JP2002014115A - Contact probe and probe device - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To reduce stress concentration at the time of overdrive and suppress damage to contact pins. A tip portion (22a) of a contact probe (22) is attached to a mounting base (24) almost vertically. Stop mount 2 supporting mounting base 24
A coil spring 30 is mounted between the top clamp 28 and the top clamp 28. A contact pin 42a protruding from the film 40 of the contact probe 22 has a curved portion 42b and a beam portion 42c extending at a tangential end thereof, and the beam portion 42c is inclined to intersect with an axis XO near the contact pin of the pattern wiring 42. I do. The contact pins 42 are covered with the photosensitive resin J except for the tip 42d of the beam 42c.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a contact probe which is used as a probe pin, a socket pin, or the like, and performs an electrical test by contacting each terminal of a semiconductor IC chip, a liquid crystal device, etc. (Probe card).

[0002]

2. Description of the Related Art In general, a probe device (probe card) is used to conduct an electrical test by contacting a semiconductor chip such as an IC chip or an LSI chip or each terminal of an LCD (liquid crystal display). . As a contact probe used for an electrical test of an IC chip or the like on a wafer provided with a surface-arranged terminal such as a flip chip, for example, Japanese Patent Application Laid-Open No. 11-326373 (Japanese Patent Application No. 10-13561).
No. 8) is disclosed in the gazette. For example, as shown in FIG. 10, the contact probe 1 is cut out into a predetermined shape as an IC probe, and is formed of a two-layer tape in which a resin film layer 2 such as polyimide and a metal film layer 3 such as copper are laminated. A plurality of pattern wirings 5 formed of Ni (nickel) or a Ni alloy are attached to the surface of the resin film layer 2 of the film 4.
The end portions of the pattern wirings 5 project from the ends of the film 4 to form contact pins 5a. The contact pins 5a are formed in a substantially hook-like curved shape, and are covered with a non-conductive photosensitive resin J or the like except for a tip portion that contacts a terminal electrode such as a pad.

An I-type terminal having a surface-arranged terminal as shown in FIG.
When the contact probe 1 is mounted on the probe device 10 for an electrical test of a C chip or the like, FIGS.
As shown in FIG. 3, a plurality of contact probes 1 are disposed so as to be substantially perpendicular to the terminals of the IC chip to be measured, and are arranged in parallel between the respective surfaces of the films 4 via spacers 11e. Set up. The spacer 11 e is made of a non-conductive material such as ceramics, for example, and also functions as a support for supporting the contact probe 1. Film 4 ...
The contact probe 1 is positioned by inserting a ceramic rod 12 into positioning holes 6 and 6 provided on both sides of the contact probe 1. 13 (a) and 13 (b)
Are connected to a printed circuit board 13 via a spacer 11e. The lead-out wiring portions 5b located on the base end side of the pattern wirings 5 of the contact probes 1 are connected to electrodes (not shown) of the printed circuit board 13 via flexible substrates (FPCs) 9.

In this state, each terminal electrode of the IC chip is arranged so as to face the contact pins 5a of the plurality of contact probes 1, and the IC chip is relatively moved in the direction of pressing and contacting the contact pins 5a to overdrive. multiply. Then, since each contact pin 5a is formed in a curved shape in a hook shape, the tip is elastically deformed and scrubbed, so that the oxide film on the pad surface can be scraped off, so that the contact can be made in contact with the pad while being pressed. At this time, even when the contact probes 1 are vertically arranged, the contact pins 5a can slide and scrub during overdrive. Moreover, even when the contact pins 5a are bent and deformed and come into contact with each other at the time of scrubbing, short-circuiting can be prevented since they are covered with the photosensitive resin J.

[0005]

However, as semiconductor devices such as IC chips have become more highly integrated and the pitch of terminals such as pads has become smaller, the contact pins 5a of the contact probe 1 have correspondingly smaller pitches. The diameter of each of the contact pins 5a becomes smaller because of the necessity to make the contact pins 5a. In that case, the contact pins 5a are mainly used during overdrive.
.. Are stressed on the curved portion intensively, so that the curved portion is liable to be broken and easily damaged. The present invention has been made in view of such problems, and provides a contact probe capable of reducing stress concentration at the time of overdrive and ensuring a scrub, and a probe device including the same. Aim.

[0006]

According to the contact probe of the present invention, a plurality of pattern wirings are formed on a film, and the tips of these pattern wirings are arranged so as to protrude from the leading end of the film to form contact pins. In the contact probe, a plurality of curved portions are formed in series on the contact pin. In this contact probe, the stress at the time of overdrive is transmitted from the tip of the contact pin to the plurality of curved portions arranged in series and elastically deformed, so that the stress at the time of overdrive is distributed to the plurality of curved portions, Since stress is not concentrated on a single curved portion as in the related art, damage such as breakage can be prevented even when the contact pins are thin and have a narrow pitch. In addition, the stress at the time of overdrive is dispersed and absorbed by the plurality of curved portions arranged in series, so that the contact pins are more easily elastically deformed and easily slide sideways with respect to the member to be inspected, so that a constant stylus force is applied. The amount of overdrive for obtaining the above can be set larger than the conventional one.

The curved portions of the contact pin may be curved in the same direction. Since each curved portion is curved in the same direction, the entire contact pin and each curved portion are also curved in the same direction during overdrive, so that stress can be relieved and scrubbing can be performed smoothly. Therefore, even if the contact probe is vertically attached to the probe device, it can be reliably scrubbed. The contact pins may be covered with resin except for the tip. Even if adjacent contact pins come into contact with each other due to a narrow pitch when the contact pins are curved during overdrive, no short circuit occurs. Moreover, since the contact pins are reinforced by the resin, the rigidity of the contact pins can be improved even with a relatively thin contact pin, and in particular, a curved portion to which stress is applied can be reinforced. That is, the burden on the contact pin due to repeated fatigue is further reduced, and the service life of the contact pin is further improved.

In the probe device according to the present invention, a plurality of pattern wirings are formed on a film, and the respective tips of the pattern wirings are arranged so as to protrude from the leading end of the film, and the contact probes which are used as contact pins are formed by mechanical parts. In the probe device mounted, the contact probe is the contact probe according to any one of claims 1 to 3. Even if this contact probe is attached to a conventional vertical type probe device, the stress at the time of overdrive is distributed to multiple curved parts, and the overdrive amount to obtain a constant stylus pressure is set larger than the conventional one Therefore, even if the contact pins are thin and have a narrow pitch, damage such as breakage can be prevented. .

In the probe device according to the present invention, a plurality of pattern wirings are formed on a film, and the respective tips of the pattern wirings are arranged so as to protrude from the front end of the film, and the contact probe which is used as a contact pin is formed by mechanical parts. In the mounted probe device, a plurality of elastic portions are formed in series between the contact pin and the support member of the mechanical part. During overdrive, the elastic parts arranged in series disperse and absorb the stress, and the overdrive amount for obtaining a constant stylus pressure can be set larger than the conventional one, so damage to the contact pin can be suppressed and smooth A good scrub. Preferably, the contact probe is used in a vertically arranged probe device in which the axis of the pattern wiring near the contact pin is arranged substantially perpendicular to the inspection object.

