EP1314171B1 - Elektrisches bauelement und verfahren zu dessen herstellung - Google Patents
Elektrisches bauelement und verfahren zu dessen herstellung Download PDFInfo
- Publication number
- EP1314171B1 EP1314171B1 EP01957747A EP01957747A EP1314171B1 EP 1314171 B1 EP1314171 B1 EP 1314171B1 EP 01957747 A EP01957747 A EP 01957747A EP 01957747 A EP01957747 A EP 01957747A EP 1314171 B1 EP1314171 B1 EP 1314171B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- intermediate layer
- basic body
- solution
- liquid
- protective layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 6
- 239000010410 layer Substances 0.000 claims abstract description 56
- 239000000463 material Substances 0.000 claims abstract description 26
- 239000011241 protective layer Substances 0.000 claims abstract description 24
- 238000000034 method Methods 0.000 claims abstract description 12
- 230000002209 hydrophobic effect Effects 0.000 claims abstract description 8
- 229910010293 ceramic material Inorganic materials 0.000 claims abstract description 6
- 238000001704 evaporation Methods 0.000 claims abstract description 5
- 239000007788 liquid Substances 0.000 claims description 17
- 229920002313 fluoropolymer Polymers 0.000 claims description 8
- 239000004811 fluoropolymer Substances 0.000 claims description 8
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- 230000008020 evaporation Effects 0.000 claims description 4
- 238000005299 abrasion Methods 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 2
- 239000000470 constituent Substances 0.000 claims description 2
- 239000012530 fluid Substances 0.000 abstract 3
- 230000008901 benefit Effects 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 238000007598 dipping method Methods 0.000 description 7
- 239000000919 ceramic Substances 0.000 description 6
- 239000011229 interlayer Substances 0.000 description 6
- 230000008569 process Effects 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 125000004122 cyclic group Chemical group 0.000 description 3
- 230000005012 migration Effects 0.000 description 3
- 238000013508 migration Methods 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 229910052596 spinel Inorganic materials 0.000 description 3
- 239000011029 spinel Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910018651 Mn—Ni Inorganic materials 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 238000005253 cladding Methods 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000006056 electrooxidation reaction Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000001404 mediated effect Effects 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229960004624 perflexane Drugs 0.000 description 1
- ZJIJAJXFLBMLCK-UHFFFAOYSA-N perfluorohexane Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F ZJIJAJXFLBMLCK-UHFFFAOYSA-N 0.000 description 1
- YVBBRRALBYAZBM-UHFFFAOYSA-N perfluorooctane Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F YVBBRRALBYAZBM-UHFFFAOYSA-N 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000010257 thawing Methods 0.000 description 1
- 238000005382 thermal cycling Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49085—Thermally variable
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49087—Resistor making with envelope or housing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49087—Resistor making with envelope or housing
- Y10T29/49098—Applying terminal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
Definitions
- the invention relates to an electrical component with a A body comprising a ceramic material, and at least two contact areas arranged on the base body, where connecting elements are attached, which with a Enveloped with organic constituents protective layer is. Furthermore, the invention relates to a process for the preparation of the electrical component.
- the document DE 198 51 869 A1 discloses electrical components of the type mentioned above, the thermistor temperature sensor from a disk-shaped ceramic Represent material. Next to the material attached Lead wires, the temperature sensor has an epoxy resin cladding, the one additional component with hydrophobic properties contains.
- the known electrical component has the disadvantage that it is sensitive to moisture. Although it is a hydrophobic Envelope of epoxy resin possesses, for example, by Dipping can be made under action moisture and / or water as a result of migration effects Failures occur.
- applied voltage is namely between the two electric poles of the ceramic element, in which the Connecting wires are attached, a potential difference. If Under the conditions of use in a humid environment forms closed water film between the electrodes, so starts a material transport (mediated by silver, Tin and lead from that used when soldering the leads Lot) from the anode to the cathode. This forms metallic Films that are suitable, similar to printed conductors to act on the surface of the ceramic.
- Thermistor temperature sensors may therefore only be used for applications be provided, where a condensation or water on the temperature sensor not he follows.
- the thermistor temperature sensor with a To provide glass cladding In this construction can However, due to the high process temperatures no isolated Connecting wires are used. There is also here the danger that under appropriate conditions of use Damage due to electrochemical corrosion of the wires or Migration over the vitreous can occur.
