JP2000278041A - Voltage controlled oscillator - Google Patents
Voltage controlled oscillatorInfo
- Publication number
- JP2000278041A JP2000278041A JP11078297A JP7829799A JP2000278041A JP 2000278041 A JP2000278041 A JP 2000278041A JP 11078297 A JP11078297 A JP 11078297A JP 7829799 A JP7829799 A JP 7829799A JP 2000278041 A JP2000278041 A JP 2000278041A
- Authority
- JP
- Japan
- Prior art keywords
- shield cover
- insulating substrate
- controlled oscillator
- voltage controlled
- connection terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 55
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 17
- 229910000679 solder Inorganic materials 0.000 claims description 14
- 238000009413 insulation Methods 0.000 abstract 6
- 238000005476 soldering Methods 0.000 description 12
- 239000004020 conductor Substances 0.000 description 8
- 230000010355 oscillation Effects 0.000 description 8
- 239000011347 resin Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 239000011120 plywood Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Oscillators With Electromechanical Resonators (AREA)
- Inductance-Capacitance Distribution Constants And Capacitance-Resistance Oscillators (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電圧制御発振器に
関する。[0001] The present invention relates to a voltage controlled oscillator.
【０００２】[0002]
【従来の技術】従来の電圧制御発振器を図８及び図９に
従って説明する。電圧制御発振器は絶縁基板３１と、絶
縁基板３１の上面をを覆う箱形のシールドカバー３２と
から構成される。2. Description of the Related Art A conventional voltage controlled oscillator will be described with reference to FIGS. The voltage controlled oscillator includes an insulating substrate 31 and a box-shaped shield cover 32 that covers the upper surface of the insulating substrate 31.
【０００３】まず、絶縁基板３１は、その上面３１ａに
電圧制御発振回路の電子部品（図示せず）が設けられて
いる。そして、絶縁基板３１の端面３１ｂには、絶縁基
板３１を上下方向に切り欠いて形成した溝部３３が設け
られている。ここで、溝部３３はその内壁面に、例え
ば、無電解メッキによって導体層（図示せず）が形成さ
れている。また、絶縁基板３１は、その端面３１ｂの四
隅を上下方向に溝状に切り欠いて形成した第一乃至第四
の切欠部３４、３５、３６、３７が形成されている。そ
して、第一乃至第四の切欠部３４、３５、３６、３７の
内壁面には、例えば、無電解メッキによって導体層（図
示せず）が形成されている。そして、第一乃至第四の切
欠部３４、３５、３６、３７のそれぞれの絶縁基板３１
の上面３１ａ側の端部３４ａ、３５ａ、３６ａ、３７ａ
が電圧制御発振回路を構成する電子部品に接続される。[0003] First, an insulating substrate 31 is provided on its upper surface 31a with electronic components (not shown) of a voltage controlled oscillator circuit. The end face 31b of the insulating substrate 31 is provided with a groove 33 formed by cutting the insulating substrate 31 in the vertical direction. Here, a conductor layer (not shown) is formed on the inner wall surface of the groove 33 by, for example, electroless plating. The insulating substrate 31 has first to fourth cutouts 34, 35, 36, and 37 formed by cutting four corners of the end face 31b in a vertical direction. A conductor layer (not shown) is formed on the inner wall surfaces of the first to fourth notches 34, 35, 36, and 37 by, for example, electroless plating. Then, each of the insulating substrates 31 of the first to fourth cutouts 34, 35, 36, 37
34a, 35a, 36a, 37a on the upper surface 31a side of
Are connected to electronic components constituting the voltage controlled oscillation circuit.
【０００４】次に、シールドカバー３２は、開口部を有
する下面（図示せず）と、上面３２ａと、四つの側面３
２ｂとを有している。そして、側面３２ｂのそれぞれに
は下面方向に突出して形成した凸部３２ｃと、隣り合う
側面３２ｂ同士の接続部の下面側の四隅を切り欠いて形
成した凹部３２ｄとが設けられている。そして、シール
ドカバー３２は、四つの側面３２ｂの下端３２ｅが絶縁
基板３１の上面３１ａに当接するとともに、凸部３２ｃ
を絶縁基板３１に設けた溝部３３にはめ込んで絶縁基板
３１の上面３１ａに設けた電圧制御発振回路を覆うよう
にして取り付けられる。そして、シールドカバー３２の
側面３２ｂに設けた凸部３２ｃは絶縁基板３１に設けた
溝部３３の導体層に半田付けされる。なお、シールドカ
バー３２は、凹部３２ｄによって第一乃至第四の切欠部
３４、３５、３６、３７の導体層とシールドカバー３２
とが接触しないようになっている。[0004] Next, the shield cover 32 has a lower surface (not shown) having an opening, an upper surface 32a, and four side surfaces 3a.
