HK1103825B - Structure comprising an electronic device particularly for the production of a security or value document - Google Patents

Description

The present invention relates to a structure incorporating an electronic device, e.g. RFID (Radio Frequency Identification Device), particularly for the manufacture of a security or valuable document or for securing an article.

Securing an article means providing an article, which may be for example a packaging device, with an electronic device capable of, for example, acting as an anti-theft or a means of authentication or tracing.

The patent application GB 2 279 907 is a chip board made by assembling the lower and upper layers with a central structure bearing an electronic device, which includes an integrated circuit and a coil connected to the circuit. To make this central structure, the electronic device is sandwiched between two layers of polyester each covered on a face of a thermo-active adhesive. This central structure is itself sandwiched between two lower and upper layers of PVC. The assembly of the constituent layers of the central structure with the electronic device and that of the central structure with the lower and upper layers takes place during the manufacture of the board.

The chip board is a chip board made by assembling the lower and upper layers with a central structure bearing an electronic device. This central structure has a support film bearing the electronic device, which includes an integrated circuit and a coil connected to this circuit. This device protrudes from both sides of the support film. The protruding parts are compensated in thickness by a thermoplastic liquid cross-linked under UV radiation.

US patent 6 233 818 is known for a chip board made by assembling lower and upper layers with a central structure bearing an electronic device. This central structure consists of a support film of thermoplastic material with a window in which the electronic device is placed, which includes a module with an integrated circuit and a copper coil which is connected to this circuit and inserted into the surface of the film via an ultrasonic process. The film, made of PVC, PC or PET-G, is then directly laminated with lower and upper layers printed for the manufacture of the chip board on a specific pressure and temperature generating equipment.

The handling of such a structure is tricky because the antenna is at the peak of the structure.

In addition, this type of structure is not suitable for direct integration between the cover of a passport and the leaflet, for example, as the binding adhesives currently used are cold applied and in liquid form.

In addition, application WO 00/42569 contains a label made by laying the following layers successively on silicone-coated paper: a layer of adhesive which can be cross-linked by UV radiation,a layer of electrically conductive material forming connection legs,a layer of dielectric material,a layer of conductive metallic ink forming an antenna,an expandable layer containing polymer resin and a window.

An electronic device is inserted into the window of the expandable layer, in contact with the antenna. In this application, there is no pre-assembled central structure. The expandable layer has a reserve at the chip level to prevent over-thickness. In the case of a label so made, it is relatively easy to peel the label from its support after application, without evidence of tampering. Finally, such a construction does not allow the electronic device, i.e. the chip and its antenna, to be camouflaged during an observation in transmitted light.

International application WO 02/089052 describes a passport with a radio frequency identification device on the cover.

The cover may consist of a first sheet bearing the radio frequency device, a second sheet with a hole and a third sheet of paper, the three sheets being glued together and the chip lodged in the hole.

International application WO 02/082126 describes a sticker document containing an electronic chip connected to an antenna, which is printed with conductive ink on an adhesive layer.

US Patent 5 528 222 describes a structure consisting of an RFID device carried on a flexible substrate to which an antenna is attached, the substrate and the RFID device being covered on both sides by two layers of adhesive.

US Application 2003/0136503 describes a process for manufacturing an article from a support containing a plurality of RFID devices and antennas.

European patent EP 0 742 926 B1 describes a data carrier such as a single or multilayer integrated circuit board in which an electronic module is embedded.

European patent application EP 1 271 398 A1 describes a multi-layer security tag including an RFID, an adhesive layer that causes the RFID to be destroyed upon takeoff.

International application WO 01/41061 A1 describes a process for manufacturing a chipboard with a fibre-based antenna support.

SMARTRAC markets structures called Prelaminated Inlays comprising layers of polycarbonate or PET, intended to be incorporated into a safety document. AONTEC also markets structures called Prelaminated Inlays intended to be laminated with layers of a safety document, these structures comprising layers of PVC or PC.

These structures do not provide complete satisfaction in terms of safety and assembly with fibrous upper and lower layers.

The purpose of the invention is, in particular, to propose, in one of its aspects, a structure incorporating an electronic device which makes it more difficult or impossible to falsify an article or a security or value document incorporating such structures, and which can be readily assembled with the article or the rest of the document.

The invention thus has a structure according to claim 1.

The interlayer may be white or coloured.

The structure according to the invention can be used, for example, for the production of an identity document, e.g. a passport, or a visa tag.

electronic device means any device which allows information to be stored and/or exchanged, particularly by wireless link. The electronic device may be in particular an RFID device. The electronic device may have an antenna, which may be in the form of a coil, wire or printed. The electronic device may or may not have electrical contacts visible from outside the structure.

The invention allows the structure to be free of any appreciable over-thickness if desired, the electronic device being able to be fully housed in the window of the interlayer, and the structure can be easily assembled, at will, with different types of safety documents, without having a specific element to compensate for the thickness of the electronic device, as is the case, for example, with the chip board described in US Patent 6 305 609 above.

The structure of the invention has the further advantage that attempts to falsify it are relatively difficult or impossible, since the interlayer is easily altered in the event of an attempt to peel the structure, which may not be the case for a security or value document made with a central structure as described e.g. in US Patent 6 233 818 or in application WO 00/42569.

In addition, the electronic device is protected against mechanical shock by being at least partially housed in a window of the interlayer.

The adjacent layer of the above structure is for example an additional interlayer, a masking layer or a support for the electronic device, this list is not exhaustive.

When the structure is intended for the manufacture of a label, e.g. a visa, the above-mentioned adhesive layer is preferably covered with a protective, removable non-adhesive film.

In a particular design, the structure shall have at least one outer fibre layer intended to be assembled with a fibre layer of the security or value document.

Thus, the structure can be assembled with at least one fibre layer of the security or value document relatively easily, in particular without the use of any special adhesive or the introduction of special rolling conditions such as those usually encountered in the manufacture of smart cards (rolling time 30 min at 150 °C), and limiting curl problems since the fibre layers to be assembled of the structure and the document are of a similar or compatible nature.

The advantage is that the interlayer is entirely fibrous, which can, for example, facilitate the incorporation of safety features into it and which can also facilitate its delamination in the event of attempted forgery.

In an example of the present invention, at least one of the nature and thickness of the interlayer is chosen so that the interlayer is opaque to transmitted light, so that the interlayer can at least partially mask the electronic device when the structure is observed in transmitted light.

The interlayer can also be arranged to reflect light, which also allows at least partial masking of the electronic device when the structure is observed in reflected or transmitted light.

As noted above, the interlayer may be white or, in some variants, colored, and the interlayer may have a colored soul with a white coating.

When the interlayer is coloured, the colouring agent (s) and/or pigment (s) present in the interlayer shall preferably be retained in the interlayer with sufficient strength to prevent migration of the colouring agent (s) or pigment (s) into adjacent layers of the structure and/or security or security document on which the structure is assembled.

The interlayer may be metallized or laminated with at least one metal film, which may make it opaque while ensuring that the read/write operation of the electronic device is not disturbed.

The window is preferably through the interlayer but alternatively the window is not through.

In an example of the present invention, the structure is arranged in such a way that a safety component carried by the structure can be detected on the security or security document through the window of the interlayer, visually, possibly under special lighting, or by means of a detection device, and this safety component may be present on the electronic device, for example in the form of an inscription or a coating such as varnish.

Preferably, the structure, including at least one of the interlayer, a masking layer and an adhesive layer, shall include at least one of the following security features: an authentication feature, a counterfeit detection feature, the security feature (s) being visible and/or detectable by a detection device.

The structure, including at least one of the interlayer, a possible structure masking layer and an adhesive layer, shall preferably include at least one safety element selected from: a variable optical and/or diffractive effect element such as a holographic, iridescent or liquid crystal element, a magnetic or crystalline coating, magnetic fibres, magnetic resonance detection tracers, fluorescence detection tracers, an X-ray or solvent print, luminescent or incandescent tracers, photochromic, thermochromic, ether and photochromic/color/color-changing compounds and acids or acids or products which come into contact with a variety of chemical bases, including oxides or oxides.

The window and/or the interlayer are preferably shaped to mimic an image, logo or inscription, in order to provide additional security for the structure and the document fitted with the structure.

In an example of the present invention, the electronic device consists of a support bearing an electronic chip and an antenna connected to the electronic chip, the electronic chip extending at least partially into the interlayer window. The antenna allows the electronic chip to be powered and read and/or written to the chip, without contact, and the chip may contain one or more integrated circuits, including memory.

The support may be made from a mineral or organic material, natural or synthetic, e.g. be a fibrous layer, including a layer of paper.

The support may also be made of a material containing a polymer, such as PET, or of PVC, ABS/PC, PC, PA, polyimide, PE, PP or epoxy glass, but this list is not exhaustive.

The antenna may be wire-type or be engraved, printed, or made by stamping, or even by using an electrolytic growth process. The antenna may extend at least partially over the chip. When the antenna is wire-based, it is advantageously held by a layer of an adhesive, which can be used to join two layers of the structure together.

The support may have a coating on one side containing a safety element such as an irreversible thermochromic compound which changes colour, for example from colourless to a predefined colour, for example pink or red, when the temperature exceeds a predefined value, for example about 65 °C. This allows the structure to be detected by heat attack.

In an example of the present invention, the support is sandwiched between two layers of the structure, in which case the structure may have a single interlayer.

Alternatively, the structure may have at least an additional intermediate layer in which the electronic device support is at least partially housed.

The additional interlayer may have a window that at least partially houses the module connection part, the encapsulation resin being housed in the window of the other interlayer.

Alternatively, the electronic device may be coupled to a second antenna which will act as an amplifier, for example by increasing the range, this second antenna being capable of being carried if necessary by an additional intermediate layer or an adjacent layer.

When the structure has several interlayer layers each with a window, the different windows may have different shapes and dimensions, for example to fit the shape of the electronic device, and the protection of the latter against impacts may be enhanced.

Where the structure has two interlayer layers, one of them may have a smaller window than the other interlayer.

The electronic device may, in particular when it is a module, contain two portions of different widths, the portion with the smallest width being received in the smallest window and the portion with the largest width in the largest window.

The interlayer with the smallest and the largest window respectively may be of a thickness substantially equal to that of the portion of the electronic device with the smallest and the largest width respectively.

The electronic device may have an antenna, e.g. engraved or wired, placed between the two interlayer layers.

The adhesive used between the two interlayer layers may not be a pressure sensitive adhesive, to facilitate the precise positioning of the two interlayer layers relative to each other.

Alternatively, the windows of the two layers are of the same size.

The structure may be up to a maximum thickness of, for example, about 500 μm.

In an example of the implementation of the invention, the structure has at least one layer of masking placed at least to the right of a window of an intermediate layer, so as to mask at least partially the electronic device when the structure is observed in transmitted and/or reflected light.

The masking layer can be white or colored. The masking layer can feature a colored soul with a white coating.

The masking layer may be metallized or laminated with at least one metal film.

The masking layer may be fibrous or not.

In an example of the invention, the adhesive layer is chosen to allow cold or hot assembly of the interlayer with an adjacent layer of the structure or with an adjacent layer of a safety or security document in or on which the structure is integrated or fixed.

The adhesive may be a thermoplastic or thermosetting adhesive, an elastomer or a mixture thereof.

The adhesive may be cross-linked, if necessary, to increase its performance, in particular with regard to mechanical or thermal resistance or chemical resistance.

The adhesive can be solid when it is a hotmelt adhesive which, when used, will be heated to a liquid state.

The adhesive may alternatively be in liquid form in solvent or aqueous media or contain 100% adhesive material.

The adhesive may, in yet another variant, be in the form of a pressure sensitive and/or heat activated adhesive transfer film.

An adhesive film without instant adhesion, activated by hot working, is advantageous in order to facilitate the positioning of the different layers during manufacture before final assembly.

The adhesive in the form of a film may be reinforced, where appropriate, by a fibre layer, woven or non-woven.

The curing of the adhesive can be achieved, for example, by evaporation of solvent or water, activation with a solvent or heat, polymerization in the case of a chemically reactive glue, cooling in the case of a hot-dip melting glue.

In some cases, the materials to be assembled with the adhesives chosen will be subjected to pressure, with or without heat, to increase bonding cohesion.

A hot-activated adhesive film may, for example, be made from a polymer or copolymer, e.g. modified polyethylene, vinyl acetate ethylene, polybutylacrylate, cross-linked polyurethane or a mixture of nitrile rubber and epoxy resin.

For example, a pressure sensitive adhesive film may be made of cross-linked or cross-linked acrylic.

For example, a liquid evaporative-curable adhesive may be made of acrylic or polyurethane, whether or not modified.

The adhesive layer may be coloured to mask at least part of the electronic device when the structure is observed in transmitted and/or reflected light.

The internal cohesion of a layer is in particular its ability to withstand internal delamination, so that an attempt to separate one of the layers of the structure causes the latter to be altered.

In an example of the invention, the structure has two intermediate layers, one of which has less internal cohesion than the other intermediate layer.

The interlayer has an internal cohesion which is advantageously less or equal to that of the masking layer, if any.

Where the electronic device has a support, the internal cohesion of the support may be less than or equal to that of the interlayer, thus providing a protection against tampering to try to isolate the electronic device by tearing or delamination between the interlayer and the masking layer or between the interlayer and the support, particularly if the latter has the same dimensions as the interlayer.

The structure may have an anti-stick film, which is intended to be removed when the structure is to be glued to a document or object, such as a packaging.

The structure can be coated on its two opposite sides with a layer of an adhesive. Each layer of adhesive can be protected by a removable protective anti-adhesive film, especially when the adhesive is pressure sensitive. When the adhesive is not pressure sensitive, for example being activated on hot, an anti-adhesive film may not be necessary.

The structure, in particular when it has an anti-stick film protecting the adhesive layer, may be a visa to be affixed to a passport sheet.

The structure may have a visible safety component on its slice.

The presence of a fibrous layer, in particular paper, e.g. interlayer or masking, on the outer face of the structure is advantageous as such a layer can be compatible with liquid adhesives, in particular water-based ones, e.g. those which may be used in the manufacture of passports.

In addition, a fibrous layer can be more easily formulated to be weakly cohesive and altered in the event of an attempt to delaminate the structure or to separate the structure from a passport cover with which the structure is assembled, and thus serve as evidence of fraudulent manipulation.

It is also possible to incorporate safety features into the fibre layer.

This fibrous layer may be relatively thin, with a density of, for example, less than or equal to 100 g/m2, or less than or equal to 70 g/m2.

The structure according to the invention may be flexible.

The invention also concerns a security or value document having a structure as defined above or consisting of such a structure, which may be the case in particular where the document is a visa.

The security document may preferably be an identity document, a visa tag or a passport booklet, for example, this list is not exhaustive.

The document may have a receiving layer intended to be assembled with the structure and the internal cohesion of this layer is preferably higher than that of the intermediate layer of the structure and possibly that of the masking layer of the structure intended to be assembled with the receiving layer of the document.

The adhesion between the receiving layer of the document and the interlayer or the masking layer, if any, is better than the internal cohesion of the interlayer or the masking layer.

A structure according to the invention may be designed to be sandwiched between two fibrous layers, including two sheets of paper.

The invention also concerns a manufacturing process for a structure according to claim 33.

The process may consist of the following steps: laying the adhesive layer on the interlayer,making a window, preferably through, in the whole of the interlayer and the adhesive layer, notably by means of a coin-grabber or laser.

The process may also involve the following steps: supplying an adhesive layer in the form of a transfer film, for example, sensitive to pressure and/or actively free from heat, with or without at least one anti-adhesive film initially coated, removing the anti-adhesive film from the adhesive layer, if necessary, joining the adhesive layer with the intermediate layer.

The process may also consist of the following steps: applying an adhesive in liquid form to the interlayer or a masking layer, if any, to form an adhesive layer, or covering the adhesive layer thus formed with an anti-adhesive film.

Where the structure has two intermediate layers, the process may include the following steps: at least one window, preferably through, shall be made on each of the interlayer layers separately.

Where the structure has one adhesive polymer interlayer and two fibrous interlayer, the process may consist of the following steps: assembling the adhesive with the interlayer,making a window through the whole,making a window through another interlayer,assembling the two interlayer layers with the electronic device housed in the windows in a targeted manner.

The process may include the following steps: laying a layer of adhesive on each of the interlayer layers,cold or hot laminating the different layers of the structure with or without pressure.

The invention also concerns a process for making a security or value document, characterized by the following steps: provide a structure as defined above, the structure being pre-assembled,assembling the structure with the security or value document.

This process may involve the following steps: laminating the structure with a layer of security or value document, either hot or cold.

The process may consist of the following steps: laying down an adhesive layer on the structure and/or a layer of the security or value document,assembling the structure with the security or value document using the adhesive layer.

Alternatively, the process may consist of the following steps: treat an external surface of the structure to make it adhesive and possibly temporarily cover it with an anti-adhesive film,assembly the structure with the security or value document by contacting the treated side of the structure with the document.

The process may include the following steps: Stitch the structure with at least one sheet or layer of the security or security document.

The advantage is that the sewing is done on a support of the electronic device of the structure, apart from an antenna and an electronic chip.

The process may consist of the following steps: printing or depositing a security element on a layer of the document before assembling it to the structure,assembling the structure to that layer of the document.

Thus, the structure is incorporated into the document only when the document layer (s) is (are) printed correctly or the security element is correctly reported.

Alternatively, the process may consist of the following steps: assembling the structure with a layer of the document,then printing or depositing a security element on the layer of the document

The invention can be better understood by reading the following detailed description, including non-limiting examples of its implementation, and by examining the attached drawing, on which: Figure 1 is a schematically and partially representative structure conforming to an example of the invention; Figure 2 is a schematically and partially representative cross-sectional representation of the structure of Figure 1; Figure 3 is a schematically and partially cross-sectional representation of a security or value document assembled with the structure of Figure 2; Figure 4 is a schematically and partially cross-sectional view;Figures 5 and 6 represent, in a schematic and partial cross-section, two safety or value documents assembled with the structure of Figure 4,Figure 7 represents, in a schematic and partial cross-section, a structure conforming to another example of implementation of the invention,Figure 8 is a schematic and partial cross-sectional view of a safety or value document with the structure of Figure 7,Figures 9A and 9 represent, in a schematic and partial cross-section, structures conforming to other examples of implementation of the invention,Figure 10 is a schematically and partially cross-sectional representation of a security or value document, with the structure of Figure 9,Figure 11 is a schematically and partially cross-sectional representation of a structure conforming to another example of implementation of the invention,Figure 12 is a schematically and partially cross-sectional representation of a security or value document, with the structure of Figure 11,Figure 13 is a schematically and partially window of an intermediate layer conforming to the invention, andFigure 14 is a schematically and partially illustrative illustration of a security document conforming to the invention with a sewn structure on top of it,Figure 15 is a schematically and partially representative set of sheets and a structure intended to be sewn together to form the document in Figure 14,Figure 16 is a schematically and partially transverse cut structure conforming to another example of implementation of the invention,Figure 17 is a schematically and partially transverse cut booklet conforming to an example of implementation of the invention,Figure 18 is a schematically and partially representative set of steps in the manufacturing process of the structure in Figure 17,Figures 19 and 20 are schematically and partially representative of two examples of booklets conforming to the invention,Figures 22 to 24 show, schematically and partially, in cross-section, structures conforming to the invention incorporating the insert in Figure 21, and Figures 25 to 28 show, schematically and partially, in cross-section, different structures conforming to different examples of implementation of the invention.

The relative proportions of the various elements depicted in the drawing were not always respected for the sake of clarity.

A structure 1 according to the invention for the production of a security or value document has been represented in Figure 1.

Structure 1 has an intermediate layer 2 with a through hole defining a window 4.

In the example, window 4 has a rectangular shape, but it is not outside the scope of the present invention when window 4 has another shape, for example a star shape, as shown in Figure 13. Generally, window 4 may have a non-circular or rectangular shape imitating an image, logo or inscription.

In the example above, intermediate layer 2 is a fibrous layer, including a paper layer, e.g. with a density of about 215 g/m2 and a thickness of 280 μm.

Interlayer 2 may incorporate a dye, e.g. a sulphur black type giving it a black colour, which is sufficiently fixed in interlayer 2 to prevent the dye from migrating to other layers when interlayer 2 is in contact with an adhesive and/or subjected to a high temperature and/or humid atmosphere.

The intermediate layer 2 is, in the example, opaque to transmitted light and may include a safety component which is visually detectable, possibly under predetermined lighting, e.g. UV or IR, or alternatively by means of a predetermined detection device, e.g. magnetic detection.

