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GB2058143B - Sputtering electrodes - Google Patents

Sputtering electrodes

Info

Publication number
GB2058143B
GB2058143B GB8024999A GB8024999A GB2058143B GB 2058143 B GB2058143 B GB 2058143B GB 8024999 A GB8024999 A GB 8024999A GB 8024999 A GB8024999 A GB 8024999A GB 2058143 B GB2058143 B GB 2058143B
Authority
GB
United Kingdom
Prior art keywords
sputtering electrodes
sputtering
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8024999A
Other versions
GB2058143A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nordiko Ltd
Original Assignee
Nordiko Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nordiko Ltd filed Critical Nordiko Ltd
Priority to GB8024999A priority Critical patent/GB2058143B/en
Publication of GB2058143A publication Critical patent/GB2058143A/en
Application granted granted Critical
Publication of GB2058143B publication Critical patent/GB2058143B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3423—Shape
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3435—Target holders (includes backing plates and endblocks)

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
GB8024999A 1979-07-31 1980-07-31 Sputtering electrodes Expired GB2058143B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB8024999A GB2058143B (en) 1979-07-31 1980-07-31 Sputtering electrodes

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB7926698 1979-07-31
GB8024999A GB2058143B (en) 1979-07-31 1980-07-31 Sputtering electrodes

Publications (2)

Publication Number Publication Date
GB2058143A GB2058143A (en) 1981-04-08
GB2058143B true GB2058143B (en) 1983-11-02

Family

ID=26272385

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8024999A Expired GB2058143B (en) 1979-07-31 1980-07-31 Sputtering electrodes

Country Status (1)

Country Link
GB (1) GB2058143B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4472259A (en) * 1981-10-29 1984-09-18 Materials Research Corporation Focusing magnetron sputtering apparatus
JPS5976875A (en) * 1982-10-22 1984-05-02 Hitachi Ltd Magnetron type sputtering device
US4515675A (en) * 1983-07-06 1985-05-07 Leybold-Heraeus Gmbh Magnetron cathode for cathodic evaportion apparatus
CH664303A5 (en) * 1985-04-03 1988-02-29 Balzers Hochvakuum HOLDING DEVICE FOR TARGETS FOR CATHODE SPRAYING.
WO1998037569A1 (en) * 1997-02-24 1998-08-27 Novellus Systems, Inc. Magnetic circuit for magnetron sputtering

Also Published As

Publication number Publication date
GB2058143A (en) 1981-04-08

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee