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GB2017416A - Circuit board manufacturing method - Google Patents

Circuit board manufacturing method

Info

Publication number
GB2017416A
GB2017416A GB7906862A GB7906862A GB2017416A GB 2017416 A GB2017416 A GB 2017416A GB 7906862 A GB7906862 A GB 7906862A GB 7906862 A GB7906862 A GB 7906862A GB 2017416 A GB2017416 A GB 2017416A
Authority
GB
United Kingdom
Prior art keywords
copper
etching
plating
circuit patterns
resist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB7906862A
Other versions
GB2017416B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Publication of GB2017416A publication Critical patent/GB2017416A/en
Application granted granted Critical
Publication of GB2017416B publication Critical patent/GB2017416B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H05K3/242—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Electromechanical Clocks (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

A method of manufacturing a circuit board made of a resin, copper- clad substrate having circuit patterns formed thereon, in which a pattern is defined employing an etching resist to form, on the copper foil surface of said copper-clad substrate, circuit patterns and common electrodes for electrolytic plating for the purpose of interconnecting said circuit patterns, copper etching is performed employing said etching resist, a pattern is formed by employing a plating resist to cover a portion of a common electrode consisting of a copper pattern formed by means of etching, electrolytic metal plating is performed making use of said plating resist to deposit a metal which will not be dissolved by a copper etching solution, said metal being electroplated on the circuit patterns, and a further etching is carried out on the common electrode, with the metal plated on said circuit patterns serving as an etching resist. Through holes are formed in the substrate for electrical connection between patterns on opposite faces of the circuit board, electrolessly plated on their inner surfaces with copper, and subsequently reinforced by electrolytic copper plating.
GB7906862A 1978-02-27 1979-02-27 Circuit board manufacturing metho Expired GB2017416B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2174778A JPS54114766A (en) 1978-02-27 1978-02-27 Method of producing circuit board

Publications (2)

Publication Number Publication Date
GB2017416A true GB2017416A (en) 1979-10-03
GB2017416B GB2017416B (en) 1982-06-09

Family

ID=12063659

Family Applications (1)

Application Number Title Priority Date Filing Date
GB7906862A Expired GB2017416B (en) 1978-02-27 1979-02-27 Circuit board manufacturing metho

Country Status (3)

Country Link
JP (1) JPS54114766A (en)
GB (1) GB2017416B (en)
HK (1) HK7485A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2137421A (en) * 1983-03-15 1984-10-03 Standard Telephones Cables Ltd Printed circuits
EP0370438A1 (en) * 1988-11-21 1990-05-30 Hewlett-Packard Company Method for preparing a flexible electrical connector
US5052103A (en) * 1988-11-04 1991-10-01 Sharp Kabushiki Kaisha Method of manufacturing printed wiring board having no copper migration

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58225697A (en) * 1982-06-25 1983-12-27 ソニー株式会社 Method of producing metal base printed circuit board
JP2006100300A (en) * 2004-09-28 2006-04-13 Shindo Denshi Kogyo Kk Printed wiring board and manufacturing method therefor

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2137421A (en) * 1983-03-15 1984-10-03 Standard Telephones Cables Ltd Printed circuits
US4572925A (en) * 1983-03-15 1986-02-25 Standard Telephones And Cables Public Limited Company Printed circuit boards with solderable plating finishes and method of making the same
US5052103A (en) * 1988-11-04 1991-10-01 Sharp Kabushiki Kaisha Method of manufacturing printed wiring board having no copper migration
EP0370438A1 (en) * 1988-11-21 1990-05-30 Hewlett-Packard Company Method for preparing a flexible electrical connector
US4989317A (en) * 1988-11-21 1991-02-05 Hewlett-Packard Company Method for making tab circuit electrical connector supporting multiple components thereon

Also Published As

Publication number Publication date
JPS54114766A (en) 1979-09-07
GB2017416B (en) 1982-06-09
HK7485A (en) 1985-02-01

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee