FI894573L - Belaeggningsfoerfarande. - Google Patents
Belaeggningsfoerfarande. Download PDFInfo
- Publication number
- FI894573L FI894573L FI894573A FI894573A FI894573L FI 894573 L FI894573 L FI 894573L FI 894573 A FI894573 A FI 894573A FI 894573 A FI894573 A FI 894573A FI 894573 L FI894573 L FI 894573L
- Authority
- FI
- Finland
- Prior art keywords
- investment
- procedures
- investment procedures
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1614—Process or apparatus coating on selected surface areas plating on one side
- C23C18/1616—Process or apparatus coating on selected surface areas plating on one side interior or inner surface
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Prevention Of Electric Corrosion (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB888822641A GB8822641D0 (en) | 1988-09-27 | 1988-09-27 | Improvements related to coatings |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| FI894573A0 FI894573A0 (fi) | 1989-09-27 |
| FI894573L true FI894573L (fi) | 1990-03-28 |
| FI894573A7 FI894573A7 (fi) | 1990-03-28 |
Family
ID=10644299
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FI894573A FI894573A7 (fi) | 1988-09-27 | 1989-09-27 | Päällystysmenetelmä |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US5149566A (fi) |
| EP (1) | EP0366268A1 (fi) |
| JP (1) | JPH02133580A (fi) |
| KR (1) | KR900004962A (fi) |
| CN (1) | CN1041400A (fi) |
| FI (1) | FI894573A7 (fi) |
| GB (1) | GB8822641D0 (fi) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5158604A (en) * | 1991-07-01 | 1992-10-27 | Monsanto Company | Viscous electroless plating solutions |
| DE4324995C2 (de) * | 1993-07-26 | 1995-12-21 | Demetron Gmbh | Cyanidisch-alkalische Bäder zur galvanischen Abscheidung von Kupfer-Zinn-Legierungsüberzügen |
| SG72795A1 (en) * | 1997-03-21 | 2000-05-23 | Tokuyama Corp | Container for holding high-purity isopropyl alcohol |
| US6194032B1 (en) | 1997-10-03 | 2001-02-27 | Massachusetts Institute Of Technology | Selective substrate metallization |
| WO2002028551A1 (en) * | 2000-09-27 | 2002-04-11 | Wm. Marsh Rice University | Method of making nanoshells |
| US7172776B2 (en) * | 2001-10-25 | 2007-02-06 | Kraft Foods Holdings, Inc. | Dough product and method for making same |
| US6818313B2 (en) * | 2002-07-24 | 2004-11-16 | University Of Dayton | Corrosion-inhibiting coating |
| US20040200725A1 (en) * | 2003-04-09 | 2004-10-14 | Applied Materials Inc. | Application of antifoaming agent to reduce defects in a semiconductor electrochemical plating process |
| GB2415645A (en) * | 2004-06-28 | 2006-01-04 | L & I Maritime Ltd | Cargo tank coating |
| KR100916118B1 (ko) * | 2007-08-24 | 2009-09-08 | 주식회사 포스코 | 아연 및 아연계 합금 도금강판용 코팅조성물, 이를 이용한피막형성방법 및 이에 따라 형성된 피막을 갖는 강판 |
| JP4575520B2 (ja) * | 2007-08-24 | 2010-11-04 | ポスコ | 亜鉛及び亜鉛系合金被膜を有する鋼板用コーティング組成物、これを利用した被膜形成方法、及びこれにより形成された被膜を有する鋼板 |
| WO2011003116A2 (en) * | 2009-07-03 | 2011-01-06 | Enthone Inc. | Beta-amino acid comprising electrolyte and method for the deposition of a metal layer |
| JP5382797B2 (ja) * | 2009-09-30 | 2014-01-08 | 独立行政法人産業技術総合研究所 | 導電性組成物を用いた電気化学反応による構造体の作製方法 |
| JP5382796B2 (ja) * | 2009-09-30 | 2014-01-08 | 独立行政法人産業技術総合研究所 | 導電性組成物および電気化学反応方法および構造体 |
| JP5889799B2 (ja) * | 2010-12-01 | 2016-03-22 | マルイ鍍金工業株式会社 | 電解ケース |
| CN103103508A (zh) * | 2011-11-14 | 2013-05-15 | 深圳富泰宏精密工业有限公司 | 铝或铝合金的表面处理方法及经该方法制得的制品 |
| CN104328392A (zh) * | 2014-10-30 | 2015-02-04 | 广东电网有限责任公司电力科学研究院 | 一种基于低温镀液的涂布式化学镀方法 |
| CN104278257A (zh) * | 2014-10-30 | 2015-01-14 | 广州特种承压设备检测研究院 | 一种基于高温镀液的涂布式化学镀方法 |
| CN104554619B (zh) * | 2014-11-28 | 2017-01-11 | 南通润力机械制造有限公司 | 不锈钢二类化学品船的压载舱双相不锈钢表面处理工艺 |
| US11466355B1 (en) * | 2016-07-20 | 2022-10-11 | Oceanit Laboratories, Inc. | Submerged underwater electroless, electrochemical deposition of metal on conductive and nonconductive surfaces |
| US20200203127A1 (en) | 2018-12-20 | 2020-06-25 | L'Air Liquide, Société Anonyme pour I'Etude et I'Exploitation des Procédés Georges Claude | Systems and methods for storage and supply of f3no-free fno gases and f3no-free fno gas mixtures for semiconductor processes |
| EP3899107A1 (en) * | 2018-12-21 | 2021-10-27 | Basf Se | Composition for cobalt plating comprising additive for void-free submicron feature filling |
| EP4201459B8 (de) * | 2021-12-21 | 2025-05-14 | Drägerwerk AG & Co. KGaA | Narkosemitteldosierer mit einem beschichteten narkosemittelbehälter und herstellungs-verfahren |
| CN119372727B (zh) * | 2024-10-24 | 2025-12-30 | 沈阳睿昇精密制造有限公司 | 一种刷镀镍溶液及其制备方法与应用 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA893821A (en) * | 1972-02-22 | Western Electric Company, Incorporated | Rigid electrochemical electrolyte structures and methods of using same | |
| US2532283A (en) * | 1947-05-05 | 1950-12-05 | Brenner Abner | Nickel plating by chemical reduction |
| US3011920A (en) * | 1959-06-08 | 1961-12-05 | Shipley Co | Method of electroless deposition on a substrate and catalyst solution therefor |
| DE1621305A1 (de) * | 1966-01-03 | 1971-05-13 | Pernix Enthone S A | Verfahren zur Herstellung von Nickel-,Kobalt- und Nickel-Kobaltlegierungsueberzuegen durch chemische Reduktion |
| US3424597A (en) * | 1966-04-08 | 1969-01-28 | Shipley Co | Electroless nickel plating |
| US3709715A (en) * | 1966-05-31 | 1973-01-09 | Dow Chemical Co | Electroless nickel plating of hollow containers |
| US4061802A (en) * | 1966-10-24 | 1977-12-06 | Costello Francis E | Plating process and bath |
| IL30616A0 (en) * | 1967-08-28 | 1968-10-24 | Western Electric Co | A rigid electrolyte structure |
| US3702263A (en) * | 1970-02-20 | 1972-11-07 | Ibm | Process for electrolessly plating magnetic thin films |
| US3947610A (en) * | 1972-09-26 | 1976-03-30 | Bbc Brown, Boveri & Company Limited | Procedure for sealing leaks in closed cooling systems |
| JPS5014617A (fi) * | 1973-06-15 | 1975-02-15 | ||
| US4160049A (en) * | 1977-11-07 | 1979-07-03 | Harold Narcus | Bright electroless plating process producing two-layer nickel coatings on dielectric substrates |
| US4368223A (en) * | 1981-06-01 | 1983-01-11 | Asahi Glass Company, Ltd. | Process for preparing nickel layer |
| US4386121A (en) * | 1981-11-05 | 1983-05-31 | Amchem Products, Inc. | Spray process for chemical nickel plating |
| JPS58104169A (ja) * | 1981-12-17 | 1983-06-21 | Ricoh Co Ltd | 無電解メツキ方法 |
-
1988
- 1988-09-27 GB GB888822641A patent/GB8822641D0/en active Pending
-
1989
- 1989-09-26 KR KR1019890013827A patent/KR900004962A/ko not_active Withdrawn
- 1989-09-26 EP EP89309777A patent/EP0366268A1/en not_active Withdrawn
- 1989-09-26 US US07/412,789 patent/US5149566A/en not_active Expired - Fee Related
- 1989-09-26 JP JP1248222A patent/JPH02133580A/ja active Pending
- 1989-09-27 CN CN89107617A patent/CN1041400A/zh active Pending
- 1989-09-27 FI FI894573A patent/FI894573A7/fi not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| EP0366268A1 (en) | 1990-05-02 |
| FI894573A0 (fi) | 1989-09-27 |
| GB8822641D0 (en) | 1988-11-02 |
| CN1041400A (zh) | 1990-04-18 |
| KR900004962A (ko) | 1990-04-13 |
| JPH02133580A (ja) | 1990-05-22 |
| FI894573A7 (fi) | 1990-03-28 |
| US5149566A (en) | 1992-09-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FD | Application lapsed | ||
| MM | Patent lapsed |
Owner name: COURTAULDS COATINGS LIMITED |