2b. Each of the side surfaces 32b is provided with a convex portion 32c formed so as to protrude in the lower surface direction, and a concave portion 32d formed by cutting out four corners on the lower surface side of a connection portion between the adjacent side surfaces 32b. The shield cover 32 is configured such that the lower ends 32e of the four side surfaces 32b abut on the upper surface 31a of the insulating substrate 31 and the protrusions 32c
Is fitted in a groove 33 provided in the insulating substrate 31 so as to cover the voltage-controlled oscillation circuit provided on the upper surface 31a of the insulating substrate 31. Then, the protrusion 32 c provided on the side surface 32 b of the shield cover 32 is soldered to the conductor layer of the groove 33 provided on the insulating substrate 31. In addition, the shield cover 32 is formed by forming the first to fourth notches 34, 35, 36, and 37 with the conductor layers of the shield cover 32 by the concave portions 32 d.
And do not come into contact.
【０００５】ここで、図９に示すように、電圧制御発振
器を、例えば、携帯電話機の送受信ユニットのマザー基
板３８に取り付ける場合には、絶縁基板３１を下にして
マザー基板３８に載置する。そして、絶縁基板３１の端
面３１ｂに形成した溝部３３の導体層の下面側の端部３
３ａ及び絶縁基板３１の四隅に形成した第一乃至第四の
切欠部３４、３５、３６、３７の導体層の下面側の端部
３４ｂ、３５ｂ、３６ｂ、３７ｂをマザー基板３８の上
面３８ａに設けた半田付けランド（図示せず）に当接
し、半田付けする。そして、溝部３３の導体層が半田付
けされた半田付けランドを接地することで、シールドカ
バー３２が接地されるようにしている。また、第一乃至
第四の切欠部３４、３５、３６、３７の導体層が半田付
けされた半田付けランドは、それぞれが、例えば、電源
や周波数変換器等に接続される。Here, as shown in FIG. 9, when a voltage-controlled oscillator is mounted on a motherboard 38 of a transmitting / receiving unit of a portable telephone, for example, the voltage-controlled oscillator is mounted on the motherboard 38 with the insulating substrate 31 facing down. The end 3 of the groove 33 formed on the end surface 31b of the insulating substrate 31 on the lower surface side of the conductor layer is formed.
3a and the lower end 34b, 35b, 36b, 37b of the first to fourth cutouts 34, 35, 36, 37 formed at the four corners of the insulating substrate 31 are provided on the upper surface 38a of the mother substrate 38. A solder land (not shown). The shield cover 32 is grounded by grounding the solder land to which the conductor layer of the groove 33 is soldered. Each of the solder lands to which the conductor layers of the first to fourth notches 34, 35, 36, and 37 are soldered is connected to, for example, a power supply or a frequency converter.
【０００６】[0006]
【発明が解決しようとする課題】ところで、従来の電圧
制御発振器においては、上述のようにシールドカバー３
２を、絶縁基板３１に設けた接地された溝部３３の導体
層に凸部３２ｃを半田付けして接地及び取り付けている
ので、溝部３３を必要とする。ところが、絶縁基板３１
にシリコン基板やガラス基板を使用した場合には、溝部
３３を形成することが難しく、その加工の際に絶縁基板
を破損してしまうという問題があった。By the way, in the conventional voltage controlled oscillator, as described above, the shield cover 3
2 is grounded and attached to the conductor layer of the grounded groove portion 33 provided on the insulating substrate 31 by soldering the convex portion 32c, so that the groove portion 33 is required. However, the insulating substrate 31
When a silicon substrate or a glass substrate is used, it is difficult to form the groove 33, and there is a problem that the insulating substrate is damaged during the processing.
【０００７】本発明はこの問題を解決するためのもの
で、その目的は、絶縁基板を加工することなくシールド
カバーを取り付けられるようにすることにある。The present invention has been made to solve this problem, and an object of the present invention is to enable a shield cover to be attached without processing an insulating substrate.
【０００８】[0008]
【課題を解決するための手段】上記問題を解決するため
の第一の解決手段として、上面に電子部品が取り付けら
れた絶縁基板と、絶縁基板の上面に取り付けられ、一方
の面に開口部を有する箱形のシールドカバーとを有し、
シールドカバーは金属板と絶縁板と外部接続用の接続端
子の三層からなり、その内壁面が金属板で、外壁面が絶
縁板でそれぞれ構成され、外壁面に接続端子が取り付け
られ、シールドカバーを電子部品を覆った状態で接続端
子を絶縁基板に半田付けするようにした。As a first means for solving the above-mentioned problems, an insulating substrate having an electronic component mounted on the upper surface and an opening mounted on the upper surface of the insulating substrate are provided on one surface. Having a box-shaped shield cover,
The shield cover consists of three layers: a metal plate, an insulating plate, and connection terminals for external connection.The inner wall surface is made of a metal plate, the outer wall surface is made of an insulating plate, and the connection terminals are attached to the outer wall surface. The connection terminals are soldered to the insulating substrate while the electronic components are covered.
【０００９】また、第二の解決手段として、接続端子を
シールドカバーの上面まで導出し、シールドカバーの上
面を下にして、半田付けランドが上面に形成されたマザ
ー基板に接続端子と半田付けランドが当接するように載
置するとともに、接続端子と半田付けランドとを半田付
けするようにした。As a second solution, the connection terminals are led out to the upper surface of the shield cover, and the connection terminals and the solder lands are placed on the mother board having the upper surface of the shield cover facing down. Are placed so as to be in contact with each other, and the connection terminals and the solder lands are soldered.
【００１０】また、第三の解決手段として、シールドカ
バーの開口部を有する面を囲む四方の面の下部を前記シ
ールドカバーの内側に折り込み、折り込んだ部分が絶縁
基板に接触しないようにした。As a third solution, the lower portions of the four sides surrounding the surface having the opening of the shield cover are folded inside the shield cover so that the folded portion does not contact the insulating substrate.
【００１１】[0011]
【発明の実施の形態】本発明の電圧制御発振器を図１乃
至図７に従って説明する。ここで、図１は本発明の電圧
制御発振器の斜視図を示し、図２は本発明の電圧制御発
振器を形成するシールドカバー及び絶縁基板の斜視図を
示し、図３は本発明のシールドカバーと絶縁基板との接
続部の要部拡大図を示し、図４は本発明の電圧制御発振
器をマザー基板に取り付けるときの斜視図を示し、図５
は本発明の電圧制御発振器をマザー基板に取り付けたと
きの斜視図を示し、図６は本発明の電圧制御発振器のシ
ールドカバーを構成する合板の斜視図を示し、図７は本
発明の電圧制御発振器のシールドカバーの展開図を斜視
図で示している。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A voltage controlled oscillator according to the present invention will be described with reference to FIGS. Here, FIG. 1 shows a perspective view of the voltage controlled oscillator of the present invention, FIG. 2 shows a perspective view of a shield cover and an insulating substrate forming the voltage controlled oscillator of the present invention, and FIG. FIG. 4 is an enlarged view of a main part of a connection portion with an insulating substrate. FIG. 4 is a perspective view when the voltage controlled oscillator of the present invention is mounted on a mother substrate.
FIG. 6 is a perspective view of the voltage-controlled oscillator of the present invention mounted on a mother board, FIG. 6 is a perspective view of a plywood constituting a shield cover of the voltage-controlled oscillator of the present invention, and FIG. FIG. 2 is a perspective view showing a development view of a shield cover of the oscillator.
【００１２】まず、本発明の電圧制御発振器を図１乃至
図５に従って説明する。本発明の電圧制御発振器は、絶
縁基板１と、下面に開口部（図示せず）を有し、絶縁基
板１の上面１ａを覆う箱形のシールドカバー２とから構
成されている。絶縁基板１は、その上面１ａに電圧制御
発振回路（図示せず）を構成する電子部品（図示せず）
と、後述する接続端子が半田付けされる複数個の端子取
付部１ｂとが設けられている。そして、電圧制御発振回
路を構成する電子部品（図示せず）は、それぞれが各端
子取付部１ｂに接続される。First, a voltage controlled oscillator according to the present invention will be described with reference to FIGS. The voltage-controlled oscillator of the present invention includes an insulating substrate 1 and a box-shaped shield cover 2 having an opening (not shown) on the lower surface and covering the upper surface 1a of the insulating substrate 1. The electronic component (not shown) which forms the voltage control oscillation circuit (not shown) on the upper surface 1a of the insulating substrate 1
And a plurality of terminal mounting portions 1b to which connection terminals to be described later are soldered. Then, electronic components (not shown) constituting the voltage controlled oscillation circuit are connected to the respective terminal mounting portions 1b.