The elastic portion has an elastic member provided as a first elastic portion between a holding member (mounting base) of the contact probe and a support member (top clamp), and has a contact as a second elastic portion. The pin may have a curved portion. The effects of the present invention can be obtained even when a conventional contact probe is mounted on the probe device according to the present invention. The contact pins may be covered with resin except for the tip. Further, the contact probe may be the contact probe according to any one of claims 1 to 3. If this contact probe is mounted, a configuration in which a plurality of elastic portions are arranged in series in the region of the contact pin will be used, and the same mechanical parts as those of the related art can be used for the probe device. The elastic member may further include an elastic member provided between the holding member and the support member of the contact probe. With this configuration, the elastic portion is formed in three or more stages in series in the probe device, and can be adjusted more finely. In the present invention, the plurality of elastic portions arranged in series may be formed on a contact pin of a contact probe, or may be provided between mechanical parts. In the latter case, the effects of the present invention can be obtained even if a conventional contact probe having a contact pin having no curved portion is used. Further, a plurality of elastic portions may be provided on each of the contact pin and the mechanical part. Either configuration is included in the present invention. When arranging the contact pin vertically with respect to the inspection object, it is necessary to provide at least one curved portion as the elastic portion on the contact pin. Good.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a probe device according to a first embodiment of the present invention will be described with reference to FIGS.
The same or similar parts and components as those in the related art will be described using the same reference numerals. 1 is a schematic configuration diagram showing a probe device according to an embodiment, FIG. 2 is an explanatory diagram of a contact probe used in the probe device, FIG. 3 is a cross-sectional view of the contact probe shown in FIG. 2 along line AA, and FIG. 2 is a partially enlarged view showing a contact pin of the contact probe shown in FIG. 2, FIG. 5 is a cross-sectional view of the contact pin in a photosensitive resin region in a contact pin arrangement direction, and FIG. 6 shows needles of the probe device according to the embodiment and a conventional probe device. It is a figure of a test result showing the relation between pressure and the amount of overdrive. Probe device according to the present embodiment 20, against the flexible mounting base 24 distal portion 22a for example, a plate-like sheet of the contact probe 22 as shown in FIG. 1
It is attached almost vertically with an adhesive or the like . The mounting bases 24 to which the contact probes 22 are attached may be arranged in a pair in a substantially plate shape, and a plurality of pairs may be arranged in a direction perpendicular to the plane of FIG. With this configuration, the contact probe 22 is supported by the mounting base 24 so that a plurality of contact probes 22 including contact pins have a tip 22 a substantially perpendicular to a contact surface Pa of an electrode P such as a peripheral type. Will be arranged.

A plate-shaped stop mount 26 is provided above the mounting base 24, and each mounting base 24 is connected to the stop mount 26 by a bolt 27 or the like. A top clamp 28 is disposed above the stop mount 26 at an interval, and a plurality of pairs of coil springs 30 are interposed between the stop mount 26 and the top clamp 28 as an elastic member (first elastic portion). Have been. In addition, instead of the coil spring 30, various elastic bodies such as springs such as a leaf spring and a laminated leaf spring, and resins such as silicone rubber and natural rubber, and resins such as epoxy resin and acrylic resin can be adopted as the elastic members. A printed circuit board (hereinafter, referred to as a printed circuit board) 32 having an opening 32a in the center is provided on the outer peripheral side of the stop mount 26 and the coil springs 30, and is connected to the lower surface of the top clamp 28 near the opening 32a. Electrodes 34 are arranged on the lower surface of the printed circuit board 32, and the base 22b of the contact probe 22 is pressed and supported on the lower surface of the printed circuit board 32 by an elastic body 38 made of rubber or the like provided on a frame-shaped bottom clamp 36, for example. , Electrode 3
4 are electrically connected to each other.

The contact probe 22 has the structure shown in FIGS. The contact probe 22 is shown in FIG.
As shown in FIG. 3, for example, a resin film 43 of a substantially L-shaped two-layer film 40 in which a resin film 43 of, for example, polyimide and a metal film 45 of, for example, Cu are laminated.
Are formed by bonding a plurality of pattern wirings 42 made of a metal such as a Ni alloy via an adhesive layer to the surface of the film 40 from the leading end 22a of the film 40.
2 have projecting tips, which are used as contact pins 42a. As shown in FIG. 4, each contact pin 42a has a curved portion 42b (second elastic portion) provided on the film 40 side, and a substantially linear beam portion 42c extending from the curved portion 42b to the tangential tip side. It has. The beam portion 42c
The axis X1 is inclined with respect to the axis X0 of the substantially linear portion of the pattern wiring 42 disposed at the leading end of the film 40. Note that the axis X1 of the beam portion 42c is
The needle advance angle θ is set to, for example, 45 ° or less with respect to the contact surface Pa of the electrode (measurement target) P such as a tip.

