JP2002158150A - Method of forming electrode of electronic component and device for forming the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of forming an electrode capable of stably forming a sneak path of the electrode. SOLUTION: A paste line CPa having a predetermined width and height is formed on the surface of a coated plate 11, and each surface in the widthwise direction of a component chip 1a is pressed onto the paste line CPa. Thus, the length of the sneak path of the conductive paste CP applied to the component chip 1a can be made nearly equal to the amount of sinking of the component chip 1a to the paste line CPa and the width of the sneak path nearly equal to the width of the paste line CPa. This can stabilize the shape of the sneak path of the conductive paste CP applied to the component chip 1a, or the shape of the sneak path 1b1 of an electrode 1b.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method and an apparatus for forming electrodes on component chips for various electronic components such as chip components, array components and composite components.

[0002]

2. Description of the Related Art FIG. 1 shows a capacitor type capacitor array known as one of array components. This capacitor array 1 has four capacitor portions arranged in parallel in a quadrangular prism-shaped component chip 1a made of ceramic. It is built in a state, and has a total of four pairs of electrodes 1b that are electrically connected to the respective capacitor sections, on both sides in the width direction of the component chip 1a. In order to enable surface mounting on a substrate, each electrode 1b is provided with a portion 1b1 (hereinafter referred to as a wraparound portion 1b1) that wraps around both surfaces in the height direction of the component chip 1a. Incidentally, some capacitor arrays have a number of built-in capacitor portions and a number of electrode pairs other than four.

The electrode 1b is formed by applying a conductor paste for an electrode to the component chip 1a in a predetermined shape, and then drying and firing the applied paste.
For applying the conductive paste, a method using an application plate 2 as shown in FIG. 2 and a method using an application roller 3 as shown in FIG. 3 are mainly employed.

The coating plate 2 shown in FIG. 2 has a plate-like elastic portion 2a made of an elastic material such as silicon rubber and a plate-like rigid portion 2b made of a rigid material such as stainless steel and supporting the lower surface of the elastic portion 2a. It is composed of Four grooves 2 corresponding to the number and positions of the electrodes 1b are formed on the surface of the elastic portion 2a.
a1 is formed in parallel.

[0005] The component chip 1 is
When the conductive paste CP is applied to the groove 2a1, the conductive paste CP is supplied to the surface of the elastic portion 2a of the coating plate 2 and the conductive paste is scraped off from the surface of the elastic portion 2a by a blade (not shown). Is filled with the conductive paste CP, a carrier plate (not shown) holding the component chip 1a in a predetermined posture is lowered, and each surface in the width direction of the component chip 1a is pressed against the surface of the elastic portion 2a. The component chip 1a pressed against the surface of the substrate is separated from the elastic portion 2a by raising the carrier plate. Since the component chip 1a slightly sinks into the elastic portion 2a at the time of the pressing, the conductive paste CP filled in each groove 2a1 is applied to each surface in the width direction of the component chip 1a, and at the same time, the height adjacent to the same surface is increased. It is also applied to the edges of both sides in the vertical direction.

On the other hand, the application roller 3 shown in FIG. 3 has a cylindrical elastic portion 3a made of an elastic material such as silicon rubber,
A cylindrical rigid portion 3b made of a rigid material such as stainless steel and supporting the inner peripheral surface of the elastic portion 3a. On the surface of the elastic portion 3a, four grooves 3a1 corresponding to the number and position of the electrodes 1b are formed in parallel. Incidentally, reference numeral 4 in FIG. 3 denotes a container containing the conductive paste CP,
Reference numeral 5 denotes a blade for scraping the conductive paste CP adhered to the surface of the elastic portion 3a.

[0007] A component chip 1 is
When the conductive paste CP is applied to a, the conductive paste CP is supplied to the surface of the elastic portion 3a using the rotation of the application roller 3 in the direction of the arrow, and the conductive paste CP is scraped off from the surface of the elastic portion 3a by the blade 5. Thus, after the grooves 3a1 are filled with the conductive paste CP, the carrier tape (not shown) holding the component chips 1a in a predetermined posture is moved in the tangential direction of the application roller 3 so that the width of the component chips 1a is reduced. Surface is pressed against the surface of the elastic portion 3a, and the component chip 1a pressed against the surface of the elastic portion 3a.
Is separated from the elastic portion 3a by the movement of the carrier tape. Since the component chip 1a slightly sinks into the elastic portion 3a at the time of the pressing, the conductive paste CP filled in each groove 3a1 is applied to each surface in the width direction of the component chip 1a, and at the same time, the height adjacent to the same surface is increased. It is also applied to the edges of both sides in the vertical direction.

[0008]

In the above-mentioned conventional method using the coating plate 2 or the coating roller 3, the length of the component chip 1a or the filling amount of the paste in the groove 2a1 or each groove 3a1 is increased due to the dimensional tolerance and the like. It is difficult to stably obtain the shape of the wraparound portion of the application paste CP, which is generally defined by the width and the dimension (dimensions E2 and E3 in FIG. 1), that is, the shape of the wraparound portion 1b1 of the electrode 1b. Since the wraparound portion 1b1 of the electrode 1b is an important part when joining the electrode 1b to the substrate electrode by soldering or the like, a defective shape of the wraparound portion 1b1 may cause a mounting problem. Needless to say, this problem can also occur when electrodes of the same shape are formed on electronic components other than the capacitor array shown in FIG. 1, and the problem becomes more significant when the electrode size is reduced. Become.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object thereof is to provide an electrode forming method capable of stably forming a wraparound portion of an electrode and an electrode forming apparatus suitable for carrying out the method. It is in.

[0010]

In order to achieve the above object, an electrode forming method according to the present invention is directed to a method for forming an electrode of an electronic component, comprising the step of applying a conductive paste for an electrode to a component chip. Supplying a conductive paste to the paste application surface, scraping the conductive paste from the paste application surface by a blade having a concave portion at a contact end with the paste application surface, and using a conductive paste passing through the concave portion to a predetermined width and height. And a step of pressing a component chip against the paste line on the paste application surface.

According to this electrode forming method, a paste line having a predetermined width and height is formed on the paste application surface, and the component chip is pressed against the paste line, whereby the conductive paste applied to the component chip is formed. The length of the wraparound portion can be assured to be substantially the same as the amount of the component chip sunk into the paste line, and the wraparound portion can be assured of a size substantially corresponding to the width of the paste line.

On the other hand, an electrode forming apparatus according to the present invention is an electrode forming apparatus for an electronic component, comprising: means for applying a conductor paste for an electrode to a component chip, the means comprising: a paste-applied surface; A blade having a concave portion at the contact end thereof and capable of forming a paste line having a predetermined width and height on the paste applied surface by the conductive paste having passed through the concave portion when scraping the conductive paste from the paste applied surface. Its features. According to this electrode forming apparatus, the above-described electrode forming method can be accurately performed.

The above and other objects, constitutional features, and operational effects of the present invention will become apparent from the following description and the accompanying drawings.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS [First Embodiment] FIGS. 4 to 8 show a first embodiment of the present invention. In the drawings, reference numeral 11 denotes a coating plate, 12 denotes a blade for scraping paste, CP Is a conductor paste for electrodes. In the following description, FIG.
And the reference numerals and names shown in FIG.

The application plate 11 is made of a rigid material such as stainless steel, and has a smooth surface used as a paste application surface. At the tip of the blade 12, four substantially U-shaped concave portions 12a corresponding to the number and positions of the electrodes 1b are formed at equal intervals in the width direction of the blade 12.

When the conductive paste CP is applied to the component chip 1a, first, as shown in FIGS. 4 and 5, the conductive paste CP of the coating plate 11 is supplied. 5 is moved rightward in FIG.

As a result, the conductive paste CP is scraped off from the surface of the coating plate 11 by the blade 12e, and as shown in FIG. 6, the conductive paste CP having the predetermined width and height is
The straight paste lines CPa are formed in parallel with the surface of the application plate 11. In order to prevent the shape of the paste line CPa after being formed on the surface of the application plate 11 from being collapsed and to perform the paste application described later satisfactorily, the conductive paste CP substantially matches the shape of the concave portion 12a of the blade 12. It is preferable to use a material having such a viscosity that the vertical cross-sectional shape appears on the paste line CPa.

After forming the paste line, the component chip 1a
The carrier plate (not shown) holding the component line 1 in a predetermined posture is lowered, and as shown in FIGS. 7 and 8, the paste line CPa is formed between one surface in the width direction of the component chip 1 a and the surface of the application plate 11. One surface in the width direction of the component chip 1a is pressed against the four paste lines CPa on the surface of the application plate 11 so that there is a gap CL smaller than the height.

As a result, one surface in the width direction of the component chip 1a enters into the four paste lines CPa, and the conductor paste CP of each paste line CPa is applied to one surface in the width direction of the component chip 1a, and at the same time, is adjacent to the same surface. Is applied to the edges of both sides in the height direction. Component chip 1
When pressing a on the paste line CPa, a gap CL smaller than the height of the paste line CPa is formed between one surface in the width direction of the component chip 1a and the surface of the application plate 11, so that the width of the component chip 1a is increased. The conductor paste CP sandwiched between one surface in the direction and the surface of the application plate 11 is prevented from spreading more than necessary. The wraparound portion of the application paste CP is a paste line CPa.
1 has a shape similar to that of the longitudinal section, and the length dimension of the wraparound portion of the coating paste CP (dimension E in FIG. 1).
2) substantially corresponds to the amount of the component chip 1a sunk into the paste line CPa, and the width of the wraparound portion (FIG. 1)
E3) substantially corresponds to the width dimension of the paste line CPa.

After pressing, the carrier plate is raised to separate the component chip 1a from the four paste lines CPa. By the way, the carrier plate is a plate-shaped elastic portion made of an elastic material such as silicon rubber and having a large number of holding holes formed in a predetermined arrangement, and a rigid frame disposed around the elastic portion and inside except for the holding holes. The component chip 1a is elastically held in the holding hole of the elastic portion in a predetermined posture and partially protruding.

Conductive paste CP for component chip 1a
Is applied to the other surface in the width direction of the component chip 1a after the application paste CP is dried. After the application paste CP is dried, the component chip 1a is put into a firing furnace and dried. The subsequent application paste CP is fired.
The firing of the component chip 1a may be performed simultaneously with the firing of the conductive paste CP, or may be performed before the conductive paste CP is applied. Thus, the multilayer capacitor array 1 shown in FIG. 1 is manufactured.

According to the paste application method and apparatus described above, a paste line CPa having a predetermined width and height is formed on the surface of the application plate 11, and each surface of the component chip 1a in the width direction is formed on the paste line CPa. The conductor paste C applied to the component chip 1a by pressing
As the length dimension (dimension E2 in FIG. 1) of the wraparound portion of P, a dimension substantially matching the amount of the component chip 1a sunk into the paste line CPa can be secured, and the width dimension of the wraparound portion (dimension E3 in FIG. 1). Paste line C
A dimension substantially matching the width dimension of Pa can be secured. Thereby, the shape of the wraparound portion of the conductor paste CP applied to the component chip 1a, that is, the shape of the wraparound portion 1b1 of the electrode 1b is stabilized, and the mounting failure due to the shape defect of the wraparound portion 1b1 of the electrode 1b is reduced. The components can be mounted favorably while avoiding the problem, and the same effect can be obtained even when the electrode size is miniaturized.

The component chip 1a is connected to a paste line C
When pressing the paste line CP between the respective surfaces in the width direction of the component chip 1a and the surface of the application plate 11,
Since the gap CL smaller than the height of the component chip 1a is formed, the conductive paste CP sandwiched between the entire surface of the component chip 1a in the width direction and the surface of the application plate 11 is prevented from spreading more than necessary. Width of coating paste CP (Fig. 1
A predetermined dimension can be secured as the reference symbol E1).

In the above description, an example in which a substantially U-shaped recess 12a is formed at the tip of the blade 12 has been described.
A paste line CP having a vertical cross-sectional shape that substantially matches the shape of the concave portion using a rectangular concave portion 12a1 as shown in FIG.
a1 or a paste line CPa2 having a vertical cross section substantially matching the shape of the concave portion using a trapezoidal concave portion 12a2 as shown in FIG. 9B, or as shown in FIG. 9C. By using such a triangular concave portion 12a3, a paste line CPa3 having a vertical cross-sectional shape substantially matching the concave shape may be obtained. FIG. 9 (A)-
If the paste lines CPa1 to CPa3 shown in FIG. 3C are used, the conductor paste CP applied to the component chip 1a
Around the paste lines CPa1 to CPa3
It is also possible to make the shape similar to the vertical cross-sectional shape of.

In the above description, the case where a total of four pairs of component electrodes 1b are formed on the component chip 1a in the multilayer capacitor array 1 shown in FIG. When forming electrodes on a capacitor array, the same method and apparatus as described above can be used. Of course, one or more electrodes having the same shape are formed on various electronic components such as chip components, array components, and composite components other than the multilayer capacitor array. Even in such a case, the same method and apparatus as described above can be used, and the same operation and effect can be obtained.

[Second Embodiment] FIG. 10 shows a second embodiment of the present invention.
Numeral 14 denotes a container containing the conductive paste CP, and numeral 15 denotes a blade for scraping the paste. In the following description, reference numerals and names shown in FIG. 1 and FIG. 1 are cited.

The application roller 13 is made of a rigid material such as stainless steel and has a smooth outer peripheral surface used as a paste application surface. Like the blade 12 shown in FIG. 4, four substantially U-shaped concave portions 15 a corresponding to the number and positions of the electrodes 1 b are formed at the tip of the blade 15 at equal intervals in the width direction of the blade 15.

When applying the conductive paste CP to the component chip 1 a, first, the tip of the blade 15 is rotated in the direction of the arrow of the application roller 13 while the tip of the blade 15 is in contact with the outer peripheral surface of the application roller 13, and is applied to the outer peripheral surface of the application roller 13. The conductive paste CP is supplied.

As a result, the conductive paste CP is scraped off from the outer peripheral surface of the application roller 13 by the blade 15, and four linear paste lines having predetermined widths and heights are formed by the conductive paste CP that has passed through the recesses 15a. CPa is formed parallel to the outer peripheral surface of the application roller 13. In order to prevent the shape of the paste line CPa after being formed on the outer peripheral surface of the application roller 13 from being collapsed and to perform the paste application described below satisfactorily, the conductive paste CP is substantially shaped like the concave portion 15a of the blade 15. It is preferable to use a material having a viscosity such that the coincident vertical sectional shape appears on the paste line CPa.

After the paste line is formed, the component chip 1a
Carrier tape (not shown) that holds the camera in a predetermined position
Is moved in the tangential direction of the application roller 13 so that a gap smaller than the height of the paste line CPa is formed between one surface in the width direction of the component chip 1a and the outer peripheral surface of the application roller 13 so that the width of the component chip 1a is reduced. One surface in the direction is pressed against the four paste lines CPa on the outer peripheral surface of the application roller 13.

As a result, one surface in the width direction of the component chip 1a enters into the four paste lines CPa, and the conductor paste CP of each paste line CPa is applied to one surface in the width direction of the component chip 1a, and at the same time, is adjacent to the same surface. Is applied to the edges of both sides in the height direction. Component chip 1
When pressing a on the paste line CPa, a gap smaller than the height of the paste line CPa is formed between one surface in the width direction of the component chip 1a and the outer peripheral surface of the application roller 13, so that the width of the component chip 1a is reduced. The conductor paste CP sandwiched between one surface in the direction and the outer peripheral surface of the application roller 13 is prevented from spreading more than necessary. The wraparound portion of the application paste CP is a paste line CPa.
1 has a shape similar to that of the longitudinal section, and the length dimension of the wraparound portion of the coating paste CP (dimension E in FIG. 1).
2) substantially corresponds to the amount of the component chip 1a sunk into the paste line CPa, and the width of the wraparound portion (FIG. 1)
Dimension E3) substantially matches the width dimension of the paste line CPa.

After the pressing, the component chip 1a is separated from the four paste lines CPa by moving the carrier tape. By the way, the carrier tape is a band-shaped elastic layer made of an elastic material such as silicon rubber and having a large number of holding holes formed at regular intervals in the length direction of the tape, and a bendable layer arranged at the center in the thickness direction of the elastic layer. The component chip 1a is elastically held in the holding hole of the elastic layer in a predetermined posture and partially protruding.

Conductive paste CP for component chip 1a
Is applied to the other surface in the width direction of the component chip 1a after the application paste CP is dried. After the application paste CP is dried, the component chip 1a is put into a firing furnace and dried. The subsequent application paste CP is fired.
The firing of the component chip 1a may be performed simultaneously with the firing of the conductive paste CP, or may be performed before the conductive paste CP is applied. Thus, the multilayer capacitor array 1 shown in FIG. 1 is manufactured.

The functions and effects obtained by the above-described paste application method and apparatus are the same as those obtained by the paste application method and apparatus described in the first embodiment.

In the above description, an example in which a substantially U-shaped concave portion 15a is formed at the tip of the blade 15 has been described.
The recesses having the shapes shown in (A) to (C) may be appropriately adopted to obtain a paste line having a longitudinal sectional shape substantially corresponding to each recess shape.

When the paste is applied using the application roller 13 as described above, if the outer diameter of the application roller 13 is small, the paste line CPa and the component chip 1a
There is a possibility that the paste application may not be sufficiently performed due to a short contact time with the component chip 1a, and the penetration angle of the component chip 1a with respect to the outer peripheral surface of the application roller 13 is increased, so that extra force acts on the component chip 1a to tilt the component chip 1a. May cause poor posture. In such a case, as shown in FIG. 11, the outer diameter of the application roller 13 may be increased as much as possible. In this case, the contact time between the paste line CPa and the component chip 1a is increased, and the paste application can be performed satisfactorily. At the same time, the angle of entry of the component chip 1a with respect to the surface of the elastic portion 13a is reduced, so that unnecessary force is prevented from acting on the component chip 1a, and the posture of the component chip 1a can be prevented from being disturbed.

Further, in the above description, the case where a total of four pairs of component electrodes 1b are formed on the component chip 1a in the multilayer capacitor array 1 shown in FIG. When forming electrodes on a capacitor array, the same method and apparatus as described above can be used. Of course, one or more electrodes having the same shape are formed on various electronic components such as chip components, array components, and composite components other than the multilayer capacitor array. Even in such a case, the same method and apparatus as described above can be used, and the same operation and effect can be obtained.

[Third Embodiment] FIG. 12 shows a third embodiment of the present invention. In the drawing, reference numeral 21 denotes an endless coating belt, 22 denotes a pair of pulleys, and 23 denotes a conductive paste CP.
, A blade 24 for scraping paste, 2
5 is a flat support for supporting the container 23 and the blade 24 via the coating belt 21, 26 is a container for collecting the residual paste, and 27 is a container 2 for scraping the residual paste.
6 is a collection blade for leading to 6. In the following description, reference numerals and names shown in FIG. 1 and FIG. 1 are cited.

