HK1065619B - Method for making an article comprising at least a silicon chip - Google Patents

Description

The present invention relates in particular to a manufacturing process for an article containing a fibrous layer and at least one electronic chip.

International application WO 99/54842 describes a paper banknote with a security wire containing an electronic chip made of semiconductor organic polymer. This security wire has metallic parts to allow direct contact with a device that reads the data stored in the chip for the current supply of the chip. No instructions are given on how the banknote is made.

The German patent application DE 198 33 746 is a traveller's cheque obtained by placing a strip of polymer material containing an electronic chip on a first layer of paper and by applying a second layer of paper to the latter, so that the polymer strip is sandwiched between the two layers.

German patent application DE 196 01 358 describes a paper article containing, embedded in its mass, a micromodule consisting of an integrated circuit and a metallic support.

German patent application DE 196 30 648 is a banknote with a broken security strip and an electronic chip placed between two portions of this strip.

The present invention is intended to propose a new manufacturing process for an article with enhanced safety, comprising at least a fibrous structure and at least one electronic chip, including an article in which the risk of the electronic chip being removed without deterioration of the article is reduced and in which the electronic chip is difficult to detect.

The invention thus concerns a manufacturing process for an article containing a fibrous layer and at least one electronic chip, the fibrous layer being formed by deposition of fibres on a surface immersed in a dispersion of fibrous material, this process being characterized by the fact that it involves the following step: bring the electronic chip into contact with the fibre layer in formation by means of a flexible support of elongated shape.

In the invention, the support and chip can be linked to the fibre layer without creating a sensitive over-thickness, which makes the chip difficult to detect.

In addition, the chip cannot be removed without damaging the article, as it is solidly attached to the support and the latter is caught in the mass of the fibrous layer, which can be completely covered on both sides by the fibres of the latter.

The support is preferably coated on both sides with a thermosetting varnish, which improves its grip on the fibre layer.

The chip may be placed on an external surface of the support without being embedded in it.

The support may be between 1 and 50 mm wide, including 1 and 10 mm, for example. It may be electrically conductive except at the chip level, possibly metallic or not, metallized or not, possibly partially metallic or metallized. When the chip is to be connected to an antenna made on the support, this antenna allowing operation without contact of the chip, the support will be non-conductive at least in places so as not to short-circuit the antenna or the contacts of the chip. The support may thus be non-electrically conductive at least at the chip location.

In one example of implementation, the support is oriented, in relation to the surface on which the fibres are deposited when the fibre layer is formed, so that the chip is on the face of the support turned on the opposite side of the fibre layer. The fibre layer can then completely cover the chip and its support. The latter can be brought into contact with the fibre layer in formation when a certain thickness of fibres has already been deposited on the fibre layer, which allows the support and the chip to be completely sunk in the fibre layer.

In addition, the chip can be embedded in the fibre layer while coming out of one side of the fibre layer. This arrangement is particularly useful when the chip is to be subsequently connected to a printed antenna or transferred onto the fibre layer, as will be explained below, or by other means such as for example by metallization, demetallization or photogravure. The face above can then be covered with at least one other layer, fibrous or non-fibrous, so that the chip and the chip are ultimately visually undetectable and untouchable.

The above submerged surface may be defined by the submerged portion of a partially submerged canvas, in particular the submerged portion of a rotary canvas cylinder of a round, partially submerged paper machine.

In one example of implementation, the chip is connected to an antenna with at least one spire. The antenna can be carried by the support used to bring the chip into the paper fibre dispersion. The antenna can extend around the chip on the support. The antenna can also be placed entirely on the chip or extend at least partially on the support,

The antenna can be made, after the fibre layer has been formed, by printing one or more spires on one side of the fibre layer, preferably by screen printing, using conductive ink.

In particular, the antenna can be made by a process involving the following steps: make a series of spires on one side of the fibre layer by means of a conductive ink,make an insulating bridge over the spires by means of an insulating ink,make a conductive track on the insulating bridge connected to one end of the spires by means of a conductive ink, and connect the chip to the conductive track and the other end of the spires by means of a conductive resin.

The antenna can still be made by engraving or transfer.

The antenna can act as an induction coil, with dimensions larger than the chip's, to allow for proximity or neighbourhood detection, for example between 1 and 70 cm.

The antenna can also be directly mounted on the chip, as shown above, particularly when a short-range detection of approximately 1 mm to 1 cm is sufficient.

The chips may be silicon-based.

The chips used may allow only data to be read or, alternatively, both read and write data.

The chip can be read and written to by a password, the data transmitted can be encrypted, and the chip can also have a so-called anti-collision system, especially if several chips are present simultaneously in the field of the non-contact reader.

The chips may contain a programmable microcontroller.

In a particular embodiment of the invention, the support, antenna or chip, including a chip varnish or encapsulation, may contain authentication elements selected in such a way as not to interfere with the operation of the chip. These authentication elements may be magnetic, opaque or visible compounds in transmission, luminescent compounds in visible, ultraviolet or infrared light, including near infrared, or biomarkers, without limitation.

The advantage is that the thickness of the fibre layer and the nature of the material used are chosen in such a way as to protect the chip and the antenna from the shocks associated with the processing of the fibre layer to produce the article and its use.

The fibre layer may consist of cellulose fibres and/or artificial or synthetic fibres and/or cotton linters.

Alternatively, the fibre layer containing the chip may be assembled with a second layer, e.g. another fibre layer, the two layers being joined together e.g. by back-gluing.

Multiple chips and associated media can be integrated into the fibre layer simultaneously, the latter being then cut to retain only one chip per article.

The support and the corresponding chip may be obtained by cutting into strips of an insulating film, e.g. polyester, on which the chips and possibly the associated antennas have been fixed, preferably at regular intervals.

The above strips, which contain the chips, may be integrated into a single sheet of paper during the manufacture of the paper in a round machine, which contains cellulose fibres and possibly artificial or synthetic fibres.

In an example of the implementation of the invention, an article containing a fibrous layer and at least one electronic chip is made by a process involving the following steps: When making a first paper jet on a paper machine, especially one with at least a round shape, one chip must be inserted into a first fibre suspension by means of a flexible support,for each chip,the paper jet must be fitted with an antenna,Pantenne must be connected to the chip by a conductive resin,a second paper jet must be made by means of a flat or round table machine,with a second fibre suspension,the two previously made jet must be glued together,the chips being on the inside.

In one example, the strips carrying the chips are antenna-free, and are partially introduced into the thickness of the first paper jet so that the chips are directly accessible from one side of the jet, with the rest of the strip being drowned in the thickness of the paper. The antenna can then be applied by printing, transferring or engraving. The chip creates no localized over-thickness and therefore does not change the external appearance of the article.

An example of an implementation of the invention shows that an article containing a fibre layer and at least one electronic chip is made by a process involving the following steps: a film with electrical insulating properties at least at the location of the chips and antennas, if any, coated at intervals, preferably regular, of antennas,fixing chips on this film by connecting each chip to an antenna, the chips being arranged at intervals, preferably regular, on the film,cutting the film into strips each containing an alignment of chips and antennas,inserting the strips into a paper formed by the joining of two jets, each coming from, for example, a round, double or flat-shaped machine, and providing, among other things,

The advantage is that the film is coated with a thermosetting varnish on both sides to improve the adhesion of the tape to the layer.

The strip containing the chips may be inserted into the thickness of the first strip so that the chips protrude from one side of the strip, the rest of the strip being submerged in the thickness of the paper.

Such an item may be a cardboard case, for example.

The article may also be self-adhesive, in particular as a self-adhesive label, which may have a fibre layer incorporating the chip and be covered with an adhesive on one side.

The invention also concerns an article consisting of a fibrous layer from a single sheet of paper, a non-electrically conductive strip at the place of the chip extending continuously between two ends of the article, a chip with or without an integrated antenna, fixed to the said strip, the latter being entirely covered by the fibres of the fibrous layer as well as the chip, the article not exhibiting any over-thickness sensitive to the right of the chip or the strip.

The article may consist of at least two layers, the fibrous layer of which contains the tape and the chip glued to it, an antenna electrically connected to the chip, this antenna being located at the interface between the two layers. The chip protrudes from the surface of the fibrous layer in contact with the other layer.

Further features and advantages of the present invention will be apparent from the following detailed description, non-exhaustive examples of implementation, and from the attached drawing, on which: Figure 1 schematically illustrates a step in the process of manufacturing a fibre layer according to a first example of the invention,Figure 2 schematically and partially represents, in cross-section, the resulting fibre layer,Figure 3 schematically and partially represents a cardboard case incorporating a chip,Figure 4 schematically illustrates a step in the process of manufacturing a fibre layer according to a second example of the invention,Figure 5 shows the resulting fibre layer in a schematic and partial cross-section,Figure 6 shows a schematic and partial cross-section of an article containing two fibre layers,Figure 7 shows a schematic and partial perspective of a fibre layer on which an antenna connected to the chip is made,Figure 8 shows a schematic cross-section of two fibre layers,Figure 9 shows a schematically different manufacturing and assembly process for two fibre layers,Figure 10 shows a schematic and partially adhesive label conforming to the invention,Figure 11 shows a schematic and partially adhesive article conforming to a variant of the invention,Figure 12 is a partial schematic view of an article conforming to another embodiment of the invention.

For the sake of clarity, the relative proportions of the various elements depicted were not always respected, the views being schematic.

A round paper machine has been partially and schematically shown in Figure 1 and consists of a tank containing a suspension of 4 fibres, e.g. cellulose fibres and/or cotton linters and/or synthetic and/or artificial fibres, in which a cylinder of rotating canvas 2 is partially immersed, defining a surface 3 on which a continuous fibrous layer 5 is formed.

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The 7 chips are of the passive type, allowing contactless data transmission, each chip being connected to an antenna with at least one and preferably several spires.

For example, chips 7 are silicon based and can be about 200 μm thick.

The antennas may have dimensions larger than the chip dimensions, thus allowing for proximity or neighborhood detection, for example a detection with a range of between 1 and 70 cm. Alternatively, where a short-range detection is sufficient, i.e. with a range greater than 1 mm but less than or equal to 1 cm, the antenna may be made directly on the chip substrate.

In the example shown in Figures 1 and 2, the chips 7 each have an integrated antenna. These may be chips marketed as IC-Link® by INSIDE TECHNOLOGIES, with the corresponding antenna measuring about 2.2 by 2.3 mm and about 250 μm thick. These chips operate in read and write modes at a frequency of 13.56 MHz and can be detected up to 5 mm away.

Band 6 is obtained as follows.

First, a plurality of chips 7 are glued with epoxy, cyanoacrylate or isocyanate glue to a polyester film, e.g. about 12 μm thick. Then, possibly, a thermosetting varnish is applied to strengthen adhesion in the fibre layer, the varnish used may contain fluorescent or magnetic safety compounds. This varnish will be brought to a sufficient temperature during the fabrication of the structure, e.g. by the heat of the rolls in contact with which the fibre layer circulates.

Each strip 6 is incorporated into the fibre layer 5 by contacting the fibres which have just settled on the submerged surface 3 of cylinder 2, as shown in Figure 1.

The strip 6b, without chips 7, is turned towards the surface 3 of the web so that the fibrous material completely covers strip 6 and chips 7 when the paper jet leaves the machine with strip 6 and chips 7.

As shown in Figure 2, strip 6 and chips 7 are completely submerged in the mass of the fibre layer 5, so that chip 7 is not visible or tangible and does not create over-thickness.

The fibre layer 5 may have a final thickness of approximately 400 μm and be, for example, cardboard.

After drying, the fibre layer 5 may be cut to form a cardboard case 9, such as that shown in Figure 3.

Note that strip 6 extends continuously between two opposite edges of the case 10 and 11 of the case 9. Thus, removal of strip 6 or chip 7 cannot be done without deteriorating the case 9, since the force of adhesion of chip 7 to strip 6 is very great.

The present invention is not excluded when the chip 7 is not in direct contact with an antenna configured to allow, for example, an increase in the detection range.

For example, a chip configured to be able to be paired with an antenna 15 by induction may be used.

The chip is preferably centered with respect to antenna 15, as shown in Figure 11.

Since the antenna 15 is not in direct contact with the chip, it can be carried out, for example, on the 5b side of the fibre layer 5 which is on the side of the support 6 or on another jet.

The antenna 15 can be considerably larger than the chip and can be detected at a relatively large distance.

The resulting chip and antenna assembly can also exhibit good mechanical strength against external stresses, due to the absence of physical bond between the chip and the antenna.

In the example described above, IC-Link® chips mentioned above can be used, which have an integrated antenna, which is inductively coupled to an antenna 15.

A further fibre layer 17 may possibly be assembled with fibre layer 5 as shown in Figure 11.

In another example of the invention, chips 7 originally without antennas are attached by bonding to a film, e.g. polyester, e.g. chips 7 are those marketed under the name I CODE by Philips, which operate in read and write modes at a frequency of 13.56 MHz and are detectable up to 1.5 m away, depending on the antenna used.

The film is then cut into 6 strips of 2 mm width, with 7 chips spaced on each 20 cm strip.

As shown in Figure 4, each strip 6 is brought under controlled voltage in the round machine so that the 7 chips come into contact with the surface 3 of the canvas before the fibrous material settles on it.

An antenna 15 can then be made for each chip 7, as follows.

A series of spires is printed on the 5a side of the fibre layer 5 by silkscreen printing using a conductive ink, e.g. silver-based. The conductive ink may also contain authentication elements chosen so as not to disrupt the operation of the chip, such as fluorescent compounds, excitable by ultraviolet or infrared radiation, or biomarkers. The printed spires have two ends 15a and 15b, the first 15a being close to chip 7, as shown in Figure 7.

An insulating bridge extending over the spires between the two ends 15a and 15b is then printed with insulating ink and a conductive track 16 is made on this bridge with insulating ink, this track being electrically connected by an end 16b to the end 15b of the spires.

The antenna 15 in the example of Figure 11 can also be made using conductive ink.

Alternatively, the antenna 15 described in Figures 7 or 11 may be made by engraving.

Antenna 15 can also be set up in another way on the fibrous material.

Antenna 15 can be obtained, for example, by transferring a hologram, which has a metallic layer that has been locally demetallised, to form conductive paths, as shown in Figure 12.

The antenna may be present on the outer face 5a.

Thus, antenna 15 can also be a safety feature, thanks to the optical variability properties of the hologram.

Antenna 15 can also be made by transferring a pattern from a metal, for example copper.

The antenna 15 can also be made by depositing an electrolyte, for example, of metal on a support containing a conductive ink print, which forms the antenna pattern.

Returning to the implementation example in Figure 7, once antenna 15 is connected to chip 7, the fibre layer 5 is assembled with a second layer 17, e.g. a fibre layer with a thickness of about 100 μm covering face 5a.

The joining of two fibrous layers 5 and 17 is done, for example, by back-gluing with the help of glue deposited by a roller 23 between two cylinders 20 and 21 of a back-gluer, as shown in Figure 8. The resulting paper has, for example, a total thickness of 400 μm and can be cut to form a case such as that shown in Figure 3.

As in the previous example, the resulting case has no noticeable over-thickness in the area where strip 6 and chip 7 are located, which are not detectable by sight or touch.

In another example of the present invention, the support 6 is made of a polyester strip with a thickness of 90 μm and a width of 4 cm. The chips 7 which are fixed on this strip 6 are for example identical to those in the previous example. The antennas can be printed or transferred onto the support, and each electrically connected to a chip. The antennas can also be made by metallization, demetallization or photogravure.

In this example, a first fibrous layer 30 is made in a round two-shaped machine and strip 6 is incorporated into it so that chips 7 protrude from one side of the fibrous layer, as described in reference to Figure 4.

The thickness of the first paper jet is about 400 μm, for example.