The curved portion 42b is provided with each contact pin 42a.
Are bent at the same position and in the same direction, and the beam portion 42c is arranged in an intersecting state with the axis X0 of the pattern wiring 42. The diameter D of the curved portion 42b is:
It is defined by calculating the maximum bending stress generated at the center of bending based on the calculation of bending stress. Note that, specifically, in order to sufficiently withstand the load, the diameter D of the curved portion 42b is set to the axis X0 when the overdrive is actually applied.
The displacement is set to be twice or more the displacement amount in the direction. As shown in FIGS. 4 and 5, the contact pin 42a is made of a non-conductive coating having flexibility, such as a cured polyimide or epoxy resin J, except for the tip 42d of the beam 42c. Covered with layers. Since the contact pins 42 are reinforced by the photosensitive resin J, the rigidity of even the relatively thin contact pins can be improved, and in particular, the curved portion 42b to which stress is applied can be reinforced. Note that the contact probe 22 may be manufactured using a photolithography technique or the like, and the photosensitive resin J may be applied after plating. The shape of the contact pin 42a can be formed by an appropriate light-shielding mask shape. The pattern wirings 42 have, for example, a pitch of the lead-out wiring portions 42e larger than a pitch of the contact pins 42a, but need not be large.
In the probe device 20 shown in FIG. 1, the distal end portion 22a of the sheet-like contact probe 22 is attached to the mounting base 24, and the base portion 22b is twisted, and the lead-out wiring portions 42e of the pattern wirings 42 are provided.
Are fixed by a bottom clamp 36 while being electrically connected to the electrodes 34 of the printed circuit board 32. The mounting base 24, the stop mount 26, the top clamp 28, the bottom clamp 36, etc. are mechanical parts 3
9. Further, the overall spring constant K of the probe device 20 including the n contact pins 42a having the spring constant k1 and the elastic body 30 having the spring constant k2 in series is K = n
k1 · k2 / (nk1 + k2), and the electrode P is contacted while satisfying this.

The probe device 20 according to the present embodiment has the above-described configuration. When performing a probe test or the like of an IC chip, the probe device 20 is mounted on a prober and electrically connected to a tester. A predetermined electric signal is applied to contact pins 42a of the pattern wirings 42.
From the IC chip on the wafer
An output signal from the chip is transmitted from the contact pin 42a to the tester, and the electrical characteristics of the IC chip are measured. In the electrical test, the electrodes P of the IC chip are arranged below the contact pins 42a of the probe device 20 in FIG. The contact surface Pa of the electrode P is substantially perpendicular to the axis XO of the pattern wiring 42 of the contact probe 22, and in this state, the IC chip is relatively moved toward the probe device 20. As a result, the contact surface Pa of the electrode P is pressed by the contact pins 22a to perform overdrive. Then, each contact pin 4
2a, each bending portion 42b is bent in the same direction at the same position in the arrangement direction, so that each bending portion 42b can be bent in the same direction and buckled. Moreover, the stress (load) due to overdrive is not entirely received by each contact pin 42a, but each mounting base 24 and stop mount 26 on which each contact probe 22 is attached is pushed and moved to be transmitted to the coil springs 30. . At this time, a part of the stress is absorbed by the elastic compression of the coil springs 30. Also mounting base 24
The contact probe 22 having the base portion 22b supported by the bottom clamp 36 in accordance with the movement of the base member 22 follows and displaces and deforms without difficulty.

Accordingly, the stress at the time of overdrive is transmitted while being dispersed and absorbed by the contact pins 42a, which are two-stage elastic portions, which are arranged in series in the transmission direction, and the coil springs 30. Therefore, the needle pressure applied to the contact pin 42a at the time of overdrive can be greatly reduced as compared with the probe device using only the conventional contact pin 42a having the curved portion 42b as the elastic portion, and the constant needle pressure can be reduced. The contact pin 2 can secure a large amount of overdrive to obtain
2a... Can be suppressed to extend the life. Further, the stress of the contact pins 42a... Is absorbed and reduced by the entire curved portion 42b due to the overdrive, and the beam portion 42c is easily pushed out in the direction of the axis X1, so that the contact pins 42a easily slide. Therefore, stress concentration during overdrive does not occur, and the beam portion 42c slides sideways, so that scrubbing is performed smoothly.

