JP2002009041A - Wet treatment device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve the problem that a particle adheres again by allowing treatment liquid to remain near the center of a substrate that is highlighted according to enlargement in the size of the substrate since plane treatment is carried out to a glass substrate, in a method for performing washing treatment to the substrate that is being conveyed with slant attitude on a substrate conveyance path that is slanted in a surface that orthogonally crosses a conveyance direction as the washing method of the glass substrate. SOLUTION: In a curved state where the center part of a substrate 1 becomes higher, treatment liquid 8 flows and is discharged from the center of the substrate 1 to an end part without stagnation to allow the surface of the substrate 1 to be subjected to chemical liquid or pure water spry treatment, thus eliminating the need for draining the chemical liquid on the front and rear surfaces of the substrate to prevent the chemical liquid after the chemical liquid treatment from being taken out, and at the same time reducing the readhesion of the particle to the surface of the substrate after the pure water spray treatment.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a substrate processing apparatus,
In particular, the present invention relates to a wet processing apparatus used for etching a substrate surface or cleaning a substrate surface.

[0002]

2. Description of the Related Art Conventionally, as a method of cleaning a glass substrate, for example, Japanese Patent Application Laid-Open No. 08-039742 discloses that a glass substrate is conveyed in an inclined posture on a substrate conveyance path inclined in a plane perpendicular to the conveyance direction. A method for performing a cleaning process on a growing substrate is shown.

[0003]

However, since this cleaning treatment method is a planar treatment for a glass substrate, the treatment liquid near the center of the substrate, which is getting close up as the size of the substrate is increased. It has not been a solution to the problem of redeposition of particles due to stagnation. Furthermore, in the inclined conveyance path, the load of the substrate is biased toward the lower conveyance roller, and there is a problem that the conveyance is not stable.

An object of the present invention is to provide an etching solution or
An object of the present invention is to provide a wet processing apparatus capable of solving a problem caused by the stay of a cleaning liquid near the center of a substrate.

[0005]

A wet processing apparatus according to the present invention is a wet processing apparatus for dropping a processing solution for processing the surface of the substrate from above the substrate onto the surface of the substrate while transporting the substrate. Wherein the transfer of the substrate is performed by bending the substrate upward, wherein the bending of the substrate sandwiches both ends of the substrate between upper and lower transfer rollers, and at least a central portion of the substrate is an intermediate roller. This is performed by pushing up the central portion of the substrate above the substrate, or the substrate is curved such that both ends of the substrate are sandwiched between upper and lower transport rollers, and the central portion of the substrate is placed in the first position.
The intermediate roller pushes up the central portion of the substrate above the substrate, and the second intermediate roller provided between the central portion of the substrate and both ends of the substrate raises the substrate above the substrate. The intermediate rollers other than the upper and lower transport rollers at both ends of the substrate have a diameter longer than the diameter of the transport rollers below both ends of the substrate, and the intermediate roller is The diameter becomes longer as approaching the center of the substrate, and the diameter becomes the maximum length at the center of the substrate.

In the wet processing apparatus described above, the treatment liquid is dropped on the surface of the substrate by spraying, and more specifically, the treatment liquid is dropped on the surface of the substrate. It is performed by spraying from a plurality of spray nozzles provided above, or, the dripping of the treatment liquid onto the surface of the substrate is performed by spraying from one spray nozzle provided above the substrate,
The one spray nozzle may be located right above a central portion of the substrate, and the substrate may be a transparent substrate on which a thin film transistor is mounted.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Before describing embodiments of the present invention, the features of the present invention will be described. The wet processing apparatus of the present invention performs a chemical solution treatment and a pure water treatment while maintaining the substrate in a curved state when performing wet processing on the front and back surfaces of the substrate in a single-wafer manner, thereby reducing reattachment of particles to the substrate. This eliminates the need for a draining operation from the surface of the substrate after the substrate is subjected to the chemical treatment.

That is, transport rollers are disposed at both ends of the rear surface of the substrate, and are supported by intermediate rollers having a diameter larger than that of the transport rollers between the transport rollers. An upper roller is provided at the edge of the front surface of the substrate, and is paired with the transport roller at both ends of the back surface to sandwich both ends of the substrate. A spray nozzle for chemical solution treatment and pure water treatment is mounted above the substrate. Have been. The substrate is bent by sandwiching the edge of the substrate between the loading roller and the transport roller, and pressing the center line of the rear surface of the substrate with the intermediate roller, and sequentially performs the chemical solution treatment and the pure water spray process while transporting the substrate in this state.

Next, a first embodiment of the present invention will be described with reference to FIG. FIG. 1 is a schematic cross-sectional view showing a state where the wet processing apparatus according to the first embodiment of the present invention is cut along with a substrate being transported on a plane perpendicular to the substrate transport direction.

First, a transport roller 2 is disposed at both ends of the back surface of a substrate 1 made of a material such as glass, and an intermediate roller 3 having a diameter larger than that of the transport roller 2 is provided between the transport rollers 2.
I support. In addition to the intermediate roller 3 at the center of the substrate 1, an intermediate roller 4 is provided between both ends of the substrate 1 and the intermediate roller 3. Each diameter is set so that the diameter of the roller 3 is the largest and gradually decreases toward the transport roller 2.

In this embodiment, an example in which three intermediate rollers are provided is shown. However, in the case where only intermediate rollers at the center of the substrate are used, four or more intermediate rollers are provided in addition to the intermediate rollers at the center of the substrate. A case where an even number of intermediate rollers are provided is also considered as a modification of the present embodiment.

The transport rollers 2 at both ends of the back surface of the substrate 1
In addition to the above, an upper roller 5 is provided at an end of the surface of the substrate 1, and a plurality of spray nozzles 7 are attached to a spray pipe 6 above the substrate 1. It is configured.

The substrate 1 is sandwiched between the both ends of the substrate 1 by the loading roller 5 and the transport roller 2, the center of the back surface of the substrate 1 is pushed up by the intermediate roller 3, and the pushing of the substrate 1 at the center is supported by the intermediate roller 4. By doing so, the substrate 1 is held in a curved shape in which the central portion of the substrate 1 becomes higher.

The degree of the curvature varies depending on the material of the substrate, but in the case of a glass substrate or the like used for a liquid crystal panel, for example, the planar shape is 680 mm × 880 m.
m, in the case of a glass substrate with a thickness of 0.7 mm,
The upper limit for bending is a state in which the center of the glass substrate protrudes 70 mm from when it is flat, and the lower limit for bending is obtained by adding the thickness of the glass substrate to the height difference of the transport rollers at both ends of the glass substrate. Value is required.

Next, the operation of the wet processing apparatus 20 will be described with reference to FIG.

First, the transport roller 2, the intermediate rollers 3, 4, and the upper roller 5 are moved in the direction of carrying out the substrate 1 (any direction perpendicular to the paper) by a drive unit (not shown) using a motor and gears. By rotating, the substrate 1 is transported while maintaining the curved state.

Next, a processing liquid 8 is supplied to a spray pipe 6 disposed above the substrate 1, and the processing liquid 8 is discharged to the surface of the substrate 1 by a spray nozzle 7, thereby performing chemical liquid processing and pure water spray processing. Perform sequentially.

As an effect of the present embodiment, first, in the cleaning process of the substrate 1, floating particles in the cleaning processing solution due to stagnation of the cleaning solution on the surface of the substrate 1 are removed.
This means that redeposition on the surface can be reduced.

The reason for this is that pure water spraying is performed on the surface of the substrate 1 in a curved state in which the central portion of the substrate 1 is raised. The treated water containing the generated particles flows in the direction of arrow X in the figure without stagnation and is discharged.

As a second effect, there is no need to remove the chemical solution on the front and back surfaces of the substrate 1 to prevent the chemical solution from being taken out after the chemical solution treatment.

The reason is that after the substrate 1 is treated with the chemical solution, the substrate 1
Since the substrate 1 is conveyed to the washing tank in a curved state in which the central portion of the substrate 1 is raised, the chemical solution flows down without stagnating on the substrate 1 and is discharged from the surface of the substrate 1.

Next, a second embodiment of the present invention will be described with reference to FIG. FIG. 2 is a schematic cross-sectional view showing a state where the wet processing apparatus according to the second embodiment of the present invention is cut along with a substrate being transported on a plane perpendicular to the substrate transport direction.

First, transport rollers 2 are provided at both ends of the back surface of the substrate 1.
Are disposed, and the substrate 1 is supported by an intermediate roller 3 having a diameter larger than that of the transport roller in the middle of the transport roller 2. An upper roller 5 is provided at an end of the surface of the substrate 1, and a spray nozzle 17 for chemical solution treatment and pure water treatment is attached above a central portion of the substrate 1. A wet treatment device 30 is configured by a combination thereof. I have.

In this embodiment, the substrate 1
By providing only the spray nozzle 17 positioned above the central portion of the substrate 1, and by using the spray nozzle 17 as a nozzle having a large flow rate, the cleaning treatment water containing the particles generated by the cleaning process flows from the central portion of the substrate 1 to the end. Since the particles flow into the section without further stagnation than in the first embodiment, the reattachment of particles to the surface of the substrate 1 can be further reduced.

[0025]

As described above, the wet processing apparatus of the present invention performs the chemical treatment or the pure water spray treatment on the surface of the substrate in a curved state in which the central portion of the substrate is raised. Since the liquid flows from the center of the substrate to the end without stagnating and discharged, the work of draining the chemical solution on the front and back surfaces of the substrate to prevent the chemical solution from being taken out after the chemical solution treatment is not required. Reattachment of particles after spraying to the surface of the substrate can be reduced.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view showing a wet processing apparatus according to a first embodiment of the present invention.

FIG. 2 is a schematic sectional view showing a wet processing apparatus according to a second embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 Transport roller 3, 4 Intermediate roller 5 Extra roller 6 Spray pipe 7, 17 Spray nozzle 8 Treatment liquid 20, 30 Wet treatment device

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01L 21/306 J

Claims (10)

[Claims] 1. A wet processing apparatus for dropping a processing liquid for treating the surface of the substrate from above the substrate while transporting the substrate, wherein the transport of the substrate moves the substrate upward. A wet processing apparatus characterized by being bent. 2. The method according to claim 1, wherein the substrate is curved by sandwiching both ends of the substrate between upper and lower transport rollers and pushing at least a central portion of the substrate above the substrate by an intermediate roller. Item 4. A wet processing apparatus according to Item 1. 3. The curvature of the substrate is such that both ends of the substrate are sandwiched between upper and lower transport rollers, and a central portion of the substrate is pushed up above the substrate by a first intermediate roller, and The wet processing apparatus according to claim 1, wherein the processing is performed by pushing up the substrate above the substrate by a second intermediate roller provided between a central portion of the substrate and both ends of the substrate. 4. The wet processing apparatus according to claim 2, wherein a diameter of an intermediate roller other than upper and lower transport rollers at both ends of the substrate is longer than a diameter of a transport roller below both ends of the substrate. 5. The wet processing apparatus according to claim 4, wherein the diameter of the intermediate roller increases as it approaches the center of the substrate, and the diameter of the intermediate roller is the maximum at the center of the substrate. 6. The wet processing apparatus according to claim 1, wherein the treatment liquid is dropped on the surface of the substrate by spraying. 7. The method according to claim 1, wherein the treatment liquid is dropped on a surface of the substrate by spraying from a plurality of spray nozzles provided above the substrate.
7. The wet processing apparatus according to 5 or 6. 8. The method according to claim 1, wherein the treatment liquid is dropped on a surface of the substrate by spraying from a single spray nozzle provided above the substrate.
7. The wet processing apparatus according to 5 or 6. 9. The wet processing apparatus according to claim 8, wherein the one spray nozzle is located immediately above a central portion of the substrate. 10. The method according to claim 1, wherein the substrate is a transparent substrate on which a thin film transistor is mounted.
10. The wet processing apparatus according to 7, 8 or 9.