A second sheet of paper 31 is made in parallel, for example 100 μm thick, and the two sheets 30 and 31 are assembled wet by passing between the canvas cylinder used to form the second sheet 31 and a roll 33, with the second sheet 31 covering the chips 7, as shown in Figure 9.

The resulting cardboard is dried on the paper machine at a temperature of about 100°C and has a thickness of 500 μm. As in the previous examples, chips 7 are not visible or tangible.

In another example of the implementation of the invention, after the step of incorporating the chips into the fibre layer 5 shown in Figure 4 and of producing the antennas by screen printing, instead of assembling the fibre layer 5 with a second fibre layer 17, the fibre layer 5 is assembled after drying with a silicone protective film 25 covered on its face facing the fibre layer 5 with a pressure sensitive adhesive.

The fibre layer 5 lined with protective film 25 may be cut to form adhesive labels, such as that shown in Figure 10, each containing a chip 7.

The chip can be used as a security element in a passport, for example.

For example, in an example of the invention, a 50 μm FLEXCHIP® chip, in which silicon has been rolled up to reduce its thickness, is glued to a strip of 13 μm thickness.

The tape is incorporated into a fibrous layer as in the previous example of implementation, then connected to an antenna and laminated with glue on the paper of a passport cover.

The invention provides an effective means of authentication, since an attempt to remove the chip will inevitably result in a visible alteration of the article.

In addition, the fiber layer that the chip is embedded in helps protect it from shock.

The invention is of course not limited to the examples of implementation just described.

The fibre layer may be treated as standard stationery and may contain counterfeiting and safety features.

The chip may perform authentication and/or traceability functions.

It may also have an anti-theft function, when its frequency corresponds to that of the detection gates.

Claims (32)

1. A method of manufacturing an article (9) comprising a fiber layer (5) and at least one electronic chip (7), the fiber layer being formed by depositing fibers on a surface (3) immersed in a dispersion (4) of fiber material, and the method being characterized by the fact that it includes the following step:

   • using an elongate flexible support (6) to bring the electronic (5) chip into contact with the fiber layer that is being formed.
2. A method according to claim 1, characterized by the fact that the support (6) and the chip (7) are integrated in the fiber layer (5) without giving rise to extra thickness.
3. A method according to either preceding claim, characterized by the fact that the support (6) does not conduct electricity, at least in the location of the chip (7).
4. A method according to any preceding claim, characterized by the fact that the width of the support (6) lies in the range 1 mm to 50 mm, and in particular in the range 1 mm to 10 mm.
5. A method according to any preceding claim, characterized by the fact that the support (6) is covered completely by fibers of said fiber layer (5).
6. A method according to any preceding claim, characterized by the fact that the support (6) is preferably coated on both faces in a heat-sealable varnish.
7. A method according to any preceding claim, characterized by the fact that the support (6) is oriented relative to the surface (3) on which the fibers are deposited during formation of the fiber layer (5) in such a manner that the chip (7) is situated on the face (6a) of the support that faces away from said surface.
8. A method according to any one of claims 1 to 6, characterized by the fact that the support (6) is placed in such a manner that the chip (7) can come into contact with said surface (3), preferably prior to being immersed.
9. A method according to claim 8, characterized by the fact that the chip (7) lies flush with one of the faces (5a) of said fiber layer (5).
10. A method according to the preceding claim, characterized by the fact that said face (5a) is covered by another optionally fibrous layer (17) so that the support (6) and the chip (7) are undetectable visually and to the touch.
11. A method according to any preceding claim, characterized by the fact that said surface (3) is defined by the immersed portion of a partially immersed rotary wire cylinder of a cylinder machine.
12. A method according to any preceding claim, characterized by the fact that a plurality of chips (7) are fixed on the support (6), in particular by adhesive.
13. A method according to any preceding claim, characterized by the fact that the support (6) is made by cutting up into strips (6) of a film on which chips (7) have been stuck, the chips being distributed on the film in such a manner as to be regularly spaced apart on said strips.
14. A method according to any preceding claim, characterized by the fact that the chip (7) is connected to an antenna (15) comprising at least one turn.
15. A method according to the preceding claim, characterized by the fact that the antenna (15) is carried by the support (6) used for bringing the chip (7) into the dispersion of papermaking fibers.
16. A method according to the preceding claim, characterized by the fact that the antenna (15) extends around the chip (7) on the support (6).
17. A method according to any one of claims 1 to 13, characterized by the fact that the antenna (15) is disposed on the chip (7) itself.
18. A method according to any one of claims 1 to 13, characterized by the fact that the support (6) and the chip (7) do not have any antenna.
19. A method according to the preceding claim, characterized by the fact that the antenna (15) is made on the fiber layer (5) after said layer has been formed.
20. A method according to claim 19, characterized by the fact that the antenna (15) is made by means of a method comprising the following steps:

