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FI20020190A7 - Menetelmä komponentin upottamiseksi alustaan ja kontaktin muodostamiseksi - Google Patents

Menetelmä komponentin upottamiseksi alustaan ja kontaktin muodostamiseksi

Info

Publication number
FI20020190A7
FI20020190A7 FI20020190A FI20020190A FI20020190A7 FI 20020190 A7 FI20020190 A7 FI 20020190A7 FI 20020190 A FI20020190 A FI 20020190A FI 20020190 A FI20020190 A FI 20020190A FI 20020190 A7 FI20020190 A7 FI 20020190A7
Authority
FI
Finland
Prior art keywords
embedding
substrate
component
forming contact
forming
Prior art date
Application number
FI20020190A
Other languages
English (en)
Swedish (sv)
Other versions
FI20020190A0 (fi
FI115285B (fi
Inventor
Risto Tuominen
Original Assignee
Imbera Electronics Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Imbera Electronics Oy filed Critical Imbera Electronics Oy
Publication of FI20020190A0 publication Critical patent/FI20020190A0/fi
Priority to FI20020190A priority Critical patent/FI115285B/fi
Priority to AT03700815T priority patent/ATE295064T1/de
Priority to US10/502,340 priority patent/US6991966B2/en
Priority to KR1020107023652A priority patent/KR20100126546A/ko
Priority to BRPI0307364A priority patent/BRPI0307364B1/pt
Priority to RU2004126137/09A priority patent/RU2297736C2/ru
Priority to CNB038031353A priority patent/CN100566511C/zh
Priority to PCT/FI2003/000064 priority patent/WO2003065778A1/en
Priority to DE60300619T priority patent/DE60300619T2/de
Priority to KR1020047011833A priority patent/KR101013325B1/ko
Priority to JP2003565216A priority patent/JP2005517287A/ja
Priority to HK05108993.5A priority patent/HK1077151B/xx
Priority to EP03700815A priority patent/EP1474959B1/en
Publication of FI20020190A7 publication Critical patent/FI20020190A7/fi
Priority to IL163238A priority patent/IL163238A/en
Application granted granted Critical
Publication of FI115285B publication Critical patent/FI115285B/fi

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H10W70/614—
    • H10W70/093—
    • H10W70/682—
    • H10W70/685—
    • H10W72/073—
    • H10W74/00—
    • H10W90/00—
    • H10W90/10—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Auxiliary Devices For And Details Of Packaging Control (AREA)
  • Reverberation, Karaoke And Other Acoustics (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Manufacturing Of Printed Wiring (AREA)
FI20020190A 2002-01-31 2002-01-31 Menetelmä komponentin upottamiseksi alustaan ja kontaktin muodostamiseksi FI115285B (fi)

Priority Applications (14)

Application Number Priority Date Filing Date Title
FI20020190A FI115285B (fi) 2002-01-31 2002-01-31 Menetelmä komponentin upottamiseksi alustaan ja kontaktin muodostamiseksi
CNB038031353A CN100566511C (zh) 2002-01-31 2003-01-28 用于将元件置入于基座中并且形成接触的方法
DE60300619T DE60300619T2 (de) 2002-01-31 2003-01-28 Verfahren zum einbetten einer komponente in eine basis und zur bildung eines kontakts
KR1020107023652A KR20100126546A (ko) 2002-01-31 2003-01-28 베이스에 부품을 삽입하고 콘택을 형성하는 방법
BRPI0307364A BRPI0307364B1 (pt) 2002-01-31 2003-01-28 método para embutir um componente em uma base e produzir um contato, e módulo eletrônico fabricado usando o referido método
RU2004126137/09A RU2297736C2 (ru) 2002-01-31 2003-01-28 Способ встраивания компонента в основание и формирования электрического контакта с компонентом
AT03700815T ATE295064T1 (de) 2002-01-31 2003-01-28 Verfahren zum einbetten einer komponente in eine basis und zur bildung eines kontakts
PCT/FI2003/000064 WO2003065778A1 (en) 2002-01-31 2003-01-28 Method for embedding a component in a base and forming a contact
US10/502,340 US6991966B2 (en) 2002-01-31 2003-01-28 Method for embedding a component in a base and forming a contact
KR1020047011833A KR101013325B1 (ko) 2002-01-31 2003-01-28 베이스에 부품을 삽입하고 콘택을 형성하는 방법
JP2003565216A JP2005517287A (ja) 2002-01-31 2003-01-28 構成要素をベースに埋め込み接触を形成する方法
HK05108993.5A HK1077151B (en) 2002-01-31 2003-01-28 Method for embedding a component in a base and forming a contact
EP03700815A EP1474959B1 (en) 2002-01-31 2003-01-28 Method for embedding a component in a base and forming a contact
IL163238A IL163238A (en) 2002-01-31 2004-07-27 Method for embedding a component in a base and forming a contact

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20020190 2002-01-31
FI20020190A FI115285B (fi) 2002-01-31 2002-01-31 Menetelmä komponentin upottamiseksi alustaan ja kontaktin muodostamiseksi

Publications (3)

Publication Number Publication Date
FI20020190A0 FI20020190A0 (fi) 2002-01-31
FI20020190A7 true FI20020190A7 (fi) 2003-08-01
FI115285B FI115285B (fi) 2005-03-31

Family

ID=8563006

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20020190A FI115285B (fi) 2002-01-31 2002-01-31 Menetelmä komponentin upottamiseksi alustaan ja kontaktin muodostamiseksi

Country Status (12)

Country Link
US (1) US6991966B2 (fi)
EP (1) EP1474959B1 (fi)
JP (1) JP2005517287A (fi)
KR (2) KR101013325B1 (fi)
CN (1) CN100566511C (fi)
AT (1) ATE295064T1 (fi)
BR (1) BRPI0307364B1 (fi)
DE (1) DE60300619T2 (fi)
FI (1) FI115285B (fi)
IL (1) IL163238A (fi)
RU (1) RU2297736C2 (fi)
WO (1) WO2003065778A1 (fi)

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Publication number Publication date
CN100566511C (zh) 2009-12-02
FI20020190A0 (fi) 2002-01-31
ATE295064T1 (de) 2005-05-15
KR20100126546A (ko) 2010-12-01
KR20040073606A (ko) 2004-08-19
WO2003065778A1 (en) 2003-08-07
US20050124148A1 (en) 2005-06-09
DE60300619T2 (de) 2006-01-19
EP1474959A1 (en) 2004-11-10
HK1077151A1 (zh) 2006-02-03
FI115285B (fi) 2005-03-31
DE60300619D1 (de) 2005-06-09
RU2004126137A (ru) 2005-06-10
US6991966B2 (en) 2006-01-31
BRPI0307364B1 (pt) 2017-02-21
BR0307364A (pt) 2004-12-14
KR101013325B1 (ko) 2011-02-09
EP1474959B1 (en) 2005-05-04
RU2297736C2 (ru) 2007-04-20
CN1625927A (zh) 2005-06-08
IL163238A (en) 2009-06-15
JP2005517287A (ja) 2005-06-09

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