JP1735563S - sealing material - Google Patents
sealing materialInfo
- Publication number
- JP1735563S JP1735563S JP2022011277F JP2022011277F JP1735563S JP 1735563 S JP1735563 S JP 1735563S JP 2022011277 F JP2022011277 F JP 2022011277F JP 2022011277 F JP2022011277 F JP 2022011277F JP 1735563 S JP1735563 S JP 1735563S
- Authority
- JP
- Japan
- Prior art keywords
- sealing material
- article
- brought
- members
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000003566 sealing material Substances 0.000 title abstract 2
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
Abstract
本物品は、例えば、半導体製造装置に用いられるシール材であって、所定の部材に接触させて両部材間の封止性能を得るものである。The article is, for example, a sealing material used in a semiconductor manufacturing apparatus, and is brought into contact with a predetermined member to obtain sealing performance between the two members.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022011277F JP1735563S (en) | 2022-05-26 | 2022-05-26 | sealing material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022011277F JP1735563S (en) | 2022-05-26 | 2022-05-26 | sealing material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP1735563S true JP1735563S (en) | 2023-01-27 |
Family
ID=84978549
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022011277F Active JP1735563S (en) | 2022-05-26 | 2022-05-26 | sealing material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP1735563S (en) |
-
2022
- 2022-05-26 JP JP2022011277F patent/JP1735563S/en active Active
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