JPH0719661Y2 - Soldering iron - Google Patents

Description

[Detailed description of the device]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering iron, and more particularly to a soldering iron tip for extracting an IC or a mini-mold semiconductor from a printed circuit board.

[0002]

2. Description of the Related Art Conventionally, as a method of extracting a semiconductor element for changing or replacing a defective part on a printed circuit board, the methods shown in FIGS. 4 and 5 have been used. In the figure, 5 is a semiconductor element to be extracted, and 5a, 5b, 5c and 5d are lead terminals to be soldered to the semiconductor element. When the soldering iron tip 8 heats the lead terminals 5a, 5b, 5c, and 5d to melt the solder, the solder tip 1 or tweezers 10 forcefully peels it off, or as shown in FIG. Terminals 5a, 5b, 5c, 5d
When the solder melted while heating the soldering part, the work of peeling it off with the tweezers 10 was performed.

For this reason, if a person who is proficient in soldering does not handle this work, an accident such as pattern peeling or pattern breakage of the printed circuit board may occur. Also, during this extraction work, the solder at the tip of the iron is scattered on the substrate, and it is easy to induce a secondary defect such as a solder bridge. In addition, the sampling re-working time varies depending on the skill level of the operator and the strength of the bonding. Further, the spot heater 9 shown in FIG. 5 requires a proficiency time to master it, and when it is operated by an inexperienced person, the printed circuit board may be burnt, which is more expensive than the soldering iron.

Therefore, a well-known technique concerning the iron tip for extracting a chip part from a printed circuit board is disclosed in Japanese Utility Model Publication No. 58-2869.
No. 9 publication. The technique of this publication will be described with reference to FIGS. 6 and 7. Reference numeral 11 in the drawings is a soldering iron tip, and a flat cutting surface 12 is formed at a constant angle at the tip of the iron tip 11. The angle of the cutting surface 12 is set to about 30 ° to 90 ° with respect to the iron tip body A as required. The claws 13 and 14 are integrally provided with a height and a spacing that enclose the upper surface of the chip component 17 and the side surface on which the conducting wire is located with a slight gap. The claw 13
The upper edge surfaces 13a and 14a of 14 and 14 are preferably formed substantially parallel to the cut surface 12. The cutting surface 12 of the component surrounding the chip component 17, the inner surfaces of the claws 13 and 14, and the upper edge surface 13
No plating is applied to a and 14b so that solder can be easily applied.

In removing the chip component 17 with the above structure, the iron tip 11 is heated to a predetermined temperature, and the rear nail 13,
When the lead wire of the chip component 17 is located between 14 and the upper edge surfaces 13a and 14b are brought into contact with the soldered component, the solder 8 melts, and due to the surface tension of the molten solder,
It is disclosed that molten solder is welded to the inner surfaces of the claws 13 and 14 and the side surface of the chip component 17, and the chip component can be removed by lifting the iron tip.

[0006]

[Problems to be solved by the invention] Actual technology of the prior art 5
The 8-28699 publication has the following drawbacks. When removing the chip component 17, which is the main purpose, the surface tension of the solder alone cannot be removed. In addition, it is not possible to deal with the case where the chip surface 17 to be removed is a back surface such as an IC, which has a solder surface. In addition, since the tip member 17 and the cutting surface 12 are close to each other as shown in FIG. 7 due to the shape of the iron tip, heating of the tip member 17 cannot be avoided. The present invention aims to provide a soldering iron from which such defects are removed.

[0007]

A soldering iron tip for extracting a semiconductor element such as a mini-molded semiconductor or an IC from a printed circuit board according to the present invention,

The tip portion of the iron tip has a width for holding the lead terminals of the semiconductor element by pressing them into contact with each other, and a slit having a length that allows the lead terminals of the semiconductor element to come into contact with all of the lead terminals. And the upper part of the semiconductor element have a space that is not heated, and the heat transfer from the inner surface of the slit part to the solder surface through the lead terminals of the semiconductor element with the tip of the soldering iron sandwiching the semiconductor element. Then, the solder around the lead terminals is melted regardless of the front and back of the solder surface. This is a soldering iron having a structure in which, when the soldering iron is swung and lifted while the solder is molten, the semiconductor element is pressed out to the slit portion of the soldering iron in a pressed state.

