AU2001281127A1 - Fault detection method and apparatus using multiple dimension measurements - Google Patents
Fault detection method and apparatus using multiple dimension measurementsInfo
- Publication number
- AU2001281127A1 AU2001281127A1 AU2001281127A AU8112701A AU2001281127A1 AU 2001281127 A1 AU2001281127 A1 AU 2001281127A1 AU 2001281127 A AU2001281127 A AU 2001281127A AU 8112701 A AU8112701 A AU 8112701A AU 2001281127 A1 AU2001281127 A1 AU 2001281127A1
- Authority
- AU
- Australia
- Prior art keywords
- detection method
- fault detection
- multiple dimension
- dimension measurements
- measurements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H10P74/23—
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US67184800A | 2000-09-27 | 2000-09-27 | |
| US09/671,848 | 2000-09-27 | ||
| PCT/US2001/024685 WO2002027782A2 (en) | 2000-09-27 | 2001-08-07 | Fault detection method and apparatus using multiple dimension measurements |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2001281127A1 true AU2001281127A1 (en) | 2002-04-08 |
Family
ID=24696108
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2001281127A Abandoned AU2001281127A1 (en) | 2000-09-27 | 2001-08-07 | Fault detection method and apparatus using multiple dimension measurements |
Country Status (2)
| Country | Link |
|---|---|
| AU (1) | AU2001281127A1 (en) |
| WO (1) | WO2002027782A2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FI20041525L (en) | 2004-11-26 | 2006-03-17 | Imbera Electronics Oy | Electronic module and method for manufacturing the same |
| US10290088B2 (en) * | 2014-02-14 | 2019-05-14 | Kla-Tencor Corporation | Wafer and lot based hierarchical method combining customized metrics with a global classification methodology to monitor process tool condition at extremely high throughput |
| CN113042599A (en) * | 2021-03-29 | 2021-06-29 | 成都腾达模具有限公司 | Processing method of qualified grid cell tube |
| CN115116878A (en) * | 2022-06-30 | 2022-09-27 | 上海华力集成电路制造有限公司 | Method for measuring size of contact hole and automatically judging defocusing |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4571685A (en) * | 1982-06-23 | 1986-02-18 | Nec Corporation | Production system for manufacturing semiconductor devices |
| US5385629A (en) * | 1993-10-14 | 1995-01-31 | Micron Semiconductor, Inc. | After etch test method and apparatus |
| DE69523274D1 (en) * | 1994-12-29 | 2001-11-22 | At & T Corp | Line width measurement on integrated circuit structures |
| US5715181A (en) * | 1995-04-03 | 1998-02-03 | Horst; Robert L. | Isogrammetric analysis method for high-yield processes |
| US5991699A (en) * | 1995-05-04 | 1999-11-23 | Kla Instruments Corporation | Detecting groups of defects in semiconductor feature space |
| US6417013B1 (en) * | 1999-01-29 | 2002-07-09 | Plasma-Therm, Inc. | Morphed processing of semiconductor devices |
-
2001
- 2001-08-07 AU AU2001281127A patent/AU2001281127A1/en not_active Abandoned
- 2001-08-07 WO PCT/US2001/024685 patent/WO2002027782A2/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2002027782A3 (en) | 2003-09-04 |
| WO2002027782A2 (en) | 2002-04-04 |
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