GB836979A - Electrodeposition of copper and copper alloys - Google Patents
Electrodeposition of copper and copper alloysInfo
- Publication number
- GB836979A GB836979A GB18212/58A GB1821258A GB836979A GB 836979 A GB836979 A GB 836979A GB 18212/58 A GB18212/58 A GB 18212/58A GB 1821258 A GB1821258 A GB 1821258A GB 836979 A GB836979 A GB 836979A
- Authority
- GB
- United Kingdom
- Prior art keywords
- copper
- metal
- june
- saccharate
- salts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title abstract 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract 4
- 239000010949 copper Substances 0.000 title abstract 4
- 229910052802 copper Inorganic materials 0.000 title abstract 3
- 238000004070 electrodeposition Methods 0.000 title 1
- -1 saccharate ions Chemical class 0.000 abstract 3
- 239000002253 acid Substances 0.000 abstract 2
- 229910052751 metal Inorganic materials 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 2
- 150000003839 salts Chemical class 0.000 abstract 2
- UGWULZWUXSCWPX-UHFFFAOYSA-N 2-sulfanylideneimidazolidin-4-one Chemical compound O=C1CNC(=S)N1 UGWULZWUXSCWPX-UHFFFAOYSA-N 0.000 abstract 1
- QNAYBMKLOCPYGJ-UHFFFAOYSA-N Alanine Chemical class CC([NH3+])C([O-])=O QNAYBMKLOCPYGJ-UHFFFAOYSA-N 0.000 abstract 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 abstract 1
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 abstract 1
- DSLZVSRJTYRBFB-LLEIAEIESA-N D-glucaric acid Chemical compound OC(=O)[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C(O)=O DSLZVSRJTYRBFB-LLEIAEIESA-N 0.000 abstract 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 abstract 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 abstract 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract 1
- 238000007792 addition Methods 0.000 abstract 1
- 239000003513 alkali Substances 0.000 abstract 1
- 229910052783 alkali metal Inorganic materials 0.000 abstract 1
- 150000001340 alkali metals Chemical class 0.000 abstract 1
- 150000001412 amines Chemical group 0.000 abstract 1
- 238000005282 brightening Methods 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 238000009713 electroplating Methods 0.000 abstract 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 abstract 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 abstract 1
- 238000007747 plating Methods 0.000 abstract 1
- 230000010287 polarization Effects 0.000 abstract 1
- PYWVYCXTNDRMGF-UHFFFAOYSA-N rhodamine B Chemical compound [Cl-].C=12C=CC(=[N+](CC)CC)C=C2OC2=CC(N(CC)CC)=CC=C2C=1C1=CC=CC=C1C(O)=O PYWVYCXTNDRMGF-UHFFFAOYSA-N 0.000 abstract 1
- 239000011669 selenium Substances 0.000 abstract 1
- 229910052711 selenium Inorganic materials 0.000 abstract 1
- 150000003498 tellurium compounds Chemical class 0.000 abstract 1
- 239000000080 wetting agent Substances 0.000 abstract 1
- 150000003751 zinc Chemical class 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
- C25D3/40—Electroplating: Baths therefor from solutions of copper from cyanide baths, e.g. with Cu+
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
836,979. Copper and copper alloy plating baths. METAL & THERMIT CORPORATION. June 6, 1958 [June 19, 1957], No. 18212/58. Class 41. An electrolytic plating bath for copper or copper alloys includes saccharate ions, e.g. by adding alkali metal or ammonium saccharates, including the acid salts, copper saccharate or saccharric acid, which improves anode current efficiency and depresses anode polarization. About 0.06 to 0.24 mols. per litre is added. Alkali cyanide baths are specified in which either tin or zinc salts may also be present to give a copper alloy deposit. Optional additions include wetting agents of the quaternary amine type, amino-propionates or polyoxyethylene glycol ethers; brightening agents, e.g. selenium and tellurium compounds, rhodamine, thiohydantoin or metal salts, all as described in Specifications 836,977 and 836,978.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US836979XA | 1957-06-19 | 1957-06-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB836979A true GB836979A (en) | 1960-06-09 |
Family
ID=22180090
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB18212/58A Expired GB836979A (en) | 1957-06-19 | 1958-06-06 | Electrodeposition of copper and copper alloys |
Country Status (2)
| Country | Link |
|---|---|
| FR (1) | FR1210751A (en) |
| GB (1) | GB836979A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015039152A1 (en) | 2013-09-18 | 2015-03-26 | Ing.W.Garhöfer Gesellschaft M.B.H. | Deposition of cu, sn, zn-layers on metallic substrates |
-
1958
- 1958-06-06 GB GB18212/58A patent/GB836979A/en not_active Expired
- 1958-06-16 FR FR1210751D patent/FR1210751A/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015039152A1 (en) | 2013-09-18 | 2015-03-26 | Ing.W.Garhöfer Gesellschaft M.B.H. | Deposition of cu, sn, zn-layers on metallic substrates |
Also Published As
| Publication number | Publication date |
|---|---|
| FR1210751A (en) | 1960-03-10 |
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