In the example above, the intermediate layer 2 has detectable tracers with a suitable detection device, e.g. tracers marketed by Microtag, detectable by magnetic resonance.

Interlayer 2 can exhibit a cohesion of approximately 150 Scott units as measured by the Scott Bond instrument.

Interlayer 2 may include any other safety feature such as: a variable optical and/or diffractive effect element such as a holographic, iridescent or liquid crystal element, a magnetic or crystalline coating, magnetic fibres, magnetic resonance detection tracers, X-ray fluorescence detection tracers, a varnish or ink print, luminescent or photofluorescent tracers, electrochromic, thermochromic, electroluminescent and/or piezochromic compounds and/or those which change colour upon contact with one or more predetermined products.

As shown in Figure 2, a layer of adhesive 6 is applied to the bottom of the interlayer 2 to allow its assembly with a support 7 of a non-contact type 8 electronic device.

Generally, the thickness of the interlayer shall be greater than or equal to that of the naked, encapsulated chip or part of a chip-containing module, as applicable; the window shall be greater than or equal to that of the naked, encapsulated chip or part of the chip-containing module, as applicable.

In the example above, adhesive 6 is a pressure sensitive adhesive, but in a variant, adhesive 6 can be of any other type, for example, being a heat sensitive adhesive.

In the example above, adhesive layer 6 contains a permanent adhesive containing a solvent, e.g. acrylic, and is approximately 25 μm thick.

The adhesive layer 6 is initially in the form of a transfer film and is cold rolled on the interlayer 2.

The adhesion and cohesion of adhesive layer 6 is greater than the internal cohesion of interlayer 2.

The electronic device 8 shall have, in addition to the support 7, an electronic chip 10.

In the example in question, chip 10 is a chip marketed as Picotag 16 KS by Inside and is square in shape with a cross-section of approximately 4 mm2 and a thickness of approximately 200 μm.

The chip 10 is connected to an antenna 11 which is made of aluminium and engraved on the support 7.

The chip 10 may be made from silicon or alternatively from a polymer.

Carrier 7 shall have on one side a coating or primer containing an irreversible thermochromic compound which changes colour when the temperature exceeds 65 °C, for example from colourless to pinkish red.

Structure 1 has an anti-adhesive film 15 attached to the support 7 by means of an adhesive layer 16. This is identical to adhesive layer 6. The anti-adhesive film 15 is intended to be removed before the structure is assembled onto a document or article.

The manufacturing steps of structure 1 are described in more detail.

First, adhesive layer 6 fixed on an anti-adhesive film (not shown) is cold rolled on the bottom of interlayer 2.

An opening is made in the assembly consisting of interlayer 2, adhesive layer 6 and anti-adhesive film by means of a cutting machine with a part holder, this opening being intended to form window 4 of structure 1.

The anti-stick film is then separated.

Interlayer 2 with adhesive layer 6 on top, support 7 with antenna 11 on top, adhesive layer 16 and anti-adhesive film 15 are assembled by cold rolling on a specific machine, with chip 8 being housed in window 4 without overflowing from it, as shown in Figures 1 and 2.

The resulting structure 1 can be used for the manufacture of a safety document.

Figure 3 shows a document 20 like a visa label, with a fibrous layer 21 on paper, this layer 21 being cold rolled on the upper side of structure 1 by means of a layer of pressure sensitive adhesive 22.

Document 20 may also be provided with a safety feature, e.g. a holographic patch, a non-polar solvent-reactive ink, an irreversible thermochromic ink which changes colour when the temperature reaches 65 °C, these safety features being preferably made outside the portion 21a of layer 21 facing window 4 of structure 1.

The fibre layer 21 may include other safety features such as visible fluorescent coloured safety fibres, invisible fluorescent plates for authentication and chemical reagents such as acid, base, oxidizer and polar solvent reagents to prevent attempted chemical falsification.

Document 20 can thus have the following advantages: security at the level of authentication: Level 1 safety: visible fibres, for example a window in the shape of a star visible in transmitted light,level 2 safety: planchettes and fluorescent fibres detectable under UV light of 365 nm,level 3 safety: microtag detectable with a detection device,security at the level of counterfeiting protection: Chemical attack: reagents in paper giving a coloured stain visible on the label surface, during chemical attack. Such chemical attack may occur when attempting to erase inscriptions on the printed surface of the visa or when attempting to remove the visa affixed to a passport or when attempting to open the visa to retrieve the electronic device,thermal attacks: attempts to remove the visa with the electronic device after application on passport paper (placement of the passport and the interlayer) cause a colour change of the thermochrome compound on the support of the electronic device, which is visible in reflection and especially in transmission at window 4 of the interlayer 2, attempts to recover the printed security paper (placement of the security paper and the interlayer) cause a coloured pattern on the print made with thermochromic ink on the surface of the security paper which makes any use of it difficult,Mechanical attacks, without heat: attempts to remove the visa with the electronic device after application on a passport paper (initiated layering between passport and interlayer) result in delamination of the interlayer, part of which will remain on the passport paper and the other on the label, so it is difficult to reuse the visa in its entirety. However, if the label is glued on another passport, there will be a loss of the detection signal from the Microtag tracers during a check anyway, since part of the interlayer is missing in the label. Attempts to recover the printed security paper (interlayering between security paper and layer) result in delamination of the single layer or the counter-visa.If the interlayer is delaminated, the pattern visible in transmission at the window level is likely to be altered and there is evidence of forgery.

In addition, the electronic device 8 is not visible in light transmitted outside window 4, which improves the aesthetics of document 20 and the patterns printed on it.

The structure may be of a different shape.

A structure 1 is shown in Figure 16 which differs from the structure 1 described above by having a layer of adhesive 16 on each side of the intermediate layer 2 and each layer of adhesive 16 is covered with an anti-adhesive film 15 which can be removed when the structure 1 is mounted on a document or article.

A structure 23 for the production of a safety document conforming to another example of the invention has been shown in Figure 4.

Structure 23 shall include: an intermediate layer 2 as described above,a layer of adhesive 6' extending only around the window 4 of the intermediate layer 2, and not on an entire face of this intermediate layer 2, a support 7' of the electronic device 8, this support 7' extending only on part of the intermediate layer 2, to the right of the adhesive layer 6', a layer of adhesive 24 extending over the entire bottom face of the intermediate layer 2, a masking layer 15'.

Structure 23 can be incorporated into a safety document 25 as shown in Figure 5 by rolling between two layers of paper 26 by means of two layers of adhesives 27.

In the example above, the interlayer 2 has an internal cohesion equal to or less than that of the paper layer 26 on which the layer 2 is mounted.

In the example above, the 15' masking layer has an internal cohesion equal to or less than that of the adjacent paper layer 26. The adhesion between interlayer 2 and masking layer 15', between interlayer 2 and adjoining layer 26, and between the 15' masking layer and adjoining layer 26 is greater than the cohesion of interlayer 2 and that of masking layer 15'. The interlayer 2 and masking layer 15 have similar cohesion.

This prevents an attempt to falsify document 25 by tearing or delaminating the interlayer 2 or the 15' masking layer to remove the electronic device 8.

The protection against tampering is enhanced when the 15' or 2' masking layers contain safety features, as alteration of the 2' or 15' masking layer may result in deterioration of the safety features or alteration of an optical, electrical or magnetic signal which can be easily detected.

The structure 23 can also be incorporated into a 25' document, as shown in Figure 6, by pre-treating the outer surfaces of interlayer 2 and masking layer 15' to give them hot reactive adhesive properties.

The layers of paper 26 are then hot rolled onto the structure 23. an intermediate layer 2, an adhesive layer 6, a support 7 of the electronic device 8, this support 7 extending over the entire lower face of the intermediate layer 2.

Such a structure 27 may be used, for example, for the production of a security or security document 28, as shown in Figure 8.

The structure 27 can be rolled to be assembled with two layers of paper 26 by means of two layers of adhesive 29.

Each layer of adhesive 29 is initially presented, for example, as a transfer film sandwiched between two anti-adhesive films, for example, the type with a paper layer with a silicone coating.

The present invention is not excluded when the electronic device is of a different type from that described above.

Figure 9 shows a structure 30 consisting of: a first masking layer 31, a first adhesive layer 32, a first intermediate layer 33 with a first window 40, a second layer of adhesive 34, a second intermediate layer 35 with a second window 41, larger than window 40, a third adhesive layer 36, a second masking layer 37.

An electronic device 42 is housed in windows 40 and 41.

Figure 9A shows structure 30 without masking layers 31 and 37.

For example, masking layers 31 and 37 each have a black core covered on their outer face with a white printing coating.

The white coating may contain, for example, fluorescent particles called Hilites, detectable under UV light of wavelength of about 365 nm.

The white coating may also contain safety fibres, e.g. double fluorescent safety fibres excitable under UV radiation at 254 nm and 365 nm respectively.

Masking layers 31 and 37 may also contain, incorporated in the core, tracers, e.g. Microtag type, detectable with a wearable detection device.

Masking layers 31 and 37 are advantageously opaque enough to render the electronic device 42 undetectable in transmitted light.

For example, adhesive layers 32, 34 and 36 contain a pressure sensitive adhesive.

Adhesive layers 32 and 36 may be pre-deposited in liquid form on masking layers 31 and 37 on their inner face, i.e. on the respective black core.

The adhesive layer 34 is, for example, initially in the form of a transfer film.

Layer 32 and 36 in the example above are approximately 25 μm thick. Layer 34 may be thicker to compress the antenna, e.g. slightly thicker than 100 μm.

The electronic device 42 contains, for example, a module 43 marketed as MOA4 by Philips.

This module 43 occupies an area of approximately 42 mm2 and has a total thickness of 410 μm.

This module 43 has at its bottom an integrated circuit, or alternatively several, and a connection circuit 44 with connection legs 45 connected to a copper antenna 46 of the wire type, deposited on the interlayer 35, and at its top an encapsulation resin 47.

Interlayer 33 is, in the example above, a fibrous layer made of cellulose fibres, with a density of approximately 320 g/m2 and a thickness of approximately 400 μm.

The window 40 of this intermediate layer 33 receives encapsulation resin 47 from module 43, encapsulation resin 47 having a thickness of about 330 μm and occupying an area of about 25 mm2 in the example shown.

The intermediate layer 33 in the example above is white and may contain safety features, for example yellow invisible fluorescent light tracers detectable with a UV lamp with a wavelength of approximately 365 nm.

This intermediate layer 33 also contains, for example, tracers detectable with a portable X-ray fluorescence device, which may be those marketed by KeyMasters Technologies.

The intermediate layer 35 is, in the example above, a fibrous layer, e.g. made of cellulose fibres, e.g. white, with a density of, for example, about 90 g/m2 for a thickness of 125 μm.

The window 41 of the intermediate layer 35 receives the module's connection circuit 44, for example, with a thickness of about 120 μm.

The interlayer 35 may include safety features such as for example fluorescent red invisible tracers detectable with a UV lamp with a wavelength of 365 nm.

In the example above, interlayer 35 has a cohesion, measured by the Scott Bond device, less than or equal to that of interlayer 33 and masking layers 31 and 37.

The adhesive layer 34 has a higher adhesion and cohesion than the internal cohesion of the intermediate layers 33 and 35.

The manufacturing steps of the structure 30 will now be described in more detail.

The adhesive layer 34 is initially sandwiched between two removable (not shown) anti-adhesive films.

After separation of one of the two anti-adhesive films, the adhesive layer 34 is cold rolled on one side of the interlayer 33.

A window is then made in the whole, consisting of interlayer 33, adhesive layer 34 and anti-adhesive film on this adhesive layer 34.

This window can be made with a cutting machine with a part holder.

A window is also made in interlayer 35.

The wired antenna 46 of the electronic device 42 is placed on one side of the interlayer 35.

The module 43 is inserted into the window 41 of the intermediate layer 35 so that the connection circuit 44 is completely housed there, being connected by the connection legs 45 to the antenna 46.

The anti-adhesive film still present on adhesive layer 34 is removed.

The assembly consisting of interlayer 33 and adhesive layer 34 is assembled with interlayer 35 so that the encapsulation resin 47 of module 43 is housed in window 40 of interlayer 33 and the antenna is sandwiched between interlayer 33 and 35.

Finally, masking layers 31 and 37 which have previously received pressure sensitive adhesive layers 32 and 36 are rolled on the assembly containing intermediate layers 33 and 35.

The resulting structure 30 may, for example, be printed with one or more inks, including one or more chemically reactive inks, one or more optically variable inks and may also be printed with a holographic patch.

The structure can also be customized at the white layers of masking layers 31 and 37.

The resulting structure 30 can be inserted between two transparent plastic layers 48 and hot-rolled with these layers 48 by means of an adhesive layer 49, as shown in Figure 10.

This gives an identity document 39 in the form of a card with the electronic device ready for use.

The structure 30 assembled in the document extends to the slice of the document so that the safety features present in particular in the intermediate layers 33 and 35 are visible on the slice and can be detected on it by suitable means or visually.

Such an identity document may have the following advantages: the authentication security: First level: optically variable inks, holographic patches, second level: fluorescent particles and double-fluorescent fibres on both sides of the printed document, yellow and red fluorescent effect on the slice of the document, third level: Microtag and KeyMaster security detectable with specific equipment, respectively, counterfeiting security: against chemical binders: reactive agents in the security inks on each paper surface of the document, giving a coloured stain visible on the surface of the card, during chemical attacks.against mechanical attack: attempts to remove the electronic device will result in tearing or delamination of the interlayer 33 and/or the interlayer 35. These attempts will also result in a loss of yellow and red fluorescence at the slice level and a change in the signal provided either by the KeyMaster tracers in the interlayer or by the Microtag tracers in the masking layers.

Moreover, the electronic device is not visible at all, neither in transmission nor reflected in the final document, which enhances the aesthetics of the map and the prints present.

A structure 50 corresponding to another example of the invention has been represented in Figure 11 and is intended for the production of a safety or value document, as will be shown below.

The structure 50 consists of: a first interlayer 51 with a first window 58, a first adhesive layer 52, a second interlayer 53 with a second window 59, larger than the first window 58, a second adhesive layer 54, and a masking layer 55.

The first interlayer 51 is, for example, a fibrous layer made of cellulose fibres, with a density of 270 g/m2 and a thickness of 350 μm.

The first interlayer 51 is for example white, with safety features such as for example the commercial reference SC4 yellow green invisible fluorescent tracers marketed by Angström, which are visually detectable with a lamp emitting U.V. radiation of 365 nm wavelength, and quantitatively with a scanner marketed by Angström.

The structure 50 shall also contain a non-contact electronic device 60, containing a support 61 made of mineral material and approximately 130 μm thick.

The device 60 also contains a chip protected by an encapsulation resin 62, e.g. approximately 330 μm thick.

The support 61 carries a wire antenna 63 made of copper.

The support 61 may, for example, have a section of 4,7 cm by 12 cm.

Window 58 of interlayer 51 receives encapsulation resin 62.

The second interlayer 53 is, in the example above, a fibrous layer made of cellulose fibres with a density of 100 g/m2 and a thickness of approximately 130 μm, which is approximately the same as that of the support 61.

The intermediate layer 53 is for example white paper, and may contain safety features such as visually detectable invisible red fluo SC10 luminescent tracers with a UV lamp emitting UV radiation of 365 nm wavelength, and quantitatively with a scanner marketed by Angström.

In the example, interlayer 51 has an internal cohesion equal to or less than that of interlayer 53. The latter has an internal cohesion equal to or less than that of the masking layer 55. The adhesion between the first interlayer 51 and the second interlayer 53 is greater than the cohesion of the interlayer 51. The adhesion between masking layer 55 and interlayer 53 is greater than the cohesion of the interlayer 53.

In the example, masking layer 55 is black, the dye or pigment used for the colouring being preferably resistant to migration under predetermined temperature and humidity conditions, e.g. 80% RH, at 65 °C and contact pressure e.g. less than 1 kg/cm2.

Adhesive layers 52 and 54 contain an adhesive which is, for example, of a pressure sensitive type and is applied in liquid form.

The manufacturing steps of the structure 50 are described in more detail.

The interlayer 51 is covered on the inner side with a liquid adhesive layer 52.

The masking layer 55 shall also be provided with a liquid adhesive 54 on its inner face.

A window is then made, in particular by means of a laser cutting machine, consisting of the interlayer 51, the adhesive layer 52 and an anti-adhesive film applied to the adhesive layer 52.

A window is also made in interlayer 53.

Then, after removal of the anti-adhesive film from the adhesive layer 52, the interlayer 51 is assembled with the electronic device 60, the interlayer 53 and the masking layer 55 on a specific machine.

The electronic device carrier 61 is housed in window 59 of intermediate layer 53 and the chip with encapsulation resin 62 is housed in window 58 of intermediate layer 51.

The resulting structure 50 can be used for the manufacture of a passport booklet 80, for example.

The manufacture of passport booklet 80 may consist of the following steps, carried out on an assembly machine: assembly of the structure 50 with a set of sheets 81 including the visa pages and the security films, this assembly being done at the level of the guard page by means of a liquid glue 82, as shown in Figure 15, sewing of all sheets 81 and the structure 50 centrally, the sewing being done so that the set of sheets and part of the support 61 of the electronic device 60 are sewn together,as shown in Figure 15, the seam 84 is made outside the antenna 63 and the electronic chip of the device 60, in order not to affect the operation of the electronic device 60, assembly of the structure and sheets 81 sewn together with a sheet 85 of a textile type coated with a liquid glue 82 so that the structure 50 is sandwiched between the sheets of paper and the coated textile sheet, as shown in Figure 14, and coating of the final cover on its coated side by application of foil by hot transfer,and folding of the booklet at the sewing stage.

The security document thus produced may have the following advantages: Forms of counterfeiting against mechanical attack: Any attempt to remove the electronic device will be made very difficult as the electronic device is sewn into the entire passport,any attempt to remove the electronic device by peeling and removing the sewing thread will result in visible delamination of the interlayer 51 or 53 and affect the recognition of yellow and red fluorescence on the slice of the cover, either visually or automatically with the Angstrom scanner.Authentication security:second level: yellow and red fluorescent effect on the passport slice,third level: measurement of the spectral signature of fluorescence at the slice level by a dedicated scanner.

Moreover, the electronic device is neither transmitted nor reflected in the cover of the final passport booklet.

Structure 50 can alternatively be incorporated into a safety document 70 by being rolled between two layers of paper 71 by means of two layers of adhesive 72, as shown in Figure 12.

A passport-like booklet 100 has been shown in Figure 17 with a cover 101 and a set of linked sheets 102.

Cover 101 has a structure 103 comprising an electronic device 104 and a fibrous interlayer 105 with a window 106 into which the electronic device 104 extends partially.

This electronic device 104 is for example a module comprising an electronic chip encapsulated in a resin and fixed on a substrate, which carries an antenna connected to two connecting legs of the electronic chip.

The structure described is the same as in Figure 9, but masking layer 31 is replaced by the set of linked sheets 102 and masking layer 37 is replaced by an outer layer 108.

The cover shall also have an outer layer 108 glued to the structure 103 by means of a layer of adhesive 109.

For example, outer layer 108 may be made of latex impregnated paper with a plastic coating, or outer layer 108 may be made of plastic impregnated textile with a plastic coating.

In the example above, structure 103 has an additional fibrous interlayer 110 with a window 111 of a lower cross section than window 106 and is arranged to partially accommodate the electronic device 104.

The interlayer 105 and 110 are assembled by means of an adhesive layer 112, e.g. with a liquid glue, the electronic device 104 with an antenna 113 pre-deposited on layer 105 before receiving adhesive layer 112.

The sheet set 102 has a guard sheet 115 glued to the structure 103 on the side of the additional fibre layer 110.

This additional interlayer 110 may, if desired, be made from a material other than paper, e.g. polymer.

The following are steps in a manufacturing process for structure 103.

As shown in Figure 18, a window 106 is first made in step 120 in the paper layer 105.

Then, at step 121, the electronic device 104 is brought into window 106 by means of a support sheet 118 bearing the electronic device 104.

At step 122, the antenna 113 is placed on layer 105 and welded to the electronic device 104.

In step 123, layer 105 is brought into contact with layer 110 which has previously received a layer of adhesive 112 applied by transfer rollers.

Electronic device 104 extends into windows 106 and 111 of layers 105 and 110.

In step 124, the structure 103 is cut to the desired size.

In step 125, the structure 103 is laminated under pressure and temperature to allow the adhesive to harden and/or cross-link.

In a variant of step 123, the adhesive layer 112 is brought in as a hot-activated film between layers 105 and 110 and the assembly is hot-rolled under pressure, for example between two rollers or in a tray press.

In the above process, it is possible to subject the structure 103 to ultrasound at specific points to maintain the prepositioning of the various components of the structure 103 before final hot pressurized assembly.

The support sheet 118 shall be removed at the end of the process.

The assembly of the structure 103 described above with reference to Figure 17 or other structures made in accordance with the invention with a book cover may be carried out in various ways.

As shown in Figure 19, the sheet 102 assembly can be assembled with the structure 103 before the structure 103 is assembled with the outer layer 108 of the cover.

In the example shown above, sheets 102 are joined together by a seam 140, which is not used to bind sheets 102 to the rest of the cover.

Alternatively, as shown in Figure 20, the seam 140 is also used to bind the sheet 102 to the sheet 103 structure.

The yarn or yarns of the seam 140 can be advantageously impregnated with an adhesive 141 to make it possible to bind the seam to the outer layer 108.

Figure 21 shows an insertion 150 comprising an electronic device 151 equipped with an electronic chip 152 connected to an antenna 153.

In the example above, the insert 150 is in the shape of a disc.

The 152 chip is made on a plastic film.

Chip 152 has wires connecting it to antenna 153.

The chip 152, the connecting wires and the antenna 153 may be encapsulated in one or more resins.

For example, insert 150 has two layers of external encapsulation resin glued together and a central layer of resin, the resin of the central portion being cast and then hardened.

The plastic film and/or outer layers of encapsulation resin can be based on polyimide (PI) or other materials such as epoxy glass films combined with resins. Polyimide is a high heat resistant material (250°C continuous), with excellent mechanical strength from -100°C to +200°C, good shock resistance, good chemical resistance, satisfactory electrical insulation properties, and a very low expansion coefficient.

To increase the communication distance between the chip and a reader, an amplifier antenna, not shown, can be attached to the insert 150.

For example, the insert 150 has a thickness of 200-300 μm, for example about 250 μm.

A structure 160 according to an example of the invention is shown in Figure 22 with a masking layer of paper 161 to which an insert 150 is glued as described above, e.g. by means of a layer 162 of an adhesive made of a hot-activated material, e.g. polyurethane, e.g. 20 to 25 μm thick.

The structure 160 also has an interlayer 163 formed by another hot-activated adhesive film, e.g. polyurethane, with a window, surrounding the insert 150 and having a thickness chosen to compensate for that of the insert 150 and that of the underlying adhesive 162.

As shown in Figure 23, structure 160 may, if desired, include a fibrous masking layer 164, this layer 164 and masking layer 161 sandwiching the insert 150.

The structure 160 with the fibrous layer 164 may be between 400 and 450 μm thick.

A structure 170 in accordance with another example of the invention, consisting of two layers of fibrous masking 171 and 173 sandwiched between an intermediate fibrous layer 172, based on e.g. natural and/or synthetic fibres, e.g. wet or dry cellulose, is shown in Figure 24.

This interlayer 172 has a window 175 arranged to receive an insert 150, for example as defined above.

Layers 171 to 173 are joined together by means of two layers of adhesive 174, e.g. in a hot-activated material, e.g. polyurethane.

The amplifier antenna may be placed between the inner face of masking layer 173 and adhesive 174 or between masking layer 171 and adhesive 174 or on the final document provided that the amplifier antenna surrounds the insert 150.

A structure 180 conforming to another example of the invention, consisting of two outer layers of paper 181 and 182 masking and sandwiching an intermediate layer of paper 183, is shown in Figure 25.

The latter has a window 184 suitable for partially housing an electronic device 185.

This consists of a substrate 186, outside window 184, sandwiched between the fibrous layer 182 and the intermediate layer 183.

The various layers 181-183 are joined together by layers of adhesive 187 including, for example, a pressure sensitive adhesive.

The outer masking layers 181 and 182 may be printed if desired.

As shown in Figure 26, the masking layer 182 may be replaced by an anti-stick support 190 on which the electronic device 185 rests.

A structure 200 without a fibrous layer has been shown in Figure 27 and consists of: a masking layer 201 of plastic,a layer of adhesives 202 activated by heat,an intermediate layer 203 of plastic with a window 204 for partial reception of an electronic device 205,an adhesive layer 206 for example activated by heat, without instantaneous adhesion, with a window 207 for receipt of part of the electronic device 205 and in which an antenna 208 of the electronic device 205 is immersed.

Figure 28 shows a structure 210 comprising: an electronic device 211,a first intermediate layer 212 with a window 213 into which the electronic device extends at least partly,a second intermediate layer 214 having thermal activation adhesive properties with a window 215 into which the electronic device extends at least partly,a third intermediate layer 216 with a window 217 into which the electronic device extends at least partly, the electronic device is housed in the cavity formed by the three windows 213, 215 and 217 assembled in a directional manner, the antenna 218 resting between the second and third intermediate layers.

The structure also has an additional layer of adhesive 219 on the outer side of the third interlayer 216 to allow its application on a substrate, and an adhesive layer 220 and a masking layer 221 on the outer side of the first interlayer 212 to hide the part of the electronic device visible in the window.

Of course, the invention is not limited to the examples of realization just described.

In particular, the characteristics of the various examples of implementation described above can be combined in unillustrated variants.

Electronic devices, e.g. modules, may be located in one direction or the other, i.e. upside down or upside down, in the structures described above.

The expression with a must be understood as being synonymous with with at least a , unless otherwise specified.

Claims (45)

1. A structure (1; 23; 27; 30; 50) for fabricating a security document or a document of value, comprising:

   - an electronic device (8; 42; 60) enabling data to be exchanged without contact, the electronic device comprises a support (7) carrying an electronic chip (10) and an antenna (11), for example engraved or wired, connected to the electronic chip,

   - an inset layer (2; 33; 35; 51; 53) made at least in part out of fiber, and having a window (4; 41; 58; 59) within which the electronic device (8 ; 42 ; 60) extends, at least in part, the electronic chip (10) of the electronic device extending in the window of the inset layer.;

   - an adhesive layer (6; 6'; 24; 32; 34; 36; 52; 54) in contact with the inset layer;

   - an adjacent layer assembled with the inset layer via the adhesive layer, the adhesive presenting adhesive power and coherence that are sufficiently high so that any attempt at separating the inset layer from the adjacent layer spoils at least the inset layer, the adjacent layer being an additional inset layer, a masking layer, or the support of the electronic device,

   the adhesion between two adjacent layers of the structure being stronger than the internal cohesion of at least one of said layers.
2. A structure according to claim 1, characterized in that the structure includes a removable anti-adhesive film for protecting the adhesive layer.
3. A structure according to any one of previous claims, characterized in that the inset layer (2; 33; 35; 51; 53) is made entirely of fiber.
4. A structure according to any one of previous claims, characterized in that the structure includes at least one outer fiber layer (2; 31; 37; 51; 55) for being assembled to a fiber layer of the security document or document of value.
5. A structure according to the previous claims, characterized in that the support (7) is flexible.
6. A structure according to any one of the two previous claims, characterized in that the support (7) is made of a polymer material selected among PET, PVC, ABS/PC, PC, PA, PI, PE, PP.
7. A structure according to any one of claims 4 and 5, characterized in that the support (7) is a fiber layer.
8. A structure according to any one of claims 4 and 5, characterized in that the support (7) is made of mineral material.
9. A structure according to any one of claims 4 and 5, characterized in that the support (7) is made of epoxy glass.
10. A structure according to any one of claims 4 to 9, characterized in that the support has a face with a coating containing an irreversible thermochromic compound.
11. A structure according to any one of claims 4 to 10, characterized in that the support (7) is sandwiched between two layers of the structure.
12. A structure according to any one of previous claims, characterized in that the electronic device (8 ; 42 ; 60) comprises a module with a connection portion for connection to an antenna and an electronic chip embedded in an encapsulating resin.
13. A structure according to previous claim, characterized in that the structure includes an additional inset layer (35; 53) with a window housing the module, the encapsulating resin being housed in the window of the other inset layer.
14. A structure according to previous claim, characterized in that the electronic device includes an antenna, and wherein the antenna is carried by said additional inset layer (35).
15. A structure according to any one of previous claims, characterized in that the adhesive layer enables the inset layer to be assembled cold with an adjacent layer of the structure or the security document or the document of value.
16. A structure according to claim 15, characterized in that the adhesive is a pressure-sensitive adhesive.
17. A structure according to any one of claims 1 to 14, characterized in that the adhesive layer enables the inset layer to be assembled hot with an adjacent layer of the structure or the security document or the document of value.
18. A structure according to claim 17, characterized in that the adhesive layer is hot-activatable.
19. A structure according to any one of previous claims, the structure comprising two inset layers, characterized in that one of the inset layers (33, 35, 51, 53) presents internal cohesion that is less than that of the other inset layer.
20. A structure according to any one of previous claims, including a masking layer, characterized in that the inset layer (2; 35; 51; 53) presents internal cohesion that is less than or equal to the internal cohesion of the masking layer (15; 31; 37; 55).
21. A structure according to any one of previous claims, characterized in that the cohesion of the support (7) is less than or equal to the cohesion of the inset layer (2).
22. A structure according to any one of previous claims, having two inset layers, characterized in that one of the inset layers includes a window (40, 58) that is smaller than the window (41, 59) of the other inset layer.
23. A structure according to the previous claim, characterized in that the electronic device includes two portions of different widths, the portion of smaller width being received in the smaller window and the portion of greater width being received in the larger window.
24. A structure according to the previous claim, characterized in that the inset layer with the smaller, respectively with the larger, window presents thickness substantially equal to that of the portion of the electronic device having the smaller, respectively the greater, width.
25. A structure according to any one of claims 22 to 24, characterized in that the electronic device includes an antenna disposed between the two inset layers.
26. A structure according to any one of claims 22 to 25, characterized in that the electronic device includes an antenna disposed on the portion of greater width.
27. A structure according to any one of claims 22 to 26, characterized in that the structure does not include pressure-sensitive adhesive between the two inset layers.
28. A structure according to claim 1, characterized in that the structure includes two adhesive layers (15) on its opposite faces, eventually each one being covered by a removable anti-adhesive film.
29. A structure according to any one of previous claims, characterized in that the electronic device is a RFID device.
30. A security document or a document of value (20; 25; 25'; 28; 39; 70) including a structure as defined in any one of previous claims.
31. A document according to claim 30, constituting an identity document, a visa label, or a passport booklet.
32. A document according to any one of claims 30 and 31, characterized in that the structure is sandwiched between two fiber layers, especially in paper.
33. A process for fabricating a structure according to any one of claims 1 to 29, the process comprising the steps of:

    - supplying the electronic device (8; 42; 60) enabling data to be exchanged without contact;

    - supplying the inset layer (2; 33; 35; 51; 53) with the window (4; 40; 41; 58; 59);

    - placing on the inset layer the adhesive layer enabling the inset layer to be assembled with an adjacent layer of the structure or of the security document or document of value,

    - placing the electronic device at least in part in the window in the inset layer.
34. A process according to the previous claim, characterized by the fact that it includes the following steps:

    - depositing the adhesive layer (6; 6'; 24; 32; 36;52; 54) on the inset layer (2; 33; 35; 51; 53); and

    - making a window in the assembly constituted by the inset layer and the adhesive layer, in particular with the help of a die or a laser.
35. A process according to any one of the two previous claims, characterized by the fact that it includes the following steps:

    - providing an adhesive layer in the form of a film for transfer, said adhesive layer initially being covered in at least one anti-adhesive film, and in particular by two anti-adhesive films each on a respective face of the adhesive layer;

    - removing the anti-adhesive film from the adhesive layer;

    - assembling the adhesive layer with the inset layer.
36. A process according to any one of the claims 34 and 35, characterized by the fact that it includes the following steps:

    - depositing an adhesive in liquid form on the inset layer or on an optional masking layer so as to form an adhesive layer; and

    - optionally covering the adhesive layer as formed in this way in an anti-adhesive film.
37. A process according to any one of the claims 33 to 36, characterized by the fact that it includes the following steps:

    - supplying two inset layers (33; 35; 51; 53);

    - separately forming at least one window in each of the inset layers; and

    - depositing an adhesive layer on each of the inset layers.
38. A process according to any one of the claims 33 and 36, characterized by the fact that it includes the following step:

    - bonding the various layers of the structure together by cold or hot-lamination.
39. A process of making a security document or a document of value (20; 25; 25'; 28; 39; 70), characterized by the fact that it comprises the following steps:

    - providing a structure as defined in any one of claims 1 to 29, said structure being preassembled;

    - assembling said structure with the security document or document of value.
40. A process according to the previous claim, characterized by the fact that it includes the following step:

    - bonding together the structure and a layer of the security document or the document of value by cold or hot-lamination.
41. A process according to any one of the claims 34 and 40, characterized by the fact that it includes the following steps:

    - depositing an adhesive layer on the structure and/or a layer of the security document or document of value;

    - assembling the structure together with the security document or document of value with the help of the adhesive layer.
42. A process according to any one of claims 39 and 41, characterized by the fact that it includes the following steps:

    - treating an outside surface of the structure in such a manner as to make it adhesive and optionally covering it temporarily in an anti-adhesive film;

    - assembling the structure with the security document or document of value by putting the treated face of the structure into contact with the document.
43. A process according to any one of claims 39 and 42, including the following step:

    - sewing the structure to at least one sheet or layer of the security document or document of value.
44. A process according to any one of claims 39 to 43, characterized by the fact that it includes the following steps:

    - making a security print and/or depositing a security element on a layer of the document prior to assembling the document with the structure; and

    - assembling the structure with said layer of the document.
45. A process according to any one of claims 39 to 44, characterized by the fact that it includes the following steps:

    - assembling the structure with a layer of the document;

    - then making a security print or depositing a security element on said layer of the document.