JP2000004078A - Area array package ejector - Google Patents

Abstract

(57) [Problem] To safely and reliably remove an area array package soldered to a printed wiring board from the printed wiring board. SOLUTION: The package sandwiching portion has a thin metal plate formed in a substantially U-shaped cross section, and a spring portion has a thin metal plate formed in a substantially U-shaped cross section. Thus, an area array package ejector in which the upper bottom of the spring portion is fixed to the upper bottom of the package holding portion is used. The area array package is sandwiched between a pair of area array package ejectors, and is applied to a reflow soldering machine while applying a force to lift the area array package from the printed wiring board, heated and melted, and then heating is stopped. After waiting until the temperature becomes lower than the solder solidification point, the area array package is removed from the printed wiring board.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique for removing an area array package soldered to a printed wiring board by using a reflow soldering apparatus.

[0002]

2. Description of the Related Art Conventionally, when a soldered area array package is removed from a printed wiring board, the printed wiring board to which the area array package is joined is heated by a high-temperature hot air device to melt the joined solder. And
The area array package was peeled off with tweezers. At this time, usually, the components mounted on the back surface of the area lay package are removed in advance from the printed wiring board, and the portion on which the area lay package is mounted is locally heated from the front and back of the printed wiring board.

[0003]

The temperature and time for melting the solder vary greatly depending on the shape of the printed wiring board, the size and the amount of the components, and the like. Therefore, the operation of removing the area array package requires much skill. This means that when removing the area array package or the components on the back surface, the solder is not completely melted and is forcibly removed, and there is a great risk of damaging the pads and the like of the printed wiring board. Also, the hot air equipment used is to locally heat the solder to keep the solder in a molten state and to remove the area array package. Must. SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problem, and has as its object to provide means for safely removing an area array package by using a normal reflow soldering apparatus.

[0004]

SUMMARY OF THE INVENTION According to the present invention, a printed wiring board is fed into a reflow soldering apparatus while applying a force for floating an area array package from the printed wiring board by utilizing the elasticity of metal. Heating allows the jointed solder to be safely stripped. That is, a package holding portion formed in a thin metal plate and having a substantially U-shaped cross-section, and a spring portion formed in a substantially U-shaped cross-section, such that the spring of the spring portion is located on the back surface of the package holding portion. And an area array package ejector having the upper portion of the spring portion fixed to the upper portion of the package holding portion.

[0005]

FIG. 2 is a diagram showing the use and operation of the present invention, and shows a printed wiring board on which an area array package is mounted. FIG. 2A is a diagram before the reflow. Reference numerals 3 and 3 'denote an area array package ejector of the present invention, 4 denotes a main body of the area array package, 5 denotes a printed wiring board, and 6 denotes a solder for joining the area array package main body 4 to the printed wiring board 5. The body 4 of the area array package to be removed is held between the pair of area array package ejectors 3 and 3 '.
At this time, a force is applied to the main body 4 of the area array package to make the area array package ejectors 3 and 3 'float from the printed wiring board 5 due to elasticity. In this state, when it is put into a reflow soldering apparatus (not shown) and heated, the solder 6 melts and the bonding strength is lost.
At this time, the area array package ejectors 3, 3 '
Due to the elasticity, the main body 4 of the area array package and the printed wiring board 5 are separated from each other. Part of the solder 6 is a printed wiring board 5
Side and partly on the body 4 side of the area array package. Further, in this state, the heating of the reflow soldering device (not shown) is stopped, and the printed wiring board is taken out after the temperature is lowered to the solidification point of the solder or lower, and the state shown in FIG. 2B is obtained. Solder 6 joining the main body 4 of the area array package and the printed wiring board 5
Are solidified while being separated on the main body 4 side and the printed wiring board 5 side of the area array package. That is, the main body 4 of the area array package is completely separated from the printed wiring board 5.

[0006]

FIG. 1 is a diagram showing one embodiment of the present invention. FIG. 1A shows a three-sided view, and FIG. 1B shows a perspective view. In FIG. 1, 1 is a package holding portion, 2
Is a spring part.

In the present embodiment, the package holding portion 1
A beryllium copper plate having a thickness of 0.1 to 0.2 mm is used for each of the spring portions 2 so as to support an area array package of 10 × 10 mm to 30 × 30 mm. A beryllium copper plate is formed into a substantially U-shaped cross section to form a package holding portion 1, and a beryllium copper plate is formed into a substantially U-shaped cross section to form a spring portion 2.
And a spring portion 22 on the back surface 12 of the package holding portion.
The upper bottoms 11 and 21 were spot-welded so as to be positioned. Note that the elasticity of the spring portion 2 is not so strong that even if the solder is not sufficiently melted, it is forcibly peeled off and damages pads and the like of the printed wiring board. It is necessary to have enough force to surely lift the array package. The adjustment of the elastic force was performed by adjusting the thickness and width of the plate of the spring portion 2.

In this embodiment, a beryllium copper plate is used as a material, but another metal plate may be used as long as it has necessary elasticity and workability. Further, although the spot welding is used for fixing the package holding portion 1 and the spring portion 2, an adhesive or another fixing method may be used if necessary connection strength can be obtained.

According to the present invention, if an area array package to be removed is sandwiched between a pair of area array package ejectors and applied to a reflow soldering apparatus while being subjected to a force for floating the printed circuit board, heating is performed. When the solder melts, the area array package is automatically separated from the printed wiring board. Therefore,
There is no fear that the solder may be forcibly peeled off in an insufficiently melted state to damage the pads and the like of the printed wiring board. Also, there is no need to remove the components mounted on the back surface of the area array package in advance. Furthermore, it can be processed by a reflow soldering apparatus, which is a usual manufacturing facility, and does not require a special apparatus.

[Brief description of the drawings]

FIG. 1 is a diagram showing one embodiment of the present invention.

FIG. 2 is a diagram illustrating the use and operation of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Package holding part 11 Upper part of package holding part 12 Back of package holding part 2 Spring part 21 Upper part of spring part 22 Spring of spring part 3, 3 'Area array package ejector 4 Area array package main body 5 Printed wiring board 6 Solder

Claims (1)

[Claims] 1. A package holding portion (1) in which a thin metal plate is formed in a substantially U-shaped cross section, and a spring portion (2) in which a thin metal plate having a spring property is formed in a substantially U-shaped cross section. An area array package in which the upper bottom (21) of the spring portion is fixed to the upper bottom (11) of the package holding portion so that the spring (22) of the spring portion is located on the back surface (12) of the holding portion. Ejector.