- the aim of the present invention is therefore a component specify the type mentioned, which also under the influence moisture has a high useful life.
- the invention provides an electrical component, with a Basic body comprising a ceramic material and at least two arranged on the body contact areas on which connecting elements are attached, that of an organic Ingredients containing protective layer is wrapped and a disposed between the base body and the protective layer Intermediate layer comprising an intermediate layer material which is both hydrophobic and lipophobic is.
- the device according to the invention has the advantage that by the intermediate layer of hydrophobic material penetrate of moisture from the outside to the surface of the body the places where the main body of the intermediate layer is covered, can be effectively reduced.
- the device according to the invention has the advantage that due to the lipophobic material property of the intermediate layer this compatible with the surrounding the body Protective layer is.
- this can also be a migration of components of the Protective layer through the intermediate layer on the surface of the main body including thereby enabled Damage can be effectively prevented.
- the intermediate layer the Main body of the device tightly encloses, so that at the entire surface of the main body of the admission of moisture is difficult.
- a component is particularly advantageous in which the interlayer material is soluble in a liquid, with which the base body can be wetted.
- Such a device has the advantage that the intermediate layer in a simple way by dipping the Base body can be made into a solution that the Liquid and the intermediate layer material dissolved therein contains.
- a component is particularly advantageous in which the thickness of the intermediate layer at the thinnest point at least 1.5 microns. Because of this minimum thickness is guaranteed that at all points where the intermediate layer at Body is arranged, the access of moisture to Body is difficult.
- a suitable material for the intermediate layer, the required Properties, for example, is a fluoropolymer. It is a perfluorinated carbon skeleton.
- the carbon skeleton can consist of chains, from connected ring systems or even a mixed form of both be constructed.
- polyethers are also usable, which have no C-C chains but C-O-C chains.
- the molecular weight of the polymer is advantageously over 1000 g / mol.
- a fluoropolymer that in certain solvents, preferably in perfluorinated ones Alkanes, is soluble.
- the fluorine-containing polymer can furthermore have the advantage that it has a soft, waxy consistency, which Favorable to the thermal shock resistance of Layer and also of the entire component can affect.
- the protective layer of the component can advantageously made of a material that is electrically insulating and at the same time to protect the intermediate layer from abrasion suitable is.
- a protective layer of this material has the advantage that it is the device from the outside against protects electrical short circuits.
- the protective layer has the advantage that they are the intermediate layer of a Fluoropolymer, which have low mechanical resistance and may have a soft, waxy consistency, effective against mechanical damage by, for example Abrasion can protect.
- a protective layer with respect to the required properties the electrical insulation and the protection of the intermediate layer comprises, advantageously consists of epoxy resin, Silicone or urethane.
- the invention provides a method for producing a electrical component, which starts from a base body, comprising a ceramic material. It has the Base body at least two contact areas on which connecting elements are attached.
- the method comprises the following steps:
- the main body is in a solution submerged, the one wetting the main body liquid and a hydrophobic and lipophobic dissolved in this liquid Interlayer material contains.
- the base body is so immersed in the solution that the body is completely inside the solution.
- the body is so out of the solution taken from that part of the solution as a the basic body completely enveloping film adheres to it.
- the film contained therein Liquid deprived by evaporation, creating the intermediate layer arises.
- the protective layer is applied to the intermediate layer.
- the protective layer can advantageously turn by dipping of the body in a corresponding solution or Liquid are applied.
- the inventive method for producing the electrical Component has the advantage that it is particularly simple is to be realized, since for the application of the intermediate layer only the main body of the device immersed in a solution must become. Furthermore, the method has the advantage that the preparation of the intermediate layer from the solution Evaporation of liquid in a liquid film happens. Such evaporation requires in addition to simple storage of the component z. B. at room temperature no further technical measures and is therefore very cost-effective to realize.
- the method can be carried out particularly advantageously by the viscosity of the solution into which the base dips, by suitable choice of the content of the solution of interlayer material adjusted so that the at the base body sticky film leads to an intermediate layer, the on the thinnest point is at least 1.5 ⁇ m thick. Through this Measure is ensured that the interlayer at each Has the required minimum thickness.
- the intermediate layer material dissolved in Contains mold advantageously, a perfluoroalkane can be used in which a suitable as an interlayer material Fluoropolymer is soluble.