The beam portion 42c slides largely in a predetermined direction due to a reaction force from the bending portion 42b generated at the time of overdrive, so that the beam portion 42c bends to release the strain generated in the bending portion 42b, thereby achieving better stress relaxation and scrub. Done. Also, at the time of overdrive, each contact pin 42a
The tip 4 of the beam 42c is elastically deformed by the curved portion 42b.
Since the contact pins 42a, 42a are covered with the photosensitive resin J except for 2d, even if the adjacent contact pins 42a, 42a are bent and contact each other, the contact pins 42a, 42
a is insulated and no short circuit occurs. The beam 42c
Since the tip portion 42d is not covered, there is no problem in the conductivity with the electrode P such as an IC chip. Since the contact pins 42a are reinforced by the photosensitive resin J, the rigidity of the relatively thin contact pins 42a can be improved, and in particular, the curved portion 42b to which stress is applied can be reinforced. The burden on the contact pin 42a due to repeated fatigue is further reduced, and the useful life of the contact pin 42a is further improved.

Next, a comparative test using the probe device 20 according to the embodiment of the present invention and the probe device according to the related art, which measures the relationship between the overdrive amount and the stylus pressure, will be described with reference to FIG. First, as an embodiment, FIGS.
And a vertical arrangement type probe device having the same configuration as the probe device 20 except that the same contact probe 22 is used as a conventional example and a coil spring 30 as a second elastic portion is not provided. The measuring means was arranged at the position of the contact surface Pa of the electrode P, and overdrive was applied to gradually increase the overdrive amount (load) to measure the stylus pressure of each contact pin. The measurement results are shown in FIG. 6, in which the measured values of the examples are indicated by diamond-shaped dots and the measured values of the conventional example are indicated by square-dots. For example, the overdrive amount for obtaining a stylus pressure of 50 mN / pin is about 40 μm in the embodiment, and 20 μm in the conventional example.
It was about μm. In the embodiment, the overdrive amount for obtaining the same stylus pressure is twice as large as that in the conventional example, which means that the overdrive control can be easily performed.

According to the present embodiment as described above, the hook-shaped contact pins 42a and the coil springs 30 arranged on the mechanical parts 44 are arranged in series in the probe device 20 as a two-stage elastic part. The stylus pressure applied to the contact pin 42a during the overdrive can be reduced, so that the contact pin 42a is prevented from being damaged due to excessive stress and the life can be improved. Therefore, a good electrical test can be performed even if the contact pins 42a are made narrower in pitch and the diameter is made thinner in response to the narrower pitch of the electrodes P.

Next, a second embodiment of the present invention will be described with reference to FIGS. 7 to 9, and the same or similar parts and components as those in the first embodiment and the prior art will be described using the same reference numerals. I do. FIG. 7 is a plan view of a contact probe according to the second embodiment, and FIG. 8 is a view B of the contact probe shown in FIG.
9 is an enlarged view of a contact pin in the contact probe of FIG. The contact probe 50 according to the second embodiment shown in FIGS. 7 and 8 has a two-layer film 51 of, for example, a substantially home-based type in which a resin film 48 and a metal film 49 are laminated. A plurality of pattern wirings 52 formed of a metal such as a Ni alloy are adhered to the surface of the resin film 48 via an adhesive layer, and the ends of the pattern wirings 52. Projecting contact pins 54 are formed. On the base 51b of the film 51, a wiring lead-out part 52a of the pattern wiring 52.
Are provided, and a pair of positioning holes 6 are drilled at both ends of the base 51b. These have the same configuration as the conventional contact probe 1. Each contact pin 54
As shown in FIG. 9, a first curved portion 54A having a relatively large curved curve and a second curved portion 54B having a relatively small curved curve are formed from the film 51 side toward the tip to be brought into contact with, for example, the electrode P of the surface arrangement terminal. The first and second elastic portions are sequentially formed, and the tip is a beam portion 54C extending from the second curved portion 54B in the tangential direction.

The first curved portion 54A and the second curved portion 54B of the contact pin 54 are curved in the same direction, and the second curved portion 54B and the beam portion 54C are curved portions of the contact pin 42a according to the first embodiment. It is assumed that it has the same configuration as the beam 42b and the beam 42c. The first curved portion 54A has a curved portion 54Aa having a diameter D1 larger than the diameter D of the second curved portion 54B, and a substantially linear first shaft portion 54Ab positioned before and after the curved portion 54Aa and positioned on the axis X0 of the pattern wiring 52. And a second shaft portion 54Ac. Then, the contact pin 54 extends from the film 51 side to the beam portion 54C from the first shaft portion 54Ab, the first curved portion 54Aa, and the second shaft portion 54A.
c, the second curved portion 54B and the beam portion 54C are connected smoothly. In the contact probe 50, the contact pins 54 have the same shape, are curved at the same position in the same direction, and are arranged at a predetermined pitch. Further, each of the contact pins 54 is covered with a photosensitive resin Ja made of a non-conductive material on the entire periphery up to the film 51 except for the tip 54d of the beam portion 54C which is brought into contact with the surface-arranged terminal electrode P. In addition, the first and second shaft portions 54 are formed by the first bending portion 54A.
Ab and 54Ac need not be provided, and the curved portion may be formed as a whole. Alternatively, the diameter D1 of the curved portion 54Aa may be the same as or smaller than the diameter D.

The contact probe 50 according to the second embodiment is mounted on the printed circuit board 13 by the mechanical parts 7 of the probe device 10 shown in FIGS. Will be arranged. In this case, the contact probe 50 is connected to an IC to be measured.
A plurality of spacers 11e made of a non-conductive material such as ceramic are arranged between the surfaces of the films 51 so as to be substantially perpendicular to the surface-arranged terminal electrodes P of the chip.
Are arranged in parallel to support a plurality of contact probes 50. Moreover, by inserting the ceramic rod 12 into the positioning holes 6 and 6 provided on both sides of the film 51,
The plurality of contact probes 50 are positioned. The plurality of contact probes 50 are connected to the printed circuit board 13 via the spacers 11e. Each pattern wiring 52 of these contact probes 50.
Are connected to electrodes (not shown) of the printed circuit board 13 via a flexible printed circuit (FPC) 9.

In this state, each terminal electrode P of the IC chip is connected to the contact pins 54 of the plurality of contact probes 50.
The IC chip is arranged in contact with the contact pins 54.
Is over-driven by relative movement in the direction in which it is brought into pressure contact with. Then, the beam portion 54C of each contact pin 54
Is pressed by the contact portion Pa of the terminal electrode P, and is bent and buckled in the same direction because each second curved portion 54B is curved in the same direction at the same position in the arrangement direction. Further, the stress due to overdrive is also transmitted to each of the first curved portions 54A, and since each of the first curved portions 54A is curved at the same position and in the same direction in the arrangement direction, the same direction as in the second curved portion 54B. And buckled. Therefore, the load due to overdrive is received by each contact pin 54 as a whole, and the first curved portion 54A and the second curved portion 54
While bending in the same direction as B, both bending portions 54A and 54B also bend in the same direction. Thereby, the stress due to overdrive is absorbed and reduced.

Therefore, the needle pressure applied to the contact pin 54 during overdrive can be greatly reduced as compared with the conventional probe device, and a large overdrive amount for obtaining a constant needle pressure can be secured. Moreover, the contact pins 54 are formed by the second curved portions 54B and the beam portions 54C extending to the front end side in the tangential direction, and the axis X1 of the beam portion 54C is disposed at the front end portion of the pattern wiring 52 in a no-load state. Of the contact pin 54, the stress is reduced by the overdrive and the beam portion 54C
Are easily pushed out in the direction of the axis X1, and the vehicle is liable to skid. Therefore, a smooth scrub is performed at the tip end portion 54d of the beam portion 54C while suppressing stress concentration during overdrive. Further, at the time of overdrive, each contact pin 54 is elastically deformed and the adjacent contact pins 54
Even if they contact each other, they are covered with the photosensitive resin Ja except for the end portion 54d of the beam portion 54C, so that no short circuit occurs.

According to the second embodiment, in addition to the above-described functions and effects, the contact probe 50 is provided with the two-stage elastic portion composed of the first and second curved portions 54A and 54B in series. Even if it is mounted on the vertical probe device 10 shown in the above-mentioned prior art, the effect can be obtained. still,
A curved portion 54A formed in series with each contact pin 54,
The number of 54B (elastic portion) is not limited to two, but may be three or more.

The structure of the contact pins 54 of the contact probe 50 according to the second embodiment may be used instead of the contact pins 42 of the contact probe 22 according to the first embodiment. In this case, the three-stage elastic portion including the two-stage elastic portion of the contact pin 54 and the elastic portion formed by the coil spring 30 can be arranged in series, and the stylus pressure for obtaining a predetermined overdrive amount can be reduced. It can be smaller. In the vertical probe device 20 shown in the first embodiment, for example, an elastic portion such as a coil spring 30 is also provided between the mounting base 24 and the stop mount 26 to provide a plurality of elastic members of three or more stages. The units may be arranged in series and used for overdrive.
Also, contact probes 20 and 50 and printed circuit board 32
As another example of the conducting means, contact probes 20,
The base end side of 50 is pressed against the electrodes of the upper substrate (transformer) and held or connected by soldering or the like, and the other electrodes of the upper substrate and the printed substrates 32 and 13 are connected to the flexible substrate (FPC) 9, wiring, etc. The connection may be made to conduct. Further, the films 40 and 51 are not necessarily two-layer films and may be composed of only a resin film, or may be composed of three or more layers by alternately stacking a resin film layer and a metal film layer. You may.

In the above embodiment, the probe devices 20 and 10 are used as probe cards, but may be used for other measuring jigs and the like. For example, the present invention may be applied to an IC chip test socket or the like mounted on an IC chip burn-in test device or the like for holding and protecting the IC chip inside. Further, in the contact probes 22 and 50 according to the first and second embodiments, the curved portions 42b, 54A and 54B of the contact pins 42a and 54 are formed with a constant curvature. The connecting portion may be a curved portion.

[0028]

According to the contact probe of the present invention, since a plurality of curved portions are formed in series on the contact pin, the stress at the time of overdrive is distributed to the plurality of curved portions, and a single curved portion as in the prior art is provided. Since the stress is not concentrated on the contact pins, even if the contact pins are made narrow and narrow, the damage such as breakage can be prevented and the life can be improved. In addition, since the stress at the time of overdrive is dispersed and absorbed by the plurality of curved portions, the contact pin is more easily elastically deformed, and a large amount of overdrive for obtaining a constant needle pressure on the member to be inspected can be secured. .

Further, since each curved portion of the contact pin is formed to be curved in the same direction, the entire contact pin is also curved in the same direction together with each curved portion during overdrive, so that stress can be relieved and scrubbing can be performed smoothly. it can. Further, since the contact pins are covered with the resin except for the tip, even if the adjacent contact pins come into contact with each other when the contact pins are curved, no short circuit occurs. In addition, the contact pins are reinforced by the resin, so that the rigidity of even relatively thin contact pins can be improved, and in particular, a curved portion to which stress is applied can be reinforced.

In the probe device according to the present invention, the contact probe is the contact probe according to any one of the first to third aspects. The stress at the time of driving is distributed to the plurality of curved portions, so that a large amount of overdrive for obtaining a constant needle pressure can be ensured, and damage such as breakage can be prevented.

In the probe device according to the present invention, since a plurality of elastic portions are formed in series between the contact pin and the supporting member of the mechanical part, the stress is absorbed by dispersing the plurality of elastic portions during overdrive. As a result, a large amount of overdrive for obtaining a constant stylus pressure can be ensured, damage can be suppressed, and a smooth scrub can be performed.

The elastic portion has an elastic member provided between the holding member and the support member of the contact probe as a first elastic portion, and a curved portion formed on the contact pin as a second elastic portion. Therefore, the effect of the present invention can be obtained even when a conventional contact probe is mounted on the probe device according to the present invention. The contact probe according to any one of claims 1 to 3, further comprising an elastic member provided between the holding member and the support member of the contact probe as an elastic portion. The configuration in which the number of stages is formed in series or more makes it easier to control the overdrive amount for controlling the stylus pressure.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram of a probe device according to a first embodiment of the present invention.

FIG. 2 is a schematic plan view of a contact probe used in the probe device shown in FIG.

FIG. 3 is a schematic cross-sectional view of the contact probe shown in FIG. 2 along the line AA.

FIG. 4 is an enlarged view of a contact pin of the contact probe of FIG.

FIG. 5 is a sectional view of a contact pin portion of a contact probe in a contact pin arrangement direction.

FIG. 6 is a diagram of a measurement result showing a relationship between an overdrive amount and a stylus pressure of each probe device according to an embodiment of the present invention and a conventional example.

FIG. 7 is a schematic plan view of a contact probe according to a second embodiment of the present invention.

FIG. 8 is a sectional view taken along line BB of the contact probe shown in FIG. 7;

9 is an enlarged view of a contact pin of the contact probe in FIG.

10A and 10B are diagrams showing a conventional contact probe, wherein FIG. 10A is a plan view and FIG. 10B is a cross-sectional view taken along the line CC of FIG.

FIG. 11 is a plan view showing surface-arranged terminal electrodes of an IC chip.

12 is a partial perspective view of a probe device equipped with the contact probe shown in FIG.

13A and 13B show a probe device, wherein FIG. 13A is a plan view and FIG. 13B is a side view.

[Explanation of symbols]

 10, 20 Probe device 22, 50 Contact probe 24 Mounting base (holding member) 26 Stop mount 28 Top clamp (supporting member) 30 Coil spring (first elastic part) 40, 51 Film 42 Pattern wiring 42a, 54 Contact pin 42b Curved Part (second elastic part) 42c, 54C Beam part 54Aa First curved part (first elastic part) 54B Second curved part (second elastic part) J, Ja Photosensitive resin

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2G003 AG03 AG08 AG12 AG20 AH05 AH07 2G011 AA02 AA15 AB01 AB06 AB08 AC14 AF06 4M106 AA01 BA01 CA01 DD04 DD06 DD10 DD30

Claims (9)

[Claims] 1. A contact probe in which a plurality of pattern wirings are formed on a film, and each end of the pattern wirings is arranged in a protruding state from the front end of the film to be a contact pin. A plurality of contact probes are formed in series. 2. The contact probe according to claim 1, wherein the curved portions of the contact pin are formed to be curved in the same direction. 3. The contact probe according to claim 1, wherein the contact pins are covered with a resin except for a tip portion. 4. A probe in which a plurality of pattern wirings are formed on a film, and the tip of each of the pattern wirings is arranged so as to protrude from the front end of the film, and a contact probe serving as a contact pin is mounted by a mechanical part. In a device, the contact probe is the contact probe according to any one of claims 1 to 3. 5. A probe in which a plurality of pattern wirings are formed on a film, and each of the ends of the pattern wirings is protruded from the front end of the film, and a contact probe serving as a contact pin is mounted by a mechanical part. In the device, a plurality of elastic portions are formed in series between the contact pin and a support member of a mechanical part, wherein the probe device is provided. 6. The elastic portion has an elastic member provided between the holding member of the contact probe and the support member as a first elastic portion, and is formed on a contact pin as a second elastic portion. The probe device according to claim 5, further comprising a curved portion. 7. The probe device according to claim 5, wherein the contact pins are covered with a resin except for a tip portion. 8. The probe device according to claim 5, wherein the contact probe is the contact probe according to any one of claims 1 to 3. 9. The probe device according to claim 8, further comprising an elastic member provided between the holding member of the contact probe and the support member as the elastic portion.