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GB201801487D0 - Silicon carbide semiconductor device and manufacturing method thereof - Google Patents

Silicon carbide semiconductor device and manufacturing method thereof

Info

Publication number
GB201801487D0
GB201801487D0 GBGB1801487.8A GB201801487A GB201801487D0 GB 201801487 D0 GB201801487 D0 GB 201801487D0 GB 201801487 A GB201801487 A GB 201801487A GB 201801487 D0 GB201801487 D0 GB 201801487D0
Authority
GB
United Kingdom
Prior art keywords
manufacturing
semiconductor device
silicon carbide
carbide semiconductor
silicon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GBGB1801487.8A
Other versions
GB2563110A (en
GB2563110B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of GB201801487D0 publication Critical patent/GB201801487D0/en
Publication of GB2563110A publication Critical patent/GB2563110A/en
Application granted granted Critical
Publication of GB2563110B publication Critical patent/GB2563110B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/118Electrodes comprising insulating layers having particular dielectric or electrostatic properties, e.g. having static charges
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00Resistors, capacitors or inductors
    • H10D1/40Resistors
    • H10D1/47Resistors having no potential barriers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/01Manufacture or treatment
    • H10D12/031Manufacture or treatment of IGBTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D48/00Individual devices not covered by groups H10D1/00 - H10D44/00
    • H10D48/01Manufacture or treatment
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/124Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
    • H10D62/126Top-view geometrical layouts of the regions or the junctions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/83Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
    • H10D62/832Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
    • H10D62/8325Silicon carbide
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/111Field plates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/111Field plates
    • H10D64/117Recessed field plates, e.g. trench field plates or buried field plates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D8/00Diodes
    • H10D8/01Manufacture or treatment
    • H10D8/051Manufacture or treatment of Schottky diodes
    • H10W10/031
    • H10W10/30
    • H10W42/20
GB1801487.8A 2017-06-02 2018-01-30 Silicon carbide semiconductor device and manufacturing method thereof Expired - Fee Related GB2563110B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017110431A JP6909057B2 (en) 2017-06-02 2017-06-02 Silicon carbide semiconductor device and its manufacturing method

Publications (3)

Publication Number Publication Date
GB201801487D0 true GB201801487D0 (en) 2018-03-14
GB2563110A GB2563110A (en) 2018-12-05
GB2563110B GB2563110B (en) 2020-10-21

Family

ID=61558159

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1801487.8A Expired - Fee Related GB2563110B (en) 2017-06-02 2018-01-30 Silicon carbide semiconductor device and manufacturing method thereof

Country Status (2)

Country Link
JP (1) JP6909057B2 (en)
GB (1) GB2563110B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7248539B2 (en) 2019-08-13 2023-03-29 株式会社日立製作所 Pressure transmitter and nuclear power plant measurement system
JP2024044679A (en) * 2022-09-21 2024-04-02 株式会社東芝 Semiconductor device and its manufacturing method

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55123157A (en) * 1979-03-16 1980-09-22 Oki Electric Ind Co Ltd High-stability ion-injected resistor
JPH0770685B2 (en) * 1985-04-25 1995-07-31 日本電信電話株式会社 Complementary MIS semiconductor integrated circuit
JPS63307757A (en) * 1987-06-09 1988-12-15 Fujitsu Ltd Radiation-resistant semiconductor device
JPH06169061A (en) * 1992-01-17 1994-06-14 Ricoh Co Ltd Input/output protecting device
JP5087831B2 (en) * 2005-09-26 2012-12-05 日産自動車株式会社 Semiconductor device and manufacturing method thereof
JP2016174031A (en) * 2015-03-16 2016-09-29 株式会社東芝 Semiconductor device

Also Published As

Publication number Publication date
JP2018206934A (en) 2018-12-27
GB2563110A (en) 2018-12-05
GB2563110B (en) 2020-10-21
JP6909057B2 (en) 2021-07-28

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20250130