The application belt 21 is made of a rigid material such as stainless steel having a bendable thickness, and has a smooth surface used as a paste application surface. At the tip of the blade 24, as in the blade 12 shown in FIG.
Four substantially U-shaped concave portions (not shown) corresponding to the number and position of b are formed at equal intervals in the width direction of the blade 12.

When applying the conductive paste CP to the component chip 1a, first, the coating belt 21 is rotated in the direction of the arrow while the tip of the blade 24 is in contact with the surface of the coating belt 21, and the conductive paste CP in the container 23 is removed. It is supplied to the surface of the application belt 21.

As a result, the conductive paste CP is scraped off from the surface of the coating belt 21 by the blade 24, and the conductive paste CP that has passed through each recess has four linear paste lines CP having a predetermined width and height.
a is formed parallel to the surface of the application belt 21. Paste line CPa formed on surface of application belt 21
In order to prevent the shape from being collapsed and to favorably apply the paste described later, the conductive paste CP has a viscosity such that a vertical cross-sectional shape substantially matching the shape of the concave portion of the blade 24 appears in the paste line CPa. It is preferable to use one.

After forming the paste line, the component chip 1a
Is lowered so that a gap smaller than the height of the paste line CPa is formed between one surface of the component chip 1a in the width direction and the surface of the application belt 21 by lowering the carrier plate (not shown). Then, one surface in the width direction of the component chip 1a is pressed against the four paste lines CPa on the surface of the application belt 21.

As a result, one surface of the component chip 1a in the width direction sinks into the four paste lines CPa, and the conductor paste CP of each paste line CPa is applied to one surface of the component chip 1a in the width direction, and at the same time, is adjacent to the same surface. Is applied to the edges of both sides in the height direction. Component chip 1
When pressing a on the paste line CPa, a gap smaller than the height of the paste line CPa is formed between one surface in the width direction of the component chip 1a and the surface of the application belt 21. The conductor paste CP sandwiched between one surface and the surface of the application belt 21 is prevented from spreading more than necessary. The wraparound portion of the application paste CP has a shape similar to the longitudinal cross-sectional shape of the paste line CPa, and the application paste C
The length dimension (dimension E2 in FIG. 1) of the wraparound portion of P substantially coincides with the amount of the component chip 1a sunk into the paste line CPa, and the width dimension of the wraparound portion (dimension E in FIG. 1).
3) substantially coincides with the width dimension of the paste line CPa.

After the pressing, the carrier plate is raised to separate the component chip 1a from the four paste lines CPa. The residue of the paste line CPa after being used for paste application is scraped off from the surface of the application belt 21 by the collection blade 27 and collected in the container 26. Incidentally, the carrier plate is the same as that described in the first embodiment.

Conductor paste CP for component chip 1a
Is applied to the other surface in the width direction of the component chip 1a after the application paste CP is dried. After the application paste CP is dried, the component chip 1a is put into a firing furnace and dried. The subsequent application paste CP is fired.
The firing of the component chip 1a may be performed simultaneously with the firing of the conductive paste CP, or may be performed before the conductive paste CP is applied. Thus, the multilayer capacitor array 1 shown in FIG. 1 is manufactured.

The functions and effects obtained by the above-described paste application method and apparatus are the same as those obtained by the paste application method and apparatus described in the first embodiment. Further, the above-described paste application method and apparatus have an advantage that the intended paste application can be performed continuously and efficiently using the endless application belt 21 that rotates intermittently in a predetermined direction.

In the above description, an example in which a substantially U-shaped concave portion is formed at the tip of the blade 24 is shown.
It is also possible to appropriately adopt the concave portions having the shapes shown in (C) to (C) so as to obtain a paste line having a longitudinal sectional shape substantially corresponding to each concave portion shape.

In the above description, the case where a total of four pairs of component electrodes 1b are formed on the component chip 1a in the multilayer capacitor array 1 shown in FIG. When forming electrodes on a capacitor array, the same method and apparatus as described above can be used. Of course, one or more electrodes having the same shape are formed on various electronic components such as chip components, array components, and composite components other than the multilayer capacitor array. Even in such a case, the same method and apparatus as described above can be used, and the same operation and effect can be obtained.

