FI20002472L - Pintamikromekaaninen absoluuttipaineanturi ja menetelmä sen valmistamiseksi - Google Patents

Pintamikromekaaninen absoluuttipaineanturi ja menetelmä sen valmistamiseksi Download PDF

Info

Publication number: FI20002472L
Authority: FI; Finland
Prior art keywords: pressure sensor; absolute pressure; manufacturing same; surface micromechanical; micromechanical absolute
Prior art date: 2000-11-10

Application number

FI20002472A

Other languages

English (en)

Swedish (sv)

Other versions

FI112644B (fi

FI20002472A0 (fi

Inventor

Martti Blomberg

Original Assignee

Vaisala Oyj

Valtion Teknillinen

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2000-11-10

Filing date

2000-11-10

Publication date

2002-05-11

2000-11-10 Application filed by Vaisala Oyj, Valtion Teknillinen filed Critical Vaisala Oyj

2000-11-10 Publication of FI20002472A0 publication Critical patent/FI20002472A0/fi

2000-11-10 Priority to FI20002472A priority Critical patent/FI112644B/fi

2001-11-07 Priority to AU2002214074A priority patent/AU2002214074A1/en

2001-11-07 Priority to AT01982512T priority patent/ATE514652T1/de

2001-11-07 Priority to EP01982512A priority patent/EP1337458B1/en

2001-11-07 Priority to JP2002541035A priority patent/JP3857231B2/ja

2001-11-07 Priority to RU2003113320/28A priority patent/RU2258914C2/ru

2001-11-07 Priority to US10/416,267 priority patent/US6931935B2/en

2001-11-07 Priority to CN01821908.XA priority patent/CN1225400C/zh

2001-11-07 Priority to PCT/FI2001/000970 priority patent/WO2002038491A1/en

2002-05-11 Publication of FI20002472L publication Critical patent/FI20002472L/fi

2003-12-31 Application granted granted Critical

2003-12-31 Publication of FI112644B publication Critical patent/FI112644B/fi

Classifications

- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
- G01L9/0073—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a semiconductive diaphragm

Landscapes

Physics & Mathematics (AREA)
General Physics & Mathematics (AREA)
Measuring Fluid Pressure (AREA)
Pressure Sensors (AREA)

FI20002472A 2000-11-10 2000-11-10 Pintamikromekaaninen absoluuttipaineanturi ja menetelmä sen valmistamiseksi FI112644B (fi)

Priority Applications (9)

Application Number	Priority Date	Filing Date	Title
FI20002472A FI112644B (fi)	2000-11-10	2000-11-10	Pintamikromekaaninen absoluuttipaineanturi ja menetelmä sen valmistamiseksi
JP2002541035A JP3857231B2 (ja)	2000-11-10	2001-11-07	表面微細加工した絶対圧力センサとその製造方法
AT01982512T ATE514652T1 (de)	2000-11-10	2001-11-07	Oberflächig mikrohergestellter absolutdrucksensor und dessen herstellungsverfahren
EP01982512A EP1337458B1 (en)	2000-11-10	2001-11-07	Surface-micromachined absolute pressure sensor and a method for manufacturing thereof
AU2002214074A AU2002214074A1 (en)	2000-11-10	2001-11-07	Surface-micromachined absolute pressure sensor and a method for manufacturing thereof
RU2003113320/28A RU2258914C2 (ru)	2000-11-10	2001-11-07	Датчик абсолютного давления с микрообработанной поверхностью и способ его изготовления
US10/416,267 US6931935B2 (en)	2000-11-10	2001-11-07	Surface-micromachined absolute pressure sensor and a method for manufacturing thereof
CN01821908.XA CN1225400C (zh)	2000-11-10	2001-11-07	表面微型机械加工的绝对压力传感器及其制造方法
PCT/FI2001/000970 WO2002038491A1 (en)	2000-11-10	2001-11-07	Surface-micromachined absolute pressure sensor and a method for manufacturing thereof

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
FI20002472		2000-11-10
FI20002472A FI112644B (fi)	2000-11-10	2000-11-10	Pintamikromekaaninen absoluuttipaineanturi ja menetelmä sen valmistamiseksi

Publications (3)

Publication Number	Publication Date
FI20002472A0 FI20002472A0 (fi)	2000-11-10
FI20002472L true FI20002472L (fi)	2002-05-11
FI112644B FI112644B (fi)	2003-12-31

Family

ID=8559475

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
FI20002472A FI112644B (fi)	2000-11-10	2000-11-10	Pintamikromekaaninen absoluuttipaineanturi ja menetelmä sen valmistamiseksi

Country Status (9)

Country	Link
US (1)	US6931935B2 (fi)
EP (1)	EP1337458B1 (fi)
JP (1)	JP3857231B2 (fi)
CN (1)	CN1225400C (fi)
AT (1)	ATE514652T1 (fi)
AU (1)	AU2002214074A1 (fi)
FI (1)	FI112644B (fi)
RU (1)	RU2258914C2 (fi)
WO (1)	WO2002038491A1 (fi)

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US7630114B2 (en)	2005-10-28	2009-12-08	Idc, Llc	Diffusion barrier layer for MEMS devices
US7711239B2 (en)	2006-04-19	2010-05-04	Qualcomm Mems Technologies, Inc.	Microelectromechanical device and method utilizing nanoparticles
US7623287B2 (en)	2006-04-19	2009-11-24	Qualcomm Mems Technologies, Inc.	Non-planar surface structures and process for microelectromechanical systems
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RU2324159C1 (ru) *	2006-08-09	2008-05-10	Федеральное государственное учреждение Российский научный центр "Курчатовский институт"	Чувствительный элемент емкостного датчика давления жидких и газообразных сред и способ его изготовления
US7545552B2 (en)	2006-10-19	2009-06-09	Qualcomm Mems Technologies, Inc.	Sacrificial spacer process and resultant structure for MEMS support structure
WO2008103632A2 (en) *	2007-02-20	2008-08-28	Qualcomm Mems Technologies, Inc.	Equipment and methods for etching of mems
US7625825B2 (en)	2007-06-14	2009-12-01	Qualcomm Mems Technologies, Inc.	Method of patterning mechanical layer for MEMS structures
JP2011501874A (ja) *	2007-09-14	2011-01-13	クォルコム・メムズ・テクノロジーズ・インコーポレーテッド	Ｍｅｍｓ製造において使用されるエッチングプロセス
US8022490B2 (en)	2008-03-24	2011-09-20	Conexant Systems, Inc.	Micro electro-mechanical sensor (MEMS) fabricated with ribbon wire bonds
DE102008028300B4 (de) *	2008-06-13	2021-10-07	Tdk Electronics Ag	Leiterplatte mit flexiblem Bereich und Verfahren zur Herstellung
RU2465681C2 (ru) *	2009-02-19	2012-10-27	Государственное образовательное учреждение высшего профессионального образования "Московский государственный технический университет имени Н.Э. Баумана" (МГТУ им. Н.Э. Баумана)	Способ изготовления чувствительного элемента датчика давления жидких и газообразных сред
US8393222B2 (en)	2010-02-27	2013-03-12	Codman Neuro Sciences Sárl	Apparatus and method for minimizing drift of a piezo-resistive pressure sensor due to progressive release of mechanical stress over time
KR101184459B1 (ko)	2010-05-06	2012-09-19	삼성전기주식회사	압력센서
US8659816B2 (en)	2011-04-25	2014-02-25	Qualcomm Mems Technologies, Inc.	Mechanical layer and methods of making the same
RU2477846C1 (ru) *	2011-12-02	2013-03-20	Федеральное государственное унитарное предприятие "Всероссийский научно-исследовательский институт автоматики им. Н.Л. Духова" (ФГУП "ВНИИА")	Датчик абсолютного давления
CN102539029B (zh) *	2012-02-29	2013-09-25	上海交通大学	基于柔性mems技术的三维流体应力传感器及其阵列
FR3002219B1 (fr) *	2013-02-19	2015-04-10	Commissariat Energie Atomique	Procede de fabrication d'une structure micromecanique et/ou nanomecanique comportant une surface poreuse
DE102017213354A1 (de) *	2017-08-02	2019-02-07	Robert Bosch Gmbh	Mikromechanische Drucksensorvorrichtung und entsprechendes Herstellungsverfahren
CN209326840U (zh)	2018-12-27	2019-08-30	热敏碟公司	压力传感器及压力变送器
WO2022019167A1 (ja) *	2020-07-21	2022-01-27	株式会社村田製作所	圧力センサ構造、圧力センサ装置および圧力センサ構造の製造方法
TR202017548A2 (tr) *	2020-11-03	2022-05-23	Koc Ueniversitesi	Bi̇r kafa i̇çi̇ basinç sensörü
IT202100022505A1 (it)	2021-08-30	2023-03-02	St Microelectronics Srl	Procedimento di fabbricazione di un sensore di pressione capacitivo e sensore di pressione capacitivo
CN218545957U (zh) *	2021-08-30	2023-02-28	意法半导体股份有限公司	电容式压力传感器
US12140489B2 (en) *	2021-09-21	2024-11-12	Invensense, Inc.	Pressure sensor with high stability
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2000
- 2000-11-10 FI FI20002472A patent/FI112644B/fi not_active IP Right Cessation
2001
- 2001-11-07 JP JP2002541035A patent/JP3857231B2/ja not_active Expired - Lifetime
- 2001-11-07 RU RU2003113320/28A patent/RU2258914C2/ru active
- 2001-11-07 AT AT01982512T patent/ATE514652T1/de not_active IP Right Cessation
- 2001-11-07 AU AU2002214074A patent/AU2002214074A1/en not_active Abandoned
- 2001-11-07 WO PCT/FI2001/000970 patent/WO2002038491A1/en not_active Ceased
- 2001-11-07 CN CN01821908.XA patent/CN1225400C/zh not_active Expired - Lifetime
- 2001-11-07 EP EP01982512A patent/EP1337458B1/en not_active Expired - Lifetime
- 2001-11-07 US US10/416,267 patent/US6931935B2/en not_active Expired - Lifetime

