GB2605167B - A wafer for the CVD growth of uniform graphene and method of manufacture therof - Google Patents
A wafer for the CVD growth of uniform graphene and method of manufacture therof Download PDFInfo
- Publication number
- GB2605167B GB2605167B GB2104140.5A GB202104140A GB2605167B GB 2605167 B GB2605167 B GB 2605167B GB 202104140 A GB202104140 A GB 202104140A GB 2605167 B GB2605167 B GB 2605167B
- Authority
- GB
- United Kingdom
- Prior art keywords
- wafer
- cvd growth
- uniform graphene
- therof
- manufacture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/403—Oxides of aluminium, magnesium or beryllium
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/02—Pretreatment of the material to be coated
- C23C16/0272—Deposition of sub-layers, e.g. to promote the adhesion of the main coating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/26—Deposition of carbon only
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- H10P14/24—
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- H10P14/2905—
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- H10P14/3238—
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- H10P14/3248—
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- H10P14/3406—
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- H10P14/6339—
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- H10P14/668—
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- H10P14/69391—
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- H10P90/00—
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
Priority Applications (16)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB2502309.4A GB2635298A (en) | 2021-03-24 | 2021-03-24 | A wafer for the CVD growth of uniform graphene and method of manufacture thereof |
| GB2104140.5A GB2605167B (en) | 2021-03-24 | 2021-03-24 | A wafer for the CVD growth of uniform graphene and method of manufacture therof |
| GB2110027.6A GB2605211B (en) | 2021-03-24 | 2021-07-12 | A method of forming a graphene layer structure and a graphene substrate |
| JP2023558487A JP7757414B2 (en) | 2021-03-24 | 2022-03-11 | Wafer for uniform graphene CVD growth and manufacturing method thereof |
| EP22711247.1A EP4314377A1 (en) | 2021-03-24 | 2022-03-11 | A wafer for the cvd growth of uniform graphene and method of manufacture thereof |
| US18/283,728 US20240153762A1 (en) | 2021-03-24 | 2022-03-11 | Wafer for the cvd growth of uniform graphene and method of manufacture thereof |
| KR1020237031823A KR102902155B1 (en) | 2021-03-24 | 2022-03-11 | Wafer for CVD growth of uniform graphene and method for manufacturing the same |
| PCT/EP2022/056398 WO2022200083A1 (en) | 2021-03-24 | 2022-03-11 | A wafer for the cvd growth of uniform graphene and method of manufacture thereof |
| GB2203995.2A GB2607410B (en) | 2021-03-24 | 2022-03-22 | A method of forming a graphene layer structure and a graphene substrate |
| DE112022001740.6T DE112022001740T5 (en) | 2021-03-24 | 2022-03-22 | Method for forming a graphene layer structure and a graphene substrate |
| GB2218951.8A GB2615867B (en) | 2021-03-24 | 2022-03-22 | A method of forming a graphene layer structure and a graphene substrate |
| PCT/EP2022/057497 WO2022200351A1 (en) | 2021-03-24 | 2022-03-22 | A method of forming a graphene layer structure and a graphene substrate |
| TW111111013A TWI836383B (en) | 2021-03-24 | 2022-03-24 | A method of forming a graphene layer structure and a graphene substrate |
| TW111111012A TWI809778B (en) | 2021-03-24 | 2022-03-24 | A wafer for the cvd growth of uniform graphene and method of manufacture thereof |
| TW113105883A TWI881715B (en) | 2021-03-24 | 2022-03-24 | A method of forming a graphene layer structure and a graphene substrate |
| US18/283,770 US20240166521A1 (en) | 2021-03-24 | 2023-03-22 | A method of forming a graphene layer structure and a graphene substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB2104140.5A GB2605167B (en) | 2021-03-24 | 2021-03-24 | A wafer for the CVD growth of uniform graphene and method of manufacture therof |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| GB202104140D0 GB202104140D0 (en) | 2021-05-05 |
| GB2605167A GB2605167A (en) | 2022-09-28 |
| GB2605167B true GB2605167B (en) | 2025-04-09 |
Family
ID=75690026
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB2502309.4A Pending GB2635298A (en) | 2021-03-24 | 2021-03-24 | A wafer for the CVD growth of uniform graphene and method of manufacture thereof |
| GB2104140.5A Active GB2605167B (en) | 2021-03-24 | 2021-03-24 | A wafer for the CVD growth of uniform graphene and method of manufacture therof |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB2502309.4A Pending GB2635298A (en) | 2021-03-24 | 2021-03-24 | A wafer for the CVD growth of uniform graphene and method of manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| GB (2) | GB2635298A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116534849A (en) * | 2023-05-06 | 2023-08-04 | 湖北隆中实验室 | Method for inhibiting multilayer nucleation in CVD single-layer graphene |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010029092A1 (en) * | 1999-12-27 | 2001-10-11 | Dae-Gyu Park | Method for forming aluminum oxide as a gate dielectric |
| US20050142715A1 (en) * | 2003-12-26 | 2005-06-30 | Fujitsu Limited | Semiconductor device with high dielectric constant insulator and its manufacture |
| US20110175060A1 (en) * | 2010-01-21 | 2011-07-21 | Makoto Okai | Graphene grown substrate and electronic/photonic integrated circuits using same |
| JP2013152969A (en) * | 2012-01-24 | 2013-08-08 | Hitachi Ltd | Graphene transistor |
-
2021
- 2021-03-24 GB GB2502309.4A patent/GB2635298A/en active Pending
- 2021-03-24 GB GB2104140.5A patent/GB2605167B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010029092A1 (en) * | 1999-12-27 | 2001-10-11 | Dae-Gyu Park | Method for forming aluminum oxide as a gate dielectric |
| US20050142715A1 (en) * | 2003-12-26 | 2005-06-30 | Fujitsu Limited | Semiconductor device with high dielectric constant insulator and its manufacture |
| US20110175060A1 (en) * | 2010-01-21 | 2011-07-21 | Makoto Okai | Graphene grown substrate and electronic/photonic integrated circuits using same |
| JP2013152969A (en) * | 2012-01-24 | 2013-08-08 | Hitachi Ltd | Graphene transistor |
Also Published As
| Publication number | Publication date |
|---|---|
| GB202104140D0 (en) | 2021-05-05 |
| GB2635298A (en) | 2025-05-07 |
| GB2605167A (en) | 2022-09-28 |
| GB202502309D0 (en) | 2025-04-02 |
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