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本物品は、例えばアッシング装置などの半導体製造装置に使用されて好適な半導体製造装置用シール材である。The present article is a sealing material for semiconductor manufacturing equipment, suitable for use in semiconductor manufacturing equipment such as an ashing device.
JP2024007380F2024-04-092024-04-09
Sealants for semiconductor manufacturing equipment
ActiveJP1781628S
(en)
Composition and process for selectively etching a layer comprising an aluminium compound in the presence of layers of low-k materials, copper and/or cobalt