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FI20031201L - Förfarande för tillverkning av en elektronikmodul och en elektronikmodul - Google Patents

Förfarande för tillverkning av en elektronikmodul och en elektronikmodul Download PDF

Info

Publication number
FI20031201L
FI20031201L FI20031201A FI20031201A FI20031201L FI 20031201 L FI20031201 L FI 20031201L FI 20031201 A FI20031201 A FI 20031201A FI 20031201 A FI20031201 A FI 20031201A FI 20031201 L FI20031201 L FI 20031201L
Authority
FI
Finland
Prior art keywords
electronic module
conductive
component
conductive layer
manufacturing
Prior art date
Application number
FI20031201A
Other languages
English (en)
Finnish (fi)
Other versions
FI20031201A0 (sv
FI20031201A7 (sv
Inventor
Risto Tuominen
Petteri Palm
Original Assignee
Imbera Electronics Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Imbera Electronics Oy filed Critical Imbera Electronics Oy
Priority to FI20031201A priority Critical patent/FI20031201A7/sv
Publication of FI20031201A0 publication Critical patent/FI20031201A0/sv
Priority to US10/569,413 priority patent/US20070131349A1/en
Priority to JP2006524376A priority patent/JP4510020B2/ja
Priority to PCT/FI2004/000474 priority patent/WO2005020651A1/en
Publication of FI20031201L publication Critical patent/FI20031201L/sv
Publication of FI20031201A7 publication Critical patent/FI20031201A7/sv

Links

Classifications

    • H10W70/614—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/188—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or attaching to a structure having a conductive layer, e.g. a metal foil, such that the terminals of the component are connected to or adjacent to the conductive layer before embedding, and by using the conductive layer, which is patterned after embedding, at least partially for connecting the component
    • H10W90/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H10W46/301—
    • H10W70/093—
    • H10W70/60—
    • H10W72/073—
    • H10W72/07323—
    • H10W72/9413—
    • H10W74/019—
    • H10W90/736—

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
FI20031201A 2003-08-26 2003-08-26 Förfarande för tillverkning av en elektronikmodul och en elektronikmodul FI20031201A7 (sv)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FI20031201A FI20031201A7 (sv) 2003-08-26 2003-08-26 Förfarande för tillverkning av en elektronikmodul och en elektronikmodul
US10/569,413 US20070131349A1 (en) 2003-08-26 2004-08-10 Method for manufacturing an electronic module, and an electronic module
JP2006524376A JP4510020B2 (ja) 2003-08-26 2004-08-10 電子モジュールの製造方法
PCT/FI2004/000474 WO2005020651A1 (en) 2003-08-26 2004-08-10 Method for manufacturing an electronic module, and an electronic module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20031201A FI20031201A7 (sv) 2003-08-26 2003-08-26 Förfarande för tillverkning av en elektronikmodul och en elektronikmodul

Publications (3)

Publication Number Publication Date
FI20031201A0 FI20031201A0 (sv) 2003-08-26
FI20031201L true FI20031201L (sv) 2005-02-27
FI20031201A7 FI20031201A7 (sv) 2005-02-27

Family

ID=27838879

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20031201A FI20031201A7 (sv) 2003-08-26 2003-08-26 Förfarande för tillverkning av en elektronikmodul och en elektronikmodul

Country Status (4)

Country Link
US (1) US20070131349A1 (sv)
JP (1) JP4510020B2 (sv)
FI (1) FI20031201A7 (sv)
WO (1) WO2005020651A1 (sv)

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FI117814B (sv) 2004-06-15 2007-02-28 Imbera Electronics Oy Förfarande för tillverkning av en elektronikmodul
GB2441265B (en) 2005-06-16 2012-01-11 Imbera Electronics Oy Method for manufacturing a circuit board structure, and a circuit board structure
FI122128B (sv) 2005-06-16 2011-08-31 Imbera Electronics Oy Förfarande för tillverkning av kretskortskonstruktion
FI119714B (sv) 2005-06-16 2009-02-13 Imbera Electronics Oy Kretskortskonstruktion och förfarande för tillverkning av kretskortskonstruktion
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FI20060256A7 (sv) 2006-03-17 2006-03-20 Imbera Electronics Oy Tillverkning av ett kretskort och ett kretskort innehållande en komponent
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US9941245B2 (en) * 2007-09-25 2018-04-10 Intel Corporation Integrated circuit packages including high density bump-less build up layers and a lesser density core or coreless substrate
DE102008000842A1 (de) * 2008-03-27 2009-10-01 Robert Bosch Gmbh Verfahren zur Herstellung einer elektronischen Baugruppe
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US8487426B2 (en) 2011-03-15 2013-07-16 Advanced Semiconductor Engineering, Inc. Semiconductor package with embedded die and manufacturing methods thereof
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Also Published As

Publication number Publication date
JP2007503713A (ja) 2007-02-22
FI20031201A0 (sv) 2003-08-26
JP4510020B2 (ja) 2010-07-21
WO2005020651A1 (en) 2005-03-03
FI20031201A7 (sv) 2005-02-27
US20070131349A1 (en) 2007-06-14

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