GB2058142B - Sputtering electrodes - Google Patents
Sputtering electrodesInfo
- Publication number
- GB2058142B GB2058142B GB8024998A GB8024998A GB2058142B GB 2058142 B GB2058142 B GB 2058142B GB 8024998 A GB8024998 A GB 8024998A GB 8024998 A GB8024998 A GB 8024998A GB 2058142 B GB2058142 B GB 2058142B
- Authority
- GB
- United Kingdom
- Prior art keywords
- sputtering electrodes
- sputtering
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004544 sputter deposition Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3423—Shape
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
- H01J37/3408—Planar magnetron sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB8024998A GB2058142B (en) | 1979-07-31 | 1980-07-31 | Sputtering electrodes |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB7926699 | 1979-07-31 | ||
| GB8024998A GB2058142B (en) | 1979-07-31 | 1980-07-31 | Sputtering electrodes |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB2058142A GB2058142A (en) | 1981-04-08 |
| GB2058142B true GB2058142B (en) | 1983-08-10 |
Family
ID=26272386
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB8024998A Expired GB2058142B (en) | 1979-07-31 | 1980-07-31 | Sputtering electrodes |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB2058142B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH646459A5 (en) * | 1982-03-22 | 1984-11-30 | Balzers Hochvakuum | RECTANGULAR TARGET PLATE FOR CATHODE SPRAY PLANTS. |
| GB8512455D0 (en) * | 1985-05-16 | 1985-06-19 | Atomic Energy Authority Uk | Coating apparatus |
| EP0342537B1 (en) * | 1988-05-16 | 1995-09-06 | Tosoh Corporation | Process for the manufacture of a sputtering target for producing electroconductive transparent films |
| JP3852967B2 (en) * | 1995-07-14 | 2006-12-06 | 株式会社アルバック | Low pressure sputtering equipment |
| IL127236A0 (en) * | 1997-11-26 | 1999-09-22 | Vapor Technologies Inc | Apparatus for sputtering or arc evaporation |
| CN111876739B (en) * | 2020-08-04 | 2021-12-31 | 中国科学院兰州化学物理研究所 | Wide-surface rectangular cathode target with high utilization rate and method for improving utilization rate thereof |
-
1980
- 1980-07-31 GB GB8024998A patent/GB2058142B/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| GB2058142A (en) | 1981-04-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PCNP | Patent ceased through non-payment of renewal fee |