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FR2729885B1 - Dispositif de coupe de substrat - Google Patents

Dispositif de coupe de substrat

Info

Publication number
FR2729885B1
FR2729885B1 FR9601049A FR9601049A FR2729885B1 FR 2729885 B1 FR2729885 B1 FR 2729885B1 FR 9601049 A FR9601049 A FR 9601049A FR 9601049 A FR9601049 A FR 9601049A FR 2729885 B1 FR2729885 B1 FR 2729885B1
Authority
FR
France
Prior art keywords
cutting device
substrate cutting
substrate
cutting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9601049A
Other languages
English (en)
Other versions
FR2729885A1 (fr
Inventor
Akira Kadowaki
Yoshio Makita
Hiroshi Ueki
Shigeo Itoh
Katunosuke Ozawa
Satoshi Yoshikata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Futaba Corp
Original Assignee
Futaba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Futaba Corp filed Critical Futaba Corp
Publication of FR2729885A1 publication Critical patent/FR2729885A1/fr
Application granted granted Critical
Publication of FR2729885B1 publication Critical patent/FR2729885B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/105—Details of cutting or scoring means, e.g. tips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0052—Means for supporting or holding work during breaking
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
FR9601049A 1995-01-30 1996-01-30 Dispositif de coupe de substrat Expired - Fee Related FR2729885B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1278695 1995-01-30
JP8000920A JP2904089B2 (ja) 1995-01-30 1996-01-08 基板切断装置

Publications (2)

Publication Number Publication Date
FR2729885A1 FR2729885A1 (fr) 1996-08-02
FR2729885B1 true FR2729885B1 (fr) 1998-09-25

Family

ID=26334034

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9601049A Expired - Fee Related FR2729885B1 (fr) 1995-01-30 1996-01-30 Dispositif de coupe de substrat

Country Status (3)

Country Link
JP (1) JP2904089B2 (fr)
FR (1) FR2729885B1 (fr)
TW (1) TW422821B (fr)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3630465B2 (ja) * 1995-04-13 2005-03-16 株式会社東芝 ガラス基板カット方法およびその装置
JPH11147216A (ja) * 1997-11-18 1999-06-02 Sumitomo Metal Smi Electron Devices Inc 分割装置およびその組付方法
JPH11160664A (ja) * 1997-11-27 1999-06-18 Seiko Epson Corp 基板の切断方法、基板の切断装置及び液晶表示装置の製造方法
EP0987226A1 (fr) * 1998-08-28 2000-03-22 Fabricom S.A. Procédé et dispositif de rompage d'une feuille de verre
CN1259264C (zh) * 2001-06-28 2006-06-14 三星钻石工业股份有限公司 脆性材料基板的破断装置及其破断方法以及具有该装置的母贴合基板的分断系统
JP4566472B2 (ja) * 2001-07-23 2010-10-20 カワサキプラントシステムズ株式会社 板ガラスの割断機構およびトリミング装置
DE10136181B4 (de) * 2001-07-25 2005-02-10 Schott Ag Verfahren zum Brechen eines eingeschnittenen Werkstückes aus Glas mit einer Wandstärke von 6mm oder mehr
JP3611122B2 (ja) * 2002-11-20 2005-01-19 川重プラント株式会社 板材のスクライブユニットおよび分断設備
WO2004082911A1 (fr) * 2003-03-17 2004-09-30 Baumann Gmbh Dispositif de rupture servant a separer des cartes de circuits imprimes en ceramique
JP5076589B2 (ja) * 2007-03-28 2012-11-21 三星ダイヤモンド工業株式会社 板材分割装置及び板材分割方法
JP4960405B2 (ja) * 2009-04-28 2012-06-27 川崎重工業株式会社 板材の分断ユニット
US8967441B2 (en) 2009-07-10 2015-03-03 Toyota Jidosha Kabushiki Kaisha Magnet splitting device and magnet splitting method
JP5517695B2 (ja) * 2010-03-29 2014-06-11 株式会社シライテック 折割装置
JP5548172B2 (ja) * 2011-08-26 2014-07-16 三星ダイヤモンド工業株式会社 脆性材料基板ブレイク装置
JP5862156B2 (ja) * 2011-09-26 2016-02-16 日産自動車株式会社 界磁極用磁石体の製造装置およびその製造方法
KR101968792B1 (ko) * 2011-11-16 2019-04-12 니폰 덴키 가라스 가부시키가이샤 판유리 할단장치, 판유리 할단방법, 판유리 제작방법 및 판유리 할단시스템
JP5849120B2 (ja) * 2014-03-25 2016-01-27 三星ダイヤモンド工業株式会社 脆性材料基板ブレイク装置
JP2019069605A (ja) * 2014-05-29 2019-05-09 三星ダイヤモンド工業株式会社 溝加工ヘッドの集塵機構及び溝加工装置
JP6507600B2 (ja) * 2014-12-02 2019-05-08 三星ダイヤモンド工業株式会社 脆性材料基板の分断方法及び加工装置
CN106587586A (zh) * 2016-12-22 2017-04-26 重庆天和玻璃有限公司 玻璃切断装置
JP2019038238A (ja) * 2017-08-29 2019-03-14 三星ダイヤモンド工業株式会社 ブレイク装置
CN109760144B (zh) * 2019-01-31 2023-07-04 东莞市九思自动化科技有限公司 一种折板机构及具有该折板机构的自动化分板机
CN109794420B (zh) * 2019-01-31 2024-08-02 东莞市九思自动化科技有限公司 一种pcb板测试及分板自动化生产线
TWI784555B (zh) * 2021-06-04 2022-11-21 晶巧股份有限公司 段差式折斷分板裝置
CN116653146A (zh) * 2023-07-19 2023-08-29 阜宁协鑫光伏科技有限公司 切割机导轮结构及其生产方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE114293C (fr) *
US4018372A (en) * 1975-12-05 1977-04-19 The Fletcher-Terry Company Glass cutting method and apparatus
DE2657757C2 (de) * 1976-12-20 1984-08-02 Bottero S.P.A., Cuneo-Spinetta Vorrichtung zum Zuschneiden von Verbundglasplatten
AT382360B (de) * 1983-07-07 1987-02-25 Lisec Peter Glastech Ind Verfahren und vorrichtung zum schneiden von verbundglas
NL8701191A (nl) * 1987-05-18 1988-12-16 Pallmac Belgium N V Scheidingsinrichting voor vlakke elementen.

Also Published As

Publication number Publication date
JP2904089B2 (ja) 1999-06-14
FR2729885A1 (fr) 1996-08-02
TW422821B (en) 2001-02-21
JPH08268728A (ja) 1996-10-15

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20060929