【００１３】シールドカバー２は、図３に示すように、
その内壁面２ｂがアルミ等の金属部材で形成されてお
り、外壁面２ｃが絶縁性を有するエポシキ等の樹脂部材
で形成されている。なお、内壁面２ｂを形成する金属部
材は、絶縁基板１の上面１ａに設けた電圧制御発振回路
から信号が外部に漏れないように設けられており、外壁
面２ｃを形成する樹脂部材は、後述する接続端子が内壁
面２ｂを形成する金属部材と電気的に接続されないよう
に設けられている。The shield cover 2 is, as shown in FIG.
The inner wall surface 2b is formed of a metal member such as aluminum, and the outer wall surface 2c is formed of an insulating resin member such as epoxy. The metal member forming the inner wall surface 2b is provided so that a signal does not leak to the outside from a voltage-controlled oscillation circuit provided on the upper surface 1a of the insulating substrate 1. The resin member forming the outer wall surface 2c is described later. The connection terminal is provided so as not to be electrically connected to the metal member forming the inner wall surface 2b.
【００１４】そして、シールドカバー２の四つの側面２
ｄには、例えば、銅箔を帯状に形成した複数個の接続端
子３が設けられている。そして、各接続端子３は、それ
ぞれがシールドカバー２の側面２ｄの上端２ｅから下端
２ｆに至るように形成されている。そして、各接続端子
３のそれぞれの一端３ａがシールドカバー２の上面２ａ
に延出されている。そして、シールドカバー２の四つの
側面２ｄの下端２ｆは、図３に示すように、シールドカ
バー２の内側方向に向かって折り込まれる。The four sides 2 of the shield cover 2
For example, d is provided with a plurality of connection terminals 3 formed of a copper foil in a strip shape. Each connection terminal 3 is formed so as to extend from the upper end 2 e to the lower end 2 f of the side surface 2 d of the shield cover 2. One end 3a of each connection terminal 3 is connected to the upper surface 2a of the shield cover 2.
Has been extended to. Then, lower ends 2f of the four side surfaces 2d of the shield cover 2 are folded toward the inside of the shield cover 2 as shown in FIG.
【００１５】そして、シールドカバー２は、図１に示す
ように、絶縁基板１の上面１ａにシールドカバーの側面
の下端をシールドカバー２の内側に折り込んだ後の側面
２ｄの下端２ｇが当接するとともに、絶縁基板１の上面
１ａに形成した端子取付部１ｂと接続端子３とが当接
し、シールドカバー２が電圧制御発振回路を覆うように
取り付けられる。そして、シールドカバー２の側面２ｄ
に設けられた各接続端子３と絶縁基板１の上面１ａに設
けた各端子取付部１ｂとを半田付けすることによって電
気的に接続する。ここで、図３に示すように、シールド
カバー２の側面２ｄの下端２ｆをシールドカバー２の内
側に折り込んでいるので、シールドカバー２の側面２ｄ
と絶縁基板１との当接部分の隙間からシールドカバー２
の内側方向に半田が流れ込んでも、シールドカバー２の
側面２ｄの内壁面２ｂを形成する金属板２ｂが半田と接
続されるのを防止している。As shown in FIG. 1, the lower end 2g of the side surface 2d of the shield cover 2 after the lower end of the side surface of the shield cover is folded into the inner surface of the shield cover 2 contacts the upper surface 1a of the insulating substrate 1, as shown in FIG. The terminal mounting portion 1b formed on the upper surface 1a of the insulating substrate 1 is in contact with the connection terminal 3, and the shield cover 2 is mounted so as to cover the voltage controlled oscillation circuit. And the side 2d of the shield cover 2
Are electrically connected to each other by soldering each connection terminal 3 provided on the upper surface and each terminal mounting portion 1b provided on the upper surface 1a of the insulating substrate 1. Here, as shown in FIG. 3, since the lower end 2f of the side surface 2d of the shield cover 2 is folded inside the shield cover 2, the side surface 2d of the shield cover 2 is formed.
Cover 2 from the gap at the contact portion between
This prevents the metal plate 2b forming the inner wall surface 2b of the side surface 2d of the shield cover 2 from being connected to the solder even if the solder flows inward.
【００１６】次に、本発明の電圧制御発振器を、例え
ば、携帯電話機の送受信ユニットのマザー基板４に取り
付ける取付方法について図４及び図５に従って説明す
る。電圧制御発振器をマザー基板４に取り付ける場合に
は、シールドカバー２の上面２ａとマザー基板４の上面
４ａとが当接するように載置して取り付ける。Next, a method of attaching the voltage controlled oscillator of the present invention to, for example, a mother board 4 of a transmitting / receiving unit of a portable telephone will be described with reference to FIGS. When the voltage-controlled oscillator is mounted on the motherboard 4, it is mounted so that the upper surface 2a of the shield cover 2 and the upper surface 4a of the motherboard 4 are in contact with each other.
【００１７】マザー基板４の上面４ａには電圧制御発振
器の接続端子３を取り付けるための半田付けランド５
と、シールドカバー２の内壁面を形成する金属部材２ｂ
と接続するための接地用ランド６とが設けられており、
半田付けランド５とシールドカバー２の側面２ｄから上
面２ａに延出して形成した接続端子３とが当接するよう
にシールドカバー２の上面２ａをマザー基板４の上面４
ａに載置する。そして、半田付けランド５と接続端子３
とを半田付けして電気的に接続する。なお、シールドカ
バー２の側面２ｄに形成した接続端子３をシールドカバ
ー２の上面２ａまで延出しているので、シールドカバー
２の側面２ｄのみに接続端子３を形成した場合に比べて
半田付けランド５との当接面が広いので、より確実に半
田付けランド５と接続端子３とを接続することが出来
る。On the upper surface 4a of the mother board 4, a soldering land 5 for attaching the connection terminal 3 of the voltage controlled oscillator is provided.
And a metal member 2b forming an inner wall surface of the shield cover 2
And a grounding land 6 for connection to the
The upper surface 2a of the shield cover 2 is attached to the upper surface 4 of the mother board 4 so that the soldering lands 5 and the connection terminals 3 extending from the side surfaces 2d to the upper surface 2a of the shield cover 2 are in contact with each other.
a. Then, the soldering land 5 and the connection terminal 3
And are electrically connected by soldering. Since the connection terminals 3 formed on the side surface 2d of the shield cover 2 extend to the upper surface 2a of the shield cover 2, the soldering lands 5 are smaller than when the connection terminals 3 are formed only on the side surface 2d of the shield cover 2. The contact surface between the soldering land 5 and the connection terminal 3 can be more reliably connected.
【００１８】一方、シールドカバー２の四つの側面２ｄ
の上端とマザー基板４の上面４ａに形成した接地用ラン
ド６との接続点の近傍の樹脂部材２ｃの一部を切り欠い
て、内壁面である金属部材２ｂの一部が剥き出しになる
ように切欠部７を形成しておく。そして、切欠部７を形
成することによって剥き出しになった金属部材２ｂの一
部と接地用ランド６とを半田付けし、接地用ランド６を
接地することで金属部材２ｂが接地され、電圧制御発振
回路から信号が漏れないようになっている。On the other hand, the four side surfaces 2d of the shield cover 2
A part of the resin member 2c near the connection point between the upper end of the resin member 2 and the grounding land 6 formed on the upper surface 4a of the mother board 4 is cut off so that a part of the metal member 2b as the inner wall surface is exposed. A notch 7 is formed. Then, a part of the metal member 2b exposed by forming the cutout portion 7 is soldered to the grounding land 6, and the grounding land 6 is grounded, whereby the metal member 2b is grounded, and the voltage controlled oscillation is performed. The signal does not leak from the circuit.
【００１９】次に、本発明の電圧制御発振器のシールド
カバー２の製作方法について図６及び図７に従って説明
する。シールドカバー２は、図６に示すように、厚さ６
０μｍ程度に形成した樹脂部材２ｃの上面に、厚さ３０
μｍ程度の板状に形成した銅箔８を張り付け、樹脂部材
２ｃの下面に、厚さ０．１ｍｍ程度の板状に形成した金
属部材２ｂを張り付けた厚さ０．２ｍｍ程度の合板から
製作される。そして、シールドカバー２は合板を図６に
示すように、互いに直交する切断線Ｓ１、Ｓ２に沿っ
て、切断線Ｓ１とＳ２との交点Ａまで切断する。そし
て、図７に示すように、切断線Ｓ１、Ｓ２に沿って金属
部材２ｂが内壁面となるように折り曲げてシールドカバ
ー２の上面２ａと側面２ｄとを形成する。さらに、シー
ルドカバー２の側面２ｄの下端２ｆをシールドカバー２
の内側方向へ折り曲げる。そして、隣り合う側面２ｄ同
士を接続することで、シールドカバー２が作成される。
そして、樹脂部材２ｃの上面に板状に形成した銅箔８を
エッチィング加工によって、帯状に接続端子３を形成す
る。Next, a method of manufacturing the shield cover 2 of the voltage controlled oscillator according to the present invention will be described with reference to FIGS. The shield cover 2 has a thickness of 6 as shown in FIG.
On the upper surface of the resin member 2c formed to about 0 μm,
It is manufactured from a plywood having a thickness of about 0.2 mm in which a copper foil 8 formed in a plate shape of about μm is attached, and a metal member 2b formed in a plate shape of about 0.1 mm is attached to the lower surface of the resin member 2c. You. Then, as shown in FIG. 6, the shield cover 2 cuts the plywood along cutting lines S1 and S2 orthogonal to each other, up to an intersection A between the cutting lines S1 and S2. Then, as shown in FIG. 7, the metal member 2b is bent along the cutting lines S1 and S2 so as to be the inner wall surface to form the upper surface 2a and the side surface 2d of the shield cover 2. Further, the lower end 2f of the side surface 2d of the shield cover 2 is
Fold inward. Then, the shield cover 2 is created by connecting the adjacent side surfaces 2d.
Then, the connection terminal 3 is formed in a strip shape by etching the copper foil 8 formed in a plate shape on the upper surface of the resin member 2c.
【００２０】[0020]
【発明の効果】以上のように、本発明の電圧制御発振器
は、第一の解決手段として、上面に電子部品が取り付け
られた絶縁基板と、絶縁基板の上面に取り付けられ、一
方の面に開口部を有する箱形のシールドカバーとを有
し、シールドカバーは金属板と絶縁板と外部接続用の接
続端子の三層からなり、その内壁面が金属板で、外壁面
が絶縁板でそれぞれ構成され、外壁面に接続端子が取り
付けられ、シールドカバーを電子部品を覆った状態で接
続端子を絶縁基板に半田付けするようにしたことで、絶
縁基板を加工することなくシールドカバーの取付及び接
地をすることができるので、シリコン基板やガラス基板
等の加工しづらい絶縁基板を用いた電圧制御発振器を提
供することが出来る。As described above, the voltage-controlled oscillator according to the present invention comprises, as a first solution, an insulating substrate having an electronic component mounted on the upper surface, an insulating substrate mounted on the upper surface of the insulating substrate, and an opening formed on one surface. The shield cover consists of a metal plate, an insulating plate, and connection terminals for external connection, and the inner wall surface is a metal plate, and the outer wall surface is an insulating plate. The connection terminals are attached to the outer wall surface, and the connection terminals are soldered to the insulating substrate with the shield cover covering the electronic components, so that the shield cover can be mounted and grounded without processing the insulating substrate. Therefore, it is possible to provide a voltage controlled oscillator using an insulating substrate such as a silicon substrate or a glass substrate which is difficult to process.
【００２１】また、本発明の第二の解決手段として、接
続端子をシールドカバーの上面まで導出し、シールドカ
バーの上面を下にして、半田付けランドが上面に形成さ
れたマザー基板に接続端子と半田付けランドが当接する
ように載置するとともに、接続端子と半田付けランドと
を半田付けするようにしたことで、シールドカバーの側
面のみに接続端子を形成した場合に比べて半田付けラン
ドとの当接面が広いので、より確実に半田付けランドと
接続端子とを接続することが出来る。As a second solution of the present invention, the connection terminals are led out to the upper surface of the shield cover, and the connection terminals are connected to the mother substrate having the upper surface of the shield cover facing down and soldering lands formed on the upper surface. The solder lands are placed so that they come into contact with each other, and the connection terminals and the solder lands are soldered. Since the contact surface is wide, the soldering land and the connection terminal can be more reliably connected.
【００２２】また、本発明の第三の解決手段として、シ
ールドカバーの開口部を有する面を囲む四方の面の下部
を前記シールドカバーの内側に折り込み、折り込んだ部
分が絶縁基板に接触しないようにした構成としたこと
で、接続端子を絶縁基板に半田付けするときに、シール
ドカバーの側面の下端と絶縁基板との間の隙間からシー
ルドカバーの内側方向に半田が流れ込んでも、シールド
カバーの側面の内壁を形成する金属板が半田によって絶
縁基板の上面に形成した電圧制御発振回路の電子部品と
電気的に接続されるのを防止することができる。As a third solution of the present invention, the lower portions of the four sides surrounding the surface having the opening of the shield cover are folded inside the shield cover so that the folded portion does not contact the insulating substrate. When soldering the connection terminals to the insulating board, even if the solder flows into the inside of the shield cover from the gap between the lower end of the side face of the shield cover and the insulating board, the connection It is possible to prevent the metal plate forming the inner wall from being electrically connected to the electronic component of the voltage controlled oscillation circuit formed on the upper surface of the insulating substrate by solder.
【図１】本発明の電圧制御発振器の斜視図である。FIG. 1 is a perspective view of a voltage controlled oscillator according to the present invention.
【図２】本発明の本発明の電圧制御発振器を形成するシ
ールドカバー及び絶縁基板の斜視図である。FIG. 2 is a perspective view of a shield cover and an insulating substrate forming the voltage controlled oscillator of the present invention.
【図３】本発明の電圧制御発振器のシールドカバーと絶
縁基板との接続部の要部拡大図である。FIG. 3 is an enlarged view of a main part of a connection portion between a shield cover and an insulating substrate of the voltage controlled oscillator according to the present invention.
【図４】本発明の電圧制御発振器をマザー基板に取り付
けるときの斜視図である。FIG. 4 is a perspective view when the voltage controlled oscillator of the present invention is mounted on a motherboard.
【図５】本発明の電圧制御発振器をマザー基板に取り付
けたときの斜視図である。FIG. 5 is a perspective view when the voltage controlled oscillator of the present invention is mounted on a mother board.
【図６】本発明の電圧制御発振器のシールドカバーを構
成する合板の斜視図である。FIG. 6 is a perspective view of a plywood constituting a shield cover of the voltage controlled oscillator of the present invention.
【図７】本発明の電圧制御発振器のシールドカバーの展
開図の斜視図である。FIG. 7 is a perspective view of a development view of a shield cover of the voltage controlled oscillator of the present invention.
【図８】従来の電圧制御発振器の斜視図である。FIG. 8 is a perspective view of a conventional voltage controlled oscillator.
【図９】従来の電圧制御発振器を形成するシールドカバ
ー及び絶縁基板の斜視図である。FIG. 9 is a perspective view of a shield cover and an insulating substrate forming a conventional voltage controlled oscillator.
１ 絶縁基板 １ａ 絶縁基板の上面 １ｂ 端子取付部 ２ シールドカバー ２ａ シールドカバーの上面 ２ｂ シールドカバーの内壁面 ２ｃ シールドカバーの外壁面 ２ｄ シールドカバーの側面 ２ｅ シールドカバーの側面の上端 ２ｆ シールドカバーの側面の下端 ２ｇ シールドカバーの側面の下部を折り曲げた後の下
端 ３ 接続端子 ３ａ 接続端子の一端 ４ マザー基板 ４ａ マザー基板の上面 ５ 半田付けランド ６ 接地用ランド ７ 切欠部 ８ 銅箔REFERENCE SIGNS LIST 1 insulating substrate 1a upper surface of insulating substrate 1b terminal mounting portion 2 shield cover 2a upper surface of shield cover 2b inner wall surface of shield cover 2c outer wall surface of shield cover 2d side surface of shield cover 2e upper end of side surface of shield cover 2f side surface of shield cover Lower end 2g Lower end after bending the lower part of the side surface of the shield cover 3 Connection terminal 3a One end of the connection terminal 4 Mother board 4a Upper surface of the mother board 5 Soldering land 6 Grounding land 7 Notch 8 Copper foil
Claims (3)
板と、該絶縁基板の上面に取り付けられ、一方の面に開
口部を有する箱形のシールドカバーとを有し、該シール
ドカバーは金属板と絶縁板と外部接続用の接続端子の三
層からなり、その内壁面が前記金属板で、外壁面が前記
絶縁板でそれぞれ構成され、該外壁面に前記接続端子が
取り付けられ、前記シールドカバーを前記電子部品を覆
った状態で前記接続端子を前記絶縁基板に半田付けする
ようにしたことを特徴とする電圧制御発振器。1. An insulating substrate having an electronic component mounted on an upper surface thereof, and a box-shaped shield cover having an opening on one surface mounted on the upper surface of the insulating substrate, wherein the shield cover is formed of a metal plate. And an insulating plate and a connection terminal for external connection, the inner wall surface of which is formed of the metal plate, and the outer wall surface of which is formed of the insulating plate. The connection terminal is attached to the outer wall surface, and the shield cover is provided. Wherein the connection terminal is soldered to the insulating substrate while covering the electronic component.
面まで導出し、該シールドカバーの上面を下にして、半
田付けランドが上面に形成されたマザー基板に前記接続
端子と前記半田付けランドが当接するように載置すると
ともに、前記接続端子と前記半田付けランドとを半田付
けするようにしたことを特徴とする請求項１記載の電圧
制御発振器。2. The connection terminal is led out to the upper surface of the shield cover, and the connection terminal and the solder land are applied to the mother board having the solder land on the upper surface with the upper surface of the shield cover down. 2. The voltage controlled oscillator according to claim 1, wherein the connection terminals are placed so as to be in contact with each other, and the connection terminals and the solder lands are soldered.
る面を囲む四方の面の下部を前記シールドカバーの内側
に折り込み、前記折り込んだ部分が前記絶縁基板に接触
しないようにしたことを特徴とする請求項１または請求
項２記載の電圧制御発振器。3. The shield cover according to claim 1, wherein lower portions of four sides surrounding the surface having the opening are folded into the inside of the shield cover so that the folded portion does not contact the insulating substrate. The voltage controlled oscillator according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11078297A JP2000278041A (en) | 1999-03-23 | 1999-03-23 | Voltage controlled oscillator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11078297A JP2000278041A (en) | 1999-03-23 | 1999-03-23 | Voltage controlled oscillator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000278041A true JP2000278041A (en) | 2000-10-06 |
Family
ID=13658004
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11078297A Pending JP2000278041A (en) | 1999-03-23 | 1999-03-23 | Voltage controlled oscillator |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000278041A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1332446C (en) * | 2003-05-20 | 2007-08-15 | 恩益禧电子股份有限公司 | Semiconductor device packaging |
| JP2008206173A (en) * | 2008-03-21 | 2008-09-04 | Matsushita Electric Ind Co Ltd | High frequency module and manufacturing method thereof |
| CN107771021A (en) * | 2017-09-26 | 2018-03-06 | 广东欧珀移动通信有限公司 | Mobile terminal, circuit board assembly and shielding case thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0794619A (en) * | 1993-09-20 | 1995-04-07 | Hitachi Ltd | Hybrid integrated circuit device |
| JPH09107186A (en) * | 1995-10-12 | 1997-04-22 | Matsushita Electric Ind Co Ltd | Electronic components and their manufacturing method |
-
1999
- 1999-03-23 JP JP11078297A patent/JP2000278041A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0794619A (en) * | 1993-09-20 | 1995-04-07 | Hitachi Ltd | Hybrid integrated circuit device |
| JPH09107186A (en) * | 1995-10-12 | 1997-04-22 | Matsushita Electric Ind Co Ltd | Electronic components and their manufacturing method |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1332446C (en) * | 2003-05-20 | 2007-08-15 | 恩益禧电子股份有限公司 | Semiconductor device packaging |
| JP2008206173A (en) * | 2008-03-21 | 2008-09-04 | Matsushita Electric Ind Co Ltd | High frequency module and manufacturing method thereof |
| CN107771021A (en) * | 2017-09-26 | 2018-03-06 | 广东欧珀移动通信有限公司 | Mobile terminal, circuit board assembly and shielding case thereof |
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