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FI964394L - Elektronisten komponenttien kotelo - Google Patents

Elektronisten komponenttien kotelo Download PDF

Info

Publication number
FI964394L
FI964394L FI964394A FI964394A FI964394L FI 964394 L FI964394 L FI 964394L FI 964394 A FI964394 A FI 964394A FI 964394 A FI964394 A FI 964394A FI 964394 L FI964394 L FI 964394L
Authority
FI
Finland
Prior art keywords
electronic components
components housing
housing
electronic
components
Prior art date
Application number
FI964394A
Other languages
English (en)
Swedish (sv)
Other versions
FI964394A7 (fi
FI964394A0 (fi
Inventor
Bruno Fuerbacher
Friedrich Lupp
Wolfgang Pahl
Guenter Trausch
Original Assignee
Siemens Matsushita Components
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Matsushita Components filed Critical Siemens Matsushita Components
Publication of FI964394L publication Critical patent/FI964394L/fi
Publication of FI964394A7 publication Critical patent/FI964394A7/fi
Publication of FI964394A0 publication Critical patent/FI964394A0/fi

Links

Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02Details
    • H03H9/05Holders or supports
    • H03H9/08Holders with means for regulating temperature
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02Details
    • H03H9/05Holders or supports
    • H03H9/10Mounting in enclosures
    • H03H9/1064Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1092Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/42Piezoelectric device making
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Casings For Electric Apparatus (AREA)
FI964394A 1994-05-02 1995-05-02 Elektronisten komponenttien kotelo FI964394A0 (fi)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE4415411 1994-05-02
DE4432566 1994-09-13
PCT/EP1995/001658 WO1995030276A1 (de) 1994-05-02 1995-05-02 Verkapselung für elektronische bauelemente

Publications (3)

Publication Number Publication Date
FI964394L true FI964394L (fi) 1996-10-31
FI964394A7 FI964394A7 (fi) 1996-10-31
FI964394A0 FI964394A0 (fi) 1996-10-31

Family

ID=25936202

Family Applications (2)

Application Number Title Priority Date Filing Date
FI964394A FI964394A0 (fi) 1994-05-02 1995-05-02 Elektronisten komponenttien kotelo
FI952093A FI952093A0 (fi) 1994-05-02 1995-05-02 Kapsling foer med akustiska ytvaogefunktionerande byggelement

Family Applications After (1)

Application Number Title Priority Date Filing Date
FI952093A FI952093A0 (fi) 1994-05-02 1995-05-02 Kapsling foer med akustiska ytvaogefunktionerande byggelement

Country Status (9)

Country Link
US (2) US5831369A (fi)
EP (1) EP0759231B1 (fi)
JP (1) JPH09512677A (fi)
KR (1) KR100648751B1 (fi)
CN (1) CN1099158C (fi)
DE (1) DE59504639D1 (fi)
FI (2) FI964394A0 (fi)
RU (1) RU2153221C2 (fi)
WO (1) WO1995030276A1 (fi)

Families Citing this family (87)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0759231B1 (de) * 1994-05-02 1998-12-23 SIEMENS MATSUSHITA COMPONENTS GmbH & CO. KG Verkapselung für elektronische bauelemente
DE19548048C2 (de) 1995-12-21 1998-01-15 Siemens Matsushita Components Elektronisches Bauelement, insbesondere mit akustischen Oberflächenwellen arbeitendes Bauelement (OFW-Bauelement)
DE19548046C2 (de) * 1995-12-21 1998-01-15 Siemens Matsushita Components Verfahren zur Herstellung von für eine Flip-Chip-Montage geeigneten Kontakten von elektrischen Bauelementen
DE19820049C2 (de) * 1998-05-05 2001-04-12 Epcos Ag Thermomechanisches Verfahren zum Planarisieren einer fototechnisch strukturierbaren Schicht, insbesondere Verkapselung für elektronische Bauelemente
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DE10006446A1 (de) * 2000-02-14 2001-08-23 Epcos Ag Verkapselung für ein elektrisches Bauelement und Verfahren zur Herstellung
US6653762B2 (en) * 2000-04-19 2003-11-25 Murata Manufacturing Co., Ltd. Piezoelectric type electric acoustic converter
WO2002005424A1 (fr) * 2000-07-06 2002-01-17 Kabushiki Kaisha Toshiba Dispositif a ondes acoustiques de surface et procede de fabrication associe
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JP3974346B2 (ja) * 2001-03-30 2007-09-12 富士通メディアデバイス株式会社 弾性表面波装置
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US6846423B1 (en) 2002-08-28 2005-01-25 Silicon Light Machines Corporation Wafer-level seal for non-silicon-based devices
DE10253163B4 (de) 2002-11-14 2015-07-23 Epcos Ag Bauelement mit hermetischer Verkapselung und Waferscale Verfahren zur Herstellung
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RU2258330C2 (ru) * 2003-08-01 2005-08-10 Федеральное государственное унитарное предприятие "Научно-производственное предприятие "Исток" Свч интегральная схема
US7108344B2 (en) * 2003-11-03 2006-09-19 Hewlett-Packard Devleopment Company, L.P. Printmode for narrow margin printing
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JP5453787B2 (ja) * 2008-12-03 2014-03-26 パナソニック株式会社 弾性表面波デバイス
CN103415995B (zh) * 2011-03-09 2016-08-17 株式会社村田制作所 电子元器件
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US9812350B2 (en) 2013-03-06 2017-11-07 Qorvo Us, Inc. Method of manufacture for a silicon-on-plastic semiconductor device with interfacial adhesion layer
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US9530709B2 (en) 2014-11-03 2016-12-27 Qorvo Us, Inc. Methods of manufacturing a printed circuit module having a semiconductor device with a protective layer in place of a low-resistivity handle layer
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US10784149B2 (en) 2016-05-20 2020-09-22 Qorvo Us, Inc. Air-cavity module with enhanced device isolation
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US10103080B2 (en) 2016-06-10 2018-10-16 Qorvo Us, Inc. Thermally enhanced semiconductor package with thermal additive and process for making the same
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US10109502B2 (en) 2016-09-12 2018-10-23 Qorvo Us, Inc. Semiconductor package with reduced parasitic coupling effects and process for making the same
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Also Published As

Publication number Publication date
EP0759231B1 (de) 1998-12-23
US5831369A (en) 1998-11-03
DE59504639D1 (de) 1999-02-04
CN1147319A (zh) 1997-04-09
FI952093A0 (fi) 1995-05-02
JPH09512677A (ja) 1997-12-16
KR970703062A (ko) 1997-06-10
CN1099158C (zh) 2003-01-15
EP0759231A1 (de) 1997-02-26
WO1995030276A1 (de) 1995-11-09
FI964394A7 (fi) 1996-10-31
FI964394A0 (fi) 1996-10-31
KR100648751B1 (ko) 2007-03-02
RU2153221C2 (ru) 2000-07-20
US6446316B1 (en) 2002-09-10

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