AU2003261884A1 - Pattern inspection method and inspection device therefor - Google Patents
Pattern inspection method and inspection device thereforInfo
- Publication number
- AU2003261884A1 AU2003261884A1 AU2003261884A AU2003261884A AU2003261884A1 AU 2003261884 A1 AU2003261884 A1 AU 2003261884A1 AU 2003261884 A AU2003261884 A AU 2003261884A AU 2003261884 A AU2003261884 A AU 2003261884A AU 2003261884 A1 AU2003261884 A1 AU 2003261884A1
- Authority
- AU
- Australia
- Prior art keywords
- device therefor
- inspection
- pattern
- inspection device
- inspection method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000007689 inspection Methods 0.000 title 2
- 238000000034 method Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
- G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
- G01N21/35—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light
- G01N21/3563—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light for analysing solids; Preparation of samples therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
- G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
- G01N21/35—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Physics & Mathematics (AREA)
- General Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
- Radiation Pyrometers (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002258204 | 2002-09-03 | ||
| JP2002-258204 | 2002-09-03 | ||
| PCT/JP2003/011187 WO2004023122A1 (en) | 2002-09-03 | 2003-09-02 | Pattern inspection method and inspection device therefor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2003261884A1 true AU2003261884A1 (en) | 2004-03-29 |
Family
ID=31973020
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2003261884A Abandoned AU2003261884A1 (en) | 2002-09-03 | 2003-09-02 | Pattern inspection method and inspection device therefor |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4504191B2 (en) |
| AU (1) | AU2003261884A1 (en) |
| WO (1) | WO2004023122A1 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006112845A (en) * | 2004-10-13 | 2006-04-27 | Ushio Inc | Pattern inspection device |
| US20090122306A1 (en) * | 2005-11-15 | 2009-05-14 | Omron Corporation | Solder Material Inspecting Device |
| JP2007139727A (en) * | 2005-11-22 | 2007-06-07 | Omron Corp | Solder material inspection device, solder material inspection method, control program for solder material inspection device, and recording medium recording control program for solder material inspection device |
| JP2007139451A (en) * | 2005-11-15 | 2007-06-07 | Omron Corp | Solder material inspection device, solder material inspection method, control program for solder material inspection device, and recording medium recording control program for solder material inspection device |
| JP2009117425A (en) | 2007-11-01 | 2009-05-28 | Nitto Denko Corp | Method for manufacturing printed circuit board |
| JP2009117424A (en) | 2007-11-01 | 2009-05-28 | Nitto Denko Corp | Method for manufacturing printed circuit board |
| JP5244020B2 (en) * | 2009-04-15 | 2013-07-24 | 日東電工株式会社 | Method for manufacturing printed circuit board |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59218938A (en) * | 1983-05-27 | 1984-12-10 | Fujitsu Ltd | Method for testing wiring pattern of printed board |
| JPS61189443A (en) * | 1985-02-19 | 1986-08-23 | Hitachi Ltd | Printed circuit board pattern inspection equipment |
| JP3617547B2 (en) * | 1995-02-14 | 2005-02-09 | 富士通株式会社 | Method and processing apparatus for observing wiring pattern |
| JP2001283194A (en) * | 2000-03-28 | 2001-10-12 | Sony Corp | Circuit board appearance inspection method and circuit board appearance inspection apparatus |
| JP2001308494A (en) * | 2000-04-25 | 2001-11-02 | Nikkiso Co Ltd | Printed circuit board inspection method and apparatus |
| JP2003172711A (en) * | 2001-09-26 | 2003-06-20 | Dainippon Screen Mfg Co Ltd | Surface inspection of inspected object using image processing |
-
2003
- 2003-09-02 AU AU2003261884A patent/AU2003261884A1/en not_active Abandoned
- 2003-09-02 JP JP2004534134A patent/JP4504191B2/en not_active Expired - Fee Related
- 2003-09-02 WO PCT/JP2003/011187 patent/WO2004023122A1/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| JP4504191B2 (en) | 2010-07-14 |
| WO2004023122A1 (en) | 2004-03-18 |
| JPWO2004023122A1 (en) | 2005-12-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |