JP2002030480A - Plating method and apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prolong the service life of a noncyanic plating solution in a plating device using the noncyanic plating solution. SOLUTION: A gold plated part 27 is constituted so that plural plating treating parts 41 arranged in series has a series for closed structure. Then, when performing electrolytic plating to tape 22, the inside of each plating treating part 41 is filled with inert gas discharged from a gas nozzle 61. Thus, the exposure of the noncyanic plating solution to the air can be prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a plating method and an apparatus therefor.

[0002]

2. Description of the Related Art Plating apparatuses include BGA, CSP, and CO.
In some semiconductor technologies such as F, electrolytic plating is performed on a long tape while transporting the tape vertically, that is, with the tape width direction vertical.

FIG. 5 is a schematic plan view showing an example of such a conventional plating apparatus. In this plating apparatus, a plurality of plating units 1 are arranged in series. The plating unit 1 includes an external processing tank 2 as shown in FIGS. 6 and 7. An internal processing tank 3 is provided at a central portion in the external processing tank 2, and a lid 4 is provided at an upper portion of the external processing tank 2. In this case, the bottom of the external processing tank 2 also serves as the bottom of the internal processing tank 3. Slits 5 and 6 formed of vertically long rectangular holes are provided at predetermined positions on the left side wall and the right side wall in FIGS. 6 and 7 of the external processing tank 2. Slits 7 and 8 formed of vertically long grooves are provided at predetermined positions on the left side wall and the right side wall in FIGS. 6 and 7 of the internal processing tank 3. The upper side wall and the lower side wall in FIG. 6 of the internal processing tank 3 are slightly lower than the left side wall and the right side wall (see FIG. 7), and these lowered portions are overflow portions 9. An anode electrode 10 is provided at a predetermined location in the internal processing tank 3.

A transport roller 11 and an electrode roller (cathode electrode) 12 are provided on the left side of each external processing tank 2 in FIG. A supply reel (not shown) is provided on the left side of the leftmost plating section 1 in FIG. The tape 13 unwound from the supply reel passes through a plurality of plating units 1 in sequence, and is then taken up by a take-up reel (not shown) provided on the right side of the rightmost plating unit 1 in FIG. It is supposed to be. In this case, the tape 13 is transferred to the transport rollers 11 disposed on the left side of the external processing tank 2 in each plating unit 1.
, The slit 5 of the external processing tank 2,
The slits 7 and 8 of the internal processing tank 3 and the slit 6 of the external processing tank 2 are sequentially passed.

A supply pipe 14 is provided at the center of the bottom of the internal processing tank 3.
Are connected at one end. Although not shown, the other end of the supply pipe 14 is connected to a plating solution tank via a pump. One end of drain pipes 15 and 16 is connected to the bottom of the external processing tank 2 between the slits 5 and 6 of the external processing tank 2 and the slits 7 and 8 of the internal processing tank 3. The other ends of the drain tubes 15 and 16 are connected to a plating solution tank.

Next, the operation of the plating apparatus will be described. When the plurality of transport rollers 11 are rotated in a predetermined direction, the tape 13 fed from the supply reel sequentially passes through the plurality of internal processing tanks 3 and is wound on a take-up reel. At this time, when the pump is driven, the plating solution in the plating solution tank is jetted into the internal processing tank 3 through the supply pipe 14 and is applied to the surface of the tape 13 passing through the internal processing tank 3. Then, the anode electrode 10 and the electrode roller 12
When a plating current flows between these steps, plating is performed on the surface of the tape 13 passing through the internal processing tank 3. The plating solution spouted into the internal processing tank 3 overflows from the overflow section 9 of the internal processing tank 3 and flows out into the external processing tank 2, and also flows through the slits 7 and 8 of the internal processing tank 3 into the external processing tank 2. And is collected in the plating solution tank via the drain pipes 15 and 16.

In the above-mentioned conventional plating apparatus, since the respective plating units 1 are individually independent, the slits 5 and 6 of the external processing tank 2 and the slits 7 and 6 of the internal processing tank 3 are separated.
The plating solution will be exposed to the atmosphere via 8.
However, for example, when a cyan plating solution is used as the plating solution, it is very stable and even when exposed to the atmosphere,
The service life is as long as about one year, and there is no problem. However,
In the case of a cyan plating solution, there are problems in terms of environment and pollution. On the other hand, in the case of a non-cyan plating solution, there is no problem in terms of environment and pollution. Therefore, in consideration of the environment and pollution, a non-cyan plating solution is more preferable.

