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EP1314171B1 - Compose electrique et son procede de production - Google Patents

Compose electrique et son procede de production Download PDF

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Publication number
EP1314171B1
EP1314171B1 EP01957747A EP01957747A EP1314171B1 EP 1314171 B1 EP1314171 B1 EP 1314171B1 EP 01957747 A EP01957747 A EP 01957747A EP 01957747 A EP01957747 A EP 01957747A EP 1314171 B1 EP1314171 B1 EP 1314171B1
Authority
EP
European Patent Office
Prior art keywords
intermediate layer
basic body
solution
liquid
protective layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP01957747A
Other languages
German (de)
English (en)
Other versions
EP1314171A1 (fr
Inventor
Roland Peinsipp
Franz Schrank
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
Epcos AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos AG filed Critical Epcos AG
Publication of EP1314171A1 publication Critical patent/EP1314171A1/fr
Application granted granted Critical
Publication of EP1314171B1 publication Critical patent/EP1314171B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49085—Thermally variable
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49087—Resistor making with envelope or housing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49087—Resistor making with envelope or housing
    • Y10T29/49098—Applying terminal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base

Definitions

  • the invention relates to an electrical component with a A body comprising a ceramic material, and at least two contact areas arranged on the base body, where connecting elements are attached, which with a Enveloped with organic constituents protective layer is. Furthermore, the invention relates to a process for the preparation of the electrical component.
  • the document DE 198 51 869 A1 discloses electrical components of the type mentioned above, the thermistor temperature sensor from a disk-shaped ceramic Represent material. Next to the material attached Lead wires, the temperature sensor has an epoxy resin cladding, the one additional component with hydrophobic properties contains.
  • the known electrical component has the disadvantage that it is sensitive to moisture. Although it is a hydrophobic Envelope of epoxy resin possesses, for example, by Dipping can be made under action moisture and / or water as a result of migration effects Failures occur.
  • applied voltage is namely between the two electric poles of the ceramic element, in which the Connecting wires are attached, a potential difference. If Under the conditions of use in a humid environment forms closed water film between the electrodes, so starts a material transport (mediated by silver, Tin and lead from that used when soldering the leads Lot) from the anode to the cathode. This forms metallic Films that are suitable, similar to printed conductors to act on the surface of the ceramic.
  • Thermistor temperature sensors may therefore only be used for applications be provided, where a condensation or water on the temperature sensor not he follows.
  • the thermistor temperature sensor with a To provide glass cladding In this construction can However, due to the high process temperatures no isolated Connecting wires are used. There is also here the danger that under appropriate conditions of use Damage due to electrochemical corrosion of the wires or Migration over the vitreous can occur.
  • the aim of the present invention is therefore a component specify the type mentioned, which also under the influence moisture has a high useful life.
  • the invention provides an electrical component, with a Basic body comprising a ceramic material and at least two arranged on the body contact areas on which connecting elements are attached, that of an organic Ingredients containing protective layer is wrapped and a disposed between the base body and the protective layer Intermediate layer comprising an intermediate layer material which is both hydrophobic and lipophobic is.
  • the device according to the invention has the advantage that by the intermediate layer of hydrophobic material penetrate of moisture from the outside to the surface of the body the places where the main body of the intermediate layer is covered, can be effectively reduced.
  • the device according to the invention has the advantage that due to the lipophobic material property of the intermediate layer this compatible with the surrounding the body Protective layer is.
  • this can also be a migration of components of the Protective layer through the intermediate layer on the surface of the main body including thereby enabled Damage can be effectively prevented.
  • the intermediate layer the Main body of the device tightly encloses, so that at the entire surface of the main body of the admission of moisture is difficult.
  • a component is particularly advantageous in which the interlayer material is soluble in a liquid, with which the base body can be wetted.
  • Such a device has the advantage that the intermediate layer in a simple way by dipping the Base body can be made into a solution that the Liquid and the intermediate layer material dissolved therein contains.
  • a component is particularly advantageous in which the thickness of the intermediate layer at the thinnest point at least 1.5 microns. Because of this minimum thickness is guaranteed that at all points where the intermediate layer at Body is arranged, the access of moisture to Body is difficult.
  • a suitable material for the intermediate layer, the required Properties, for example, is a fluoropolymer. It is a perfluorinated carbon skeleton.
  • the carbon skeleton can consist of chains, from connected ring systems or even a mixed form of both be constructed.
  • polyethers are also usable, which have no C-C chains but C-O-C chains.
  • the molecular weight of the polymer is advantageously over 1000 g / mol.
  • a fluoropolymer that in certain solvents, preferably in perfluorinated ones Alkanes, is soluble.
  • the fluorine-containing polymer can furthermore have the advantage that it has a soft, waxy consistency, which Favorable to the thermal shock resistance of Layer and also of the entire component can affect.
  • the protective layer of the component can advantageously made of a material that is electrically insulating and at the same time to protect the intermediate layer from abrasion suitable is.
  • a protective layer of this material has the advantage that it is the device from the outside against protects electrical short circuits.
  • the protective layer has the advantage that they are the intermediate layer of a Fluoropolymer, which have low mechanical resistance and may have a soft, waxy consistency, effective against mechanical damage by, for example Abrasion can protect.
  • a protective layer with respect to the required properties the electrical insulation and the protection of the intermediate layer comprises, advantageously consists of epoxy resin, Silicone or urethane.
  • the invention provides a method for producing a electrical component, which starts from a base body, comprising a ceramic material. It has the Base body at least two contact areas on which connecting elements are attached.
  • the method comprises the following steps:
  • the main body is in a solution submerged, the one wetting the main body liquid and a hydrophobic and lipophobic dissolved in this liquid Interlayer material contains.
  • the base body is so immersed in the solution that the body is completely inside the solution.
  • the body is so out of the solution taken from that part of the solution as a the basic body completely enveloping film adheres to it.
  • the film contained therein Liquid deprived by evaporation, creating the intermediate layer arises.
  • the protective layer is applied to the intermediate layer.
  • the protective layer can advantageously turn by dipping of the body in a corresponding solution or Liquid are applied.
  • the inventive method for producing the electrical Component has the advantage that it is particularly simple is to be realized, since for the application of the intermediate layer only the main body of the device immersed in a solution must become. Furthermore, the method has the advantage that the preparation of the intermediate layer from the solution Evaporation of liquid in a liquid film happens. Such evaporation requires in addition to simple storage of the component z. B. at room temperature no further technical measures and is therefore very cost-effective to realize.
  • the method can be carried out particularly advantageously by the viscosity of the solution into which the base dips, by suitable choice of the content of the solution of interlayer material adjusted so that the at the base body sticky film leads to an intermediate layer, the on the thinnest point is at least 1.5 ⁇ m thick. Through this Measure is ensured that the interlayer at each Has the required minimum thickness.
  • the intermediate layer material dissolved in Contains mold advantageously, a perfluoroalkane can be used in which a suitable as an interlayer material Fluoropolymer is soluble.
  • the figure shows an example of an inventive electrical Component in schematic cross section.
  • the figure shows an electrical component with a base body 1, which consists of a polycrystalline ceramic of the spinel type, in particular, of the Mn-Ni spinel type and above In addition, further doping or minor components may contain. In addition, ceramics are also conceivable which consist of other main components.
  • the above Mn-Ni spinel type ceramic is usually used as a base body 1 used for thermistor temperature sensor. Just It is special with such thermistor temperature sensors important that the body has a stable electrical resistance which is not affected by the action of moisture is changed.
  • the figure also shows a first contact region 2 and a second contact area 3, which at the top or Underside of the base body 1 are applied. These Contact areas, for example, by a silver-baking paste be prepared.
  • a first connection element 4 is fixed, which for example a wire provided with an electrical insulation can be.
  • the attachment of such a wire on the first Contact area 2 is preferably carried out by soldering.
  • a second connection element 5 in Attached form of a soldered, insulated wire.
  • the main body 1 is enveloped by an intermediate layer 7, by immersing the body 1 in a solution of a Fluoropolymer is applied.
  • This fluoropolymer is off built up multi-cyclic monomer units and its molecular weight is about 2000 g / mol.
  • the concentration of the solution This polymer is between 1% and 30%. By the Concentration of the solution can adjust the viscosity of the solution be, whereby the thickness of the intermediate layer. 7 is determined.
  • solvents for example, the easy available perfluoroalkanes, in particular perfluorohexane or Perfluorooctane suitable.
  • the sheath with a Two-component epoxy encapsulated in the dipping process, causing the Protective layer 6 is formed.
  • the intermediate layer 7 it should be noted that due to the application of the layer in a dipping process a largely homogeneous layer thickness, as shown in the figure is, can not be achieved. Rather, the Layer at the edges of the body 1 much thinner be, for example, between the contact areas 2, 3. In the embodiment described here became an intermediate layer 7 made at the edges of the main body 1 a layer thickness of less than 2 microns and others Make thicknesses can have up to 5 microns.
  • the protective layer 6 is by means of the dipping method described so applied that it has a layer thickness between 100 microns and 1000 microns. Regarding the protective layer 6 applies their layer thickness the same as for the intermediate layer 7 said.
  • a protective layer 6 are all suitable Standard wrapping materials, for example based on Epoxy resin, which are electrically insulating and the minimum strength against the formation of cracks exhibit. In addition to epoxy resin also come PU resin or silicone varnish into consideration.
  • the protective layer 6 may be in addition to the dipping method also applied with another method be, for. B. with the powder coating process.
  • the base body 1 When producing the intermediate layer 7 or the Protective layer 6, the base body 1 is preferably in the immersed appropriate liquid that end portions 8, 9th the connection elements 4, 5 remain uncoated and so as electrical contacts for connecting the device in one Circuit can be used.
  • Temperature sensor was under different test conditions tested for its water resistance. This was for example a water storage at a temperature of 80 ° C and an applied DC voltage of 3 V over 2000 hours carried out. This test was done by the temperature sensor without Change in electrical resistance survived.
  • the invention is not limited to the illustrated embodiment, but becomes in its most general form defined by claim 1 or claim 8.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Thermistors And Varistors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Insulating Bodies (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Claims (10)