[0049]

As described in detail above, according to the present invention,
By stabilizing the shape of the wraparound portion of the conductor paste applied to the component chip, that is, the shape of the wraparound portion of the electrode,
The problem of defective mounting caused by the defective shape of the wraparound portion of the electrode can be avoided, and the component can be mounted favorably, and the same effect can be obtained even when the electrode size is miniaturized.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a multilayer capacitor array.

FIG. 2 is a diagram showing a conventional method and a conventional apparatus for applying a conductive paste to a component chip using an application plate.

FIG. 3 is a diagram showing a conventional method and a conventional apparatus for applying a conductive paste to a component chip using an application roller.

FIG. 4 is a view showing a paste application unit according to the first embodiment of the present invention.

FIG. 5 is a view taken along line AA of FIG. 4;

6 is a view showing a paste line formed on the surface of an application plate by the paste application means shown in FIG.

FIG. 7 is a diagram showing a state in which a component chip is pressed against a paste line formed on the surface of a coating plate.

FIG. 8 is a view taken along line BB of FIG. 7;

9 is a view showing a modification of the concave shape of the blade shown in FIG. 4;

FIG. 10 is a diagram showing a paste application unit according to a second embodiment of the present invention.

11 is a diagram showing a modification of the application roller shown in FIG.

FIG. 12 is a view showing a paste application unit according to a third embodiment of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Capacitor array, 1a ... Part chip, 1b ... Electrode, 1b1 ... Wound part, CP ... Conductor paste, 11 ...
Coating plate, 12 ... blade, 12a, 12a1, 1
2a2, 12a3: recess, CPa, CPa1, CPa
2, CPa3: paste line, 13: coating roller,
Reference numeral 15: blade, 15a: concave portion, 21: coating belt, 2
4 ... Blade.

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Kazuo Sugai, 6-16-20 Ueno, Taito-ku, Tokyo Taiyo Denki Co., Ltd. (72) Shinichi Sugita 6-16-20, Ueno, Taito-ku, Tokyo Taiyo Denki Co., Ltd. (72) Inventor Kazuo Naganuma 6-16-20 Ueno, Taito-ku, Tokyo Taiyo Denki Co., Ltd. (72) Inventor Haruhiko Matsushita 6-16-20 Ueno, Taito-ku, Tokyo Taiyo Induction (72) Inventor Hiroyuki Mogi 6-16-20 Ueno, Taito-ku, Tokyo Taiyo Denki Co., Ltd. F-term (reference) 5E032 BB01 CA02 CB01 CC06 CC11 CC14 5E082 AA01 AB03 BC38 BC40 CC03 GG10 GG28 LL01 LL35 MM22 MM24

Claims (3)

[Claims] 1. A method for forming an electrode of an electronic component, comprising a step of applying a conductor paste for an electrode to a component chip, the step comprising: supplying a conductor paste to a paste application surface; Scraping the conductive paste from the paste-applied surface with a blade having a concave portion at the end, forming a paste line having a predetermined width and height on the paste-applied surface with the conductive paste passing through the concave portion; Pressing the component chip against the line. A method for forming an electrode of an electronic component, comprising: 2. The step of pressing a component chip onto a paste line on a paste application surface includes pressing the component chip onto the paste line such that there is a gap smaller than the height of the paste line between the component chip and the paste application surface. The method for forming an electrode of an electronic component according to claim 1, wherein the method is performed by: 3. An electrode forming apparatus for an electronic component, comprising: means for applying a conductor paste for an electrode to a component chip, wherein said means has a concave portion at a contact end between the paste applied surface and the paste applied surface. And a blade capable of forming a paste line having a predetermined width and height on the paste application surface with the conductor paste having passed through the concave portion when the conductor paste is scraped off from the application surface. apparatus.