JP2002030490A - Chemical treatment apparatus and chemical treatment method using the same - Google Patents

Abstract

(57) [Problem] To reduce the length of piping as a whole in a plating apparatus in which a plurality of plating sections are arranged in series. A plating solution tank (61) is provided in each external processing tank (42) of a plurality of plating processing sections (41). The plating solution 62 in each plating solution tank 61 is spouted into each internal processing tank 43 via each supply pipe 64 by driving each pump 66, and is applied to the surface of the tape 53 passing through each internal processing tank 43. Can be Most of the plating solution 62 jetted into each internal processing tank 43 is collected in each plating solution tank 61 via each internal drain pipe 77, 78. A part of the plating solution 62 jetted into each of the internal processing tanks 43 flows out of each of the slits 47 and 48 into each of the external processing tanks 42, and flows into each of the plating solution tanks 61 through each of the external drain pipes 73 and 74. Will be collected.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chemical processing apparatus for performing plating, etching, and the like, and a chemical processing method using the same.

[0002]

2. Description of the Related Art A plating apparatus, which is one of chemical processing apparatuses, includes a long tape having a surface layer such as a lead wiring made of copper or aluminum on a surface in a semiconductor technology such as BGA, CSP and COF. In some cases, the surface layer of the tape is electroplated with gold, copper, nickel, or the like while transporting the tape vertically, that is, with the tape width direction vertical.

FIG. 11 is a schematic diagram showing an example of such a conventional plating apparatus. In this plating apparatus, a plurality of plating units 1 are arranged in series. The plating section 1 includes an external processing tank 2 as shown in FIGS. An internal processing tank 3 is provided at a central portion in the external processing tank 2, and a lid 4 is provided at an upper portion of the external processing tank 2. In this case, the bottom of the external processing tank 2 also serves as the bottom of the internal processing tank 3. Slits 5 and 6 formed of vertically long rectangular holes are provided at predetermined positions on the left side wall and right side wall in FIGS. 12 and 13 of the external processing tank 2. Slits 7 and 8 composed of vertically long grooves are provided at predetermined positions on the left side wall and the right side wall in FIGS. 12 and 13 of the internal processing tank 3. Internal processing tank 3
13 is slightly lower than the left side wall and the right side wall in FIG. 13 (see FIG. 12).
An anode electrode 10 is provided at a predetermined location in the internal processing tank 3.

A transfer roller 11 and an electrode roller (cathode electrode) 12 are opposed to each other in a roller chamber (not shown) provided between the external processing tanks 2 and on the left side of the leftmost external processing tank 2 in FIG. It is provided. FIG.
1, a supply reel (not shown) is provided on the left side of the leftmost roller chamber. The supply reel is wound with a tape 13 made of a metal foil such as copper or aluminum and formed with a circuit pattern and a plating pattern for connecting the circuit patterns as a surface layer.

[0005] The tape 13 fed from the supply reel
After passing through a plurality of plating units 1 sequentially, it is wound on a take-up reel (not shown) provided on the right side of the rightmost plating unit 1 in FIG. In this case, in each plating section 1, the tape 13 is provided between the transport roller 11 and the electrode roller 12 in the roller chamber, the slit 5 of the external processing tank 2, the slits 7 and 8 of the internal processing tank 3, and the external processing tank 2. Through the slits 6 sequentially. Further, although not shown, in order to prevent poor contact between the electrode roller 12 and the surface layer of the tape 13 and prevent sparking, pure water in a pure water tank is pumped up and the electrode roller is showered. The pure water after spraying on the contact portion between the tape 12 and the tape 13 is collected in a pure water tank via a drain pipe.

A supply pipe 21 is provided at the center of the bottom of the internal processing tank 3.
Are connected at one end. In the middle of each supply pipe 21, a flow sensor 22 and a pump 23 are interposed. The pump 23 is controlled by the control unit 2 based on the flow signal of the flow sensor 22.
4 is driven. The other end of each supply pipe 21 is connected to a common plating solution tank 26 via a common supply pipe 25. Common plating solution tank 26
The inside contains a plating solution 27. Drain pipes 28 and 29 are provided at the bottom of the external processing tank 2 between the slits 5 and 6 of the external processing tank 2 and the slits 7 and 8 of the internal processing tank 3.
Are connected at one end. The other end of each drain tube 28, 29 is connected to a common plating solution tank 26 via a common drain tube 30.

Next, the operation of the plating apparatus will be described. The tape 13 fed from the supply reel is
When the plurality of transport rollers 11 are rotated in a predetermined direction, the transport rollers 11 sequentially pass through the plurality of internal processing tanks 3 and are taken up on a take-up reel. At this time, when each pump 23 is driven, the plating solution 27 in the common plating solution tank 26 is jetted into each internal processing tank 3 through the common supply pipe 25 and each supply pipe 21, and the inside of each internal processing tank 3 is discharged. It is applied to the surface layer of the passing tape 13. Then, the anode electrode 10 and the electrode roller 1
When a plating current flows between the tapes 2 and 3, the surface layer of the tape 13 passing through each internal processing tank 3 is plated. The plating solution 27 jetted into each internal processing tank 3 overflows from the overflow section 9 of each internal processing tank 3 and flows out into each external processing tank 2, and flows through each drain pipe 28, 29 and the common drain pipe 30. It is collected in the common plating solution tank 26 through the same.

The width of the slits 5 and 6 of the external processing tank 2 and the width of the slits 7 and 8 of the internal processing tank 3
Is considerably larger than the thickness, for example, about 10 mm. The reason why the width of the slits 5 to 8 is increased in this way is that even if the tape 13 dances in the plating solution 27 jetted into the internal processing tank 3, the surface layer of the tape 13 This is to prevent contact with the inner wall surface.
As a result, the plating solution 27 jetted into each internal processing tank 3
Not only overflows from the overflow section 9 of each internal processing tank 3 and flows out into the external processing tank 2, but also flows out into the external processing tank 2 from the slits 7 and 8 of each internal processing tank 3.

On the other hand, the tape 13 generally has a width of 35 mm, 48 mm and 70 mm. In the case of such a tape 13, since the width is relatively small, the height (depth) of the internal processing tank 3 is relatively low (shallow).
The length of the slits 7 and 8 in the vertical direction may be relatively short. For this reason, the amount of the plating solution 27 flowing out of the slits 7 and 8 of the internal processing tank 3 into the external processing tank 2 is relatively small and the power of the plating solution 27 is relatively weak. It hardly escapes into the room.

Recently, attempts have been made to use a relatively wide tape, for example, 158 mm wide. However, in the case of such a tape, since the width is relatively large, the height (depth) of the internal processing tank 3 is relatively high (deep), and the vertical length of the slits 7 and 8 is also relatively large. become longer. As a result, the internal processing tank 3
The amount of the plating solution 27 flowing out of the slits 7 and 8 into the external processing tank 2 is relatively large, and the force of the plating solution 27 is relatively strong. The plating liquid 27 flows out of the slits 5 and 6 of the external processing tank 2 into the roller chamber. . When the plating solution 27 flows into the roller chamber, the plating solution 27 is wasted and not only increases the cost, but also the plating solution 27 is mixed into the pure water in the pure water tank.
The surface of the electrode roller 12 is plated by the spray of the mixed liquid, and a problem occurs in electrical contact.

When the width of the tape 13 is relatively large, the height (depth) of the internal processing tank 3 is relatively high (deep), and the vertical length of the slits 7 and 8 is relatively long, The amount of the plating solution 27 flowing out from the slits 7 and 8 of the internal processing tank 3 into the external processing tank 2 is relatively large, so that the outflow momentum becomes relatively strong. The difference in elevation when overflowing into the processing tank 2 becomes relatively large, and in any case, bubbles containing oxygen and the like are easily trapped. On the other hand, for example, when the plating of the surface layer is gold plating, the plating solution includes a cyan plating solution and a non-cyan plating solution. In the case of the non-cyan plating solution, bubbles containing oxygen and the like are involved. Then, the life is shortened.

[0012]

In the above-mentioned conventional plating apparatus, the plating solution 27 in the common plating solution tank 26 is jetted into the internal processing tanks 3 via the common supply pipes 25 and the respective supply pipes 21. Then, the plating solution 27 flowing out of the internal processing tank 3 into the external processing tank 2
Since the liquid is collected in the common plating solution tank 26 via the common drain pipes 8 and 29 and the common drain pipe 30, the length of the entire pipe becomes considerably long. As a result, in the case of a non-cyan plating solution, the amount of gold spontaneously deposited in these pipes is relatively large, and as a result, wasteful use of extremely expensive gold is increased, resulting in high cost. Would.
Further, as described above, the life of the non-cyan plating solution is shortened when the non-cyan plating solution contains bubbles containing oxygen and the like. However, conventionally, the plating solution 27 in each of the internal processing tanks 3 is replaced with a common plating solution tank. Since the outlet of the common drain tube 30 leading to 26 was located above the plating solution level, the amount of air bubbles involved was increased, causing a reduction in life. An object of the present invention is to reduce the length of a pipe as a whole and to reduce the amount of air bubbles involved.

[0013]

According to a first aspect of the present invention, there is provided a chemical processing apparatus comprising: a vertically elongated slit provided in an external processing tank for carrying in and out a tape; and a tape provided in an internal processing tank. In a chemical treatment apparatus in which a plurality of surface treatment units for carrying out chemical treatment with a chemical liquid ejected into the internal treatment tank are arranged in series, the surface layer of the tape passing through a vertically long slit for carrying in and carrying out the tape, A chemical liquid tank containing a chemical liquid is provided immediately below each of the external processing tanks of each of the surface treatment units, and a chemical liquid ejecting unit that ejects the chemical liquid in each of the chemical liquid tanks into the corresponding internal processing tank is provided. Provided in each of the external processing tanks, an external drain pipe communicating with the external processing tank and the chemical liquid tank and extending into a liquid of the chemical liquid contained in the chemical liquid tank. is there. The chemical treatment method according to the invention according to claim 13, wherein a plurality of surface treatment units having an external treatment tank and an internal treatment tank are arranged in series, and each of the surface treatment units is used for carrying in a tape provided in the external treatment tank. A tape is inserted through a vertically elongated slit for carrying out the tape and a vertically arranged slit for carrying in and out the tape provided in the internal processing tank, and the surface layer of the tape is ejected into the internal processing tank. A chemical treatment method for performing chemical treatment with a chemical liquid, wherein a chemical liquid tank containing a chemical liquid is provided immediately below each of the external processing tanks in each of the surface treatment units, and the chemical liquid in each of the chemical liquid tanks is handled. A chemical liquid ejecting means for ejecting the chemical liquid into the internal processing tank, and connecting the external processing tank with the chemical liquid tank to each of the external processing tanks, and supplying the chemical liquid contained in the chemical liquid tank to the external processing tank. During ~ An extended external drain pipe is provided, and the chemical liquid that has been sprayed into the internal processing tank and processed the surface layer of the tape is contained in the chemical liquid in each of the chemical liquid tanks through the external drain pipe. It is like that. According to the present invention, since the chemical solution tank is provided immediately below each external processing tank of each surface processing unit, and each external processing tank is provided with the external drain pipe communicating the external processing tank and the chemical liquid tank, The length of the piping as a whole can be shortened. In addition, the external drain pipe is extended into the chemical liquid stored in the chemical liquid tank, and is spouted into the internal processing tank to treat the tape surface layer with the chemical liquid via the external drain pipe. Since the liquid is contained in the chemical liquid in the tank, the amount of air bubbles can be reduced.

[0014]

FIG. 1 is a schematic block diagram of a plating apparatus according to a first embodiment of the present invention. In this plating apparatus, a plurality of plating sections 41
Are arranged in series. The plating section 41 includes an external processing tank 42 as shown in FIGS.
An internal processing tank 43 is provided at a central portion in the external processing tank 42, and a lid 44 is provided at an upper portion of the external processing tank 42. In this case, the bottom of the external processing tank 42, and the upper and lower walls in FIG. 3 also serve as the bottom, upper and lower walls of the internal processing tank 43. 2 and 3 of the external processing tank 42 are provided with slits 45 and 46 formed of vertically long rectangular holes at predetermined positions on the left side wall and the right side wall, respectively. Slits 47 and 48 formed of vertically long grooves are provided at predetermined positions on the left side wall and the right side wall in FIGS. 2 and 3 of the internal processing tank 43, respectively. An anode electrode 49 is provided at a predetermined position in the internal processing tank 43.

A transport roller 51 and an electrode roller (cathode electrode) 52 face each other in a roller chamber (not shown) provided between the external processing tanks 42 and on the left side of the leftmost external processing tank 42 in FIG. It is provided. A supply reel (not shown) is provided on the left side of the leftmost roller chamber in FIG. On the supply reel,
A tape 53 made of a metal foil such as copper or aluminum and formed with a circuit pattern and a plating pattern for connecting the circuit pattern as a surface layer is wound and shot.

The tape 53 fed from the supply reel
After passing through a plurality of plating units 41 in sequence, it is wound on a take-up reel (not shown) provided on the right side of the rightmost plating unit 41 in FIG. In this case, in each plating section 41, the tape 53 is provided between the transport roller 51 and the electrode roller 52 in the roller chamber, the slit 45 of the external processing tank 42, and the internal processing tank 43.
Through the slits 47 and 48 and the slit 46 in the external processing tank 42. In addition, although not shown, in order to prevent poor contact between the electrode roller 52 and the surface layer of the tape 53 to prevent sparking, pure water in a pure water tank is pumped up and the electrode roller is showered. The sprayed water is sprayed to the contact portion between the tape 52 and the tape 53, and the sprayed pure water in the roller chamber is collected in a pure water tank via a drain pipe.

A plating solution tank 61 is provided below each external processing tank 42. A plating solution 62 is contained in the plating solution tank 61. A supply hole 63 is provided at the center of the bottom of the internal processing tank 43, and one end of a supply pipe 64 is connected to the supply hole 63. Each supply pipe 64 extends through the bottom (or side wall) of the corresponding plating solution tank 61 in a liquid-tight manner and extends to the outside of the plating solution tank 61. A flow sensor 65 and a pump 66 are provided in the middle of the extension. Intervened. The pump 66 is driven under the control of the control unit 67 based on the flow signal of the flow sensor 65. The other end of each supply pipe 64 is connected to the corresponding plating solution tank 61.

External drain holes 71 and 72 are provided at the bottom of the external processing tank 42 between the slits 45 and 46 of the external processing tank 42 and the slits 47 and 48 of the internal processing tank 43. , 72 are connected to the upper ends of the external drain tubes 73, 74. Internal drain holes 75 and 76 are provided at the bottom of the internal processing tank 42 inside the slits 47 and 48 of the internal processing tank 43,
The upper ends of the internal drain tubes 77 and 78 are connected to these internal drain holes 75 and 76. The lower ends of the external drain tubes 73 and 74 and the internal drain tubes 77 and 78 are immersed in the plating solution 62 in the corresponding plating solution tank 61.

Here, the width of the tape 53 is, for example, 158 m.
m, which is relatively large. For this reason, the internal processing tank 4
The height (depth) of 3 is relatively high (deep), and the slit 4
The vertical lengths of 7, 48 are also relatively long. Also in this case, the slits 45 and 46 of the external processing tank 42 are also provided.
The width of the slits 47 and 48 of the internal processing tank 43 is considerably larger than the thickness of the tape 53, for example, about 10 mm.

Next, the operation of the plating apparatus will be described. The tape 53 fed from the supply reel is
When the transport rollers 51 are rotated in a predetermined direction, the transport rollers 51 sequentially pass through the internal processing tanks 43 and are taken up on a take-up reel. At this time, when each pump 66 is driven, the plating solution 62 in each plating solution tank 61 is spouted into each internal processing tank 43 via each supply pipe 64, and each internal processing tank 43
It is applied to the surface of the tape 53 passing through the inside. And
When a plating current flows between the anode electrode 49 and the electrode roller 52, the tape 53 passing through each internal processing tank 43
Is plated on the surface.

Here, the reason why the plating section 41 is divided into a plurality of parts is that, in order to transport the tape 53 at a predetermined speed and perform plating, a plating time corresponding to a plating thickness to be formed is required. Is a length corresponding to the plating time. Then, tape 53
Since voltage is applied to the pattern formed on the electrode 53 by the electrode roller (cathode electrode) 52, when the plating treatment length of the tape 53 becomes longer, the central portion between the vicinity of the electrode roller 52 and the electrode roller 52 due to the resistance value of the pattern. And the difference in voltage between them and the plating thickness increases,
The plating section 41 is divided into a plurality of sections, and the distance between the electrode rollers 52 is shortened.

Most of the plating solution 62 jetted into each internal processing tank 43 is supplied to the internal drain pipe 7 of each internal processing tank 43.
It is collected in each plating solution tank 61 via 7 and 78. In this case, even if the height of the internal processing tank 43 is relatively high, most of the plating solution 62 jetted into the internal processing tank 43 does not overflow into the plating solution tank 61 without overflowing to the outside of the internal processing tank 3. Since it is collected, bubbles containing oxygen and the like are hardly involved. Further, since the lower ends of the internal drain tubes 77 and 78 are immersed in the plating solution 62 in the plating solution tank 61, air bubbles are hardly involved here.

On the other hand, a part of the plating solution 62 jetted into each internal processing tank 43 is
7 and 48 flow out into each external processing tank 42 and are collected in each plating solution tank 61 via the external drain pipes 73 and 74 of each external processing tank 42. By the way, the internal processing tank 43
Since the vertical length of the slits 47 and 48 is relatively long, when the internal drain tubes 77 and 78 are not provided, the amount of the plating solution 62 flowing out of the slits 47 and 48 is relatively large. As it flows out vigorously, it is easy to entrap air bubbles, and the slits 45, 4
6 easily flows into the roller chamber.

On the other hand, the slit 4 of the internal processing tank 43
If the internal drain tubes 77 and 78 are provided immediately inside the slits 47 and 48, the liquid pressure immediately inside the slits 47 and 48 will be low, and the amount of the plating solution 62 flowing out of the slits 47 and 48 will be small. The momentum also weakens. As a result, bubbles trapped in the plating solution 62 flowing out of the slits 47 and 48 of the internal processing tank 43 are reduced. Most of the plating solution 62 jetted into the internal processing tank 43 is recovered via the internal drain pipes 77 and 78, and
From the slits 47 and 48 of the internal processing tank 43 to the external processing tank 4
Since the amount of the plating solution 62 flowing out into the inside 2 can be reduced, the plating solution 62 is prevented from flowing out of the slits 45 of the external processing tank 42 into the roller chamber. further,
The lower ends of the external drain tubes 73 and 74 are in the plating solution tank 6.
Since it is immersed in the plating solution 62 in 1, air bubbles are hardly involved here.

As described above, in this plating apparatus,
Since the plating solution 62 can be prevented from flowing out of the slits 45 and 46 of the external processing tank 42 into the roller chamber, the plating solution 62 can be prevented from being wasted, and the cost can be reduced. Further, since the plating solution 62 can be prevented from flowing into the roller chamber, the plating solution 62 does not mix with the pure water in the pure water tank connected to the roller chamber via the drain pipe, and the electrode The surface of the roller 52 is not plated, and the tape transport function can be prevented from being impaired. Further, in this plating apparatus, it is possible to make it difficult for air bubbles to be caught in the recovered plating solution 62. Therefore, even if the plating solution 62 is a non-cyan plating solution, the life of the entire plating solution is reduced. Can be longer.

Further, in this plating apparatus, since the plating solution tank 61 is provided below each external processing tank 42, the lengths of the supply pipe 64, the external drain pipes 73 and 74, and the internal drain pipes 77 and 78 are set. Can be made as short as possible. As a result, when the plating solution 62 is a non-cyan plating solution, the amount of gold spontaneously deposited in these pipes can be reduced as much as possible. As much as possible, the cost can be reduced.

Next, FIG. 4 is a cross-sectional view of a main part of a plating section according to a second embodiment of the present invention, FIG. 5 is a plan view of the plating section with its lid omitted, and FIG. FIG. 3 is a cross-sectional view taken along line XX. In these figures, the same parts as those in FIGS. 2 and 3 are denoted by the same reference numerals,
The description is omitted as appropriate.

The plating section 41 does not have the internal drain tubes 77 and 78, but instead has an internal processing tank 43.
The overflow guide 80 is formed by using the left side wall and the right side wall in FIGS.
The overflow guide 80 includes cutouts 81 formed at both ends of the upper surface of the left side wall or the right side wall of the internal processing tank 43,
A guide wall 82 provided on the outer side of each side wall and having a substantially flat L-shape whose height is the same as the height of the internal processing tank 43;
The overflowing plating solution 62 flows from the notch 81 and is guided between the left side wall and the guide wall 82 or between the right side wall and the guide wall 82. A rectangular opening 83 is provided at a predetermined location below the guide wall 82 of the overflow guide 80, and a shutter 84 is provided outside the opening 83 so as to be vertically movable.

That is, in the plating section 41, a part of the plating solution 62 jetted into the internal processing tank 43 is guided from the notch 81 into the overflow guide section 80, and from the opening section 83 of the overflow guide section 80. External processing tank 42
And is collected in the plating solution tank 61 via the external drain pipes 73 and 74. In this case, the shutter 84
By adjusting the opening amount of the opening portion 83, the liquid level of the plating solution 62 in the overflow guide portion 80 is prevented from lowering below the bottom surface of the notch portion 81. That is, it is possible to adjust the overflow guide 80 (a space surrounded between the side wall and the guide wall 82) so as to maintain a state where the overflow guide 80 is always filled with the plating solution 62.
The plating solution 62 flowing out to the overflow guide 80
Air bubbles can be prevented from being caught in the inside.

Further, since most of the plating solution 62 jetted into the internal processing tank 43 flows out from the overflow guide 80, the pressure of the plating solution in the internal processing tank 43 is reduced. The amount of the plating solution 62 flowing out can be reduced by that much, and the momentum of the flowing out can be reduced. As a result, the slit 47,
Air bubbles can be prevented from being easily entrained in the plating solution 62 flowing out of the plating solution 62. Also, the plating solution 62 is prevented from flowing out of the slits 45 and 46 of the external processing tank 42 into the roller chamber.

FIG. 7 is a plan view of a main part of a plating section according to a third embodiment of the present invention, and FIG.
FIG. 3 is a cross-sectional view corresponding to a portion along the X-ray. In these drawings, the same parts as those in FIGS. 4 to 6 are denoted by the same reference numerals, and the description thereof will be appropriately omitted.

In the plating section 41, the slit 47
In addition, the amount of the plating solution 62 flowing out of the slit 48 is made smaller than that in the second embodiment to further reduce the bubbles trapped in the plating solution 62. For this purpose, the plating section 41 in the third embodiment is provided with an intermediate tank 90 near slits 47 and 48 of the internal processing tank 43.
Having. Each of the intermediate tanks 90 has the same structure.
Only one provided on the slit 47 side is shown (the same applies to the slit 48 in FIGS. 4 to 6, but not shown). The intermediate layer 90 has a planar substantially U-shaped partition wall 91 whose height is the same as the height of the internal processing tank 43. In this case, the bottom of the external processing tank 42 also serves as the bottom of the intermediate tank 90. At a predetermined position of the partition wall 91, a slit 92 similar to the slit 47 is provided. An intermediate drain hole 93 is provided at the center of the bottom of the intermediate tank 90, and the upper end of the intermediate drain tube 94 is connected to the intermediate drain hole 93. The lower end of the intermediate drain tube 94 is immersed in a plating solution (not shown) in the plating solution tank 61.

In the intermediate tank 90, a pair of flow regulating rollers 95 are arranged on both sides of the tape transport path. A portion corresponding to the tape 53 of the pair of flow regulating rollers 95 is a small diameter portion 95a. An upper support plate 96 is provided at an upper portion of the intermediate tank 90, and a lower support plate 97 is provided at a predetermined lower portion in the intermediate tank 90. The upper shaft 95b and the lower shaft 95c of one of the flow regulating rollers 95 are rotatably supported by the upper support plate 96 and the lower support plate 97 at a position close to the main body so as to substantially contact the wall surface 43a of the intermediate layer 90. Have been. The upper shaft 95b and the lower shaft 95c of the other flow regulating roller 95 are provided on the upper support plate 96 and the lower support plate 97 at positions close to each other so that the main body portion substantially contacts the wall surface 43a of the intermediate layer 90. Circular hole 96
a and 97a so as to be rotatable and movable in the left-right direction in FIG. That is, one of the pair of flow regulating rollers 95 is rotatably provided at a position fixed relative to the tape 53, and the other is provided rotatably so as to be close to and away from the tape 53. ing. A gap for a flow path is provided between the lower surface of the main body of the pair of flow regulating rollers 95 and the lower support plate 97. In addition, through holes 97b (not shown in FIG. 7) for the flow path are provided at a plurality of predetermined positions of the lower support plate 97.

With the above configuration, the other flow rate regulating roller 9
The tape 53 can be inserted between the pair of flow regulating rollers 95 while holding the tape 5 at a position separated from the one flow regulating roller 95. Then, in this state, when the plating solution is jetted into the internal processing tank 43, a part of the plating solution flows into the intermediate tank 90 through the slit 92. Intermediate tank 9
The plating solution that has flowed into the inside of a pair of flow regulating rollers 9
5, the flow rate toward the slit 47 is regulated. Therefore, part of the plating solution that has flowed into the intermediate tank 90 is
Through hole 97b of lower support plate 97 and intermediate drain tube 9
4 and is collected in the plating solution tank 61. A part of the remaining plating solution is supplied to the small diameter portion 95 of each flow regulating roller 95.
a and the wall surface 91a of the intermediate layer 43, and the flow pressure of the plating solution causes the other of the pair of flow regulating rollers 95 to
It is moved to one flow regulating roller 95 side and is pressed against one flow regulating roller 95. Here, in this pressed state, the interval between the small diameter portions 95a of the pair of flow regulating rollers 95 is about 1 mm larger than the thickness of the tape 53. The remaining plating solution passes through the gap between the small-diameter portions 95 a of the pair of flow regulating rollers 95 and the gap between each flow regulating roller 95 and the wall surface 43 a of the intermediate tank 90, and then passes through the slit 47 through the external processing tank. It flows out into 42 and is collected in the plating solution tank 61 via the external drain tube 73.

By the way, the other flow regulating roller 95 is
In the state of being pressed against one of the flow regulating rollers 95, the plating solution flows along the flow of the plating solution while rotating each of the flow regulating rollers 95 in the direction indicated by the arrow in FIG. Small diameter portion 95a of roller 95
Although the gap flows between the small diameter portions 95a of the pair of flow rate regulating rollers 95, the flow rate of the plating solution flowing therethrough decreases. Further, since each flow regulating roller 95 is located at a position almost in contact with the wall surface 43a, the flow rate of the plating solution flowing between each flow regulating roller 95 and the wall surface 43a is also reduced. Therefore, the slit 9
Most of the plating solution flowing from 2 into the intermediate layer 90 is recovered in the plating solution tank 61 via the intermediate drain tube 94 and the like, and the flow rate flowing out of the slit 47 becomes very small. As a result, the height of the level of the plating solution flowing out of the slit 47 into the external processing tank 42 decreases, and the force of the outflow also weakens. Is reduced. Further, since the flow rate flowing out of the slit 47 is very small, the plating liquid 62 is further prevented from flowing out of the slit 45 of the external processing tank 42 into the roller chamber.

In the third embodiment, the slit 4
Although the case where the intermediate tank 90 and the pair of flow rate regulating rollers 95 are provided inside the internal processing tank 43 in the portion 7 has been described, the present invention is not limited to this. For example, as in the fourth embodiment of the present invention shown in FIG. Alternatively, an intermediate tank 90 and a pair of flow regulating rollers 95 may be provided outside the internal processing tank 43 at the slit 47 portion. Further, such a flow rate regulating means is not limited to the flow rate regulating roller 95, and may be a flow rate regulating member 98 having a rounded flat rectangular shape as in a fifth embodiment of the present invention shown in FIG. However, in this case, the recess 98 is formed in a portion corresponding to the tape 53 on the opposing surfaces of the pair of flow regulating members 98.
a is provided. The flow regulating member 98 has two shafts 98b. One of the flow regulating members 98 is fixed, and the other flow regulating member 98 can be moved toward and away from the one flow regulating member 98. Furthermore, in the third to fifth embodiments, the pair of flow regulating rollers 95 or the flow regulating members 98
5a or the recess 98a.
The flow restricting roller 95 or the flow restricting member 98 disposed on the surface on which the pattern No. 3 is not formed has a small diameter portion 95.
a or the concave portion 98a may not be provided.

The present invention is not limited to plating,
The present invention can be applied to other chemical treatments such as a degreasing treatment, an oxide film removing treatment, and a plating pretreatment.

[0038]

As described above, according to the present invention, a chemical liquid tank is provided immediately below each external processing tank of each surface processing section, and the external processing tank and the chemical liquid tank are provided in each external processing tank. Since the communicating external drain pipe is provided, the overall length of the pipe can be reduced. In addition, the external drain pipe is extended into the chemical liquid stored in the chemical liquid tank, and is spouted into the internal processing tank to treat the tape surface layer with the chemical liquid via the external drain pipe. Since the liquid is contained in the chemical liquid in the tank, the amount of air bubbles can be reduced.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram of a plating apparatus according to a first embodiment of the present invention.

FIG. 2 is a sectional view of a main part of a plating section shown in FIG. 1;

FIG. 3 is a plan view of the plating section shown in FIG. 2 with a lid omitted.

FIG. 4 is a sectional view of a main part of a plating section according to a second embodiment of the present invention.

FIG. 5 is a plan view of the plating section shown in FIG. 4 with a lid omitted.

FIG. 6 is a sectional view taken along line XX of FIG. 5;

FIG. 7 is a plan view of a main part of a plating section according to a third embodiment of the present invention.

FIG. 8 is a sectional view corresponding to a portion substantially along the line XX of FIG. 7;

FIG. 9 is a plan view of a main part of a plating section according to a fourth embodiment of the present invention.

FIG. 10 is a plan view of a main part of a plating section according to a fifth embodiment of the present invention.

FIG. 11 is a schematic configuration diagram of an example of a conventional plating apparatus.

FIG. 12 is a cross-sectional view of a part of the plating unit shown in FIG. 11;

FIG. 13 is a plan view of the plating section shown in FIG. 12 with a lid omitted.

[Explanation of symbols]

 41 Plating section 42 External processing tank 43 Internal processing tank 45 to 48 Slit 53 Tape 61 Plating solution tank 62 Plating solution 64 Supply pipe 66 Pump 73, 74 External drain pipe 77, 78 Internal drain pipe 80 Overflow guide section 81 Notch section 82 Guide wall 83 Opening 84 Shutter 90 Intermediate tank 94 Intermediate drain pipe 95 Flow regulating roller

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01L 21/60 311 H01L 21/60 311W (72) Inventor Mitsuhiko Yamamoto 3-10-6 Imai, Ome-shi, Tokyo Inside Casio Micronics Co., Ltd. (72) Inventor Kozo Kanaya 962 Fujishin Kamimitsukamae, Kashiwa-shi, Chiba F-term in Seto Giken Kogyo Co., Ltd.

Claims (21)

[Claims] 1. A tape surface layer which passes through a vertically long slit for carrying in and out a tape provided in an external processing tank and a vertically extending slit for carrying in and out a tape provided in an internal processing tank. In a chemical treatment apparatus in which a plurality of surface treatment units for performing a chemical treatment with a chemical liquid ejected into the internal treatment tank are arranged in series, a chemical liquid is accommodated immediately below each of the external treatment tanks in each of the surface treatment units. A chemical liquid tank, and a chemical liquid jetting means for jetting the chemical liquid in each of the chemical liquid tanks into the corresponding internal processing tank, and the external processing tank and the chemical liquid tank are provided in each of the external processing tanks. And an external drain pipe extending into the chemical liquid stored in the chemical liquid tank. 2. The chemical processing apparatus according to claim 1, wherein an outlet to the external drain pipe is provided at a bottom of the external processing tank. 3. The chemical liquid according to claim 1, wherein each of the internal processing tanks communicates with the internal processing tank and the chemical liquid tank and the chemical liquid contained in the chemical liquid tank. A chemical treatment apparatus characterized in that an internal drain pipe extending to the inside is provided. 4. The chemical processing apparatus according to claim 1, wherein an outlet to the internal drain pipe is provided at a bottom of the internal processing tank. 5. The chemical processing apparatus according to claim 1, wherein the internal processing tank is provided with an overflow guide for flowing a chemical solution overflowing from the internal processing tank to the external processing tank. . 6. The chemical processing apparatus according to claim 4, wherein the inside of the overflow guide is filled with a chemical solution during the chemical treatment of the surface layer of the tape. 7. The chemical processing apparatus according to claim 5, wherein the overflow guide has flow rate adjusting means for adjusting an amount of a chemical solution flowing into the external processing tank. 8. The method according to claim 1, wherein at least one of the inside and outside of the internal processing tank has a flow rate of a chemical solution flowing from the internal processing tank to the external processing tank. An intermediate tank is provided, and the intermediate tank communicates with the intermediate tank and the chemical liquid tank, and an intermediate drain pipe extending into the liquid of the chemical liquid contained in the chemical liquid tank is provided. A chemical treatment device provided. 9. The chemical treatment apparatus according to claim 8, wherein an outlet to the intermediate drain pipe is provided at a bottom of the intermediate tank. 10. A pump according to any one of claims 1 to 9, wherein each of the surface treatment sections sucks a chemical liquid contained in the chemical liquid tank and jets the chemical liquid into the internal processing tank. A chemical treatment apparatus comprising: 11. The chemical processing apparatus according to claim 1, wherein the chemical solution is a plating solution. 12. The chemical processing apparatus according to claim 11, wherein the plating solution is a non-cyan plating solution. 13. A plurality of surface treatment sections each having an external treatment tank and an internal treatment tank are arranged in series, and in each of the surface treatment sections, a vertically long slit for carrying in and taking out tape provided in the external treatment tank is provided. A chemical treatment in which a tape is inserted into vertically long slits for carrying in and out the tape provided in the internal processing tank, and the surface layer of the tape is subjected to chemical processing with a chemical solution ejected into the internal processing tank. A method, wherein a chemical liquid tank containing a chemical liquid is provided immediately below each of the external processing tanks of each of the surface treatment units, and the chemical liquid in each of the chemical liquid tanks is ejected into the corresponding internal processing tank. An external drain pipe which is provided with a chemical liquid jetting means, communicates the external processing tank with the chemical liquid tank, and extends into the liquid of the chemical liquid contained in the chemical liquid tank; Set A chemical solution spouted into the internal treatment tank and treating the surface layer of the tape in the chemical solution in each of the chemical solution tanks via the external drain pipe. . 14. The invention according to claim 13, wherein each of the internal processing tanks communicates the internal processing tank with the chemical liquid tank and extends into the chemical liquid contained in the chemical liquid tank. Providing the discharged internal drain pipe, and containing the chemical liquid that has been sprayed into the internal processing tank and processed the surface layer of the tape in the chemical liquid in each of the chemical liquid tanks through the internal drain pipe. A chemical treatment method characterized by the above-mentioned. 15. The chemical processing method according to claim 14, wherein an overflow guide portion is provided in the internal processing tank, and a chemical liquid overflowing from the internal processing tank flows out to the external processing tank. . 16. A chemical treatment method according to claim 15, wherein the inside of the overflow guide is filled with a chemical solution to chemically treat a surface layer of the tape. 17. The chemical according to claim 15, wherein a flow rate adjusting means is provided in the overflow guide so that the amount of the chemical solution flowing out of the internal processing tank can be adjusted. Processing method. 18. The method according to claim 13, wherein at least one of the inside and the outside of the internal processing tank, the flow rate of the chemical solution flowing from the internal processing tank to the external processing tank. The intermediate tank is provided with an intermediate drain pipe which communicates the intermediate tank with the chemical liquid tank and extends into the chemical liquid contained in the chemical liquid tank. A chemical treatment method, wherein a chemical solution spouted into the internal treatment tank and treating the surface layer of the tape is contained in the chemical solution in each of the chemical solution tanks via the intermediate drain pipe. 19. A pump according to any one of claims 13 to 18, wherein each of the surface treatment sections sucks a chemical liquid contained in the chemical liquid tank and jets the chemical liquid into the internal processing tank. And circulating a chemical solution contained in the chemical solution tank for each of the surface treatment units. 20. The method according to claim 13, wherein said chemical treatment is an electrolytic plating process. 21. The chemical treatment method according to claim 20, wherein the plating solution for the electrolytic plating is a non-cyan plating solution.