  1. Composant électrique comprenant
    un corps (1) de base comprenant un matériau céramique,
    au moins deux zones (2, 3) de contact qui sont disposées sur le corps (1) de base et sur lesquelles sont fixés des éléments (4, 5) de borne,
    qui est enrobé d'une couche (6) de protection contenant des constituants organiques, et
    qui a une couche (7) intermédiaire disposée entre le corps (1) de base et la couche (6) de protection et en un matériau de couche intermédiaire qui est tant hydrophobe qu'également lipophobe.
  2. Composant suivant la revendication 1,
       dans lequel la matière de la couche intermédiaire est soluble dans un liquide par lequel le corps (1) de base peut être mouillé.
  3. Composant suivant la revendication 2,
       dans lequel la couche (7) intermédiaire est produite par immersion du corps (1) de base dans une solution qui contient le liquide et la matière de la couche intermédiaire qui y est dissoute.
  4. Composant suivant l'une des revendications 1 à 3,
       dans lequel l'épaisseur de la couche (7) intermédiaire au point le plus mince est inférieure à 1,5 µm.
  5. Composant suivant l'une des revendications 1 à 4,
       dans lequel la matière de la couche intermédiaire comprend un polymère fluoré.
  6. Composant suivant l'une des revendications 1 à 5,
       dans lequel la couche (6) de protection est en une matière qui est isolante du point de vue électrique et qui est appropriée pour protéger la couche (7) intermédiaire de l'usure.
  7. Composant suivant la revendication 6,
       dans lequel la couche (6) de protection comprend une résine époxyde, une silicone ou un uréthane.
  8. Procédé de fabrication d'un composant électrique qui part d'un corps de base comprenant un matériau céramique sur lequel il est prévu au moins deux zones (2, 3) de contact avec des éléments (4, 5) de bornes qui y sont fixées et qui comprend les stades suivants :
    a) immersion du corps (1) de base dans une solution qui contient un liquide mouillant le corps (1) de base et une matière de couche intermédiaire hydrophobe et lipophobe qui y est dissoute.
    b) enlèvement du corps (1) de base de la solution de façon à ce qu'une partie de la solution y reste adhérente sous la forme d'une pellicule enrobant complètement le corps (1) de base.
    c) production de la couche (7) intermédiaire par évaporation du liquide contenu dans le filtre.
    d) dépôt de la couche (6) de protection sur la couche (7) intermédiaire.
  9. Procédé suivant la revendication 8, dans lequel on règle la viscosité de la solution par un choix appropriée de la teneur en la matière de la couche intermédiaire de façon à ce que la pellicule adhérant au corps (1) de base donne une couche (7) intermédiaire qui au point le plus mince a une épaisseur d'au moins 1,5 µm.
  10. Procédé suivant la revendication 8 ou 9, dans lequel on utilise comme liquide un perfluoroalcane et comme matière de couche intermédiaire un polymère fluoré.
EP01957747A 2000-08-30 2001-08-02 Compose electrique et son procede de production Expired - Lifetime EP1314171B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10042636 2000-08-30
DE10042636A DE10042636C1 (de) 2000-08-30 2000-08-30 Elektrisches Bauelement und Verfahren zu dessen Herstellung
PCT/DE2001/002931 WO2002019348A1 (fr) 2000-08-30 2001-08-02 Compose electrique et son procede de production

Publications (2)

Publication Number Publication Date
EP1314171A1 EP1314171A1 (fr) 2003-05-28
EP1314171B1 true EP1314171B1 (fr) 2005-06-15

Family

ID=7654326

Family Applications (1)

Application Number Title Priority Date Filing Date
EP01957747A Expired - Lifetime EP1314171B1 (fr) 2000-08-30 2001-08-02 Compose electrique et son procede de production

Country Status (7)

Country Link
US (2) US7145430B2 (fr)
EP (1) EP1314171B1 (fr)
JP (2) JP5294528B2 (fr)
AT (1) ATE298128T1 (fr)
AU (1) AU2001279578A1 (fr)
DE (2) DE10042636C1 (fr)
WO (1) WO2002019348A1 (fr)

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Also Published As

Publication number Publication date
DE50106534D1 (de) 2005-07-21
US20040026106A1 (en) 2004-02-12
JP2004508702A (ja) 2004-03-18
DE10042636C1 (de) 2002-04-11
JP5340350B2 (ja) 2013-11-13
US7145430B2 (en) 2006-12-05
US7430797B2 (en) 2008-10-07
ATE298128T1 (de) 2005-07-15
AU2001279578A1 (en) 2002-03-13
WO2002019348A1 (fr) 2002-03-07
JP2011223030A (ja) 2011-11-04
JP5294528B2 (ja) 2013-09-18
US20070040646A1 (en) 2007-02-22
EP1314171A1 (fr) 2003-05-28

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