[go: up one dir, main page]

HK1062081B - 用於防護連接器的減低電磁放射技術 - Google Patents

用於防護連接器的減低電磁放射技術 Download PDF

Info

Publication number
HK1062081B
HK1062081B HK04105009.4A HK04105009A HK1062081B HK 1062081 B HK1062081 B HK 1062081B HK 04105009 A HK04105009 A HK 04105009A HK 1062081 B HK1062081 B HK 1062081B
Authority
HK
Hong Kong
Prior art keywords
connector shell
layer
logic ground
coupled
current path
Prior art date
Application number
HK04105009.4A
Other languages
German (de)
English (en)
French (fr)
Other versions
HK1062081A1 (zh
Inventor
Alok Tripathi
Dennis Miller
Original Assignee
Intel Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/940,147 external-priority patent/US6700455B2/en
Application filed by Intel Corporation filed Critical Intel Corporation
Publication of HK1062081A1 publication Critical patent/HK1062081A1/zh
Publication of HK1062081B publication Critical patent/HK1062081B/zh

Links

HK04105009.4A 2001-08-23 2002-08-01 用於防護連接器的減低電磁放射技術 HK1062081B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/940,147 2001-08-23
US09/940,147 US6700455B2 (en) 2001-08-23 2001-08-23 Electromagnetic emission reduction technique for shielded connectors
PCT/US2002/024671 WO2003019733A1 (en) 2001-08-23 2002-08-01 Electromagnetic emission reduction technique for shielded connectors

Publications (2)

Publication Number Publication Date
HK1062081A1 HK1062081A1 (zh) 2004-10-15
HK1062081B true HK1062081B (zh) 2007-04-27

Family

ID=

Similar Documents

Publication Publication Date Title
EP1419559B1 (en) Electromagnetic emission reduction technique for shielded connectors
US5120258A (en) Low inductance shielded cable to printed circuit board connection apparatus
US5331505A (en) Multi-coplanar capacitor for electrical connector
US9806469B2 (en) Electrical connectors including electromagnetic interference (EMI) absorbing material
US4751479A (en) Reducing electromagnetic interference
US4891616A (en) Parallel planar signal transmission system
US5003273A (en) Multilayer printed circuit board with pseudo-coaxial transmission lines
US5315069A (en) Electromagnetic radiation reduction technique using grounded conductive traces circumscribing internal planes of printed circuit boards
US5392019A (en) Inductance device and manufacturing process thereof
EP1945010B1 (en) Multi-layer substrate and electronic device having the same
JP5983780B2 (ja) プリント配線基板、電子機器及び配線接続方法
WO2002091515A1 (fr) Composantes de type ligne de transmission
US20050224912A1 (en) Circuit and method for enhanced low frequency switching noise suppression in multilayer printed circuit boards using a chip capacitor lattice
US7086869B1 (en) Flexible cable interconnect with integrated EMC shielding
CN109473805A (zh) 一种连接器及背板互连系统
CN215835591U (zh) 印刷电路板和电子设备
CN108738224B (zh) 包括屏蔽多层电力传输板的电源
US7209368B2 (en) Circuitized substrate with signal wire shielding, electrical assembly utilizing same and method of making
EP1568099B1 (en) A circuit that taps a differential signal
US7679005B2 (en) Circuitized substrate with shielded signal lines and plated-thru-holes and method of making same, and electrical assembly and information handling system utilizing same
HK1062081B (zh) 用於防護連接器的減低電磁放射技術
CN109478747B (zh) 高速通信插座
CN107852812A (zh) 印刷布线板
CN110784995A (zh) 电路板结构
US20050070161A1 (en) Modular jack with external electromagnetic shielding