CN209326840U - 压力传感器及压力变送器 - Google Patents
压力传感器及压力变送器 Download PDFInfo
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0061—Electrical connection means
- G01L19/0069—Electrical connection means from the sensor to its support
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/18—Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0007—Fluidic connecting means
- G01L19/0038—Fluidic connecting means being part of the housing
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
- G01L19/0627—Protection against aggressive medium in general
- G01L19/0645—Protection against aggressive medium in general using isolation membranes, specially adapted for protection
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/142—Multiple part housings
- G01L19/143—Two part housings
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/147—Details about the mounting of the sensor to support or covering means
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/02—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning
- G01L9/06—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning of piezo-resistive devices
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Abstract
本实用新型提供了一种压力传感器及压力变送器,该压力传感器包括:压敏元件,该压敏元件为硅压阻式;信号调制模块,该信号调制模块用于将压敏元件的输出信号调制成预设格式的信号;该压敏元件和该信号调制模块集成在同一个基板上。通过实用新型提供的技术方案,使得压敏元件和信号调制模块能够整合成一个独立的压力元件,使用安装更加简单,整体体积更加小巧紧凑,提高了可靠性。
Description
技术领域
本实用新型涉及传感器领域,具体而言,涉及一种压力传感器及压力变送器。
背景技术
压力变送器是一种将压力转换成气动信号或电动信号进行控制和远传的设备。常规压力变送器,包括压敏元件及控制电路等。压敏元件设置在连接器内,通过导线与设置在压力变送器外壳内的控制电路连接。常规的压力变送器中,压敏元件及控制电路采用结构相互分离的设计方式,使得产品整体体积偏大,可靠性较差。
实用新型内容
为解决上述问题,本实用新型提供一种压力传感器及压力变送器。
本实用新型的一方面,提供一种压力传感器,包括:压敏元件,所述压敏元件为硅压阻式;信号调制模块,用于将所述压敏元件的输出信号调制成预设格式的信号;所述压敏元件和所述信号调制模块集成在同一个基板上。
优选地,所述压敏元件和所述信号调制模块通过表面贴装的方式设置在所述基板上。
优选地,所述压敏元件与所述信号调制模块通过键合方式相互连接;或者,所述压敏元件与所述信号调制模块通过所述基板上的印制电路相互连接。
优选地,所述基板包括:陶瓷基板。
优选地,所述陶瓷基板包括:氧化铝陶瓷基板或氧化锆陶瓷基板。
优选地,所述压敏元件与所述信号调制模块通过所述基板上的印制电路相互连接。
优选地,所述的压力传感器,还包括:保护罩,设置在所述基板上,用于保护所述信号调制模块,和/或所述压敏元件。
优选地,所述的压力传感器,还包括:负载,设置在所述信号调制模块和所述压敏元件的电路中。
本实用新型的另一方面,提供一种压力变送器,包括如上述的压力传感器。
优选地,所述压力传感器设置在所述压力变送器的连接器和外壳之间。
优选地,所述的压力变送器,还包括以下至少两项:第一密封胶,设置在所述连接器的空腔和所述基板的共同的边缘处;密封圈,设置在所述压力传感器与所述外壳相接触的部分;第二密封胶,设置在所述连接器与所述外壳的边沿相接触的地方。
本实用新型提供了一种压力传感器及压力变送器,该压力传感器包括:压敏元件,该压敏元件为硅压阻式;信号调制模块,该信号调制模块用于将压敏元件的输出信号调制成预设格式的信号;该压敏元件和该信号调制模块集成在同一个基板上。通过实用新型提供的技术方案,使得压敏元件和信号调制模块能够整合成一个独立的压力元件,使用安装更加简单,整体体积更加小巧紧凑,提高了可靠性。
附图说明
此处所说明的附图用来提供对本实用新型的进一步理解,构成本申请的一部分,本实用新型的示意性实施例及其说明用于解释本实用新型,并不构成对本实用新型的不当限定。在附图中:
图1是根据本实用新型的压力传感器的一个实施例的结构示意图;
图2是根据本实用新型的压力传感器的另一个实施例的结构示意图;
图3是根据本实用新型的压力变送器的一个实施例的结构示意图;
图4是根据本实用新型的压力变送器的连接器的一个实施例的结构示意图;
图5是如图4所示连接器的仰视图;
图6是根据本实用新型的压力变送器的外壳的一个实施例的结构示意图;
图7是根据本实用新型的压力变送器的一个实施例的轴向截面的结构示意图。
具体实施方式
下文中将参考附图并结合实施例来详细说明本实用新型。需要说明的是,在不冲突的情况下,本申请中的实施例及实施例中的特征可以相互组合。
本实用新型提供了一种压力传感器,图1是根据本实用新型的压力传感器的一个实施例的结构示意图。一种压力传感器,如图1所示,包括:压敏元件110,该压敏元件为硅压阻式;信号调制模块120,用于将压敏元件110的输出信号调制成预设格式的信号;压敏元件110和信号调制模块120集成在同一个基板100上。通过本实用新型的技术方案,采用硅压阻式的压敏元件,使用集成的方式,将压敏元件和信号调制模块整合成一个独立的压力元件,使得该压力元件,使用安装更加简单,整体体积更加小巧紧凑,提高了可靠性。
作为一个较优的实施方式,压敏元件110可以采用相关技术中的多种感压元件,例如微机电系统(Micro-Electro-Mechanical Systems,简称为MEMS),信号调制模块120可以采用相关技术中用于信号调制的芯片,例如专用集成电路(Application SpecificIntegrated Circuit,简称为ASIC)。
作为一个较优的实施方式,压敏元件110和信号调制模块120可以通过表面贴装的方式设置在基板100上。在该实施方式下,将压敏元件和信号调制模块通过表面贴装的方式设置在基板上,不需要导线连接,减小了压力传感器的体积,整体更为小巧紧凑。
作为另一个较优的实施方式,压敏元件110与信号调制模块120可以通过键合方式相互连接;或者,压敏元件110与信号调制模块120可以通过基板上的印制电路相互连接。在该实施方式下,压敏元件与信号调制模块通过键合方式,或,通过基板上的印制电路相互电连接,使得压敏元件与信号调制模块之间的连接省去了导线的连接,并且生产加工方便,实施性强。
作为另一个较优的实施方式,基板100可以包括陶瓷基板。通过该实施方式,使用陶瓷基板,相比较于常规设计中的玻璃纤维基板,机械强度更好,绝缘性能更好,材料性质更稳定,抗腐蚀能力更强;并且,在该压力传感器的使用过程中,需要与工作介质直接接触时,特别是与液体工作介质直接接触时,适应范围更广;同时,相对于常规方案应用于压力变送器中时,该实施方式下,不需要将陶瓷基板与工作介质做物理隔离,简化了设计及工艺。
优选地,陶瓷基板可以包括氧化铝陶瓷基板或氧化锆陶瓷基板。通过该实施方式,在使用时,提高了该压力传感器的基板的传导性、机械强度和耐高温性。
作为另一个较优的实施方式,上述的压力传感器,如图2所示,还可以包括保护罩230,保护罩230设置在基板上,用于保护信号调制模块,和/或压敏元件(即就是,用于保护以下至少之一的元件:信号调制模块;压敏元件)。在该实施方式下,设置在基板上的保护罩230,罩住信号调制模块,和/或压敏元件,使得在该压力传感器在使用过程中,保护罩内的元器件不易被碰撞到,使用更为安全,可靠性更高。
作为另一个较优的实施方式,上述的压力传感器,还包括:负载140,设置信号调制模块120和压敏元件110的电路中(该负载140包括:被动元器件,如:电阻和电容等,被动元器件均设置在基板上,并与信号调制模块及压敏元件电连接)。通过该实施方式,使得信号调制模块及压敏元件能够得到电流保护,安全性更高。
本实用新型还提供了一种压力变送器,图3是根据本实用新型的压力变送器的一个实施例的结构示意图。一种压力变送器300,包括如上述的压力传感器。通过该技术方案,采用如上述的压力传感器,压力变送器300中不需要像常规设计中那样设计(在常规设计中,分别在连接器350中和外壳360中设置压敏元件及控制电路,并通过导线等方式将其连接并安装起来),简化了设计;通过该技术方案,简化了生产安装工艺,也使得压力变送器整体的体积更加小巧紧凑,使用更为便利,集成化的设置也提高了产品的可靠性。
图4是根据本实用新型的压力变送器的连接器的一个实施例的结构示意图;图5是如图4所示连接器的仰视图;图6是根据本实用新型的压力变送器的外壳的一个实施例的结构示意图;图7是根据本实用新型的压力变送器的一个实施例的轴向截面的结构示意图。作为一个较优的实施方式,压力传感器400可以设置在压力变送器的连接器450和外壳460之间。如图4、图5、图6、图7所示,压力传感器400可以设置在连接器450的空腔455内部。第一密封胶457可以设置在压力传感器400的底部,并且围绕着基板(如图1中所示的基板100)的边缘处设置,基板上设置有压力传感器400,压力传感器400容纳在连接器450的空腔455内(也就是说,第一密封胶457设置在连接器的空腔455和基板100的共同的边缘处,将压力传感器400与连接器450整合在一起)。压力传感器400的底部(如图4、图5所示)可以被容纳并密封在连接器450的空腔455内部。图5示出了压力传感器400容纳在连接器450内部时连接器的底部的结构示意图。在该实施方式中,压力传感器整体包封在连接器内部,使得压力变送器的结构更为简单、紧凑,压力变送器的性能更为可靠。
作为另一个较优的实施方式,上述压力变送器,还可以包括:密封圈470,密封圈470可以设置在压力传感器400与外壳460相接触的部分(例如:密封圈470可以设置在外壳460的容纳腔465内,并与压力传感器相接触);和/或,第二密封胶480,第二密封胶480可以设置在连接器与外壳的边沿462相接触的地方。在该实施方式中,通过外壳的容纳腔内的密封圈与压力传感器的底部压合密封,将压力传感器整体包封在外壳内部,使得压力变送器的密封性能更高,在一定程度上提高了产品的可靠性。
以上实施方式仅示出了部分优选的实施方式,需要说明的是,本领域技术人员可以根据实际的需要,选择以下的至少两项:第一密封胶,设置在连接器的空腔和基板的共同的边缘处;密封圈,设置在压力传感器与外壳相接触的部分;第二密封胶,设置在连接器与外壳的边沿相接触的地方。
结合附图1至图7对装配过程进行详细说明。作为一个较优的实施方式,在装配过程中,首先,压力传感器400被设置在连接器450的空腔455内,使得基板100的边缘紧密适配在空腔455的边缘内。然后,将端子(或引线)406连接(例如,通过焊接)到压力传感器400的基板100上的触点105上。之后,第一密封胶457设置在压力传感器400的基板100和空腔455共同的边缘处,将压力传感器400与连接器450整合(集成)在一起,提供了压力传感器与周围环境之间的第一密封。然后,密封圈470可以设置在外壳460的容纳腔465内。连接器450(具有集成的压力传感器400)被设置在外壳460的容纳腔465内,使得压力传感器压紧(压紧并紧靠)密封圈470,同时外壳460的边沿462压接在连接器450上(如图7所示),从而将连接器450安装到外壳460上,并将压力传感器400整体包封在外壳460的容纳腔465内。用这种方式,提供了压力传感器400与周围环境之间的第二密封。最后,第二密封胶480设置在外壳460的边沿处连接连接器450(例如,在外壳460在连接器450上的压接处)。第二密封胶480提供了压力传感器与周围环境之间的第三密封。
通过上述实施例,提供了一种压力传感器及压力变送器。通过该技术方案,达到了如下技术效果:将压敏元件和信号调制模块整合成一个独立的压力元件,使得该压力元件,使用安装更加简单,整体体积更加小巧紧凑,提高了产品可靠性;并且,集成为一个独立压力元件,压力元件内部的零件位置也相对固定,避免了使用柔性印制电路板和绝缘线材等位置不固定的零件;同时,相对于常规方案应用于压力变送器中时,该实施方式下,不需要将压力传感器与工作介质做物理隔离,简化了设计及工艺。
需要说明的是,这些技术效果并不是上述所有的实施方式所具有的,有些技术效果是某些优选实施方式才能取得的。
以上所述仅为本实用新型的较佳实施例而已,并非用于限定本实用新型的保护范围。凡在本实用新型的精神和原则之内所作的任何修改、等同替换、改进等,均包含在本实用新型的保护范围内。
Claims (10)
1.一种压力传感器,其特征在于,包括:
压敏元件,所述压敏元件为硅压阻式;
信号调制模块,用于将所述压敏元件的输出信号调制成预设格式的信号;
所述压敏元件和所述信号调制模块集成在同一个基板上。
2.根据权利要求1所述的压力传感器,其特征在于,所述压敏元件和所述信号调制模块通过表面贴装的方式设置在所述基板上。
3.根据权利要求2所述的压力传感器,其特征在于,
所述压敏元件与所述信号调制模块通过键合方式相互连接;或者,
所述压敏元件与所述信号调制模块通过所述基板上的印制电路相互连接。
4.根据权利要求3所述的压力传感器,其特征在于,
所述基板包括:陶瓷基板。
5.根据权利要求4所述的压力传感器,其特征在于,
所述陶瓷基板包括:氧化铝陶瓷基板或氧化锆陶瓷基板。
6.根据权利要求1至5中任一项所述的压力传感器,其特征在于,还包括:
保护罩,设置在所述基板上,用于保护所述信号调制模块,和/或所述压敏元件。
7.根据权利要求1至5中任一项所述的压力传感器,其特征在于,还包括:
负载,设置在所述信号调制模块和所述压敏元件的电路中。
8.一种压力变送器,其特征在于,包括根据权利要求1至7中任一项所述的压力传感器。
9.根据权利要求8所述的压力变送器,其特征在于,所述压力传感器设置在所述压力变送器的连接器和外壳之间。
10.根据权利要求9所述的压力变送器,其特征在于,还包括以下至少两项:
第一密封胶,设置在所述连接器的空腔和所述基板的共同的边缘处;
密封圈,设置在所述压力传感器与所述外壳相接触的部分;
第二密封胶,设置在所述连接器与所述外壳的边沿相接触的地方。
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| CN201822213406.4U CN209326840U (zh) | 2018-12-27 | 2018-12-27 | 压力传感器及压力变送器 |
| US16/518,466 US11047753B2 (en) | 2018-12-27 | 2019-07-22 | Pressure sensor assembly and method for manufacturing a pressure sensor assembly |
| PCT/US2019/067915 WO2020139768A1 (en) | 2018-12-27 | 2019-12-20 | Pressure sensor assembly and method for manufacturing a pressure sensor assembly |
| CN201980040895.2A CN112543864B (zh) | 2018-12-27 | 2019-12-20 | 压力传感器组件和用于制造压力传感器组件的方法 |
| EP23173261.1A EP4235133A3 (en) | 2018-12-27 | 2019-12-20 | Pressure sensor assembly and method for manufacturing a pressure sensor assembly |
| CN202210878382.2A CN115371856B (zh) | 2018-12-27 | 2019-12-20 | 压力传感器组件和用于制造压力传感器组件的方法 |
| EP19842694.2A EP3755982B1 (en) | 2018-12-27 | 2019-12-20 | Pressure sensor assembly and method for manufacturing a pressure sensor assembly |
| JP2021537843A JP7114814B2 (ja) | 2018-12-27 | 2019-12-20 | 圧力センサアセンブリ及び圧力センサアセンブリを製造するための方法 |
| JP2022119415A JP7314370B2 (ja) | 2018-12-27 | 2022-07-27 | 圧力センサアセンブリ及び圧力センサアセンブリを製造するための方法 |
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Family Cites Families (348)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10185734A (ja) * | 1996-12-26 | 1998-07-14 | Hokuriku Electric Ind Co Ltd | 圧力センサモジュール |
| US5974893A (en) | 1997-07-24 | 1999-11-02 | Texas Instruments Incorporated | Combined pressure responsive transducer and temperature sensor apparatus |
| US6144866A (en) | 1998-10-30 | 2000-11-07 | Medtronic, Inc. | Multiple sensor assembly for medical electric lead |
| DK0915326T3 (da) | 1997-10-10 | 2002-03-25 | Wika Alexander Wiegand Gmbh | Fremgangsmåde til fremstilling af en trykmåletransducer samt trykmåletransducer |
| NO308228B1 (no) | 1997-11-26 | 2000-08-14 | Presens As | Dynamisk trykksensor |
| US20040099061A1 (en) | 1997-12-22 | 2004-05-27 | Mks Instruments | Pressure sensor for detecting small pressure differences and low pressures |
| US5959212A (en) | 1998-04-27 | 1999-09-28 | Texas Instruments Incorporated | Capacitive pressure transducer having reduced output error |
| US6422085B1 (en) | 1998-07-21 | 2002-07-23 | Endress + Hauser Gmbh + Co. | Flush-diaphragm relative pressure sensor |
| DE59812186D1 (de) | 1998-07-24 | 2004-12-02 | Wika Alexander Wiegand Gmbh | Verfahren zur Herstellung eines Messsystems für ein Druckmessgerät |
| DE59813429D1 (de) | 1998-12-15 | 2006-05-04 | Wika Alexander Wiegand Gmbh | Messsystem für ein Druckmessgerät sowie Druckmessgerät |
| US6229190B1 (en) | 1998-12-18 | 2001-05-08 | Maxim Integrated Products, Inc. | Compensated semiconductor pressure sensor |
| DE19859507C2 (de) | 1998-12-22 | 2003-04-24 | Wika Alexander Wiegand Gmbh | Kunststoffdruckmittler für Halbleiterindustrie |
| US6255728B1 (en) | 1999-01-15 | 2001-07-03 | Maxim Integrated Products, Inc. | Rigid encapsulation package for semiconductor devices |
| US6578427B1 (en) | 1999-06-15 | 2003-06-17 | Envec Mess- Und Regeltechnik Gmbh + Co. | Capacitive ceramic relative-pressure sensor |
| US6272927B1 (en) | 1999-10-20 | 2001-08-14 | Texas Instruments Incorporated | Hermetically sealed pressure sensing device |
| JP2001133345A (ja) | 1999-11-02 | 2001-05-18 | Fuji Koki Corp | 圧力センサ |
| US6453747B1 (en) | 2000-01-12 | 2002-09-24 | Peter A. Weise | Hermetic pressure transducer |
| US6272928B1 (en) | 2000-01-24 | 2001-08-14 | Kulite Semiconductor Products | Hermetically sealed absolute and differential pressure transducer |
| DE50016091D1 (de) | 2000-02-22 | 2011-05-19 | Endress & Hauser Gmbh & Co Kg | Drucksensor |
| TW507073B (en) | 2000-03-31 | 2002-10-21 | Tdk Corp | Humidity sensor and method for making |
| DE20007053U1 (de) | 2000-04-17 | 2000-07-27 | Wika Alexander Wiegand GmbH & Co, 63911 Klingenberg | Druckmessgerät |
| US6564642B1 (en) | 2000-11-02 | 2003-05-20 | Kavlico Corporation | Stable differential pressure measuring system |
| FI112644B (fi) | 2000-11-10 | 2003-12-31 | Vaisala Oyj | Pintamikromekaaninen absoluuttipaineanturi ja menetelmä sen valmistamiseksi |
| US6487911B1 (en) | 2000-11-21 | 2002-12-03 | Texas Instruments Incorporated | Pressure sensor apparatus |
| US6505398B2 (en) | 2000-12-04 | 2003-01-14 | Kavlico Corporation | Very high pressure miniature sensing and mounting technique |
| US6420201B1 (en) | 2001-01-03 | 2002-07-16 | Amkor Technology, Inc. | Method for forming a bond wire pressure sensor die package |
| US6432737B1 (en) | 2001-01-03 | 2002-08-13 | Amkor Technology, Inc. | Method for forming a flip chip pressure sensor die package |
| US6441503B1 (en) | 2001-01-03 | 2002-08-27 | Amkor Technology, Inc. | Bond wire pressure sensor die package |
| US6687642B2 (en) | 2001-01-26 | 2004-02-03 | Texas Instruments Incorporated | Condition responsive sense system and method |
| US6581468B2 (en) | 2001-03-22 | 2003-06-24 | Kavlico Corporation | Independent-excitation cross-coupled differential-pressure transducer |
| DE20107260U1 (de) | 2001-04-27 | 2001-08-16 | WIKA Alexander Wiegand GmbH & Co. KG, 63911 Klingenberg | Übertragungsflüssigkeit für die Druckmesstechnik und deren Anwendung |
| DE10133745A1 (de) | 2001-07-11 | 2003-01-23 | Endress & Hauser Gmbh & Co Kg | Drucksensor und Verfahren zu dessen Betrieb |
| US6672171B2 (en) | 2001-07-16 | 2004-01-06 | Mks Instruments, Inc. | Combination differential and absolute pressure transducer for load lock control |
| JP4044307B2 (ja) | 2001-08-01 | 2008-02-06 | 株式会社山武 | 圧力センサ |
| US6584853B2 (en) | 2001-10-12 | 2003-07-01 | Kavlico Corporation | Corrosion-proof pressure transducer |
| JP3752444B2 (ja) | 2001-11-16 | 2006-03-08 | 株式会社日立製作所 | 圧力検出装置 |
| US6806722B2 (en) | 2001-12-07 | 2004-10-19 | Samsung Electronics Co., Ltd. | Polymer-type humidity sensor |
| US7057247B2 (en) | 2001-12-12 | 2006-06-06 | Kulite Semiconductor Products, Inc. | Combined absolute differential transducer |
| DE10200780A1 (de) | 2002-01-10 | 2003-07-24 | Endress & Hauser Gmbh & Co Kg | Relativdrucksensor |
| US6688182B2 (en) | 2002-01-31 | 2004-02-10 | Kulite Semiconductor Products, Inc. | Static pitot transducer |
| JP2003232693A (ja) | 2002-02-08 | 2003-08-22 | Denso Corp | 圧力センサ |
| DE10215621A1 (de) * | 2002-04-09 | 2003-10-30 | Rudolf Ehwald | Vorrichtung und Verfahren zur Druckmessung in einem abgeschlossenen Raum |
| US6647794B1 (en) | 2002-05-06 | 2003-11-18 | Rosemount Inc. | Absolute pressure sensor |
| JP3824964B2 (ja) | 2002-05-17 | 2006-09-20 | 長野計器株式会社 | 絶対圧型圧力センサ |
| US6715357B2 (en) | 2002-07-10 | 2004-04-06 | Texas Instruments Incorporated | Hermetic pressure transducer |
| US6672170B1 (en) | 2002-07-10 | 2004-01-06 | Texas Instruments Incorporated | Hermetic pressure transducer |
| JP3704685B2 (ja) | 2002-07-29 | 2005-10-12 | 株式会社山武 | 静電容量センサ |
| DE10234754A1 (de) | 2002-07-30 | 2004-02-19 | Endress + Hauser Gmbh + Co. Kg | Differenzdrucksensor mit symmetrischem Trennkörperfehler |
| US7465425B1 (en) | 2002-09-09 | 2008-12-16 | Yizhong Sun | Sensor and method for detecting analytes in fluids |
| EP1411349B1 (de) | 2002-10-18 | 2005-12-21 | Siemens Schweiz AG | Feuchtigkeitsfühler mit kapazitivem Feuchte-Messelement und Verfahren zur Erfassung der Luftfeuchtigkeit |
| ATE325338T1 (de) | 2002-10-18 | 2006-06-15 | Siemens Schweiz Ag | Verfahren zur erfassung der luftfeuchtigkeit mit kapazitivem feuchte-messelement |
| AU2003287977A1 (en) | 2002-11-05 | 2004-06-07 | Endress + Hauser Gmbh + Co. Kg | Relative pressure sensor having an atmosphere-side damper |
| DE10252023B3 (de) | 2002-11-06 | 2004-07-15 | Metallux Gmbh | Drucksensor |
| US6742395B1 (en) | 2002-12-20 | 2004-06-01 | Texas Instruments Incorporated | Hermetic pressure transducer |
| US6715360B1 (en) | 2003-02-19 | 2004-04-06 | Fisher Controls International, Llc | Gauge pressure sensor for hazardous applications |
| JP3915715B2 (ja) | 2003-03-07 | 2007-05-16 | 株式会社デンソー | 半導体圧力センサ |
| EP1601942B1 (en) | 2003-03-10 | 2008-05-07 | Danfoss A/S | Silicon pressure sensor with decreased pressure equalization between measured pressure and reference chamber |
| JP3855950B2 (ja) | 2003-03-19 | 2006-12-13 | 株式会社デンソー | 容量式湿度センサ |
| US6907790B2 (en) | 2003-03-21 | 2005-06-21 | Rosemount Inc. | Gage pressure output from an absolute pressure measurement device |
| DE10316033A1 (de) | 2003-04-07 | 2004-10-21 | Endress + Hauser Gmbh + Co. Kg | Relativdruckmeßumformer |
| DE10319417A1 (de) | 2003-04-29 | 2004-11-18 | Endress + Hauser Gmbh + Co. Kg | Druckaufnehmer mit Temperaturkompensation |
| JP4020014B2 (ja) * | 2003-05-26 | 2007-12-12 | 株式会社ジェイテクト | 圧力センサ |
| US7210333B2 (en) | 2003-05-30 | 2007-05-01 | Ngk Spark Plug Co., Ltd. | Humidity sensor and method of using the humidity sensor |
| ATE310236T1 (de) | 2003-06-27 | 2005-12-15 | Wika Alexander Wiegand Gmbh | Drucksensor |
| US7284440B2 (en) | 2003-07-24 | 2007-10-23 | Kulite Semiconductor Products, Inc. | Line pressure compensated differential pressure transducer assembly |
| US7421905B2 (en) * | 2003-09-04 | 2008-09-09 | Baker Hughes Incorporated | Optical sensor with co-located pressure and temperature sensors |
| EP1942324B1 (en) * | 2003-09-04 | 2012-04-11 | Baker Hughes Incorporated | Optical sensor with co-located pressure and temperature sensors |
| US7111518B1 (en) | 2003-09-19 | 2006-09-26 | Silicon Microstructures, Inc. | Extremely low cost pressure sensor realized using deep reactive ion etching |
| DE10343521A1 (de) | 2003-09-19 | 2005-04-21 | Beru Ag | Druckmessglühkerze für einen Dieselmotor |
| US6781814B1 (en) | 2003-11-03 | 2004-08-24 | Texas Instruments Incorporated | Capacitive pressure transducer |
| US7031863B2 (en) | 2003-12-22 | 2006-04-18 | Texas Instruments Incorporated | Variable condition responsive sense system and method |
| JP3976015B2 (ja) * | 2004-02-04 | 2007-09-12 | 株式会社デンソー | 圧力センサ |
| DE102004012593A1 (de) | 2004-03-12 | 2005-09-29 | Robert Bosch Gmbh | Sensormodul |
| CN1961209A (zh) | 2004-04-02 | 2007-05-09 | 蒂莫西·卡明斯 | 集成电子传感器 |
| US7028552B2 (en) | 2004-05-17 | 2006-04-18 | Kavlico Corporation | Reliable piezo-resistive pressure sensor |
| US7028551B2 (en) | 2004-06-18 | 2006-04-18 | Kavlico Corporation | Linearity semi-conductive pressure sensor |
| US7073375B2 (en) | 2004-07-02 | 2006-07-11 | Honeywell International Inc. | Exhaust back pressure sensor using absolute micromachined pressure sense die |
| JP2006023115A (ja) | 2004-07-06 | 2006-01-26 | Surpass Kogyo Kk | 絶対圧形圧力センサの製造方法および製造装置 |
| US7007552B2 (en) | 2004-07-26 | 2006-03-07 | Texas Instruments Incorporated | Multi-channel pressure sensing apparatus |
| JP4341506B2 (ja) | 2004-08-20 | 2009-10-07 | 株式会社デンソー | 湿度センサおよび湿度検出機能を有する複合センサ |
| EP1810013B1 (en) | 2004-10-18 | 2012-06-13 | Senmatic A/S | A humidity sensor and a method for manufacturing the same |
| US6923069B1 (en) | 2004-10-18 | 2005-08-02 | Honeywell International Inc. | Top side reference cavity for absolute pressure sensor |
| JP4455286B2 (ja) | 2004-11-09 | 2010-04-21 | 株式会社日本自動車部品総合研究所 | 静電容量式湿度センサ |
| US7231815B2 (en) | 2004-12-02 | 2007-06-19 | Construction Technology Laboratories, Inc. | Relative humidity probe for concrete |
| US7499604B1 (en) | 2004-12-12 | 2009-03-03 | Burns David W | Optically coupled resonant pressure sensor and process |
| US7290453B2 (en) | 2004-12-28 | 2007-11-06 | Amnon Brosh | Composite MEMS pressure sensor configuration |
| US7836910B2 (en) | 2004-12-29 | 2010-11-23 | Rain Bird Corporation | Soil moisture sensor and controller |
| US7000478B1 (en) | 2005-01-31 | 2006-02-21 | Texas Instruments Incorporated | Combined pressure and temperature transducer |
| US7355718B2 (en) | 2005-04-04 | 2008-04-08 | North Carolina Agricultural And Technical State University | Pressure sensor having two materials with different coefficients of thermal expansion configured to reduce temperature dependence |
| US7635091B2 (en) | 2005-04-21 | 2009-12-22 | Honeywell International Inc. | Humidity sensor formed on a ceramic substrate in association with heating components |
| JP4609173B2 (ja) | 2005-04-22 | 2011-01-12 | 株式会社デンソー | 容量式湿度センサおよびその製造方法 |
| US7243552B2 (en) | 2005-05-09 | 2007-07-17 | Delphi Technologies, Inc. | Pressure sensor assembly |
| USD543476S1 (en) | 2005-07-01 | 2007-05-29 | Wika Alexander Wiegand Gmbh & Co. Kg | Pressure gage with axial connector |
| USD545707S1 (en) | 2005-07-01 | 2007-07-03 | Wika Alexander Wiegand Gmbh & Co. Kg | Pressure gage with radial connector |
| USD559716S1 (en) | 2005-07-01 | 2008-01-15 | Wika Alexander Wiegand Gmbh & Co. Kg | Pressure measurement cartridge for a low and vacuum pressure gas pressure gage |