- the figure shows an example of an inventive electrical Component in schematic cross section.
- the figure shows an electrical component with a base body 1, which consists of a polycrystalline ceramic of the spinel type, in particular, of the Mn-Ni spinel type and above In addition, further doping or minor components may contain. In addition, ceramics are also conceivable which consist of other main components.
- the above Mn-Ni spinel type ceramic is usually used as a base body 1 used for thermistor temperature sensor. Just It is special with such thermistor temperature sensors important that the body has a stable electrical resistance which is not affected by the action of moisture is changed.
- the figure also shows a first contact region 2 and a second contact area 3, which at the top or Underside of the base body 1 are applied. These Contact areas, for example, by a silver-baking paste be prepared.
- a first connection element 4 is fixed, which for example a wire provided with an electrical insulation can be.
- the attachment of such a wire on the first Contact area 2 is preferably carried out by soldering.
- a second connection element 5 in Attached form of a soldered, insulated wire.
- the main body 1 is enveloped by an intermediate layer 7, by immersing the body 1 in a solution of a Fluoropolymer is applied.
- This fluoropolymer is off built up multi-cyclic monomer units and its molecular weight is about 2000 g / mol.
- the concentration of the solution This polymer is between 1% and 30%. By the Concentration of the solution can adjust the viscosity of the solution be, whereby the thickness of the intermediate layer. 7 is determined.
- solvents for example, the easy available perfluoroalkanes, in particular perfluorohexane or Perfluorooctane suitable.
- the sheath with a Two-component epoxy encapsulated in the dipping process, causing the Protective layer 6 is formed.
- the intermediate layer 7 it should be noted that due to the application of the layer in a dipping process a largely homogeneous layer thickness, as shown in the figure is, can not be achieved. Rather, the Layer at the edges of the body 1 much thinner be, for example, between the contact areas 2, 3. In the embodiment described here became an intermediate layer 7 made at the edges of the main body 1 a layer thickness of less than 2 microns and others Make thicknesses can have up to 5 microns.
- the protective layer 6 is by means of the dipping method described so applied that it has a layer thickness between 100 microns and 1000 microns. Regarding the protective layer 6 applies their layer thickness the same as for the intermediate layer 7 said.
- a protective layer 6 are all suitable Standard wrapping materials, for example based on Epoxy resin, which are electrically insulating and the minimum strength against the formation of cracks exhibit. In addition to epoxy resin also come PU resin or silicone varnish into consideration.
- the protective layer 6 may be in addition to the dipping method also applied with another method be, for. B. with the powder coating process.
- the base body 1 When producing the intermediate layer 7 or the Protective layer 6, the base body 1 is preferably in the immersed appropriate liquid that end portions 8, 9th the connection elements 4, 5 remain uncoated and so as electrical contacts for connecting the device in one Circuit can be used.
- Temperature sensor was under different test conditions tested for its water resistance. This was for example a water storage at a temperature of 80 ° C and an applied DC voltage of 3 V over 2000 hours carried out. This test was done by the temperature sensor without Change in electrical resistance survived.
- the invention is not limited to the illustrated embodiment, but becomes in its most general form defined by claim 1 or claim 8.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Thermistors And Varistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Insulating Bodies (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Description
Claims (10)
- Elektrisches Bauelement miteinem Grundkörper (1) umfassend ein keramisches Material,wenigstens zwei auf dem Grundkörper (1) angeordneten Kontaktbereichen (2, 3), an denen Anschlußelemente (4, 5) befestigt sind,das von einer organische Bestandteile enthaltenden Schutzschicht (6) umhüllt ist unddas eine zwischen dem Grundkörper (1) und der Schutzschicht (6) angeordnete Zwischenschicht (7) aufweist, die aus einem Zwischenschichtmaterial besteht, welches sowohl hydrophob als auch lipophob ist.
- Bauelement nach Anspruch 1,
bei dem das Zwischenschichtmaterial in einer Flüssigkeit löslich ist, mit der der Grundkörper (1) benetzt werden kann. - Bauelement nach Anspruch 2,
bei dem die Zwischenschicht (7) durch Eintauchen des Grundkörpers (1) in eine Lösung hergestellt ist, die die Flüssigkeit und das darin gelöste Zwischenschichtmaterial enthält. - Bauelement nach Anspruch 1 - 3,
bei dem Dicke der Zwischenschicht (7) an der dünnsten Stelle wenigstens 1,5 µm beträgt. - Bauelement nach Anspruch 1 - 4,
bei dem das Zwischenschichtmaterial ein Fluorpolymer umfaßt. - Bauelement nach Anspruch 1 - 5,
bei dem die Schutzschicht (6) aus einem Material besteht, das elektrisch isolierend und zum Schutz der Zwischenschicht (7) vor Abrieb geeignet ist. - Bauelement nach Anspruch 6,
bei dem die Schutzschicht (6) ein Epoxidharz, Silikon oder ein Urethan umfaßt. - Verfahren zur Herstellung eines elektrischen Bauelements, das von einem ein keramisches Material umfassenden Grundkörper (1) ausgeht, auf dem wenigstens zwei Kontaktbereiche (2, 3) mit daran befestigten Anschlußelementen (4, 5) vorgesehen sind, und das folgende Schritte umfaßt:a) Eintauchen des Grundkörpers (1) in eine Lösung, die eine den Grundkörper (1) benetzende Flüssigkeit und ein darin gelöstes hydrophobes und lipophobes Zwischenschichtmaterial enthältb) Entnehmen des Grundkörpers (1) so aus der Lösung, daß ein Teil der Lösung als ein den Grundkörper (1) vollständig umhüllender Film daran haften bleibtc) Herstellen der Zwischenschicht (7) durch Verdunsten der im Film enthaltenen Flüssigkeitd) Aufbringen der Schutzschicht (6) auf die Zwischenschicht (7).
- Verfahren nach Anspruch 8,
wobei die Viskosität der Lösung durch geeignete Wahl des Gehalts an Zwischenschichtmaterial so eingestellt wird, daß der am Grundkörper (1) haftende Film zu einer Zwischenschicht (7) führt, die an der dünnsten Stelle wenigstens 1,5 µm dick ist. - Verfahren nach Anspruch 8 oder 9,
wobei als Flüssigkeit ein Perfluoralkan und als Zwischenschichtmaterial ein Fluorpolymer verwendet wird.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10042636 | 2000-08-30 | ||
| DE10042636A DE10042636C1 (de) | 2000-08-30 | 2000-08-30 | Elektrisches Bauelement und Verfahren zu dessen Herstellung |
| PCT/DE2001/002931 WO2002019348A1 (de) | 2000-08-30 | 2001-08-02 | Elektrisches bauelement und verfahren zu dessen herstellung |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP1314171A1 EP1314171A1 (de) | 2003-05-28 |
| EP1314171B1 true EP1314171B1 (de) | 2005-06-15 |
Family
ID=7654326
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP01957747A Expired - Lifetime EP1314171B1 (de) | 2000-08-30 | 2001-08-02 | Elektrisches bauelement und verfahren zu dessen herstellung |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US7145430B2 (de) |
| EP (1) | EP1314171B1 (de) |
| JP (2) | JP5294528B2 (de) |
| AT (1) | ATE298128T1 (de) |
| AU (1) | AU2001279578A1 (de) |
| DE (2) | DE10042636C1 (de) |
| WO (1) | WO2002019348A1 (de) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4430422B2 (ja) * | 2004-02-06 | 2010-03-10 | 株式会社日立製作所 | 温度センサ |
| DK1776455T3 (da) * | 2004-07-16 | 2015-06-22 | Dupont Nutrition Biosci Aps | Lipolytisk enzym, anvendelser deraf i fødevareindustrien |
| DE102005021551A1 (de) * | 2005-05-10 | 2006-11-16 | BSH Bosch und Siemens Hausgeräte GmbH | Kältegerät mit einer Wasserleitung |
| JP4744947B2 (ja) * | 2005-06-23 | 2011-08-10 | 本田技研工業株式会社 | 電子制御ユニット及びその製造方法 |
