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GB1094447A - A method of electrically interconnecting double-sided printed circuits - Google Patents

A method of electrically interconnecting double-sided printed circuits

Info

Publication number
GB1094447A
GB1094447A GB4919065A GB4919065A GB1094447A GB 1094447 A GB1094447 A GB 1094447A GB 4919065 A GB4919065 A GB 4919065A GB 4919065 A GB4919065 A GB 4919065A GB 1094447 A GB1094447 A GB 1094447A
Authority
GB
United Kingdom
Prior art keywords
sheet
electro
tool
plating
bit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4919065A
Inventor
Jiri Lucek
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TELAS
Original Assignee
TELAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TELAS filed Critical TELAS
Priority to GB4919065A priority Critical patent/GB1094447A/en
Publication of GB1094447A publication Critical patent/GB1094447A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/04—Tubes; Rings; Hollow bodies
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/033—Punching metal foil, e.g. solder foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0763—Treating individual holes or single row of holes, e.g. by nozzle
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/005—Punching of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

Printed circuits on opposite sides of an insulating base sheet are inter-connected by punching or drilling holes in the sheet with a punching tool or drill bit provided with a recess or groove filled with a conductive medium which forms a coating on the wall of the holes formed, the coating being smoothed by withdrawal of the tool or bit, and then immersing the sheet in an electro-plating bath to form an electro-plated connection between the circuits via the walls of the hole. Preferably the tool or bit passes through a container holding the conductive medium before effecting punching or drilling of the sheet as by forming the container as a cavity in a guiding plate. In the electro-plating step, an insulating member contacts the side of the sheet remote from the anode and a conductive member is contacted with the other side of the sheet, both members engaging the sheet where electro-plating is not desired. Typically the insulating base sheet is of glass fibre impregnated with epoxy resin, the conductive medium applied by the tool or bit is an aqueous graphite emulsion, and electro-plating is effected with an acid copper bath containing organic inhibitors as in Specification 1,064,769 to give a hard copper deposit.
GB4919065A 1965-11-19 1965-11-19 A method of electrically interconnecting double-sided printed circuits Expired GB1094447A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB4919065A GB1094447A (en) 1965-11-19 1965-11-19 A method of electrically interconnecting double-sided printed circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB4919065A GB1094447A (en) 1965-11-19 1965-11-19 A method of electrically interconnecting double-sided printed circuits

Publications (1)

Publication Number Publication Date
GB1094447A true GB1094447A (en) 1967-12-13

Family

ID=10451495

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4919065A Expired GB1094447A (en) 1965-11-19 1965-11-19 A method of electrically interconnecting double-sided printed circuits

Country Status (1)

Country Link
GB (1) GB1094447A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1983001886A1 (en) * 1981-11-17 1983-05-26 Grünwald, Werner Method for making through connections in a printed circuit
EP0111599A1 (en) * 1982-12-13 1984-06-27 LOMERSON, Robert Bogardus Method of processing through-holes
EP0040190A4 (en) * 1979-11-16 1984-09-24 Robert Bogardus Lomerson Method for metalizing holes in insulating material.
WO1997034451A1 (en) * 1996-03-13 1997-09-18 So.Ma.Ci.S. - S.P.A. System for realising connection jumpers between the tracks of double-sided printed circuit boards

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0040190A4 (en) * 1979-11-16 1984-09-24 Robert Bogardus Lomerson Method for metalizing holes in insulating material.
DE2953899C1 (en) * 1979-11-16 1989-02-23 Robert Bogardus Fort Worth Texas Us Lomerson
WO1983001886A1 (en) * 1981-11-17 1983-05-26 Grünwald, Werner Method for making through connections in a printed circuit
EP0111599A1 (en) * 1982-12-13 1984-06-27 LOMERSON, Robert Bogardus Method of processing through-holes
WO1997034451A1 (en) * 1996-03-13 1997-09-18 So.Ma.Ci.S. - S.P.A. System for realising connection jumpers between the tracks of double-sided printed circuit boards

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