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GB2301938B - Testing semiconductor elements - Google Patents

Testing semiconductor elements

Info

Publication number
GB2301938B
GB2301938B GB9614327A GB9614327A GB2301938B GB 2301938 B GB2301938 B GB 2301938B GB 9614327 A GB9614327 A GB 9614327A GB 9614327 A GB9614327 A GB 9614327A GB 2301938 B GB2301938 B GB 2301938B
Authority
GB
United Kingdom
Prior art keywords
semiconductor elements
testing semiconductor
testing
elements
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9614327A
Other versions
GB2301938A (en
GB9614327D0 (en
Inventor
Tsuneo Hamaguchi
Kenji Kagata
Goro Izuta
Mitsunori Ishizaki
Osamu Hayashi
Susumu Hoshinouchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP03034194A external-priority patent/JP3288840B2/en
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of GB9614327D0 publication Critical patent/GB9614327D0/en
Publication of GB2301938A publication Critical patent/GB2301938A/en
Application granted granted Critical
Publication of GB2301938B publication Critical patent/GB2301938B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • H10P74/277—
    • H10W72/012—
    • H10W90/00—
    • H10W72/07251—
    • H10W72/20—
    • H10W72/251—
    • H10W72/877—
    • H10W72/9445—
    • H10W90/22—
    • H10W90/288—
    • H10W90/291—
    • H10W90/721—
    • H10W90/722—
    • H10W90/724—

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
GB9614327A 1994-02-28 1995-02-21 Testing semiconductor elements Expired - Fee Related GB2301938B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP03034194A JP3288840B2 (en) 1994-02-28 1994-02-28 Semiconductor device and manufacturing method thereof
GB9503419A GB2287123B (en) 1994-02-28 1995-02-21 Semiconductor device and production method

Publications (3)

Publication Number Publication Date
GB9614327D0 GB9614327D0 (en) 1996-09-04
GB2301938A GB2301938A (en) 1996-12-18
GB2301938B true GB2301938B (en) 1997-03-12

Family

ID=26306549

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9614327A Expired - Fee Related GB2301938B (en) 1994-02-28 1995-02-21 Testing semiconductor elements

Country Status (1)

Country Link
GB (1) GB2301938B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3129524B1 (en) * 2021-11-24 2025-10-24 Aledia Structure and testing and transfer method of an optoelectronic device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2180698A (en) * 1985-09-24 1987-04-01 Borg Instr Gmbh Bonding integrated circuit chips to substrates
US5289631A (en) * 1992-03-04 1994-03-01 Mcnc Method for testing, burn-in, and/or programming of integrated circuit chips
EP0596393A1 (en) * 1992-10-27 1994-05-11 Matsushita Electric Industrial Co., Ltd. Method of applying bumps on a semiconductor device and connecting it with a printed circuit board
US5440239A (en) * 1994-04-25 1995-08-08 Rockwell International Corporation Transferable solder bumps for interconnect and assembly of MCM substrates

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2180698A (en) * 1985-09-24 1987-04-01 Borg Instr Gmbh Bonding integrated circuit chips to substrates
US5289631A (en) * 1992-03-04 1994-03-01 Mcnc Method for testing, burn-in, and/or programming of integrated circuit chips
EP0596393A1 (en) * 1992-10-27 1994-05-11 Matsushita Electric Industrial Co., Ltd. Method of applying bumps on a semiconductor device and connecting it with a printed circuit board
US5440239A (en) * 1994-04-25 1995-08-08 Rockwell International Corporation Transferable solder bumps for interconnect and assembly of MCM substrates

Also Published As

Publication number Publication date
GB2301938A (en) 1996-12-18
GB9614327D0 (en) 1996-09-04

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Legal Events

Date Code Title Description
746 Register noted 'licences of right' (sect. 46/1977)

Effective date: 20000127

PCNP Patent ceased through non-payment of renewal fee

Effective date: 20060221