| EP1910793B1 (en) | 2005-07-29 | 2010-12-29 | Sensata Technologies, Inc. | Compensation arrangement and method for operation thereof |
| US7162926B1 (en) | 2005-08-04 | 2007-01-16 | Kavlico Corporation | Lead embedded pressure sensor |
| JP4674529B2 (ja) | 2005-11-07 | 2011-04-20 | 株式会社デンソー | 湿度センサ装置及びその製造方法 |
| US7597005B2 (en) | 2005-11-10 | 2009-10-06 | Honeywell International Inc. | Pressure sensor housing and configuration |
| EP2270095A3 (en) | 2005-11-25 | 2014-09-10 | Dublin Institute of Technology | A holographic sensor |
| US7467891B2 (en) | 2005-11-29 | 2008-12-23 | Sensata Technologies, Inc. | Sensor arrangement for measuring a pressure and a temperature in a fluid |
| DE102005060855A1 (de) | 2005-12-20 | 2007-06-28 | Robert Bosch Gmbh | Mikromechanischer kapazitiver Druckwandler und Herstellungsverfahren |
| EP1977207B1 (en) | 2006-01-10 | 2017-04-12 | Kyungdong One Corporation | Accurate pressure sensor |
| US7380459B1 (en) | 2006-01-17 | 2008-06-03 | Irvine Sensors Corp. | Absolute pressure sensor |
| FR2897937B1 (fr) | 2006-02-24 | 2008-05-23 | Commissariat Energie Atomique | Capteur de pression a jauges resistives |
| JP4770530B2 (ja) | 2006-03-13 | 2011-09-14 | 株式会社デンソー | 容量式湿度センサ |
| DE112007000980A5 (de) | 2006-04-24 | 2009-03-19 | Wika Alexander Wiegand Gmbh & Co. Kg | Messinstrument in Zweileitertechnik |
| US7515039B2 (en) | 2006-06-05 | 2009-04-07 | Kavlico Corporation | Method and apparatus for tire pressure monitoring |
| US7275444B1 (en) | 2006-07-13 | 2007-10-02 | Kulite Semiconductor Products, Inc. | Pressure transducer apparatus adapted to measure engine pressure parameters |
| DE102006033467B4 (de) | 2006-07-19 | 2010-03-25 | Continental Automotive Gmbh | Druckerfassungsvorrichtung |
| US7487681B1 (en) | 2006-08-06 | 2009-02-10 | Silicon Microstructures Inc. | Pressure sensor adjustment using backside mask |
| DE102006050451A1 (de) | 2006-10-20 | 2008-04-24 | Endress + Hauser Gmbh + Co. Kg | Druckmessgerät |
| FR2908882B1 (fr) | 2006-11-17 | 2008-12-26 | Thales Sa | Dispositif de mesure de la pression totale d'un ecoulement et procede mettant en oeuvre le dispositif |
| DE102006056172A1 (de) | 2006-11-27 | 2008-05-29 | Endress + Hauser Gmbh + Co. Kg | Elastischer Keramikkörper und Drucksensor mit einem elastischen Keramikkörper |
| US8661910B2 (en) | 2007-01-19 | 2014-03-04 | Ipg, Llc | Capacitive sensor |
| DE102007003544A1 (de) | 2007-01-24 | 2008-07-31 | Robert Bosch Gmbh | Verfahren zur Herstellung eines Bauteils und Sensorelement |
| US8324913B2 (en) | 2007-04-05 | 2012-12-04 | Micronas Gmbh | Moisture sensor and method for measuring moisture of a gas-phase medium |
| JP4386295B2 (ja) | 2007-04-20 | 2009-12-16 | 株式会社日本自動車部品総合研究所 | 湿度センサ |
| US7967965B2 (en) | 2007-05-11 | 2011-06-28 | Honeywell International Inc. | Gas sensor |
| DE102007026243A1 (de) | 2007-06-04 | 2008-12-11 | Endress + Hauser Gmbh + Co. Kg | Kapazitiver Drucksensor |
| US7974503B2 (en) | 2007-06-22 | 2011-07-05 | National Chiao Tung University | Fiber grating sensor |
| US7493822B2 (en) | 2007-07-05 | 2009-02-24 | Honeywell International Inc. | Small gauge pressure sensor using wafer bonding and electrochemical etch stopping |
| JP4930254B2 (ja) * | 2007-08-01 | 2012-05-16 | 株式会社デンソー | 半導体装置 |
| US8132457B2 (en) | 2007-08-09 | 2012-03-13 | Northern Illinois University | Nano-porous alumina sensor |
| US7683636B2 (en) | 2007-10-26 | 2010-03-23 | Honeywell International Inc. | Structure for capacitive balancing of integrated relative humidity sensor |
| WO2009070888A1 (en) | 2007-12-07 | 2009-06-11 | Esi Environmental Sensors Inc. | Moisture sensor |
| US7762140B2 (en) | 2008-01-10 | 2010-07-27 | Sensata Technologies, Inc. | Combined fluid pressure and temperature sensor apparatus |
| US7578194B1 (en) | 2008-02-11 | 2009-08-25 | Sensata Technologies, Inc. | Differential fluid pressure measurement apparatus |
| US7895897B2 (en) | 2008-03-03 | 2011-03-01 | Wika Alexander Wiegand Gmbh & Co. Kg | Sensor assembly and use of a sensor assembly |
| US7924028B2 (en) | 2008-03-20 | 2011-04-12 | Honeywell International Inc. | Method and system for adjusting characteristics of integrated relative humidity sensor |
| US7698950B2 (en) | 2008-04-04 | 2010-04-20 | Wika Alexander Wiegand Gmbh & Co. Kg | Pressure sensor assembly for measuring absolute pressure |
| US7775118B2 (en) | 2008-04-24 | 2010-08-17 | Custom Sensors & Technologies, Inc. | Sensor element assembly and method |
| DE102008021091A1 (de) | 2008-04-28 | 2009-10-29 | Epcos Ag | Drucksensor |
| US8217475B2 (en) | 2008-05-15 | 2012-07-10 | Custom Sensors & Technologies, Inc. | Backside controlled MEMS capacitive sensor and interface and method |
| US7698951B2 (en) | 2008-05-27 | 2010-04-20 | Honeywell International Inc. | Pressure-sensor apparatus |
| US7779701B2 (en) | 2008-06-02 | 2010-08-24 | Sensata Technologies, Inc. | Pressure sensor apparatus |
| US8082807B2 (en) | 2008-06-02 | 2011-12-27 | Custom Sensors & Technologies, Inc. | Sensor assembly and method |
| DE102008002312A1 (de) | 2008-06-09 | 2009-12-10 | Wika Alexander Wiegand Gmbh & Co. Kg | Manometer |
| US8024970B2 (en) | 2008-06-12 | 2011-09-27 | Honeywell International Inc. | Passive humidity sensors and methods for temperature adjusted humidity sensing |
| ITTO20080483A1 (it) * | 2008-06-19 | 2009-12-20 | Eltek Spa | Dispositivo sensore di pressione |
| ITTO20080485A1 (it) * | 2008-06-19 | 2009-12-20 | Eltek Spa | Dispositivo sensore di pressione |
| US7673518B2 (en) | 2008-06-19 | 2010-03-09 | Kulite Semiconductor Products, Inc. | Compact absolute and gage pressure transducer having a mounting apparatus for accurately positioning and aligning a leadless semiconductor chip on an associated header |
| ITTO20080484A1 (it) * | 2008-06-19 | 2009-12-20 | Eltek Spa | Dispositivo sensore di pressione |
| EP2138820B1 (en) | 2008-06-25 | 2016-09-21 | Sensata Technologies, Inc. | A piezoresistive pressure-measuring plug for a combustion engine |
| FR2934051B1 (fr) | 2008-07-16 | 2011-12-09 | Commissariat Energie Atomique | Detecteur d'humidite capacitif a dielectrique hydrophile nanoporeux |
| DE102008040557B4 (de) | 2008-07-18 | 2023-06-01 | Wika Alexander Wiegand Se & Co. Kg | Druckmessgerät |
| CN101368863B (zh) * | 2008-07-25 | 2013-02-20 | 陈建海 | 压力传感器 |
| US7992441B2 (en) | 2008-07-31 | 2011-08-09 | Sensata Technologies, Inc. | Pressure sensor for measuring pressure in a medium |
