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FI20041525A7 - Elektroniikkamoduuli ja menetelmä sen valmistamiseksi - Google Patents

Elektroniikkamoduuli ja menetelmä sen valmistamiseksi Download PDF

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Publication number
FI20041525A7
FI20041525A7 FI20041525A FI20041525A FI20041525A7 FI 20041525 A7 FI20041525 A7 FI 20041525A7 FI 20041525 A FI20041525 A FI 20041525A FI 20041525 A FI20041525 A FI 20041525A FI 20041525 A7 FI20041525 A7 FI 20041525A7
Authority
FI
Finland
Prior art keywords
electronic module
contact terminals
manufacturing
same
component
Prior art date
Application number
FI20041525A
Other languages
English (en)
Swedish (sv)
Other versions
FI20041525L (fi
FI20041525A0 (fi
Inventor
Risto Tuominen
Antti Iihola
Original Assignee
Imbera Electronics Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Imbera Electronics Oy filed Critical Imbera Electronics Oy
Priority to FI20041525A priority Critical patent/FI20041525A7/fi
Publication of FI20041525A0 publication Critical patent/FI20041525A0/fi
Priority to US11/791,547 priority patent/US8547701B2/en
Priority to JP2007542020A priority patent/JP2008522397A/ja
Priority to PCT/FI2005/000506 priority patent/WO2006056648A2/en
Publication of FI20041525L publication Critical patent/FI20041525L/fi
Publication of FI20041525A7 publication Critical patent/FI20041525A7/fi

Links

Classifications

    • H10W90/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/188—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or attaching to a structure having a conductive layer, e.g. a metal foil, such that the terminals of the component are connected to or adjacent to the conductive layer before embedding, and by using the conductive layer, which is patterned after embedding, at least partially for connecting the component
    • H10W70/09—
    • H10W70/614—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10515—Stacked components
    • H10W46/301—
    • H10W70/093—
    • H10W70/60—
    • H10W70/682—
    • H10W70/685—
    • H10W72/07251—
    • H10W72/073—
    • H10W72/07307—
    • H10W72/07323—
    • H10W72/20—
    • H10W72/29—
    • H10W72/874—
    • H10W72/9413—
    • H10W90/20—
    • H10W90/297—
    • H10W90/732—
    • H10W90/736—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2804—Next to metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Credit Cards Or The Like (AREA)
  • Wire Bonding (AREA)

Abstract

Tässä julkaisussa on kuvattu elektroniikkamoduuli ja menetelmä sen valmistamiseksi. Elektroniikkamoduuli sisältää ainakin yhden ensimmäisen upotetun komponentin (6), jonka kontaktiterminaalit (7) osoittavat oleellisesti kohti eristemateriaalikerroksen (1) ensimmäistä pintaa ja joka on kontaktiterminaaleistaan (7) yhdistetty sähköisesti elektroniikkamoduulin sisältämiin johderakenteisiin. Keksinnön mukaan ensimmäiseen komponenttiin (6) kiinnitetään toinen upotettu komponentti (6'), jonka kontaktiterminaalit (7') osoittavat oleellisesti kohti eristemateriaalikerroksen toista pintaa ja joka on kontaktiterminaaleistaan (7') yhdistetty sähköisesti elektroniikkamoduulin sisältämiin johderakenteisiin. Keksinnön avulla on mahdollista saavuttaa yksinkertainen kaksi komponenttikerrosta käsittävä moduulirakenne, mikä mahdollistaa entistä pienempien elektroniikkalaitteiden valmistamisen. (Kuvio 12)
FI20041525A 2004-11-26 2004-11-26 Elektroniikkamoduuli ja menetelmä sen valmistamiseksi FI20041525A7 (fi)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FI20041525A FI20041525A7 (fi) 2004-11-26 2004-11-26 Elektroniikkamoduuli ja menetelmä sen valmistamiseksi
US11/791,547 US8547701B2 (en) 2004-11-26 2005-11-24 Electronics module and method for manufacturing the same
JP2007542020A JP2008522397A (ja) 2004-11-26 2005-11-24 電子モジュール及びその製造方法
PCT/FI2005/000506 WO2006056648A2 (en) 2004-11-26 2005-11-24 Electronics module and method for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20041525A FI20041525A7 (fi) 2004-11-26 2004-11-26 Elektroniikkamoduuli ja menetelmä sen valmistamiseksi

Publications (3)

Publication Number Publication Date
FI20041525A0 FI20041525A0 (fi) 2004-11-26
FI20041525L FI20041525L (fi) 2006-03-17
FI20041525A7 true FI20041525A7 (fi) 2006-03-17

Family

ID=33515277

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20041525A FI20041525A7 (fi) 2004-11-26 2004-11-26 Elektroniikkamoduuli ja menetelmä sen valmistamiseksi

Country Status (4)

Country Link
US (1) US8547701B2 (fi)
JP (1) JP2008522397A (fi)
FI (1) FI20041525A7 (fi)
WO (1) WO2006056648A2 (fi)

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US8547701B2 (en) 2013-10-01
FI20041525L (fi) 2006-03-17
WO2006056648A2 (en) 2006-06-01
US20080094805A1 (en) 2008-04-24
FI20041525A0 (fi) 2004-11-26
WO2006056648A3 (en) 2006-08-31
JP2008522397A (ja) 2008-06-26

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