GB1391842A - Apparatus for coating substrates by cathode sputtering and for cleaning by ion bombardment in the same vacuum vessel - Google Patents
Apparatus for coating substrates by cathode sputtering and for cleaning by ion bombardment in the same vacuum vesselInfo
- Publication number
- GB1391842A GB1391842A GB1611472A GB1611472A GB1391842A GB 1391842 A GB1391842 A GB 1391842A GB 1611472 A GB1611472 A GB 1611472A GB 1611472 A GB1611472 A GB 1611472A GB 1391842 A GB1391842 A GB 1391842A
- Authority
- GB
- United Kingdom
- Prior art keywords
- substrates
- target
- cleaning
- electrodes
- vacuum vessel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 title abstract 6
- 238000004544 sputter deposition Methods 0.000 title abstract 3
- 238000004140 cleaning Methods 0.000 title abstract 2
- 239000011248 coating agent Substances 0.000 title 1
- 238000000576 coating method Methods 0.000 title 1
- 238000010849 ion bombardment Methods 0.000 title 1
- 230000004048 modification Effects 0.000 abstract 2
- 238000012986 modification Methods 0.000 abstract 2
- 239000013077 target material Substances 0.000 abstract 2
- 239000011521 glass Substances 0.000 abstract 1
- 238000005477 sputtering target Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB1611472A GB1391842A (en) | 1971-08-04 | 1972-04-07 | Apparatus for coating substrates by cathode sputtering and for cleaning by ion bombardment in the same vacuum vessel |
| DE19722221600 DE2221600A1 (de) | 1971-08-04 | 1972-05-03 | Vorrichtung zum beschichten von substraten durch kathodenzerstaeubung und zum reinigen durch ionenaetzen im gleichen vakuumgefaess |
| CH853472A CH553259A (de) | 1971-08-04 | 1972-06-08 | Vorrichtung zum beschichten von substraten durch katodenzerstaeubung und zum reinigen durch ionenaetzen im gleichen vakuumgefaess. |
| FR7228084A FR2148245B1 (de) | 1971-08-04 | 1972-08-03 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DD15697371 | 1971-08-04 | ||
| GB1611472A GB1391842A (en) | 1971-08-04 | 1972-04-07 | Apparatus for coating substrates by cathode sputtering and for cleaning by ion bombardment in the same vacuum vessel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1391842A true GB1391842A (en) | 1975-04-23 |
Family
ID=25747417
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB1611472A Expired GB1391842A (en) | 1971-08-04 | 1972-04-07 | Apparatus for coating substrates by cathode sputtering and for cleaning by ion bombardment in the same vacuum vessel |
Country Status (4)
| Country | Link |
|---|---|
| CH (1) | CH553259A (de) |
| DE (1) | DE2221600A1 (de) |
| FR (1) | FR2148245B1 (de) |
| GB (1) | GB1391842A (de) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0034706A3 (en) * | 1980-02-08 | 1981-09-09 | Veb Zentrum Fur Forschung Und Technologie Mikroelektronik | Process and apparatus for ion etching or for plasma c.v.d. |
| GB2154249A (en) * | 1984-02-11 | 1985-09-04 | Glyco Metall Werke | Cathode sputtering |
| FR2772185A1 (fr) * | 1997-11-26 | 1999-06-11 | Vapor Technologies Inc | Cathode de pulverisation cathodique ou d'evaporation par arc et appareil la comportant |
| EP2081212A1 (de) * | 2008-01-16 | 2009-07-22 | Applied Materials, Inc. | Doppelbeschichtungsvorrichtung mit einer Prozesskammer |
| US9175383B2 (en) | 2008-01-16 | 2015-11-03 | Applied Materials, Inc. | Double-coating device with one process chamber |
| WO2018010770A1 (en) * | 2016-07-12 | 2018-01-18 | Applied Materials, Inc. | Sputter deposition source, sputter deposition apparatus and method of operating a sputter deposition source |
| EP4207245A1 (de) * | 2021-12-31 | 2023-07-05 | SPTS Technologies Limited | Verfahren zum betreiben eines pvd-gerätes |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2371777A1 (fr) * | 1976-11-18 | 1978-06-16 | Loic Henry | Procede de fabrication d'une barriere de diffusion en nitrure de silicium sur un substrat de semiconducteur, en particulier du type iii-v |
| GB1570380A (en) * | 1978-05-30 | 1980-07-02 | Standard Telephones Cables Ltd | Electroless plating |
| US4194962A (en) * | 1978-12-20 | 1980-03-25 | Advanced Coating Technology, Inc. | Cathode for sputtering |
| DE3041551A1 (de) * | 1980-11-04 | 1982-06-09 | Siemens AG, 1000 Berlin und 8000 München | Elektroden fuer plasma-aetzanlage |
| DE3306738A1 (de) * | 1983-02-25 | 1984-08-30 | Berna AG Olten, Olten | Vorrichtung und verfahren zur beschichtung von substraten mittels glimmentladung, sowie deren anwendung |
-
1972
- 1972-04-07 GB GB1611472A patent/GB1391842A/en not_active Expired
- 1972-05-03 DE DE19722221600 patent/DE2221600A1/de active Pending
- 1972-06-08 CH CH853472A patent/CH553259A/de not_active IP Right Cessation
- 1972-08-03 FR FR7228084A patent/FR2148245B1/fr not_active Expired
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0034706A3 (en) * | 1980-02-08 | 1981-09-09 | Veb Zentrum Fur Forschung Und Technologie Mikroelektronik | Process and apparatus for ion etching or for plasma c.v.d. |
| GB2154249A (en) * | 1984-02-11 | 1985-09-04 | Glyco Metall Werke | Cathode sputtering |
| FR2772185A1 (fr) * | 1997-11-26 | 1999-06-11 | Vapor Technologies Inc | Cathode de pulverisation cathodique ou d'evaporation par arc et appareil la comportant |
| EP2081212A1 (de) * | 2008-01-16 | 2009-07-22 | Applied Materials, Inc. | Doppelbeschichtungsvorrichtung mit einer Prozesskammer |
| US9175383B2 (en) | 2008-01-16 | 2015-11-03 | Applied Materials, Inc. | Double-coating device with one process chamber |
| WO2018010770A1 (en) * | 2016-07-12 | 2018-01-18 | Applied Materials, Inc. | Sputter deposition source, sputter deposition apparatus and method of operating a sputter deposition source |
| CN109314035A (zh) * | 2016-07-12 | 2019-02-05 | 应用材料公司 | 溅射沉积源、溅射沉积设备和操作溅射沉积源的方法 |
| TWI665324B (zh) * | 2016-07-12 | 2019-07-11 | 應用材料股份有限公司 | 濺射沉積源、濺射沉積設備及操作濺射沉積源之方法 |
| EP4207245A1 (de) * | 2021-12-31 | 2023-07-05 | SPTS Technologies Limited | Verfahren zum betreiben eines pvd-gerätes |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2148245B1 (de) | 1976-05-14 |
| FR2148245A1 (de) | 1973-03-11 |
| CH553259A (de) | 1974-08-30 |
| DE2221600A1 (de) | 1973-02-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed | ||
| PLNP | Patent lapsed through nonpayment of renewal fees |