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GB1124298A - Improvements in or relating to printed circuits - Google Patents

Improvements in or relating to printed circuits

Info

Publication number
GB1124298A
GB1124298A GB4502064A GB4502064A GB1124298A GB 1124298 A GB1124298 A GB 1124298A GB 4502064 A GB4502064 A GB 4502064A GB 4502064 A GB4502064 A GB 4502064A GB 1124298 A GB1124298 A GB 1124298A
Authority
GB
United Kingdom
Prior art keywords
holes
copper
metal
walls
face
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4502064A
Inventor
John Bryan Walker
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BTR Industries Ltd
Original Assignee
BTR Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BTR Industries Ltd filed Critical BTR Industries Ltd
Priority to GB4502064A priority Critical patent/GB1124298A/en
Publication of GB1124298A publication Critical patent/GB1124298A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09945—Universal aspects, e.g. universal inner layers or via grid, or anisotropic interposer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

1,124,298. Laminates. BTR INDUSTRIES Ltd. 29 Oct., 1965 [4 Nov., 1964], No. 45020/64. Heading B5N. [Also in Division H1] In a method of making a double-sided printed circuit, the starting material is an insulating sheet having a layer of metal on each face, and a matrix of holes formed therethrough in a regular pattern with a layer of metal lining each hole and interconnecting the layers of metal on the faces of the sheet. Preferably the insulating sheet, clad on each face with copper foil, has a rectangular co-ordinate array of holes, spaced 0À2 inch apart in rows formed therein by drilling or punching. The walls of the holes are sensitized, as by coating with graphite, after which they are lined with copper by electroplating. A plating resist ink is applied in a negative pattern to the copper surfaces, including the hole-walls, and the uninked area is electroplated with leadtin solder; the ink is removed and the underlying copper etched away, as with chromic acid. Alternatively, a positive etchant-resist pattern may be applied, followed by etching. Holes not required for interconnections may be enlarged to accommodate mechanical mountings.
GB4502064A 1964-11-04 1964-11-04 Improvements in or relating to printed circuits Expired GB1124298A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB4502064A GB1124298A (en) 1964-11-04 1964-11-04 Improvements in or relating to printed circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB4502064A GB1124298A (en) 1964-11-04 1964-11-04 Improvements in or relating to printed circuits

Publications (1)

Publication Number Publication Date
GB1124298A true GB1124298A (en) 1968-08-21

Family

ID=10435565

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4502064A Expired GB1124298A (en) 1964-11-04 1964-11-04 Improvements in or relating to printed circuits

Country Status (1)

Country Link
GB (1) GB1124298A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0154909A3 (en) * 1984-03-09 1986-07-16 Hoechst Aktiengesellschaft Process and sheet material for the manufacture of printed circuits with through-connections
DE3611157A1 (en) * 1985-04-03 1986-10-09 Ibiden K.K., Oogaki, Gifu CERAMIC WIRE PLATE AND METHOD FOR PRODUCING THE SAME
GB2207558A (en) * 1987-07-11 1989-02-01 Abdul Hamed Perforated printed circuit boards
US5840402A (en) * 1994-06-24 1998-11-24 Sheldahl, Inc. Metallized laminate material having ordered distribution of conductive through holes

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0154909A3 (en) * 1984-03-09 1986-07-16 Hoechst Aktiengesellschaft Process and sheet material for the manufacture of printed circuits with through-connections
US4770900A (en) * 1984-03-09 1988-09-13 Hoechst Aktiengesellschaft Process and laminate for the manufacture of through-hole plated electric printed-circuit boards
DE3611157A1 (en) * 1985-04-03 1986-10-09 Ibiden K.K., Oogaki, Gifu CERAMIC WIRE PLATE AND METHOD FOR PRODUCING THE SAME
DE3611157C2 (en) * 1985-04-03 1992-08-27 Ibiden K.K., Oogaki, Gifu, Jp
GB2207558A (en) * 1987-07-11 1989-02-01 Abdul Hamed Perforated printed circuit boards
GB2207558B (en) * 1987-07-11 1991-10-30 Abdul Hamed Printed circuit boards
US5840402A (en) * 1994-06-24 1998-11-24 Sheldahl, Inc. Metallized laminate material having ordered distribution of conductive through holes

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