 1 to 10, more preferably 5 It is in the range of ~ 8. When the value of n is small, the filling property of the adhesive film tends to decrease, and when it is large, the adhesiveness decreases, which is not preferable. By introducing a silicon unit into the polyimide resin by using these diaminosiloxanes, it is possible to impart fluidity to the adhesive film during thermocompression bonding and improve the filling property on the printed circuit board surface.

The polyimide resin (A) used in the present invention is prepared by reacting the above-mentioned tetracarboxylic dianhydride, aromatic diamine and diaminosiloxane in a solvent to form a precursor resin, and then heating and ring-closing the above-mentioned general formula (1). ) And (2), a polyimide resin having a silicone unit having repeating units can be produced. At this time, the constitutional ratio of the repeating units represented by the general formulas (1) and (2) is preferably (1) / (2) = 20/80 to 5/95. Outside this range, the effects of the present invention cannot be sufficiently obtained. That is, when the ratio of the constitutional unit represented by the general formula (1) exceeds 20, the flexibility is improved, but the heat resistance is sacrificed, and the reliability for via formation in the build-up laminated structure decreases. Unfavorable,
Also, if the ratio is less than 5, high temperature when commercializing,
High pressure may be required, which is not preferable.

The polyfunctional solid epoxy resin (B) used in the present invention is required to have a softening point in the range of 55 to 70 ° C., but other than that, it is not particularly limited. Here, the softening point of the epoxy resin refers to a value obtained according to the JIS standard (JIS K-7234). When the softening point of the epoxy resin is lower than the above range, not only the fluidity becomes large when used as an adhesive film, but also the reactivity decreases, which is not preferable. Further, if the softening point exceeds the above range, the fluidity is small and the filling property in high-density wiring may be deteriorated. The polyfunctional epoxy resin of the present invention preferably has an average of 3 or more epoxy groups. Among polyfunctional epoxy resins, novolac type epoxy resins are exemplified as preferable ones. The solid means a substance that is not in a liquid state at room temperature, and naturally includes a powdery substance. In the present invention, the epoxy resin, if the softening point range is in the range of 55 ~ 70 ° C., it is possible to use a plurality of kinds in combination, but in the case of using a plurality of kinds, those other than the above softening point range are used. However, the temperature range of the softening point of the entire epoxy resin component may be 55 to 70 ° C. The polyfunctional solid epoxy resin used preferably has an epoxy equivalent of 250.
Above all, it is particularly preferable to be in the range of 265 to 285. Furthermore, it is also preferable to use an epoxy resin having a Br content in the range of 30 to 40% per epoxy equivalent as a part or all of the epoxy resin.

The polyfunctional solid epoxy resin (B) is used in an amount of 5 to 45 parts by weight, preferably 15 to 35 parts by weight, per 100 parts by weight of the polyimide resin (A). If the amount of the epoxy resin used is small, it is not preferable because the thermocompression bonding at a relatively low temperature, which is a feature of the present invention, becomes difficult, and if the amount is too large, the heat resistance when formed into a film tends to decrease, which is not preferable.

Examples of the silane coupling agent (C) used in the present invention include aminosilane coupling agents, glycidoxysilane coupling agents, vinylsilane coupling agents, mercapton coupling agents, methacryloxysilane coupling agents and the like. Is mentioned. Among these, those having good compatibility with the silicone polyimide component and the epoxy component are desirable. Specifically, mercapto-modified ones are particularly preferable, and 3-mercaptopropyltrimethoxysilane (TSL-8380: manufactured by Toshiba Silicone Co., Ltd.), SH6062 (manufactured by Toray Dow Corning Co., Ltd.) and the like can be mentioned. The amount of the silane coupling agent (C) used is 0.1 to 20 parts by weight, preferably 0.1 to 5 parts by weight, based on 100 parts by weight of the polyimide resin (A). When the amount of the silane coupling agent used is 0.1 parts by weight or less, the effect of improving the adhesion to the adherend is small, and when it exceeds 20 parts by weight, the heat resistance is deteriorated, which is not preferable.

