JP2002280202A - Chip-type electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a chip-type electronic component, in which electrical opening defects will not occur between an upper electrode and a side face electrode in the chip type electronic component provided with an external connection terminal which comprises the upper electrode, a lower electrode and the side face electrode, provided on both the left and right sides of a chip substrate. SOLUTION: An electrode paste extension recess part (13) is recessed in the side edge part of an upper electrode (14), on which an electrode paste as a side face electrode (21) is superimposed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip-type electronic component, and more particularly, to an upper electrode and a lower electrode provided on both right and left sides of a chip substrate for forming external connection terminals of the chip-type electronic component. In a chip-type electronic component where the electrode paste is applied and baked so that the electrode is electrically connected to the side electrodes, the electrode paste that will become the side electrodes can be easily extended to the upper electrode side, ensuring reliable conduction between the side electrodes and the top electrode. The present invention relates to a chip-type electronic component capable of performing the following.

[0002]

2. Description of the Related Art Conventionally, in the production of chip-type electronic components such as a chip resistor and a chip capacitor, a plurality of first division grooves parallel to each other on a large-sized substrate intersect at a substantially right angle with the first division grooves. And a plurality of parallel second divided grooves, the large-sized substrate is formed into a rod-shaped substrate by dividing along the first divided groove, and the rod-shaped substrate is formed by further dividing along the second divided groove. Is made into a chip substrate, and instead of being manufactured in the state of a chip substrate, it is manufactured in the state of a large-sized substrate and is finally divided into chip substrates to increase productivity. .

That is, for example, in the case of a chip resistor,
In the state of the large-sized substrate in which the first divisional groove and the second divisional groove were engraved, an upper electrode was formed on the upper surface of the large-sized substrate, a lower electrode was formed on the lower surface, and then a resistor was disposed between the upper electrodes. Thereafter, the resistance value is adjusted, and the resistor is hermetically sealed to form a main part of the electronic component.

[0004] Thereafter, the large-sized substrate is divided into rod-shaped substrates by performing division at the first division groove. The upper electrode and the lower electrode are provided along the first division groove, and a part of a side edge portion of the upper electrode is formed on an exposed surface of the rod-shaped substrate which is exposed by performing division along the first division groove. An external electrode in which an electrode paste serving as a side electrode is applied so as to be superposed on the side edge portion of the lower electrode and polymerized, and baked to form a side electrode, and the upper electrode and the lower electrode are electrically connected by the same side electrode Connection terminals are formed.

After the external connection terminals are formed, the rod-shaped substrate is divided into chip substrates by performing division along the second division grooves.
The external connection terminals of each chip substrate are plated with nickel and solder to complete the chip resistor.

[0006]

However, as the product size of chip-type electronic components becomes smaller,
It is also necessary to reduce the substantial overlap width of the electrode paste applied to form the side electrode to the side edge portion of the upper electrode and the side edge portion of the lower electrode. However, there is a problem that an open defect occurs due to non-contact with each other, thereby lowering a manufacturing yield.

In particular, on the upper electrode side, the electrode paste which becomes the side electrode is fired with the upper electrode side facing upward, so that the electrode paste whose viscosity has decreased due to the heating by firing is applied to the lower electrode side. When the upper electrode is easily transferred and the amount of polymerization on the upper electrode is small, it is not possible to generate a force to stop the movement of the electrode paste that is going to move downward, so the front edge of the side electrode that has been polymerized on the upper electrode recedes. However, there has been a problem that a further electrical open defect is caused to lower the manufacturing yield.

[0008]

In order to solve the above-mentioned problems, according to the present invention, an upper electrode provided on the left and right upper surfaces of the chip substrate and a lower electrode provided on the left and right lower surfaces of the chip substrate are also provided. In chip-type electronic components that are electrically connected by electrodes to form external connection terminals,
An electrode paste extension recess was formed in the side edge portion of the upper electrode where the electrode paste to be the side electrode was polymerized.

That is, by providing the electrode paste extension concave portion, the electrode paste can be easily extended toward the upper electrode when the electrode paste serving as the side electrode is applied, and an electric connection is provided between the upper electrode and the side electrode. This is to prevent the opening from happening.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION The chip-type electronic component according to the present invention has a structure in which a first divisional groove and a second divisional groove are provided in a grid pattern on an insulating large-sized substrate, and division is performed along the first divisional groove. An electronic component manufactured by forming a large-sized substrate into a rod-shaped substrate and further dividing the rod-shaped substrate as a chip substrate by dividing the substrate along the second dividing groove, and forming an upper electrode on both upper surfaces of both ends of the chip substrate. This is an electronic component in which a lower electrode is provided on a lower surface and a side electrode for electrically connecting the upper electrode and the lower electrode is provided on a side surface to form an external connection terminal.

The side electrodes are formed by applying and firing electrode pastes on the left and right side surfaces of the bar-shaped substrate exposed by dividing the large-sized substrate along the first dividing grooves. By embedding the electrode paste extension concave portion at the side edge portion of the upper electrode where the paste is polymerized, the same electrode paste is extended along the electrode paste extension concave portion with the application of the electrode paste to be the side electrode, The conduction between the side electrode and the upper electrode is ensured.

In particular, a force that tends to move to the lower electrode side during firing of the electrode paste is unlikely to act on the electrode paste extended along the electrode paste extension concave portion, so that the electrode paste in the electrode paste extension concave portion is anchored. Thus, it is possible to suppress the occurrence of a force that tends to move to the lower electrode side during firing of the electrode paste, and to reliably prevent the occurrence of an electrical open failure.

The electrode paste extending recess may be provided not only on the side edge of the upper electrode but also on the side edge of the lower electrode. Since an open defect caused by the electrode is unlikely to occur from the beginning, the effect is not as good as that provided on the upper electrode side.

Hereinafter, the present invention will be described in more detail with reference to the drawings. In this embodiment, a chip resistor will be described. However, the present invention is not limited to the chip resistor, but is not limited to a multiple chip resistor, a chip capacitor, a multiple chip capacitor, and a network electronic device in which a chip resistor and a chip capacitor are mixed. The present invention can be applied to all chip-type electronic components such as components and chip inductance.

[0015]

FIG. 1 is an explanatory view for explaining a manufacturing process of a chip resistor according to the present embodiment. The chip resistor of this embodiment is
A plurality of first dividing grooves 11 parallel to each other and a plurality of parallel second dividing grooves 12 intersecting the first dividing grooves 11 in an orthogonal state.
A resistor r is disposed on a ceramic large-sized substrate 10 provided with the above-described components, and the large-sized substrate 10 is formed into a rod-shaped substrate 20 by dividing the substrate along a first dividing groove 11.
After applying and firing an electrode paste to be the side electrode 21 on the side edge of the rod 20, the rod-shaped substrate 20 is made into a chip substrate 30 by dividing along the second dividing groove 12, and nickel plating and soldering are applied to the external connection terminal portions. It is plated to make a chip resistor.

The first dividing groove 11 and the second dividing groove 12 are engraved in the state of a ceramic green sheet which becomes the large-sized substrate 10 by firing, and are formed by engraving the first dividing groove 11. A pressing mold (not shown) provided with a first split groove projecting piece (not shown) and a second split groove projecting piece (not shown) for engraving the second split groove 12. ), The ceramic green sheet is formed by pressing.

Further, in the present embodiment, the electrode paste extending recessed parts (not shown) are provided at predetermined intervals along the first divided groove projecting pieces provided on the pressing die. I have. The electrode paste extended concave portion forming body has a quadrangular pyramid shape having a substantially rhombus bottom surface, and one diagonal line of the bottom surface is provided so as to overlap the first division groove projecting piece.

Therefore, by pressing the ceramic green sheet with a pressing die, the first split groove 11, the second split groove 12, and the electrode paste extension recess 13 can be formed on the ceramic green sheet. A large-sized substrate 10 is formed by firing a ceramic green sheet (FIG. 1A). In this embodiment,
Two electrode paste extension recesses 13 are provided on the first divisional groove 11 divided by two adjacent second divisional grooves 12,12.

Each of the electrode paste extension concave portions 13 is formed in a V-shaped groove having a triangular shape in a plan view and a triangular shape in a side view because the electrode paste extended concave portion forming member has a quadrangular pyramid shape.

On the upper surface of the large-sized substrate 10 thus obtained, an electrode paste to be the upper electrode 14 is applied in a strip shape so as to straddle the first dividing groove 11, and the upper electrode on the back side of the large-sized substrate 10 is formed. An electrode paste for forming the lower electrode 15 is applied in a band shape to a position corresponding to 14, and baked to form the upper electrode 14 and the lower electrode 15.
After that, a resistor paste made of a resistor material such as ruthenium is applied between the upper electrodes 14 and 14 and fired to form a resistor r (FIG. 1B).

Of course, the electrode paste which becomes the upper electrode 14 is also applied to the electrode paste extension concave portion 13, but the electrode paste to be applied is not so filled with the electrode paste extension recess 13. The dimensions of the electrode paste extension recess 13 are determined in consideration of the paste application amount.

After the formation of the resistor r, a protective glass layer 16 is provided on the upper surface of the resistor r in order to adjust the resistance, and the resistance is adjusted by trimming by laser trimming.
Reference numeral 17 denotes a trimming groove (FIG. 1C).

After adjusting the resistance value by trimming, the trimming groove 17 is backfilled, and a plurality of glass layers are provided on the upper surface of the resistor r in order to completely hermetically seal the resistor r to form a coating glass layer 18. (Fig. 1
(D)). If necessary, marking is performed on the upper surface of the coating glass layer 18 to complete the main part of the chip resistor.

After that, the large-sized substrate 10
Is divided into a rod-shaped substrate 20 (FIG. 1 (e)). An electrode paste for forming a side electrode 21 is applied to the exposed surface 22 newly exposed by the division and fired. 15 is electrically connected.

When the electrode paste for forming the side electrode 21 is applied, the exposed surface 22 of the rod-shaped substrate 20 to which the electrode paste is applied is applied.
Is directed downward, and the application is performed by bringing the exposed surface 22 into contact with the liquid surface of the electrode paste.However, by providing the electrode paste extension recess 13 on the side edge portion of the upper electrode 14,
The electrode paste is extended along the electrode paste extension recess 13 due to the surface tension of the electrode paste in the electrode paste extension recess 13, so that the electrode paste can be reliably polymerized on the upper electrode 14.

When the electrode paste is fired after the application of the electrode paste for forming the side electrodes 21, since the firing is performed with the upper electrode 14 directed upward, the electrode paste extends along the electrode paste extension recess 13. The electrode paste that has been received is received by the electrode paste extension recesses 13, so that it does not move downward due to heating during baking, and the electrode paste that does not move in the electrode paste extension recesses 13 is replaced with the surrounding electrode paste. The overall movement of the electrode paste is also suppressed by suppressing the movement of
It is possible to suppress the occurrence of an electrical open failure between the side electrode 14 and the side electrode 21 and to ensure reliable conduction. Therefore, it is possible to prevent the production yield from lowering.

The rod substrate 20 on which the side electrodes 21 are formed as described above is divided along the second division grooves 12 to form a chip substrate 30 (FIG. 1F).
Nickel plating and solder plating are applied to external connection terminals including the lower electrode 15, the lower electrode 15, and the side electrode 21, so that a chip resistor is completed.

As described above, in the present embodiment, two V-shaped groove-shaped electrode paste extension recesses 13 are provided at the side edges of one upper electrode 14, but the present invention is not limited to this embodiment. As shown in FIG. 2, a plurality of V-shaped groove-shaped electrode paste extension recesses 13 may be continuously provided on the side edge portion of the upper electrode 14. In FIG. 2, only one chip substrate 30 in the large-sized substrate 10 is drawn for convenience of explanation.
2A is a plan view of the chip substrate 30, and FIG. 2B is a side view of the same. By increasing the number of the electrode paste extension recesses 13, the overlapping area between the side electrode 21 and the upper electrode 14 can be increased, and the side electrode 21 and the upper electrode 14 can be conducted more favorably.

Alternatively, as shown in FIG.
May be provided with one wide V-shaped groove-shaped electrode paste extension recess 13 at the side edge portion of the electrode paste. By enlarging the V-shaped groove shape, the overlapping area between the side electrode 21 and the upper electrode 14 can be increased, and the side electrode 21 and the upper electrode 14 can be more effectively conducted. Further, when the upper electrode 14 is formed, it is possible to easily prevent the electrode paste extension recess 13 from being buried back by the electrode paste that becomes the upper electrode 14.

The shape of the electrode paste extension recess 13 is as follows.
It is not limited to a V-shaped groove, but as shown in FIG.
The shape may be a round bottom groove so as to have an arc shape in plan view and an arc shape in side view. In the case of the round bottom groove shape, the surface area can be increased as compared with the V-shaped groove shape, so that the electrode paste to be more side electrodes 21 can be held in the round bottom groove portion. When forming the upper electrode 14, the upper electrode
Electrode paste extension recessed by electrode paste that becomes 14 13
Can be more easily prevented from being backfilled.

As shown in FIG. 5, the electrode paste extension recess 13 is formed in a substantially trapezoidal shape in a plan view and also in a substantially trapezoidal shape in a side view. In such a case, more electrode paste can be held, and the electrode paste extending recess 13 can be more easily prevented from being buried back by the electrode paste that becomes the upper electrode 14.