[0009]

FIG. 1 is a perspective view showing an embodiment of the present invention. In the figure, reference numeral 1 is the iron tip body. Bend the tip 2 at an angle α ° that is highly workable. Numeral 3 is a slit portion, and width 3a is a width that can be pressed and held between the lead terminals of the semiconductor element according to the standard of the mini-mold semiconductor or IC, etc., and all the lead terminals are in the slit inner surface with the semiconductor element pressed and held. The slit structure is set to a length that allows contact, and has a sufficient contact surface with the lead terminal so that the lead terminal can be sufficiently heated from the side surface. 4 is a soldering iron tip insertion port.

FIG. 2 shows another embodiment having a different shape. 1
Is the soldering iron tip body. 3a of the slit portion 3 has a width,
Reference numeral 3b is a length and 3c is a soldering tip having a shape of a slit portion having a height such that the semiconductor element is not heated.

FIG. 3 is an operation explanatory view showing the order of extracting the semiconductor device of the present invention. The lead terminals 5a, 5b, 5c, 5d of the semiconductor element 5 are made of steel, and the surface thereof is plated so that solder can be easily attached. Since the lead terminals 5a, 5b, 5c, 5d are bent at a right angle with a predetermined length, they can be pressed from the lateral direction. On the other hand, there is sufficient strength. The lead terminals 5a, 5b, 5c, and 5d soldered to the printed circuit board 6 are compared with a and b in FIG.
As shown in, the width direction of the slit portion is pressed into the lead terminals 5a, 5b, 5c and 5d of the semiconductor element 5 so as to be sandwiched. The heat of the soldering iron is conducted from the inside of the slit by the lead terminals 5a, 5b, 5c and 5d to heat and melt the solder surface. When the solder melts, the soldering iron can be swung as shown in FIG. 1C to remove the semiconductor 5 from the printed circuit board surface as shown in FIG. 1d. Further, since the heating method is a method of melting the solder around the lead terminals by heating the lead terminals instead of directly heating the solder surface, the solder surface can be applied regardless of the front and back of the printed circuit board 6.
It is also possible to remove C etc. In that case, if the solder is attached to the inner surface of the slit, the heating effect can be further enhanced. When the semiconductor element is pulled out from the molten state, the lead terminal and the inner surface of the slit are clamped by pressure, and the soldering iron and the semiconductor element are in a fixed state, so it is easy to lift the soldering iron while swinging the soldering iron The semiconductor can be extracted from the.

[0012]

[Effects of the Invention] The slit shape of the tip of the soldering iron according to the present invention is set to a width and a length that can be sandwiched by sandwiching a standard type semiconductor element such as a mini-molded semiconductor or an IC with all lead terminals of the semiconductor element in pressure contact. With this structure, the soldering surface of the printed board can melt the solder irrespective of the front and back surfaces, and since the soldering iron tip holds the semiconductor element, it has the effect of facilitating extraction.

[Brief description of drawings]

FIG. 1 is a perspective view showing a soldering iron tip of the present invention.

FIG. 2 is a perspective view showing another soldering iron tip of the present invention.

FIG. 3 is a diagram showing an example of removal of the present invention.

FIG. 4 is a diagram showing an example of removing a semiconductor by a conventional soldering iron.

FIG. 5 is a diagram showing an example of removing a semiconductor with a spot heater.

FIG. 6 is a perspective view showing a conventional soldering iron tip.

FIG. 7 is a plan view of a part of the tip of a conventional soldering iron tip.

[Explanation of symbols]

 1 Iron Tip 2 Tip Bend Part 3 Slit 4 Solder Iron Connection Port 5 Semiconductor Element 5a, 5b, 5c, 5d Lead Terminal 6 of Semiconductor Element 5 Printed Circuit Board 7 Solder 8 Solder Iron 9 Spot Heater 10 Tweezers 11 Solder Iron Tip 12 Cut Surface 13, 14 Nail 15 Printed circuit board 17 Chip parts 18 Solder

Claims (1)

[Scope of utility model registration request] 1. In a soldering iron which has a slit at the tip of a soldering iron and holds and pulls out a component to be extracted from a printed circuit board at the slit position, the slit has all the lead terminals of a standard semiconductor element such as a mini-mold semiconductor or an IC. It is equipped with a slit inner surface with a width and length that allows it to be pressed and clamped from both sides, and to the slit printed circuit board.
Side close to form an obtuse angle with respect to soldering iron, characterized in that the lead terminal of the semiconductor element and pressed to sandwich <br/> Write-Nukitoreru structure in a heated soldering iron soldering iron.