| US8643127B2 (en) | 2008-08-21 | 2014-02-04 | S3C, Inc. | Sensor device packaging |
| DE102008041942A1 (de) | 2008-09-10 | 2010-03-11 | Robert Bosch Gmbh | Sensoranordnung, Verfahren zum Betrieb einer Sensoranordnung und Verfahren zur Herstellung einer Sensoranordnung |
| US7866215B2 (en) | 2008-10-02 | 2011-01-11 | Kulite Semiconductor Products, Inc. | Redundant self compensating leadless pressure sensor |
| US8020448B2 (en) | 2008-10-21 | 2011-09-20 | GM Global Technology Operations LLC | Pressure sensor with nonlinear characteristic curve |
| DE102008043175A1 (de) | 2008-10-24 | 2010-04-29 | Endress + Hauser Gmbh + Co. Kg | Relativdrucksensor |
| KR101093612B1 (ko) | 2008-11-12 | 2011-12-15 | 전자부품연구원 | 정전용량형 습도센서 및 그 제조방법 |
| US7775117B2 (en) | 2008-12-11 | 2010-08-17 | Kulite Semiconductor Products, Inc. | Combined wet-wet differential and gage transducer employing a common housing |
| CN102318025B (zh) | 2009-01-30 | 2015-11-25 | 威卡亚历山大威甘德股份有限公司 | 用于确定绝缘室或开关柜中的sf6气体的填充量的测量设备及相应的方法 |
| US7775119B1 (en) | 2009-03-03 | 2010-08-17 | S3C, Inc. | Media-compatible electrically isolated pressure sensor for high temperature applications |
| DE102009001892A1 (de) | 2009-03-26 | 2010-09-30 | Endress + Hauser Gmbh + Co. Kg | Drucksensor |
| WO2010113712A1 (ja) | 2009-03-31 | 2010-10-07 | アルプス電気株式会社 | 容量型湿度センサ及びその製造方法 |
| US7819014B1 (en) | 2009-04-23 | 2010-10-26 | Rosemount Inc. | Capacitive gage pressure sensor with vacuum dielectric |
| IT1394791B1 (it) | 2009-05-20 | 2012-07-13 | Metallux Sa | Sensore di pressione |
| US8215176B2 (en) | 2009-05-27 | 2012-07-10 | Continental Automotive Systems, Inc. | Pressure sensor for harsh media sensing and flexible packaging |
| US9340414B2 (en) | 2009-07-07 | 2016-05-17 | MCube Inc. | Method and structure of monolithically integrated absolute pressure sensor |
| EP2275805A1 (en) | 2009-07-16 | 2011-01-19 | Acreo AB | Moister sensor |
| DE102009028488A1 (de) | 2009-08-12 | 2011-02-17 | Endress + Hauser Gmbh + Co. Kg | Relativdrucksensor |
| US8235592B2 (en) | 2009-10-07 | 2012-08-07 | Wika Alexander Wiegand Se & Co. Kg | Gauge on a pipe section |
| EP2315013B1 (de) | 2009-10-21 | 2014-06-18 | Micronas GmbH | Feuchtesensor |
| EP2494343A2 (de) | 2009-10-30 | 2012-09-05 | Peter Hagl | Sensorvorrichtung |
| US8082797B2 (en) | 2009-11-11 | 2011-12-27 | Honeywell International Inc. | Pressure sensor assembly |
| US8186226B2 (en) | 2009-12-09 | 2012-05-29 | Honeywell International Inc. | Pressure sensor with on-board compensation |
| DE102009054689A1 (de) * | 2009-12-15 | 2011-06-16 | Robert Bosch Gmbh | Verfahren zum Herstellen einer Drucksensoranordnung sowie Drucksensoranordnung |
| US8371160B2 (en) | 2009-12-16 | 2013-02-12 | Meggitt (San Juan Capistrano), Inc. | Weatherized direct-mount absolute pressure sensor |
| WO2011076124A1 (en) | 2009-12-22 | 2011-06-30 | Nano And Advanced Materials Institute Limited | Rapid response relative humidity sensor using anodic aluminum oxide film |
| DE102010002157A1 (de) | 2010-02-19 | 2011-08-25 | Endress + Hauser GmbH + Co. KG, 79689 | Druckmessaufnehmer und Differenzdruckmessaufnehmer |
| US8393222B2 (en) | 2010-02-27 | 2013-03-12 | Codman Neuro Sciences Sárl | Apparatus and method for minimizing drift of a piezo-resistive pressure sensor due to progressive release of mechanical stress over time |
| DE102010002463A1 (de) | 2010-03-01 | 2011-09-01 | Robert Bosch Gmbh | Mikromechanisches Drucksensorelement und Verfahren zu dessen Herstellung |
| US8763466B2 (en) | 2010-04-08 | 2014-07-01 | Endress + Hauser Gmbh + Co. Kg | Gauge pressure sensor |
| US8256300B2 (en) | 2010-05-27 | 2012-09-04 | Sensata Technologies, Inc. | Pressure sensor |
| EP2395336B1 (en) | 2010-06-08 | 2018-08-01 | Sensata Technologies, Inc. | Hermetically sealed pressure sensing device |
| US8813562B2 (en) | 2010-06-25 | 2014-08-26 | Guy Prud'Homme | Relative humidity sensor apparatus |
| US8618620B2 (en) | 2010-07-13 | 2013-12-31 | Infineon Technologies Ag | Pressure sensor package systems and methods |
| US8264074B2 (en) | 2010-09-10 | 2012-09-11 | General Electric Company | Device for use as dual-sided sensor package |
| US9007050B2 (en) | 2010-09-17 | 2015-04-14 | The Toro Company | Soil moisture sensor with improved enclosure |
| JP5547296B2 (ja) | 2010-10-04 | 2014-07-09 | アルプス電気株式会社 | 湿度検出センサ及びその製造方法 |
| EP2444786B1 (en) | 2010-10-20 | 2013-07-17 | Sensata Technologies, Inc. | A pressure measuring glow plug for a combustion engine |
| DE102010050340A1 (de) | 2010-11-05 | 2012-05-10 | Wika Alexander Wiegand Se & Co. Kg | Messgerät mit Zusatzanzeigeeinrichtung für Überlasterreichung |
| US8616065B2 (en) | 2010-11-24 | 2013-12-31 | Honeywell International Inc. | Pressure sensor |
| GB201021033D0 (en) | 2010-12-13 | 2011-01-26 | Verdirrigation Ltd | An irrigation apparatus and a sensor therefor |
| US7998777B1 (en) | 2010-12-15 | 2011-08-16 | General Electric Company | Method for fabricating a sensor |
| US8191425B1 (en) | 2010-12-17 | 2012-06-05 | Kulite Semiconductor Products, Inc. | Gage pressure transducer and method for making the same |
| US9291514B2 (en) | 2010-12-27 | 2016-03-22 | Epcos Ag | Pressure sensor having a compressible element |
| DE102011004577B4 (de) | 2011-02-23 | 2023-07-27 | Robert Bosch Gmbh | Bauelementträger, Verfahren zur Herstellung eines solchen Bauelementträgers sowie Bauteil mit einem MEMS-Bauelement auf einem solchen Bauelementträger |
| DE102011004722A1 (de) | 2011-02-25 | 2012-08-30 | Endress + Hauser Gmbh + Co. Kg | Keramische Druckmesszelle |
| FR2972261B1 (fr) | 2011-03-03 | 2013-04-12 | Commissariat Energie Atomique | Capteur d'humidite comprenant comme couche absorbante d'humidite une couche polymerique comprenant un melange de polyamides |
| US8662200B2 (en) * | 2011-03-24 | 2014-03-04 | Merlin Technology Inc. | Sonde with integral pressure sensor and method |
| US8590387B2 (en) | 2011-03-31 | 2013-11-26 | DePuy Synthes Products, LLC | Absolute capacitive micro pressure sensor |
| KR101322354B1 (ko) | 2011-04-07 | 2013-10-25 | 한국과학기술원 | 습도 센서, 습도 센싱 방법 및 이를 위한 트랜지스터 |
| EP2508874B1 (en) | 2011-04-08 | 2019-06-05 | ams international AG | Capacitive sensor, integrated circuit, electronic device and method |
| JP5516505B2 (ja) | 2011-05-25 | 2014-06-11 | 株式会社デンソー | 容量式湿度センサ及びその製造方法 |
| JP5488534B2 (ja) | 2011-06-06 | 2014-05-14 | 株式会社デンソー | 湿度センサ及びその製造方法 |
| JP5908069B2 (ja) | 2011-06-08 | 2016-04-26 | スリーエム イノベイティブ プロパティズ カンパニー | 湿度センサ及びそのためのセンサ素子 |
| US8365607B2 (en) | 2011-06-30 | 2013-02-05 | Sensata Technologies, Inc. | Anti-slip grooves in a crimped pressure sensor assembly |
| DE102011078557A1 (de) | 2011-07-01 | 2013-01-03 | Endress + Hauser Gmbh + Co. Kg | Verfahren zum Betreiben eines Absolut- oder Relativdrucksensors mit einem kapazitiven Wandler |
| FR2977319B1 (fr) | 2011-07-01 | 2014-03-14 | Commissariat Energie Atomique | Dispositif de mesure de pression a sensiblite optimisee |
| EP2554968B1 (en) | 2011-08-01 | 2019-01-16 | Sensata Technologies, Inc. | Sensor system for differential pressure measurement |
| US8528409B2 (en) | 2011-08-09 | 2013-09-10 | Honeywell International Inc. | High temperature gage pressure sensor |
| US8935961B2 (en) | 2011-08-18 | 2015-01-20 | Sensata Technologies, Inc. | Combination pressure/temperature in a compact sensor assembly |
| US8770034B2 (en) | 2011-09-06 | 2014-07-08 | Honeywell International Inc. | Packaged sensor with multiple sensors elements |
| JP2013057616A (ja) | 2011-09-09 | 2013-03-28 | Azbil Corp | 環境センサ |
| WO2013043148A1 (en) | 2011-09-19 | 2013-03-28 | Hewlett-Packard Development Company, L.P. | Sensing water vapour |
| US9027400B2 (en) | 2011-12-02 | 2015-05-12 | Stmicroelectronics Pte Ltd. | Tunable humidity sensor with integrated heater |
| US8739623B2 (en) | 2012-03-09 | 2014-06-03 | The University Of Kentucky Research Foundation | Moisture sensors on conductive substrates |
| EP2657691B1 (de) | 2012-04-25 | 2018-08-29 | E+E Elektronik Ges.m.b.H. | Feuchtesensor-Anordnung |
| KR101477341B1 (ko) | 2012-05-11 | 2015-01-06 | 포항공과대학교 산학협력단 | 발색 습도 센서 |
| US9116060B2 (en) | 2012-05-23 | 2015-08-25 | Hach Company | Auto-zeroing absolute pressure sensor |
| CN104487831B (zh) | 2012-05-29 | 2016-09-07 | 3M创新有限公司 | 湿度传感器和传感器元件 |
| FR2991456B1 (fr) | 2012-06-04 | 2023-02-10 | Commissariat Energie Atomique | Capteur d'humidite capacitif a electrode de graphene |
| DE102012210752A1 (de) | 2012-06-25 | 2014-01-23 | Robert Bosch Gmbh | Druckerfassungsmodul sowie Drucksensorvorrichtung mit einem solchen Druckerfassungsmodul |
| US8820170B2 (en) | 2012-09-14 | 2014-09-02 | Sensata Technologies, Inc. | Pressure sensor |
| US9027410B2 (en) | 2012-09-14 | 2015-05-12 | Sensata Technologies, Inc. | Hermetically glass sealed pressure sensor |
| EP2730904A1 (en) | 2012-11-12 | 2014-05-14 | Sensata Technologies, Inc. | A pressure-measuring plug for a combustion engine |
| EP2730905B1 (en) | 2012-11-12 | 2019-01-02 | Sensata Technologies, Inc. | A pressure-measuring plug for a combustion engine |
| DE102012111001A1 (de) | 2012-11-15 | 2014-05-15 | Endress + Hauser Gmbh + Co. Kg | Dichtring und Druckmessaufnehmer mit mindestens einem solchen Dichtring |
| US9310269B2 (en) | 2012-11-30 | 2016-04-12 | Sensata Technologies, Inc. | Analog front-end compensation |
| US9709461B2 (en) | 2012-11-30 | 2017-07-18 | Sensata Technologies, Inc. | Method of integrating a temperature sensing element |
| DE102013208537A1 (de) * | 2012-12-27 | 2014-07-03 | Robert Bosch Gmbh | Drucksensoranordnung sowie Verfahren zum Montieren einer Drucksensoranordnung |
| US9304098B2 (en) | 2013-02-04 | 2016-04-05 | Veris Industries, Llc | Capacitive humidity sensor with hysteresis compensation |
| US9746438B2 (en) | 2013-02-06 | 2017-08-29 | Veris Industries, Llc | Humidity sensor with temperature compensation |
| DE102013202090A1 (de) | 2013-02-08 | 2014-08-14 | Wika Alexander Wiegand Se & Co. Kg | Druckmessgerät |
| DE212014000016U1 (de) | 2013-02-18 | 2015-08-11 | Illinois Tool Works Inc. | Motorkrümmer-Sensoranordnung |
| US8878316B2 (en) | 2013-02-22 | 2014-11-04 | Continental Automotive Systems, Inc. | Cap side bonding structure for backside absolute pressure sensors |
| DE102013101936A1 (de) | 2013-02-27 | 2014-08-28 | Endress + Hauser Gmbh + Co. Kg | Drucksensor |
| US9146164B2 (en) | 2013-03-07 | 2015-09-29 | Sensata Technologies, Inc. | Pressure transducer substrate with self alignment feature |
| US10175188B2 (en) | 2013-03-15 | 2019-01-08 | Robert Bosch Gmbh | Trench based capacitive humidity sensor |
| EP2781903B1 (en) | 2013-03-20 | 2016-05-25 | Sensata Technologies, Inc. | A measuring plug and method for assembling a measuring plug |
| JP5991246B2 (ja) | 2013-03-25 | 2016-09-14 | ブラザー工業株式会社 | センサ装置、同センサ装置を備えた画像形成装置、及び湿度検出方法 |
| US9234859B2 (en) | 2013-03-28 | 2016-01-12 | Stmicroelectronics S.R.L. | Integrated device of a capacitive type for detecting humidity, in particular manufactured using a CMOS technology |
| US9310266B2 (en) | 2013-05-08 | 2016-04-12 | Sensata Technologies, Inc. | Strain gauge pressure sensor |
| DE102013209248B4 (de) | 2013-05-17 | 2021-02-11 | Robert Bosch Gmbh | Mikromechanisches Bauteil und Herstellungsverfahren für ein mikromechanisches Bauteil |
| EP2808665B1 (en) | 2013-05-28 | 2019-02-20 | Sensata Technologies, Inc. | A measuring plug |
| WO2014191619A1 (en) | 2013-05-30 | 2014-12-04 | Vaisala Oyj | A dual gas sensor structure and measurement method |
| US9285334B2 (en) | 2013-06-06 | 2016-03-15 | Zhi David Chen | Hybrid dielectric moisture sensors |
| DE102013211378B4 (de) | 2013-06-18 | 2021-05-20 | Robert Bosch Gmbh | Mikromechanische Feuchtesensorvorrichtung und entsprechendes Herstellungsverfahren sowie mikromechanische Sensoranordnung |
| US10739213B2 (en) | 2013-07-10 | 2020-08-11 | Hitachi Automotive Systems, Ltd. | Temperature and humidity sensor |
| EP2824438A1 (en) | 2013-07-12 | 2015-01-14 | Siemens Aktiengesellschaft | Pressure sensor |
| US9546922B2 (en) | 2013-08-09 | 2017-01-17 | Continental Automotive Systems, Inc. | Absolute pressure sensor with improved cap bonding boundary |
| CN105452853B (zh) | 2013-08-13 | 2018-01-30 | 株式会社村田制作所 | 温湿度传感器 |
| US9671359B2 (en) | 2013-08-27 | 2017-06-06 | Council Of Scientific & Industrial Research | Resistive type humidity sensor based on porous magnesium ferrite pellet |
| DE102013217349B4 (de) | 2013-08-30 | 2024-06-13 | Robert Bosch Gmbh | Mikromechanische Sensoranordnung und entsprechendes Herstellungsverfahren |
| CN105556295A (zh) | 2013-08-30 | 2016-05-04 | 株式会社村田制作所 | 气体传感器、气体传感器的制造方法、以及气体浓度的检测方法 |
| US9562796B2 (en) | 2013-09-06 | 2017-02-07 | Illinois Tool Works Inc. | Absolute and differential pressure transducer |
| KR20150028929A (ko) | 2013-09-06 | 2015-03-17 | 매그나칩 반도체 유한회사 | 정전용량형 습도센서 |
| US9470593B2 (en) | 2013-09-12 | 2016-10-18 | Honeywell International Inc. | Media isolated pressure sensor |
| KR101521346B1 (ko) | 2013-10-10 | 2015-05-18 | 박세용 | 보드 걸이용 밸트 |
| US9423315B2 (en) | 2013-10-15 | 2016-08-23 | Rosemount Aerospace Inc. | Duplex pressure transducers |
| FR3012604B1 (fr) | 2013-10-25 | 2017-03-03 | Auxitrol Sa | Capteur de pression comprenant une structure de controle d'une couche d'adhesif resistante aux variations de temperatures |
| US9568384B1 (en) | 2013-10-30 | 2017-02-14 | Remote Industrial Sensor Company LLC | Variable volume enclosure to terminate vented pressure transducers |
| US9557237B2 (en) | 2013-11-18 | 2017-01-31 | Sensata Technologies, Inc. | MEMS pressure sensor field shield layout for surface charge immunity in oil filled packaging |
| US9401601B2 (en) | 2013-12-03 | 2016-07-26 | Sensata Technologies, Inc. | Circuit designs for induced transient immunity |
| DE102013114608A1 (de) | 2013-12-20 | 2015-07-09 | Endress + Hauser Gmbh + Co. Kg | Relativdrucksensor |
| USD724981S1 (en) | 2013-12-20 | 2015-03-24 | Wika Alexander Wiegand Se & Co. Kg | Electronic pressure transducer with output display |
| US9383283B2 (en) | 2014-01-16 | 2016-07-05 | Sensata Technologies, Inc. | Pressure transducer with capacitively coupled source electrode |
| US9470594B2 (en) | 2014-01-17 | 2016-10-18 | Sensata Technologies, Inc. | Differential pressure sensor with dual output using a double-sided capacitive sensing element |
| DE102014204348A1 (de) | 2014-03-10 | 2015-09-10 | Wika Alexander Wiegand Se & Co. Kg | Messelement aus stahl mit gehärteter randzone |
| US9494477B2 (en) | 2014-03-31 | 2016-11-15 | Infineon Technologies Ag | Dynamic pressure sensor |
| EP3128318B1 (en) | 2014-04-04 | 2022-11-09 | Hitachi Astemo, Ltd. | Humidity detection device |
| US9494538B2 (en) | 2014-04-04 | 2016-11-15 | Deere & Company | Agricultural moisture sensor with co-planar electrodes |
| US9574961B2 (en) | 2014-04-09 | 2017-02-21 | Continental Automotive Systems, Inc. | Humidity resistant sensors and methods of making same |
| DE102014119108A1 (de) | 2014-04-23 | 2015-10-29 | Endress + Hauser Gmbh + Co. Kg | Drucksensor mit einem keramischen Grundkörper |
| US10359415B2 (en) | 2014-05-02 | 2019-07-23 | Rosemount Inc. | Single-use bioreactor sensor architecture |
| US9804113B2 (en) | 2014-05-19 | 2017-10-31 | Fiskars Oyj Abp | Soil moisture sensor |
| CN103957498B (zh) | 2014-05-21 | 2017-11-03 | 苏州敏芯微电子技术股份有限公司 | 侧面进声的硅麦克风封装结构 |
| DE102014107251A1 (de) | 2014-05-22 | 2015-11-26 | Endress + Hauser Gmbh + Co. Kg | Druckausgleichselement |
| US9752999B2 (en) | 2014-05-29 | 2017-09-05 | Apple Inc. | Moisture ingress sensors |
| KR102237710B1 (ko) | 2014-06-18 | 2021-04-09 | 주식회사 해치텍 | 커패시터형 습도센서 |
| DE102014108780A1 (de) | 2014-06-24 | 2015-12-24 | Endress + Hauser Gmbh + Co. Kg | Trockenmodul für einen Relativdruckmessaufnehmer |
| US11111135B2 (en) | 2014-07-02 | 2021-09-07 | My01 Ip Holdings Inc. | Methods and devices for microelectromechanical pressure sensors |
| KR102187614B1 (ko) | 2014-07-02 | 2020-12-08 | 주식회사 키 파운드리 | 커패시터형 습도센서 |
| US9557238B2 (en) | 2014-07-25 | 2017-01-31 | Ams International Ag | Pressure sensor with geter embedded in membrane |
| US9568388B2 (en) | 2014-08-05 | 2017-02-14 | Sensata Technologies, Inc. | Small form factor pressure sensor |
| EP2988122B1 (en) | 2014-08-20 | 2019-04-24 | ams international AG | Capacitive sensor |
| US9513242B2 (en) | 2014-09-12 | 2016-12-06 | Honeywell International Inc. | Humidity sensor |
| US10054511B2 (en) | 2014-10-01 | 2018-08-21 | Sensata Technologies, Inc. | Pressure sensor with correction of offset drift in cyclic signal |
| US9828848B2 (en) | 2014-10-09 | 2017-11-28 | Baker Hughes, A Ge Company, Llc | Wireless passive pressure sensor for downhole annulus monitoring |
| DE102014221067A1 (de) | 2014-10-16 | 2016-04-21 | Robert Bosch Gmbh | Drucksensor zur Erfassung eines Drucks eines fluiden Mediums |
| US9915577B2 (en) | 2014-12-02 | 2018-03-13 | Sensata Technologies, Inc. | Case isolated oil filled MEMS pressure sensor |
| GB2533084A (en) | 2014-12-02 | 2016-06-15 | Melexis Tech N V | Relative and absolute pressure sensor combined on chip |
| DE102014118541A1 (de) | 2014-12-12 | 2016-06-16 | Endress + Hauser Gmbh + Co. Kg | Druckausgleichselement für ein Feldgerät der Automatisierungstechnik |
| FR3030738B1 (fr) | 2014-12-19 | 2020-03-20 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Capteur de pression adapte aux mesures de pression en milieu agressif |
| DE102014119396A1 (de) | 2014-12-22 | 2016-06-23 | Endress + Hauser Gmbh + Co. Kg | Druckmesseinrichtung |
| US10161895B2 (en) | 2014-12-23 | 2018-12-25 | 3M Innovative Properties Company | Electronic moisture sensor |
| EP3241019B1 (en) | 2014-12-29 | 2019-08-07 | Robert Bosch GmbH | Fabrication method for a nanostructured lanthanum oxide humidity sensor and corresponding sensor device |
| US20160207762A1 (en) | 2015-01-20 | 2016-07-21 | Sigurd Microelectronics Corp. | Sensor package structure and method |
| US9746390B2 (en) | 2015-02-26 | 2017-08-29 | Sensata Technologies, Inc. | Microfused silicon strain gauge (MSG) pressure sensor package |
| JP6535185B2 (ja) | 2015-03-04 | 2019-06-26 | エイブリック株式会社 | 湿度センサ |
| US9903777B2 (en) | 2015-03-12 | 2018-02-27 | Sensata Technologies, Inc. | Pressure transducer |
| US9714876B2 (en) | 2015-03-26 | 2017-07-25 | Sensata Technologies, Inc. | Semiconductor strain gauge |
| US20160298575A1 (en) | 2015-04-02 | 2016-10-13 | Sensata Technologies, Inc. | Combined temperature, absolute and differential pressure sensor assembly |
| GB2539630A (en) | 2015-04-09 | 2016-12-28 | Continental automotive systems inc | 3D stacked piezoresistive pressure sensor |
| EP3078964B1 (en) | 2015-04-09 | 2017-05-24 | Honeywell International Inc. | Relative humidity sensor and method |
| US9952111B2 (en) | 2015-04-15 | 2018-04-24 | Infineon Technologies Ag | System and method for a packaged MEMS device |
| US9702740B2 (en) | 2015-04-17 | 2017-07-11 | Wika Alexander Wiegand Se & Co. Kg | Measuring instrument with connecting coupling |
| US10126260B2 (en) | 2015-05-07 | 2018-11-13 | International Business Machines Corporation | Moisture detection and ingression monitoring systems and methods of manufacture |
| CN106197792B (zh) | 2015-05-26 | 2021-01-01 | 威卡亚力山大维甘德欧洲两合公司 | 具有监控功能的板簧式压力计 |
| US20160348618A1 (en) | 2015-05-26 | 2016-12-01 | Amphenol Thermometrics, Inc. | Intake Air Sensor and Sensing Method for Determining Air Filter Performance, Barometric Pressure, and Manifold Pressure of a Combustion Engine |
| DE102015008098B4 (de) | 2015-06-25 | 2023-03-30 | Wika Alexander Wiegand Se & Co. Kg | Messgerät mit gespreizter Messwertausgabe |
| US9766145B2 (en) | 2015-07-03 | 2017-09-19 | WIKA Alexander Weigand SE & Co. KG | Active diaphragm seal assembly for pressure measurement |
| US9780554B2 (en) | 2015-07-31 | 2017-10-03 | Apple Inc. | Moisture sensors |
| EP2960754A3 (en) | 2015-08-06 | 2016-03-09 | Sensirion AG | Sensing device |
| EP3128305B1 (en) | 2015-08-07 | 2019-07-31 | Sensata Technologies, Inc. | A hermetic pressure sensor |
| DE102016006771A1 (de) | 2015-08-24 | 2017-03-02 | Wika Alexander Wiegand Se & Co. Kg | Temperaturkompensiertes Manometer mit Schaltausgang |
| CN105236343B (zh) | 2015-09-07 | 2017-07-07 | 苏州敏芯微电子技术有限公司 | 介质隔离式压力传感器封装结构 |
| US10101230B2 (en) | 2015-09-16 | 2018-10-16 | Sensata Technologies, Inc. | Reduction of non-linearity errors in automotive pressure sensors |
| US10459537B2 (en) | 2015-09-30 | 2019-10-29 | Stmicroelectronics, Inc. | Encapsulated pressure sensor |
| EP3150999B1 (en) | 2015-10-01 | 2017-12-13 | Honeywell International Inc. | Relative humidity sensor and method of forming relative humidity sensor |
| US9909947B2 (en) | 2015-11-13 | 2018-03-06 | Sensata Technologies, Inc. | Pressure sensor comprising a tip secured to a port |
| DE102016012173A1 (de) | 2015-11-17 | 2017-05-18 | Wika Alexander Wiegand Se & Co. Kg | Druckmesssystem mit selbstschliessender Drossel |
| EP3173760A1 (de) | 2015-11-30 | 2017-05-31 | VEGA Grieshaber KG | Relativdrucksensor |
| US10171893B2 (en) | 2015-12-18 | 2019-01-01 | Archimedes Controls Corp. | Battery-powered wireless long life temperature and humidity sensor module |
| US10060820B2 (en) | 2015-12-22 | 2018-08-28 | Continental Automotive Systems, Inc. | Stress-isolated absolute pressure sensor |
| US10215655B2 (en) * | 2015-12-31 | 2019-02-26 | Honeywell International Inc. | Pressure sensor assembly |
| US9804048B2 (en) | 2016-01-20 | 2017-10-31 | Rosemount Aerospace Inc. | Pseudo differential pressure sensing bridge configuration |
| US9638559B1 (en) | 2016-02-10 | 2017-05-02 | Sensata Technologies Inc. | System, devices and methods for measuring differential and absolute pressure utilizing two MEMS sense elements |
| US10101234B2 (en) | 2016-02-11 | 2018-10-16 | Rosemount Aerospace, Inc. | Open diaphragm harsh environment pressure sensor |
| US10336606B2 (en) | 2016-02-25 | 2019-07-02 | Nxp Usa, Inc. | Integrated capacitive humidity sensor |
| EP3211408B1 (en) | 2016-02-29 | 2019-04-10 | Honeywell International Inc. | Relative humidity sensor and method |
| US10247687B2 (en) | 2016-03-02 | 2019-04-02 | International Business Machines Corporation | Soil moisture probing at variable depth |
| EP3217167B1 (en) | 2016-03-11 | 2018-05-16 | Honeywell International Inc. | Humidity sensors with transistor structures and piezoelectric layer |
| CN107290099B (zh) | 2016-04-11 | 2021-06-08 | 森萨塔科技公司 | 压力传感器、用于压力传感器的插塞件和制造插塞件的方法 |
| EP3236226B1 (en) | 2016-04-20 | 2019-07-24 | Sensata Technologies, Inc. | Method of manufacturing a pressure sensor |
| DE102016207260B3 (de) | 2016-04-28 | 2017-01-12 | Robert Bosch Gmbh | Mikromechanische Feuchtesensorvorrichtung und entsprechendes Herstellungsverfahren |
| JP6910152B2 (ja) | 2016-04-28 | 2021-07-28 | ヴィーカ アレクサンダー ヴィーガント ソシエタス ヨーロピア ウント コンパニー コマンディートゲゼルシャフトWIKA Alexander Wiegand SE & Co.KG | 測定装置及び設備コンポーネントのための仮想機能モジュール |
| EP3244201B1 (en) | 2016-05-13 | 2021-10-27 | Honeywell International Inc. | Fet based humidity sensor with barrier layer protecting gate dielectric |
| US10801985B2 (en) | 2016-06-03 | 2020-10-13 | Texas Instruments Incorporated | Sensing capacitor with a permeable electrode |
| EP3260833B1 (en) | 2016-06-21 | 2021-10-27 | Melexis Technologies NV | Semiconductor sensor assembly for harsh media application |
| US10247632B2 (en) | 2016-06-23 | 2019-04-02 | Honeywell International | Oil filled gage reference side protection |
| CN205785644U (zh) | 2016-06-23 | 2016-12-07 | 龙微科技无锡有限公司 | Mems微压压力传感器 |
| EP3261200B1 (de) | 2016-06-23 | 2020-06-10 | WIKA Alexander Wiegand SE & Co. KG | Sensorsystem für schaltanlagen |
| USD803082S1 (en) | 2016-06-27 | 2017-11-21 | Wika Alexander Wiegand Se & Co. Kg | Pressure sensor |
| DE102016211513A1 (de) | 2016-06-27 | 2018-01-04 | Infineon Technologies Dresden Gmbh | Stressentkoppelter piezoresistiver Relativdrucksensor und Verfahren zur Herstellung desselben |
| US10288513B2 (en) | 2016-09-14 | 2019-05-14 | Sensata Technologies | Integrated pressure and temperature sensor |
| US10144636B2 (en) | 2016-09-26 | 2018-12-04 | MEAS Switzerland S.a.r.l. | Method of manufacturing a sensor |
| US10548492B2 (en) * | 2016-12-08 | 2020-02-04 | MEAS Switzerland S.a.r.l. | Pressure sensor |
| US20200003635A1 (en) * | 2017-03-08 | 2020-01-02 | Tohoku University | Pressure sensor device and method for manufacturing pressure sensor device |
| US10247629B2 (en) | 2017-04-27 | 2019-04-02 | Continental Automotive Systems, Inc. | Stacked or unstacked MEMS pressure sensor with through-hole cap and plurality of chip capacitors |
| US10598559B2 (en) * | 2017-06-29 | 2020-03-24 | Rosemount Inc. | Pressure sensor assembly |
| DE102017213768A1 (de) * | 2017-08-08 | 2019-02-14 | Robert Bosch Gmbh | Drucksensor und Verfahren zum Herstellen eines Drucksensors |
| US10495538B2 (en) | 2017-09-18 | 2019-12-03 | Measurement Specialties, Inc | Modular sensor package having adhesive-free seal to housing |
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2018
- 2018-12-27 CN CN201822213406.4U patent/CN209326840U/zh active Active
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2019
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| WO2020139768A1 (en) | 2020-07-02 |
| JP7314370B2 (ja) | 2023-07-25 |
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| CN112543864B (zh) | 2022-08-16 |
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| JP2022169528A (ja) | 2022-11-09 |
| US20200209091A1 (en) | 2020-07-02 |
| EP4235133A2 (en) | 2023-08-30 |
| EP3755982B1 (en) | 2024-01-31 |
| EP3755982A1 (en) | 2020-12-30 |
| CN115371856B (zh) | 2024-06-28 |
| US11047753B2 (en) | 2021-06-29 |
| JP2022516096A (ja) | 2022-02-24 |
| JP7114814B2 (ja) | 2022-08-08 |
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