Also Published As

Publication number	Publication date
AU2002214074A1 (en)	2002-05-21
US20040020303A1 (en)	2004-02-05
WO2002038491A1 (en)	2002-05-16
EP1337458A1 (en)	2003-08-27
CN1225400C (zh)	2005-11-02
CN1486277A (zh)	2004-03-31
JP3857231B2 (ja)	2006-12-13
ATE514652T1 (de)	2011-07-15
RU2258914C2 (ru)	2005-08-20
US6931935B2 (en)	2005-08-23
FI112644B (fi)	2003-12-31
JP2004513356A (ja)	2004-04-30
FI20002472A0 (fi)	2000-11-10
EP1337458B1 (en)	2011-06-29

Publication	Publication Date	Title
FI20002472L (fi)	2002-05-11	Pintamikromekaaninen absoluuttipaineanturi ja menetelmä sen valmistamiseksi
FI20021508L (fi)	2004-02-22	Voima- tai paineanturi ja menetelmä sen soveltamiseksi
DE60032676D1 (de)	2007-02-15	Drucksensor und Herstellungsverfahren desselben
DE60031089D1 (de)	2006-11-16	Kapazitiver Drucksensor und zugehöriges Herstellungsverfahren
DE60015451D1 (de)	2004-12-09	Drucksensor und Herstellungsverfahren desselben
DE50016091D1 (de)	2011-05-19	Drucksensor
DE60144214D1 (de)	2011-04-28	Kapazitiver Drucksensor
DE60143780D1 (de)	2011-02-17	Zusammengesetzte Sensorvorrichtung und zugehöriges Herstellungsverfahren
FI20000661L (fi)	2001-09-22	Menetelmä kalvoanturin valmistamiseksi
JP2002504674A5 (ja)	2006-03-30	圧力センサ
DE10196961T1 (de)	2003-12-24	Verfahren zum Zusammenfügen eines elektromechanischen Sensors
AU2001278067A1 (en)	2002-02-13	A mem sensor and a method of making same
FI991506L (fi)	2001-01-02	Menetelmä anturielementien valmistamiseksi ja anturielementti
DE50109327D1 (de)	2006-05-11	Mikromechanisches bauelement und entsprechendes herstellungsverfahren
DE50103327D1 (de)	2004-09-23	Mikromechanisches bauelement und entsprechendes herstellungsverfahren
FI20021964A7 (fi)	2004-05-05	Menetelmä tuoteanturin valmistamiseksi sekä tuoteanturi
DE50103208D1 (de)	2004-09-16	Druckanzeiger
DE50014915D1 (de)	2008-03-06	Drucksensor
FI20000755L (fi)	2001-10-01	Menetelmä tuoteanturin muodostamiseksi ja tuoteanturi
TWI348776B (en)	2011-09-11	Contact pressure sensor and method for manufacturing the same
FI20000883L (fi)	2001-10-14	Komposiittirakenteinen tela ja menetelmä sen valmistamiseksi
FI20010582L (fi)	2002-09-22	Menetelmä piianturin valmistamiseksi sekä piianturi
DE50109722D1 (de)	2006-06-08	Mikromechanisches bauelement und entsprechendes herstellungsverfahren
DE60140833D1 (de)	2010-02-04	Druckerfassungsapparat
GB0300015D0 (en)	2003-02-05	A method of measuring forces in the presence of an external pressure

Legal Events

Date	Code	Title	Description
2011-02-03	PC	Transfer of assignment of patent	Owner name: VALTION TEKNILLINEN TUTKIMUSKESKUS Free format text: VALTION TEKNILLINEN TUTKIMUSKESKUS
2020-12-18	MA	Patent expired

Date

Code

Title

Description

2011-02-03

Transfer of assignment of patent

Owner name: VALTION TEKNILLINEN TUTKIMUSKESKUS

Free format text: VALTION TEKNILLINEN TUTKIMUSKESKUS

2020-12-18

Patent expired