[0008]

However, in the case of a non-cyan plating solution, it is very unstable and exposed to the atmosphere, and its life is about 2 to 3 months especially when air containing oxygen or the like is involved. Will be shorter. An object of the present invention is to prolong the life of a non-cyan plating solution.

[0009]

According to a first aspect of the present invention, there is provided a plating method wherein a plurality of plating sections arranged in series are formed into a series of closed structures, and the inside thereof is filled with an inert gas. Electroplating with a non-cyanide plating solution is performed in each of the plating sections on the tape inserted through the plurality of plating sections. The plating apparatus according to claim 5, wherein the plating apparatus performs electrolytic plating with a non-cyanide-based plating solution in each of the plating processing sections on a tape inserted through a plurality of plating processing sections arranged in series. Wherein the plurality of plating units have a series of hermetically sealed structures, and are provided with inert gas supply means for supplying an inert gas to the inside thereof. According to the present invention, a plurality of plating processing units arranged in series form a series of sealed structures, and when the inside is filled with an inert gas, the non-cyanide plating solution in each plating processing unit is exposed to the atmosphere. Therefore, the life of the non-cyan plating solution can be extended.

[0010]

FIG. 1 is a schematic plan view of a plating apparatus according to an embodiment of the present invention. In this plating apparatus, a nickel plating layer and a non-cyanide-based gold plating layer are formed on the surface of a circuit pattern made of copper foil provided on the surface of a tape 22 fed from a supply reel 21 and a plating pattern connecting the circuit patterns. It is supposed to. Therefore, between the supply reel 21 and the take-up reel 23, in order from the supply reel 21 side,
Primary processing unit 24, nickel plating unit 25, secondary processing unit 2
6, a gold plating section 27, a cleaning section 28, and a drying section 29 are provided continuously in series.

In this case, from the primary processing section 24 to the drying section 29
Until then, it has a series of closed structures. That is, the slit (not shown) on the tape carry-in side of the primary processing unit 24 and the slit (not shown) on the tape carry-out side of the drying unit 29 are open to the atmosphere. Has become. One ends of exhaust ducts 31 and 32 are connected to the upstream side of the primary processing section 24 and the downstream side of the drying section 29. The other ends of the exhaust ducts 31 and 32 are open to the atmosphere. The drying unit 29 is connected to an inert gas (for example, nitrogen) supply source 34 via a pipe 33.

The primary processing section 24 is for performing degreasing, cleaning, pretreatment of nickel plating, and the like. The nickel plating section 25 has a plurality of plating sections, similarly to the gold plating section 27 described later, and is used for forming a nickel plating layer having a final film thickness of 5 μm or less on the copper foil surface of the tape 22 by electrolytic plating. Things. This nickel plating layer
It has a role as a barrier layer between the copper foil and the gold plating layer and a role to reduce the thickness of the gold plating layer.

The secondary processing section 26 is for performing cleaning, pre-treatment of gold plating, and the like. As will be described in detail later, the gold plating section 27 has a plurality of plating processing sections, and has a final film thickness of 1 μm on the base gold plating layer of the tape 22 by electrolytic plating using a non-cyanide plating solution in an inert gas atmosphere.
This is for forming the following gold plating layer. The washing unit 28 is for washing with water. The drying unit 29 is for drying.

Next, FIG. 2 is a schematic plan view of a portion of the gold plating portion 27. In this gold-plated part 27,
A plurality of plating units 41 are arranged in series between the secondary processing unit 26 and the cleaning unit 28 in series. In each of the plating units 41, as shown in FIGS. 3 and 4, a roller chamber 43 is provided in front of the external processing tank. An internal processing tank 44 is provided at a central portion in the external processing tank 42,
A lid 45 is provided on the upper part of the external processing tank 42. In this case, the bottom of the external processing tank 42, and the upper and lower walls in FIG. 3 also serve as the bottom, upper and lower walls of the internal processing tank 44.

Slits 46 and 47 each having a vertically long rectangular hole are provided at predetermined positions on the left side wall and the right side wall in FIGS. 3 and 4 of the external processing tank 42, respectively. Slits 48 and 49 formed of vertically elongated grooves are provided at predetermined positions on the left side wall and the right side wall of the internal processing tank 44 in FIGS.
Is provided. An anode electrode 50 is provided at a predetermined position in the internal processing tank 44. In the roller chamber 43, a transport roller 51 and an electrode roller (cathode electrode) 5 are provided.
2 are provided facing each other. Also in this case, in each plating section 41, the tape 22 is provided between the transport roller 51 and the electrode roller 52, the slit 46 of the external processing tank 42, the slits 48 and 49 of the internal processing tank 44, and the external processing tank 42. Are sequentially passed. Here, the width of the tape 22 in this case is relatively large, for example, 158 mm. For this reason,
The height (depth) of the internal processing tank 44 is relatively high (deep),
The vertical length of the slits 48 and 49 is also relatively long.

One end of a supply pipe 53 is connected to the center of the bottom of the internal processing tank 44. Although not shown, the other end of the supply pipe 53 is connected to a plating solution tank via a pump. The plating solution tank contains a non-cyan plating solution. Slit 4 of external processing tank 42
The external drain tube 5 is provided at the bottom of the external processing tank 42 between the internal processing tank 44 and the slits 48 and 49 of the internal processing tank 44.
4, 55 are connected at one end. One ends of the internal drain pipes 56 and 57 are connected to the bottom of the internal processing tank 42 inside the slits 48 and 49 of the internal processing tank 44. The other ends of the external drain tubes 54 and 55 and the internal drain tubes 56 and 57 are connected to a plating solution tank.

A pair of gas nozzles 61 are provided on both sides of the tape transport path in the external processing tank 42 between the slit 47 of the external processing tank 42 and one end of the external drain tube 56. The pair of gas nozzles 61 are connected to an inert gas (for example, nitrogen) supply source 63 via a pipe 62. The inert gas supply source 63 may be the same as or different from the inert gas supply source 34 shown in FIG. The inert gas discharged from the pair of gas nozzles 61 is blown at an angle of about 45 ° to both sides of the tape 22 from the tape transport direction side, as indicated by arrows in FIG.

Next, the operation of the plating apparatus will be described. First, in each plating section 41 of the gold plating section 27, the inert gas supplied from the inert gas supply source 63 and discharged from the pair of gas nozzles 61 is supplied from the tape transport direction side as shown by an arrow in FIG. The tape 22 is sprayed on both sides at an angle of about 45 °. Also,
An inert gas is supplied from the inert gas supply source 34 into the drying unit 29.

For this reason, the external processing tank 42 including the inside of each plating section 41 of the gold plating section 27, that is, the inside of the internal processing tank 44.
The inside and the inside of the roller chamber 43 are filled with an inert gas. Further, the inside of the drying unit 29 and the inside of the cleaning unit 28 are also filled with the inert gas. Most of the filled inert gas flows to the discharge direction side from the gas nozzle 61, that is, to the tape loading side, and is discharged into the atmosphere from the exhaust duct 31 of the primary processing unit 24 and the slit on the tape loading side.
The remaining inert gas is discharged into the atmosphere from the exhaust duct 32 of the drying unit 29 and the slit on the tape discharge side.
Therefore, during the plating process by the plating apparatus, the inert gas is always filled in each plating section 41 of the gold plating section 27.

Next, the operation of the gold plating unit 27 will be described. The tape 22 sequentially passes through the plurality of internal processing tanks 44 when the plurality of transport rollers 51 are rotated in a predetermined direction. At this time, when the non-cyan plating solution in the plating solution tank is jetted into each internal processing tank 44 through each supply pipe 53, the jetted non-cyan plating liquid flows through each internal processing tank 44. It is applied to the surface of the passing tape 22.
Then, when a plating current flows between the anode electrode 50 and the electrode roller 52, plating is performed on the surface of the tape 22 passing through each of the internal processing tanks 44.

Most of the non-cyan plating liquid 52 jetted into each internal processing tank 44 is recovered into the plating liquid tank via the internal drain pipes 56 and 57 of each internal processing tank 44. On the other hand, a part of the plating solution 52 jetted into each of the internal processing tanks 44 is formed by slits 48 and 49 of the internal processing tanks 44.
Out of each of the external processing tanks 42, and is collected in the plating solution tank via the external drain pipes 54 and 55 of each of the external processing tanks 42.

By the way, as described above, during the plating process,
Since the inert gas is always filled in each of the plating sections 41 of the gold plating section 27, the non-cyan plating solution in each of the plating sections 41 is not exposed to the atmosphere. Life can be extended. Further, in this plating apparatus, the inert gas discharged from the pair of gas nozzles 61 provided on the tape unloading side in the external processing tank 42, as shown by arrows in FIG.
About 45 from both sides of the tape 22
°, a pair of gas nozzles 61
This allows the tape 22 to be drained.

Here, the reason why the gold plating section 27 is constituted by a plurality of plating processing sections 41 will be described.
In order to carry and plate the tape 22 at a predetermined speed, a plating time corresponding to a plating thickness to be formed is required.
The plating process length of the tape 22 is a length corresponding to this plating time. However, since the application of the voltage to the pattern formed on the tape 22 is performed by the electrode roller 52, when the plating process length of the tape 22 becomes longer, the central portion between the electrode roller 52 vicinity and the electrode roller 52 due to the resistance of the pattern. This is because the difference between the voltage on the side and the variation in plating thickness increases, so that the gold plating section 27 is constituted by a plurality of plating processing sections 41 and the distance between the electrode rollers 52 is shortened.

[0024]

As described above, according to the present invention, a plurality of plating sections arranged in series are formed into a series of closed structures, and when the inside thereof is filled with an inert gas, non-plating within each plating section is achieved. The cyan plating solution is not exposed to the atmosphere, and therefore, the life of the non-cyan plating solution can be extended.

[Brief description of the drawings]

FIG. 1 is a schematic plan view of a plating apparatus according to an embodiment of the present invention.

FIG. 2 is a schematic plan view of a gold-plated portion shown in FIG.

3 is a plan view of a part of the gold-plated portion shown in FIG. 2 in a state where a lid is omitted.

FIG. 4 is a sectional view corresponding to a portion along line XX in FIG. 3;

FIG. 5 is a schematic plan view of an example of a conventional plating apparatus.

FIG. 6 is a plan view of the plating section shown in FIG. 5 with a lid omitted.

FIG. 7 is a sectional view corresponding to a portion along line XX of FIG. 6;

[Explanation of symbols]

 22 Tape 27 Gold plating part 41 Plating part 42 External processing tank 44 Internal processing tank 61 Gas nozzle 63 Inert gas supply source

Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat II (Reference) H01L 21/60 311 H01L 21/60 311W (72) Inventor Mitsuhiko Yamamoto 3-10-6 Imai, Ome-shi, Tokyo Casio Micronics Incorporated (72) Inventor Kozo Kanaya 962 Fujishin-Kamijinzumae, Kashiwa-shi, Chiba Prefecture Seto Giken Kogyo Co., Ltd.F-term (reference)

Claims (8)

[Claims] A plurality of plating units arranged in series are formed in a series of hermetically sealed structures, the inside of which is filled with an inert gas, and a tape inserted through the plurality of plating units is subjected to each of the plating processes. A plating method, wherein electrolytic plating is performed with a non-cyanide plating solution in a processing section. 2. The invention according to claim 1, wherein the plurality of plating units and a pre-processing unit and a post-processing unit provided on a front side and a rear side thereof have a series of sealed structures. And the plating method. 3. The plating method according to claim 1, wherein the tape is conveyed vertically. 4. The plating method according to claim 3, wherein the tape is drained with the supplied inert gas. 5. A plating apparatus for performing electrolytic plating with a non-cyanide-based plating solution on a tape inserted through a plurality of plating units arranged in series in each of the plating units, wherein the plurality of plating units are provided. A plating apparatus comprising: a treatment section having a series of hermetic structures; and an inert gas supply means for supplying an inert gas into the treatment section. 6. The invention according to claim 5, wherein the plurality of plating processing units and a pre-processing unit and a post-processing unit provided on a front side and a rear side thereof are formed as a series of sealed structures. Plating equipment. 7. The plating apparatus according to claim 5, wherein the tape is transported vertically. 8. The invention according to claim 7, wherein the inert gas supply means includes a gas nozzle provided for each of the plating units, and the gas nozzle drains the tape. Features plating equipment.