In the present invention, an epoxy resin curing agent (D) may be used if necessary for the purpose of promoting curing. Specific examples of the epoxy resin curing agent include phenols such as phenol novolac and o-cresol novolac, and acid anhydrides such as pyromellitic dianhydride and phthalic anhydride. The epoxy resin curing agent is preferably in the range of 20 to 120 parts by weight with respect to 100 parts by weight of the polyfunctional epoxy resin (B).

The heat-resistant adhesive film for build-up of the present invention can be formed into a film by dissolving each of the above components in an appropriate organic solvent by a known method. As a specific example of a suitable film forming method, a polyimide resin, an epoxy resin and a resin composed of other components are dissolved in a solvent, and the obtained resin solution is coated on a suitable substrate by a known method and then dried. Then, the method of peeling from a base material is mentioned.

Base material (support base material) to which the resin solution is applied
Is not particularly limited, but is preferably a metal or PET film that has been subjected to a release treatment so that its surface is easily peeled off. The preferable thickness of the substrate is 100 μm or less, more preferably 20 to 80 μm. The preferable thickness of the adhesive film on the base material is 60 μm or less in the state of being used as the adhesive film, and particularly 40 to 50 μm.
It is preferably in the range of m. In this state,
It may contain a few% of solvent. The laminate having the adhesive film provided on the substrate is preferably formed of these two layers, and a total thickness in the range of 115 to 125 μm is suitable for the build-up lamination process.

A typical solvent used for forming the film is N, N-dimethylformamide (DM
F), N, N-dimethylacetamide (DMAc), N-methyl-2
-Pyrrolidone (NMP), tetrahydrofuran (THF), diglyme, cyclohexanone, 1,4-dioxane (1,4-D
O) etc. Also, as a solvent during film formation,
There is no problem even if the solvent used in the production of the polyimide resin is used as it is.

The heat-resistant adhesive film for build-up substrates of the present invention has an elastic modulus after being cured in the range of 180 to 195 ° C.
It is preferably in the range of 2.0 Gpa or more. This elastic modulus
If it is less than 2.0 GPa, the characteristics of the insulating layer at high temperature may deteriorate, which is not preferable. Further, the heat-resistant adhesive film for a build-up substrate of the present invention preferably has a linear expansion coefficient after curing in the range of 50 to 80 ppm / ° C. If the coefficient of linear expansion exceeds this range, the reliability of vias, through holes, etc. of the built-up board will deteriorate, which is not preferable. Moreover, the glass transition temperature of the heat-resistant film is 160 in order to be suitable for build-up substrates.
It is better to be in the range of ~ 190 ° C. Glass transition temperature is 160
If the temperature is less than ℃, the reliability for via formation is insufficient, and if the glass transition temperature exceeds 190 ℃, the thermocompression bonding conditions become severe, which is not desirable.

The heat-resistant adhesive film for a built-up board of the present invention is preferably used as an adhesive material such as a flexible printed circuit board / metal, an epoxy wiring board / metal, a paper / phenol wiring board / metal, etc. Between the metal and the metal, insert the adhesive film of the present invention,
Thermocompression bonding under the conditions of 160 ℃ -200 ℃, pressure 3.00-4.90Mpa,
Preferably, a method of further heating at a temperature of 160 to 200 ° C. for a predetermined time to completely cure the epoxy resin to form an adhesive layer between the adherends can be mentioned.

Polyimide resin (A) used in the present invention
Is soluble in a solvent and can be combined with an epoxy resin, and because it has a silicone unit and an epoxy resin with a softening point in an appropriate range, it shows good fluidity during thermocompression bonding and is excellent for adherends. It has excellent filling and adhesion. In addition, the use of an aromatic diamine having reactivity with the epoxy resin has a feature that it can be crosslinked with the epoxy resin to form an adhesive layer excellent in strength and heat resistance. Further, since the glass transition point is not too high, it can be bonded at a lower temperature than conventional polyimide adhesives.