Alternatively, instead of the above-described V-shaped groove, round-bottom groove or the like, as shown in FIG. The shape step 13a may be recessed to form the electrode paste extension recess 13. By forming the rectangular step portion 13a, it is possible to easily prevent the upper electrode 14 from being buried with the electrode paste that becomes the upper electrode 14 when the upper electrode 14 is formed. In addition,
In this embodiment, two rectangular steps 13a are provided on one side, but the number is not limited to two and may be one or three or more.

Further, as shown in FIG.
The electrode paste extension recess 13 may be formed by engraving a vertical electrode paste lead-in groove 13b on the side surface of the electrode paste 30. By engraving the electrode paste lead-in groove 13b, the electrode paste is drawn into the electrode paste lead-in groove 13b when the electrode paste to be the side electrode 21 is applied, so that the electrode paste lead-in groove 13b is formed. Providing this makes it easier to polymerize the electrode paste to be the side electrode 21 on the protruding upper electrode 14, so that the upper electrode 14 and the side electrode 21 can be reliably conducted.
In this embodiment, four electrode paste lead-in grooves are provided on one side.
13b is engraved, but is not limited to four,
Other numbers may be used.

In FIGS. 3 to 7 described above, only one chip substrate 30 is drawn for convenience of explanation, as in FIG. 2, (a) is a plan view, and (b) is the same view. Is shown.

In the present embodiment, the formation of the electrode paste extension concave portion 13 is such that the ceramic green sheet is pressed by the pressing die as described above. However, the present invention is not limited to this mode. The electrode paste extension recess 13 may be formed in the substrate by grinding.

Alternatively, as shown in FIG. 8, a ceramic green sheet 10 ″ having a notched portion of the electrode paste extending recess 13 and a ceramic green sheet 10 ′ having no portion of the electrode paste extending recess 13 are laminated. And baking to form a large-sized substrate on which the electrode paste extension recesses 13 are formed.In FIG. 8, only one chip substrate 30 is drawn for convenience of explanation. The electrode paste extension concave portion 13 is formed to be a rectangular step portion 13a.

Alternatively, the electrode paste extension recesses 13 may be relatively formed by screen-printing a glass paste on a portion other than the portion where the electrode paste extension recesses 13 are formed on the upper surface of the large-size substrate where the electrode paste extension recesses 13 are not provided. It may be.

[0038]

According to the present invention, the upper electrode and the side electrode are reliably formed by forming the electrode paste extension concave portion at the side edge portion of the upper electrode on which the electrode paste serving as the side electrode is superimposed. To prevent the occurrence of an open defect, thereby improving the production yield.

In particular, a force which tends to move to the lower electrode side during firing of the electrode paste can be made less likely to act on the electrode paste extended along the electrode paste extension concave portion. The electrode paste itself functions as an anchor, suppressing the generation of a force that tends to move to the lower electrode side during firing of the electrode paste, and can reliably prevent the occurrence of electrical open failure. Therefore, the production yield can be improved.

[Brief description of the drawings]

FIG. 1 is an explanatory view illustrating a manufacturing process of a chip resistor provided with an electrode paste extension concave portion according to the present invention.

FIG. 2A is a plan view of a chip substrate according to another embodiment,
(B) is the same side view.

FIG. 3A is a plan view of a chip substrate according to another embodiment,
(B) is the same side view.

FIG. 4A is a plan view of a chip substrate according to another embodiment,
(B) is the same side view.

FIG. 5A is a plan view of a chip substrate according to another embodiment,
(B) is the same side view.

FIG. 6A is a plan view of a chip substrate according to another embodiment,
(B) is the same side view.

FIG. 7A is a plan view of a chip substrate according to another embodiment,
(B) is the same side view.

FIG. 8 is an explanatory view showing a method for forming an electrode paste extension concave portion according to another embodiment.

[Explanation of symbols]

 r Resistor 10 Large format substrate 11 First dividing groove 12 Second dividing groove 13 Electrode paste extension recess 14 Upper electrode 15 Lower electrode 16 Protective glass layer 17 Trimming groove 18 Coating glass layer 20 Bar-shaped substrate 21 Side electrode 22 Exposed surface 30 Chip substrate

Claims (1)

[Claims] An upper electrode (14) provided on the left and right upper surfaces of a chip substrate (30) and a lower electrode (15) similarly provided on the left and right lower surfaces of the chip substrate (30) by side electrodes (21). In a chip-type electronic component that is electrically connected to an external connection terminal, an upper electrode on which an electrode paste serving as a side electrode (21) is polymerized
A chip-type electronic component, wherein an electrode paste extension recess (13) is provided in a side edge portion of (14).