| JP2007035766A (ja) * | 2005-07-25 | 2007-02-08 | Hitachi Ltd | 温度感知素子 |
| US7276839B1 (en) * | 2005-11-30 | 2007-10-02 | The United States Of America Represented By The Secretary Of The Navy | Bondable fluoropolymer film as a water block/acoustic window for environmentally isolating acoustic devices |
| US7875812B2 (en) * | 2008-07-31 | 2011-01-25 | Ge Aviation Systems, Llc | Method and apparatus for electrical component physical protection |
| JP2010141180A (ja) * | 2008-12-12 | 2010-06-24 | Nichicon Corp | 固体電解コンデンサおよびその製造方法 |
| US8684705B2 (en) * | 2010-02-26 | 2014-04-01 | Entegris, Inc. | Method and system for controlling operation of a pump based on filter information in a filter information tag |
| KR101008310B1 (ko) * | 2010-07-30 | 2011-01-13 | 김선기 | 세라믹 칩 어셈블리 |
| DE102012109704A1 (de) * | 2012-10-11 | 2014-04-17 | Epcos Ag | Keramisches Bauelement mit Schutzschicht und Verfahren zu dessen Herstellung |
| JP6723690B2 (ja) * | 2015-06-01 | 2020-07-15 | 株式会社村田製作所 | 被覆リードタイプ電子部品およびその製造方法 |
| DE102023104467A1 (de) * | 2023-02-23 | 2024-08-29 | Tdk Electronics Ag | Keramisches Bauelement und Verfahren zur Herstellung eines keramischen Bauelements |
| TWI859967B (zh) * | 2023-07-12 | 2024-10-21 | 聚鼎科技股份有限公司 | 過電流保護元件 |
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| US2741687A (en) * | 1953-08-21 | 1956-04-10 | Erie Resistor Corp | Pyrolytic carbon resistors |
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| US3666551A (en) * | 1967-12-08 | 1972-05-30 | Corning Glass Works | Impregnating and coating composition for porous ceramic insulation |
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| JPH02152206A (ja) * | 1988-12-03 | 1990-06-12 | Fujikura Ltd | 電気素子の絶縁被覆方法 |
| JPH02303101A (ja) * | 1989-05-18 | 1990-12-17 | Tdk Corp | セラミック電子部品 |
| JP3152352B2 (ja) * | 1990-11-14 | 2001-04-03 | 三菱マテリアル株式会社 | サーミスタ素子 |
| JPH04224896A (ja) * | 1990-12-26 | 1992-08-14 | Nippon Kouyu:Kk | 油分の拡散防止法及び油分の拡散防止剤 |
| JP2839739B2 (ja) * | 1991-03-13 | 1998-12-16 | 日本碍子株式会社 | 抵抗素子 |
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-
2000
- 2000-08-30 DE DE10042636A patent/DE10042636C1/de not_active Expired - Fee Related
-
2001
- 2001-08-02 US US10/363,275 patent/US7145430B2/en not_active Expired - Lifetime
- 2001-08-02 DE DE50106534T patent/DE50106534D1/de not_active Expired - Lifetime
- 2001-08-02 AU AU2001279578A patent/AU2001279578A1/en not_active Abandoned
- 2001-08-02 WO PCT/DE2001/002931 patent/WO2002019348A1/de not_active Ceased
- 2001-08-02 JP JP2002524157A patent/JP5294528B2/ja not_active Expired - Fee Related
- 2001-08-02 EP EP01957747A patent/EP1314171B1/de not_active Expired - Lifetime
- 2001-08-02 AT AT01957747T patent/ATE298128T1/de not_active IP Right Cessation
-
2006
- 2006-10-25 US US11/586,969 patent/US7430797B2/en not_active Expired - Fee Related
-
2011
- 2011-07-08 JP JP2011151898A patent/JP5340350B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| DE50106534D1 (de) | 2005-07-21 |
| US20040026106A1 (en) | 2004-02-12 |
| JP2004508702A (ja) | 2004-03-18 |
| DE10042636C1 (de) | 2002-04-11 |
| JP5340350B2 (ja) | 2013-11-13 |
| US7145430B2 (en) | 2006-12-05 |
| US7430797B2 (en) | 2008-10-07 |
| ATE298128T1 (de) | 2005-07-15 |
| AU2001279578A1 (en) | 2002-03-13 |
| WO2002019348A1 (de) | 2002-03-07 |
| JP2011223030A (ja) | 2011-11-04 |
| JP5294528B2 (ja) | 2013-09-18 |
| US20070040646A1 (en) | 2007-02-22 |
| EP1314171A1 (de) | 2003-05-28 |
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