[0027]

EXAMPLES The present invention will be described below based on examples.
The present invention is not limited to these examples. In addition, various physical property values in the examples are based on the following measuring methods.

[Glass transition temperature] 190
After curing for 60 minutes in hot air oven in a ℃ atmosphere, this cured film is used to measure 20 at 1 Hz with a viscoelasticity measuring device.
The peak of the dynamic loss tangent (tan δ) from ℃ to 350 ℃ was taken as the glass transition temperature (Tg). [Linear Expansion Coefficient] The adhesive film was cured for 60 minutes in a hot air oven under an atmosphere of 190 ° C., and then this cured film was heated using a TMA device to change the thermal expansion (heating condition 10 ° C./min,
A load of 5 g and a variation range of 60 ° C to 100 ° C) were measured. [Flowability] After opening a hole of 5 mm in the adhesive film with a punch, this film was hot-pressed (190 ° C., 3.43 Mpa), and the dimensional change amount of the opening before and after the pressing was measured.
The amount of dimensional change in the opening at this time was defined as the flow amount. [Adhesive strength] A hot press (190 mm) was used to bond the adhesive film to the rough surface of the 35 μm thick Cu foil (Mitsui Kinzoku 3EC-III).
℃, 3.43MPa, 60min) pasted, the pasted one
It was cut into a cm-width strip, the copper foil on one side was peeled off, and the adhesive force at room temperature of 180 ° was measured.

[Solder heat resistance] Adhesive film with a thickness of 35
Heat press (190 ℃, 3.43Mpa, 60mi) to adhere to the rough side of μm PI film (polyimide film obtained by etching copper foil of one-sided copper clad laminate manufactured by Nippon Steel Chemical Co., Ltd.)
n), and paste the attached product in a constant temperature and humidity chamber (23 ° C, 5
It was left at 0% RH) for 15 hours. After standing, it was cut into 2.5 cm square to prepare a test sample. This sample 260 ~ 3
It was immersed in a solder bath heated to 00 ° C for 30 seconds for evaluation. The evaluation result (temperature) is the upper limit temperature at which swelling or peeling is not observed when observed after immersion. [Elasticity] The adhesive film was cured for 60 minutes in a hot air oven under an atmosphere of 190 ° C, and then the cured film was used to
The loss modulus and the storage modulus at 20 to 350 ℃ at 1Hz were measured with a viscoelasticity measuring device. The measured value was the value of storage elastic modulus at 25 ° C.

Example 1 500 m equipped with a dry nitrogen gas inlet tube, a thermometer and a stirrer
In a separable flask of l, 0.13 mol of 3,3 ', 4,4'-diphenylsulfone tetracarboxylic acid dianhydride (DSDA), 200 g of N-methyl-2-pyrrolidone (NMP) and 10 g of xylene were added, and nitrogen gas was added. Pour and mix well in the system at room temperature. Next, 0.015 mol of PSX (diaminosiloxane having an average molecular weight of 740: BY16-853X manufactured by Toray Dow Corning Co., Ltd.) was added dropwise, and the reaction solution was ice-cooled with stirring to obtain 2,2′-bis (4-aminophenoxy). Phenyl) propane (BAPP) 0.090 mol and 4,4'-diamino-3,3'-dihydroxy-biphenyl (HA
B) 0.004 mol was added, and the mixture was stirred at room temperature for 2 hours to obtain a polyamic acid. The temperature of this polyamic acid is raised to 190 ° C, 1
Heating and stirring were continued for 4 hours, and water generated during heating was removed from the system. After heating for 14 hours, the system was cooled to obtain a polyimide solution having a logarithmic viscosity of 0.60 dl / g.

Next, the solid content of the obtained polyimide solution is 10
Novolak type epoxy resin (B-CNB-2) for 0 parts by weight
33 parts by weight and 0.5 parts by weight of 3-mercaptopropyltrimethoxysilane as a silane coupling agent were mixed and stirred for 3 hours to prepare a resin solution for an adhesive film. This resin solution is applied to the release-treated metal foil to a thickness of 50 μm after drying, and then dried in a hot air dryer in the order of 90 ° C, 5 minutes-150 ° C, 5 minutes to create an adhesive film. did.

With respect to the adhesive film thus obtained, the glass transition temperature, linear expansion coefficient, flowability, adhesive strength, and solder heat resistance were evaluated according to the above measuring methods. The results are shown in Table 3.

Examples 2 to 3 and Comparative Examples 1 to 4 Polyimides having the compositions shown in Table 1 were obtained in the same manner as in Example 1,
A film was prepared with the composition shown in Table 2 and its various properties were measured. However, in Examples 2 to 3 and Comparative Examples 1 to 4, the same amount of the silane coupling agent used in Example 1 was used. The results are shown in Table 3.

In Table 2, B-CNB-1, B-CNB-2, O-CNB-
1, PNB abbreviations are as follows. B-CNB-1: Bromocresol novolac type epoxy resin (softening point 84 ° C, epoxy equivalent 283) B-CNB-2: Bromocresol novolac type epoxy resin (softening point 63 ° C, epoxy equivalent 271) O-CNB: o- Cresol novolac type epoxy resin (softening point 68 ° C, epoxy equivalent 198) PNB: phenol novolac resin (softening point 165 ° C)

[0035]

[Table 1]

[0036]

[Table 2]

[0037]

[Table 3]

The adhesive films obtained in Example 1 and Comparative Example 1 and Cu foil were alternately combined to form two built-up layers, and then BVH (blind via hole) was opened by laser processing and Cu plating was performed. A build-up multilayer board was created. When a cooling / heating cycle test, which is a reliability test, was performed using this test piece, in the case of using the adhesive sheet of Comparative Example 1, cracks occurred in the Cu plating of BVH and disconnection occurred, but the adhesive sheet of Example 1 The build-up multi-layer substrate using was stable in shape without breaking. From this, it was found that the adhesive film of the present invention is suitable for use as an adhesive film for a built-up substrate.

[0039]

EFFECT OF THE INVENTION The heat-resistant adhesive film for a build-up board of the present invention not only has an excellent balance of heat resistance and moldability during bonding, but also has practical adhesive strength and solder heat resistance required for a build-up board. The reliability and reliability are also good.

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Masaya Furukawa             7-21-11 Nishigotanda, Shinagawa-ku, Tokyo Nippon Steel             Inside Chemical Co., Ltd. F-term (reference) 4J004 AA02 AA11 AA13 AA17 AB05                       CA06 CA08 DB02 FA05 GA01                 4J040 EC072 EC152 EH031 EK071                       GA20 GA22 GA29 HD35 HD36                       HD37 JA09 JB02 NA20                 5E346 AA12 CC09 CC10 EE35

Claims (4)

[Claims] 1. A softening point of 55 per 100 parts by weight of an organic solvent-soluble polyimide resin (A) consisting of a diamine component containing 5 to 20 mol% of a tetracarboxylic dianhydride component and a diaminosiloxane component. 5 to 45 parts by weight of a polyfunctional epoxy resin (B) and a silane coupling agent (C) 0.1 to 70 ° C
A heat-resistant adhesive film for built-up substrates that contains ~ 20 parts by weight as the main component. 2. The heat-resistant adhesive film for a built-up substrate according to claim 1, wherein the polyfunctional epoxy resin (B) is an epoxy resin having an epoxy equivalent of 250 or more. 3. The heat-resistant adhesive film for a built-up substrate according to claim 1, which has an elastic modulus after curing of 2.0 Gpa or more. 4. The method of claim 1 on a peelable support film.
A laminated body in which the heat-resistant adhesive film for a built-up substrate according to any one of 3 is laminated.