    • using a conductive ink to make a series of turns on one face of the fiber layer (5);

    • using an insulating ink to make an insulating bridge over the turns;

    • using a conducive ink to make a conductive track (16) on the bridge, the track being connected to one of the ends (15b) of the turns; and

    • using a conductive resin to connect the chip (7) to the conductive track and to the other end (15a) of the turns.
21. A method according to any preceding claim, characterized by the fact that the chip is based on silicon.
22. A method according to any preceding claim, characterized by the fact that the chip (7) enables data to be transmitted without contact.
23. A method according to any preceding claim, characterized by the fact that the support (6) is made of polyester.
24. A method according to any one of claims 1 to 23, characterized by the fact that the fiber layer (5) is the only fiber layer.
25. A method according to any one of claims (9) 1 to 23, characterized by the fact that the article comprises at least two superposed fiber layers, assembled together by lamination, one of the layers including the chip (7).
26. A method according to claim 1, characterized by the fact that it comprises the following steps:

    • using a flexible support to introduce a chip (7) into a first suspension of fibers while making a first web of paper in a papermaking machine, the chip-carrying strips having no antennas and being introduced partway through the thickness of the first web of paper so that the chips are directly accessible on one side of the web, the remainder of the chip being embedded in the thickness of the paper;

    • providing the resulting web of paper with an antenna (15) for each chip;

    • using a conductive resin to connect the antenna to the chip; a

    • using a second suspension of fibers to make a second web of paper by means of an endless wire machine or a cylinder machine; and

    • laminating the two previously-made webs together with the chips situated on the inside.
27. A method according to claim 1, characterized by the fact that it comprises the following steps:

    • providing a film having electrically insulating properties at least in the locations of chips and any antennas, the film being provided at preferably regular intervals with antennas (15);

    • fixing chips (7) on the film, connecting each chip to an antenna, the chips being disposed at preferably regular intervals on the film;

    • cutting the film into strips each comprising a line of chips and antennas; and

    • introducing the strips into paper formed by uniting two webs, the strip carrying the chips being introduced into the thickness of the first web so that the chips are flush with one side of said web, the remainder of the strip being embedded in the thickness of the paper, the second web covering the first web beside the chips.
28. A method according to the preceding claim, characterized by the fact that the film is coated in a heat-sealable varnish on both faces.
29. A method according to any preceding claim, characterized by the fact that at least one of the support (6), the chip (7), in particular a varnish or an encapsulation, and an antenna (15) comprises authentication elements.
30. A method according to claim 29, characterized by the fact that said authentication elements are selected from the list consisting of: compounds that are magnetic, opaque, or visible in transmission, compounds that emit light under visible, ultraviolet or infrared, or near-infrared light, biomarkers.
31. An article (9) characterized by the fact that it comprises a fiber layer coming from a single web of paper, a strip (6) that is not electrically conductive at least in the locations of chips extending continuously between two ends of the article, a chip (7) being fixed on said strip, the strip being completely covered by the fibers of the fiber layer as is the chip, the article not presenting any perceptible extra thickness over the chip over the strip.
32. An article (9) according to claim 31, characterized by the fact that it comprises at least two layers, including the fiber layer (5) housing the strip (6) and the chip (7) stuck thereto in its thickness, an antenna (15) electrically connected to the chip, said antenna being situated at the interface between the two layers, the chip coming flush with the face of the fiber layer that is in contact with the other layer.