FR2729885B1 - SUBSTRATE CUTTING DEVICE - Google Patents

SUBSTRATE CUTTING DEVICE

Info

Publication number: FR2729885B1
Authority: FR; France
Prior art keywords: cutting device; substrate cutting; substrate; cutting
Prior art date: 1995-01-30
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Fee Related

Application number

FR9601049A

Other languages

French (fr)

Other versions

FR2729885A1 (en

Inventor

Akira Kadowaki

Yoshio Makita

Hiroshi Ueki

Shigeo Itoh

Katunosuke Ozawa

Satoshi Yoshikata

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Futaba Corp

Original Assignee

Futaba Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1995-01-30

Filing date

1996-01-30

Publication date

1998-09-25

1996-01-30 Application filed by Futaba Corp filed Critical Futaba Corp

1996-08-02 Publication of FR2729885A1 publication Critical patent/FR2729885A1/en

1998-09-25 Application granted granted Critical

1998-09-25 Publication of FR2729885B1 publication Critical patent/FR2729885B1/en

2016-01-30 Anticipated expiration legal-status Critical

Status Expired - Fee Related legal-status Critical Current

Classifications

- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
- C03B33/105—Details of cutting or scoring means, e.g. tips
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
- B28D5/0023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0052—Means for supporting or holding work during breaking
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/04—Arrangements of vacuum systems or suction cups

Landscapes

Engineering & Computer Science (AREA)
Chemical & Material Sciences (AREA)
Mechanical Engineering (AREA)
Materials Engineering (AREA)
Organic Chemistry (AREA)
Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Processing Of Stones Or Stones Resemblance Materials (AREA)
Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

FR9601049A 1995-01-30 1996-01-30 SUBSTRATE CUTTING DEVICE Expired - Fee Related FR2729885B1 (en)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP1278695		1995-01-30
JP8000920A JP2904089B2 (en)	1995-01-30	1996-01-08	Substrate cutting device

Publications (2)

Publication Number	Publication Date
FR2729885A1 FR2729885A1 (en)	1996-08-02
FR2729885B1 true FR2729885B1 (en)	1998-09-25

Family

ID=26334034

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
FR9601049A Expired - Fee Related FR2729885B1 (en)	1995-01-30	1996-01-30	SUBSTRATE CUTTING DEVICE

Country Status (3)

Country	Link
JP (1)	JP2904089B2 (en)
FR (1)	FR2729885B1 (en)
TW (1)	TW422821B (en)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP3630465B2 (en) *	1995-04-13	2005-03-16	株式会社東芝	Glass substrate cutting method and apparatus
JPH11147216A (en) *	1997-11-18	1999-06-02	Sumitomo Metal Smi Electron Devices Inc	Dividing device and its assembly method
JPH11160664A (en) *	1997-11-27	1999-06-18	Seiko Epson Corp	Substrate cutting method, substrate cutting device, and liquid crystal display device manufacturing method
EP0987226A1 (en) *	1998-08-28	2000-03-22	Fabricom S.A.	Process and apparatus for breaking a glass sheet
CN1259264C (en) *	2001-06-28	2006-06-14	三星钻石工业股份有限公司	Device and method for breaking fragile material substrate
JP4566472B2 (en) *	2001-07-23	2010-10-20	カワサキプラントシステムズ株式会社	Sheet glass cleaving mechanism and trimming device
DE10136181B4 (en) *	2001-07-25	2005-02-10	Schott Ag	A method of breaking a cut glass piece having a wall thickness of 6mm or more
JP3611122B2 (en) *	2002-11-20	2005-01-19	川重プラント株式会社	Board scribing unit and cutting equipment
WO2004082911A1 (en) *	2003-03-17	2004-09-30	Baumann Gmbh	Breaking device for separating ceramic printed circuit boards
JP5076589B2 (en) *	2007-03-28	2012-11-21	三星ダイヤモンド工業株式会社	Plate material dividing apparatus and plate material dividing method
JP4960405B2 (en) *	2009-04-28	2012-06-27	川崎重工業株式会社	Sheet material cutting unit
US8967441B2 (en)	2009-07-10	2015-03-03	Toyota Jidosha Kabushiki Kaisha	Magnet splitting device and magnet splitting method
JP5517695B2 (en) *	2010-03-29	2014-06-11	株式会社シライテック	Folding device
JP5548172B2 (en) *	2011-08-26	2014-07-16	三星ダイヤモンド工業株式会社	Brittle material substrate breaker
JP5862156B2 (en) *	2011-09-26	2016-02-16	日産自動車株式会社	Field pole magnet body manufacturing apparatus and method
KR101968792B1 (en) *	2011-11-16	2019-04-12	니폰 덴키 가라스 가부시키가이샤	Glass plate cleaving device, method for cleaving glass plate, method for manufacturing glass plate, and glass plate cleaving system
JP5849120B2 (en) *	2014-03-25	2016-01-27	三星ダイヤモンド工業株式会社	Brittle material substrate breaker
JP2019069605A (en) *	2014-05-29	2019-05-09	三星ダイヤモンド工業株式会社	Dust collection mechanism of groove processing head, and groove processing device
JP6507600B2 (en) *	2014-12-02	2019-05-08	三星ダイヤモンド工業株式会社	Method and apparatus for dividing brittle material substrate
CN106587586A (en) *	2016-12-22	2017-04-26	重庆天和玻璃有限公司	Glass cutting device
JP2019038238A (en) *	2017-08-29	2019-03-14	三星ダイヤモンド工業株式会社	Break device
CN109760144B (en) *	2019-01-31	2023-07-04	东莞市九思自动化科技有限公司	Folded plate mechanism and automatic plate separating machine with folded plate mechanism
CN109794420B (en) *	2019-01-31	2024-08-02	东莞市九思自动化科技有限公司	PCB board test and divide board automation line
TWI784555B (en) *	2021-06-04	2022-11-21	晶巧股份有限公司	Depaneling machine
CN116653146A (en) *	2023-07-19	2023-08-29	阜宁协鑫光伏科技有限公司	Cutting machine guide wheel structure and production method thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE114293C (en) *
US4018372A (en) *	1975-12-05	1977-04-19	The Fletcher-Terry Company	Glass cutting method and apparatus
DE2657757C2 (en) *	1976-12-20	1984-08-02	Bottero S.P.A., Cuneo-Spinetta	Device for cutting laminated glass panels
AT382360B (en) *	1983-07-07	1987-02-25	Lisec Peter Glastech Ind	METHOD AND DEVICE FOR CUTTING COMPOSITE GLASS
NL8701191A (en) *	1987-05-18	1988-12-16	Pallmac Belgium N V	SEPARATING DEVICE FOR FLAT ELEMENTS.

1996
- 1996-01-08 JP JP8000920A patent/JP2904089B2/en not_active Expired - Fee Related
- 1996-01-27 TW TW85101037A patent/TW422821B/en not_active IP Right Cessation
- 1996-01-30 FR FR9601049A patent/FR2729885B1/en not_active Expired - Fee Related

Also Published As

Publication number	Publication date
JP2904089B2 (en)	1999-06-14
FR2729885A1 (en)	1996-08-02
TW422821B (en)	2001-02-21
JPH08268728A (en)	1996-10-15

Publication	Publication Date	Title
FR2729885B1 (en)	1998-09-25	SUBSTRATE CUTTING DEVICE
FR2733305B3 (en)	1997-04-11	ELECTROSOLAR DEVICE
EP0732107A3 (en)	1997-05-07	Screen device for circuit substrate
EP1061157A4 (en)	2009-05-06	DEVICE FOR PLACING SUBSTRATE
FR2744013B1 (en)	1998-04-24	KERATOPROTHESIS DEVICE
HK1001924B (en)	1998-07-17	Slate positioning device
EP0776035A4 (en)	2003-02-12	SUBSTRATE TRANSPORT DEVICE
EP0723292A3 (en)	1997-07-30	Semiconductor device
FR2764028B1 (en)	2001-11-09	POSITIONING DEVICE
FR2743245B1 (en)	1998-01-23	DEMULTIPLEXING DEVICE
DK27496A (en)	1996-09-09	cutting device
DE69620177D1 (en)	2002-05-02	REFLECTIVE SEMICONDUCTOR SUBSTRATES
EP0727828A3 (en)	1997-07-30	Light emitting semiconductor device
EP1118696A4 (en)	2007-10-17	METHOD AND DEVICE FOR COATING SUBSTRATE
EP0632499A3 (en)	1995-03-29	Substrate for semiconductor device.
FR2714314B1 (en)	1996-01-26	Epicyclic vibration device.
ATE208254T1 (en)	2001-11-15	CUTTING DEVICE
DE59608039D1 (en)	2001-12-06	Cutting device
NO980918D0 (en)	1998-03-03	Substrate fastener
FR2733108B1 (en)	1997-05-16	COMMUNICATION DEVICE
FR2731766B1 (en)	1997-05-23	FAUCET DEVICE
FR2740227B1 (en)	1997-11-07	LASER TOMOSCOPIC DETECTION DEVICE
EP1048756A4 (en)	2006-06-21	DEVICE FOR PLACING SUBSTRATE
FR2766750B1 (en)	1999-09-17	PILOT CLAMPING DEVICE
CH687429GA3 (en)	1996-12-13	Watertight pusher device.

Legal Events

Date	Code	Title	Description
2006-12-08	ST	Notification of lapse	Effective date: 20060929