JP2002228685A - Probe device - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To prevent bending of a contact pin and bending of a spring layer even by a sudden change in overdrive. SOLUTION: In a contact probe 1, a spring layer 7 is applied to the back surface of a film 4 thereof. The elastic body 22 is attached to the rigid body 21 in a gap t between the rigid body 21 protruding from the tip of the mounting base 23 and the tip of the spring layer 7.
Adhered to the side. A gap x was formed between the elastic body 22 and the tip of the spring layer 7. The contact pins 2a were attached to the surface of the film 4 without protruding from the tip of the film 4.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention
The present invention relates to a probe device provided with a contact probe for performing an electrical test by bringing a contact pin into contact with each electrode terminal of a CD (liquid crystal display) or the like.

[0002]

2. Description of the Related Art In general, a contact probe provided with contact pins is used for mechanically testing a semiconductor chip such as an IC chip or an LSI chip or a member to be inspected such as an LCD (liquid crystal display). A probe device mounted on a printed circuit board is used.

For example, as a prior art, in a contact probe 1 shown in FIGS. 3 and 4, a plurality of pattern wirings 2 made of, for example, a Ni alloy or the like are arranged, and a film 4 is coated thereon with an adhesive layer 3 interposed therebetween. Wearing film 4
A resin film layer 5 made of, for example, a polyimide resin or the like and a metal film layer 6 made of, for example, Cu serving as a ground are laminated. Further, a spring layer 7 is applied to the back surface of the film 4 over substantially the entire surface. Each end of the pattern wiring 2 is arranged at a narrow pitch and substantially parallel to each other and is located at the end of the film 4, and does not protrude from the film 4 and constitutes a contact pin 2 a.

The contact probe 1 is, for example, shown in FIG.
As shown in a plan view, it has a substantially home base shape in a plan view, and a tip 1a in which contact pins 2a are arranged at a narrow pitch at a tip of a narrow portion whose width is gradually reduced, and a tip opposite to the tip 1a. And a base 1b formed with a maximum width.
A substantially rectangular window 1c extending in a direction crossing the pattern wiring 2 is formed in the base 1b. Each wiring lead-out portion 2b of the pattern wiring 2 is connected to an electrode of a printed circuit board 8 described later through the window 1c.

[0005] The contact probe 1 having the above configuration
As shown in FIGS. 5 and 6, the probe device 10 is incorporated into the mechanical parts 9 together with the printed circuit board 8, and the terminals of a member to be inspected such as a semiconductor IC chip or an LCD are brought into contact with the contact pins 2a. .

More specifically, in the probe device 10 shown in FIGS. 5 and 6, for example, a top clamp 12 is mounted on a printed circuit board 8 having a substantially disk shape and having a central window 8a, and the contact probe 1 is attached to the lower surface thereof. Is fixed to the top clamp 12 with bolts or the like. Then, the base 1 of the contact probe 1 is clamped by the bottom clamp 15 having a substantially frame shape.
By pressing down the base b, the base 1b is pressed and fixed to the lower surface of the printed circuit board 8 by the elastic substance 16 of the bottom clamp 15. In this state, contact probe 1
6 is held in a state of being inclined downward in FIG.

As a result, the wiring lead portion 2b of the pattern wiring 2 is pressed through the window 1c against the substrate-side electrode 8b on the lower surface of the printed circuit board 8 and is kept in contact. In this state, the semiconductor IC chip 18
The terminal 18a such as a pad or a bump of a member to be inspected is pressed into contact with the contact pin 2a to perform an electrical test. On the other hand, the surface of the pad 18a such as the IC chip 18 formed of an Al (aluminum) alloy or the like is oxidized in the air and is covered with a thin aluminum surface oxide film. Therefore, in order to conduct an electrical test of the pad 18a, the surface oxide film of aluminum is peeled off and the aluminum inside is exposed,
It is necessary to ensure conductivity.

Therefore, in the contact probe 1, overdrive is applied while the contact pin 2a is in contact with the surface of the pad 18a (the pad 18a is further pulled up after the contact pin 2a contacts the pad 18a). The contact pin 2
The tip of a is used to scrape the surface oxide film of aluminum on the surface of the pad 18a to expose the aluminum inside. The above-described operation is called scrub, and is important for reliably performing an electrical test.

As another prior art, Japanese Patent Laid-Open No. 7-3
There is a probe device as disclosed in Japanese Patent No. 21170. Such a probe device has a spring holding body as an adjusting means for suppressing the pressure of the leaf spring portion (tip portion of the contact probe) of the probe blade (contact probe).

[0010]

In the probe device 10 as described above, the strength of the contact pins 2a is increased by the spring layer 7 attached to the back surface of the film 4 of the contact probe 1, and the overdrive is performed. It is aimed at absorbing the stress applied to the contact pin 2a sometimes and preventing the contact pin 2a from being damaged due to bending. However, when a sudden change in overdrive occurs due to an operator's operation error or the like, not only is the contact pin 2a bent, but also,
There is a possibility that even the spring layer 7 located on the back side of the film 4 on which the contact pins 2a are adhered is deformed and cannot be returned to its original state.
There is a possibility that the contact property between the contact probe 1 and the pad 18a may be impaired, and the contact probe 1 may need to be repaired or remanufactured. Also, in the probe device disclosed in Japanese Patent Application Laid-Open No. 7-321170, the contact probe does not include a spring layer, and the spring holding body is used only for adjusting a contact pin. It was attached and could not cope with such a sudden change in overdrive.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and it is possible to suppress the bending of a contact pin and the deformation of a spring layer attached to the back surface of a film even by a sudden change in overdrive. It is an object to provide a probe device.

[0012]

Means for Solving the Problems To solve the above problems,
In order to achieve such an object, the present invention is configured such that a plurality of pattern wirings are attached on a surface of a film, and a contact probe having each of the ends of the pattern wirings as a contact pin is attached to a mechanical part. In the probe device, the contact probe is one in which a spring layer is attached to a back surface of the film,
An elastic body adhered to the holding member is provided between the holding member of the contact probe and the tip of the spring layer in the mechanical part, and between the elastic body and the tip of the spring layer. Is characterized in that a gap is formed. Since the contact probe has the spring layer on the back surface side of the film, the stress applied to the contact pin during overdrive can be absorbed by the elastic deformation of the spring layer, and the contact pin can be prevented from bending. Moreover, on the upper side of the tip of the spring layer,
Since the elastic body is provided through a predetermined gap,
For example, even if a sudden change in overdrive occurs due to an operator's operation error or the like, and even if excessive stress is applied not only to the contact pins but also to the spring layer attached to the back surface of the film, the spring layer is After being elastically deformed until it comes into contact with the elastic body located above, the elastic body absorbs further deformation, not only bending of the contact pins, but also the spring layer is deformed and cannot return to its original state. Can be prevented.

The gap formed between the tip of the spring layer and the elastic body is 100 μm to 500 μm.
Is preferably set in such a range. When such a range is set, the degree of freedom of the contact pin can be ensured, and the deformation of the spring layer can be prevented. Here, if the gap is smaller than 100 μm, a predetermined overdrive amount may not be secured. On the other hand, if the gap is larger than 500 μm, the distance that the spring layer must deform before contacting the elastic body is large. Therefore, there is a possibility that the deformation of the spring layer exceeds the allowable range of elastic deformation and cannot be restored.

Further, in the probe device according to the present invention, when an excessive stress is applied to the spring layer during overdrive, the spring layer is elastically deformed until it comes into contact with the elastic body. Although the elastic body is absorbed by the body, the elastic body needs to be an elastic body having a certain degree of hardness in order to absorb the stress applied to the spring layer. Therefore, the amount of strain in a state where the elastic body is absorbing the stress applied to the spring layer (the vertical direction from when the spring layer comes into contact with the elastic body to when it is supported by the elastic deformation of the elastic body) Is relatively set to 10 μm or less. When the amount of strain of the elastic body is larger than 10 μm, the effect of absorbing the deformation of the spring layer by the elastic body is reduced, and there is a possibility that the spring layer is deformed and cannot be restored.

Further, the contact probe is characterized in that the contact pins are attached to a surface of the film. When a contact probe in which a film is present on the back surface side of such a contact pin is used in the probe device of the present invention, the strength of the contact pin can be secured by the film, and the effect of preventing damage due to bending can be obtained. Can be kept higher.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings, and the same parts as those in the above-mentioned prior art will be denoted by the same reference numerals and description thereof will be omitted. FIG. 1 is a longitudinal sectional view of the probe device according to the present embodiment, and FIG. 2 is an enlarged sectional view of a main part of the probe device in FIG.

As shown in FIGS. 1 and 2, the probe device 20 according to the present embodiment is one in which the contact probe 1 is incorporated together with the printed circuit board 8 by the mechanical parts 9. This contact probe 1
Has a configuration similar to that of the prior art in FIGS. 3 and 4 described above, and a plurality of pattern wirings 2 are adhered to the surface of a film 4 in which a resin film layer 5 and a metal film layer 6 are laminated. Further, a thin plate-like spring layer 7 made of a spring rope such as a SUP material specified in JIS G 4801 is adhered to almost the entire back surface of the film 4. At the leading end of the film 4 (the leading end 1a of the contact probe 1), the leading ends of the pattern wirings 2 are arranged almost in parallel at a narrow pitch to form contact pins 2a, and the contact pins 2a are attached to the film 4. It has been done. That is, the contact pins 2 a are in a state where they do not protrude from the leading end of the film 4.

As shown in FIGS. 1 and 2, the contact probe 1 as described above is assembled with mechanical parts 9 together with a printed circuit board 8 in the same manner as in the above-mentioned prior art to form a probe device 20. Here, the contact probe 1 is attached to the lower surface 23a with an adhesive or the like.
The mounting base 23 to which the contact probe 1 is attached has a function as a holding member for the contact probe 1, and a tip portion (a portion located in the tip direction of the attached contact probe 1) is provided with the contact probe 1. A rigid body portion 21 is formed so as to protrude through a gap t from above the distal end portion 1a.

An elastic body 22 made of, for example, rubber or a coil spring is provided in a gap t between the rigid body 21 and the tip 1a of the contact probe 1 (the tip of the spring layer 7).
Is provided at a position from the distal end side of the contact probe 1 in the gap t so as to be adhered to the rigid body portion 21. Moreover, a gap x is formed between the elastic body 22 and the tip of the spring layer 7 (the tip 1a of the contact probe 1), and the gap x is set in a range of 100 μm ≦ x ≦ 500 μm. ing.

At this time, the elastic body 22 includes the rigid body 21 and the tip of the spring layer 7 (the tip 1a of the contact probe 1).
The elastic body 22 and the spring layer 7 are arranged in series in the direction in which the stress applied during overdrive is transmitted. Furthermore, since the elastic body 22 is provided at a portion from the tip side of the contact probe 1, it is located immediately above the tip portion of the contact pin 2a.

According to the probe device 20 as described above,
The contact pins 2 a of the contact probe 1 incorporated by the mechanical parts 9 are attached to the surface of the film 4, and further,
Since the spring layer 7 is applied over substantially the entire surface, the strength of the contact pin 2a can be increased by the film 4, and the spring layer 7 is elastically deformed at the time of overdrive, so that the stress applied to the contact pin 2a is increased. And the bending of the contact pin 2a can be prevented, so that an electrical test of the member to be inspected can be performed while maintaining good contact properties.

Further, immediately above the tip of the spring layer 7,
Since the elastic body 22 is arranged via the gap x,
For example, even if a sudden change in overdrive occurs due to an operator's operation error or the like, and excessive stress is applied to the spring layer 7 located above the contact pin 2a, the spring layer 7 Since the elastic member 22 is elastically deformed until the contact is made, the elastic body 22 absorbs the subsequent deformation, so that not only the bending of the contact pin 2a but also the spring layer 7 is formed.
It is possible to avoid a situation in which the contact probe cannot be restored to its original state, and it is not necessary to repair or remanufacture the contact probe, so that an electrical test can be performed efficiently.

The gap x formed between the tip of the spring layer 7 and the elastic body 22 is 100 μm ≦ x ≦ 500 μm
, The degree of freedom of the contact pin 2a can be ensured to obtain good contact performance, and the deformation of the spring layer 7 can be prevented. If the gap x is smaller than 100 μm, a predetermined overdrive amount may not be secured.
When the thickness is larger than 00 μm, the distance that the spring layer 7 must deform before contacting the elastic body 22 increases, and the deformation of the spring layer 7 may exceed the allowable range of elastic deformation and may not be restored. Would.

Further, in the probe device 20 according to the present invention, when an excessive stress is applied to the spring layer 7 during overdrive, the spring layer 7 is elastically deformed until it comes into contact with the elastic body 22, and thereafter, Although the deformation of the spring layer 7 is absorbed by the elastic body 22, the amount of distortion of the elastic body 22 at this time (after the spring layer 7 comes into contact with the elastic body 22 and is supported by the elastic deformation of the elastic body 22). Elastic body 2 of the spring layer 7 in the vertical direction until the state
2) is preferably set to be 10 μm or less. When the amount of strain of the elastic body 22 is larger than 10 μm, the effect of absorbing the deformation of the spring layer 7 by the elastic body 22 is reduced, and there is a possibility that the spring layer 7 is deformed and cannot be restored.

In the present embodiment, the contact pin 2a located at the tip of the pattern wiring 2 is
In the above description, the pattern wiring 2 does not protrude from the front end portion, but the pattern wiring 2 may be arranged in a protruding state from the front end portion of the film 4 and the protruding portion may be the contact pin 2a. In such a case, the spring layer 7 is made to protrude from the front end of the film 4 and is positioned immediately above the contact pin 2a, so that the contact pin 2a
The contact pin 2a is bent more than necessary.
It is preferable to suppress by contact with Further, in this case, for example, an insulating material may be attached to the surface of the spring layer 7 protruding from the film 4 on the contact pin 2a side so that the contact pin 2a and the spring layer 7 do not conduct. preferable.

In this embodiment, the rigid body 21
The elastic body 22 is provided by bonding only to a part of the rigid body portion 22 from the distal end side in a gap t between the contact probe 1 and the distal end portion 1a of the contact probe 1 (the distal end portion of the spring layer 7), but is not limited thereto. Alternatively, the elastic body 22 may be provided by bonding the entire surface of the rigid body portion 22 facing the gap t.

In the present embodiment, the rigid body 21 is formed so as to protrude from the tip of the mounting base 23, and the elastic body 22 is provided between the rigid body 21 and the tip of the spring layer 7. The rigid part 21 is not formed at the tip of the mounting base 23 without being limited thereto, and a portion corresponding to the rigid part 21 is mounted on the mounting base 23.
And may be formed integrally.

Furthermore, in the present embodiment, the present invention is applied to an IC contact probe, but it may be applied to other devices. For example, the present invention can be applied to a contact probe used for an IC chip test socket mounted on an IC chip burn-in test device or the like or a contact probe used for an LCD test probe device for protecting the IC chip by holding it inside. Good.

[0029]

As described above, according to the present invention, since the contact probe has the spring layer on the back side of the film, the stress applied to the contact pin during overdrive is reduced by the elasticity of the spring layer. As it can be absorbed by deformation and can prevent bending of the contact pin,
An electrical test of the inspected member can be performed while maintaining good contact properties. Further, since the elastic body is provided above the distal end portion of the spring layer via a predetermined gap, a sudden change in overdrive occurs due to, for example, an operator's operation error or the like, and only the contact pin Even if excessive stress is applied to the spring layer attached to the back side of the film instead of the film, after the spring layer elastically deforms until it contacts the elastic body located above it, This eliminates not only the bending of the contact pins but also the situation where the spring layer is deformed and cannot return to its original state, eliminating the need for repair or remanufacture of the contact probe. Electrical test can be performed.

Further, by using a contact probe in which the contact pins are attached to the front surface of the film and the film is present on the back side of the contact pins in the probe device of the present invention, the contact pins of the film can be used. The effect of ensuring strength can be obtained, and the effect of preventing breakage due to bending can be kept higher.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view of a probe device according to an embodiment of the present invention.

FIG. 2 is an enlarged sectional view of a main part of the probe device in FIG.

FIG. 3 is a plan view showing a contact probe mounted on a conventional probe device.

FIG. 4 is a view of the contact probe AA in FIG. 3;
It is a line sectional view.

FIG. 5 is an exploded perspective view showing a conventional probe device.

6 is a longitudinal sectional view of the probe device in FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Contact probe 2 Pattern wiring 2a Contact pin 4 Film 7 Spring layer 8 Printed circuit board 9 Mechanical parts 12 Top clamp 15 Bottom clamp 20 Probe device 21 Rigid part 22 Elastic body 23 Mounting base t Between rigid part and tip of spring layer X The gap between the elastic body and the tip of the spring layer

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Yoshiaki Kawakami Twelve-six Techno Park, Mita-shi, Hyogo Mitsubishi Materials Corporation Mita Plant (72) Inventor Hayato Sasaki Twelve-six Techno Park, Mita-shi, Hyogo Inside the Mita Plant of Mitsubishi Materials Corporation (72) Inventor Takao Iwakoshi at 12-12 Techno Park, Mita City, Hyogo Prefecture Inside of the Mita Plant Mitsubishi Materials Corporation (72) Inventor Naoki Kato, 12-12 Techno Park, Mita City, Hyogo Prefecture Mitsubishi Materials Corporation Mita Plant F term (reference) 2G003 AA07 AG03 AG12 AH05 AH07 2G011 AA15 AA21 AB01 AB06 AB08 AC02 AC14 AE01 AE03 AF06 4M106 AA02 AA04 DD09 DD10 DD12

Claims (2)

[Claims] 1. A probe device comprising a plurality of pattern wirings attached to a surface of a film, and contact probes each having a tip as a contact pin attached to a mechanical part. A spring layer is adhered to the back surface of the film, and further comprises an elastic body bonded to the holding member between the holding member of the contact probe and the tip of the spring layer in the mechanical part. And a gap is formed between the elastic body and the tip of the spring layer. 2. The probe device according to claim 1, wherein the contact probe has the contact pins attached to a surface of the film.